Polishing tool for silicon core machining

Abstract

The utility model provides a polishing tool for silicon core machining, and relates to the technical field of polycrystalline silicon machining equipment. The polishing tool for silicon core machining comprises a polishing head; the dismounting and mounting assembly is arranged at one end of the polishing head; wherein a grinding disc is arranged at the end, close to the dismounting and mounting assembly, of the grinding head, the grinding disc and the grinding head can synchronously rotate to conduct silicon core punching operation, and when the grinding head drills a machining hole, the grinding disc can grind the periphery of the machining hole to form a machining plane perpendicular to the extending direction of the machining hole; after the round silicon core is successfully drawn, the round silicon core punching device is arranged on punching equipment to carry out punching operation in the subsequent machining process; according to the polishing tool for silicon core machining, the punching depth of punching equipment on a round silicon core can be accurately controlled, the working efficiency is improved, and the labor cost is reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to polycrystal silicon processing equipment technical field, specifically is a kind of polishing frock for silicon core processing. BACKGROUND

[0002] Silicon core drawing refers to in silicon core furnace, using high-frequency induction heating or zone melting method, polycrystalline silicon rod is heated and melted, and is drawn into silicon core with certain length and diameter by pulling method. This silicon core is usually used as carrier in polycrystalline silicon reduction furnace, and is the key step of producing high-quality polycrystalline silicon.

[0003] In the silicon core drawing industry, after the successful drawing of round silicon core, subsequent mechanical processing is needed for polishing manufacturing, and the punching grinding head used is one of the pipe fittings. After the round silicon core is cut into cross beams, punching processing is needed. Since the diameters of round silicon cores are different, the punching depth of punching equipment cannot be accurately controlled, manual selection of cross beams with different diameters and extreme differences is needed, and punching equipment with exclusive diameter is set to punch, but this process will waste manual sorting, and cross beams with too large extreme difference will be directly scrapped. However, if the punching depth is not controlled by sorting, the interface distance between the cross beam hole and the upper cone and lower top end will be different when round silicon core is used for assembly in the subsequent process, which will cause quality problems. UTILITY MODEL CONTENT

[0004] The utility model discloses to solve the problem that the punching depth of punching equipment cannot be accurately controlled due to the difference in diameter of round silicon core after the round silicon core is cut into cross beams for punching processing in the prior art, which increases labor cost and reduces the quality of polycrystalline silicon products. A polishing frock for silicon core processing is provided, which can accurately control the punching depth of punching equipment on round silicon core.

[0005] The utility model discloses the technical scheme that adopts is as follows:

[0006] A polishing frock for silicon core processing includes:

[0007] A polishing head;

[0008] A dismounting and assembling component is arranged at one end of the polishing head;

[0009] Wherein, the polishing head is provided with a grinding disc on one end close to the dismounting and assembling component, the grinding disc can rotate synchronously with the polishing head to perform punching operation on silicon core, and when the polishing head drills and processes a hole, the grinding disc can polish a processing plane perpendicular to the extension direction of the hole around the hole.

[0010] Further, the side surface of the polishing head is inclined, and the diameter of one end of the polishing head connected with the dismounting and assembling component is greater than the diameter of one end of the polishing head used for contacting silicon core.

[0011] Further, a spiral-shaped chip removal groove is arranged on the outer side wall of the polishing head.

[0012] Further, the surface of the polishing head is covered with a first diamond layer; and the surface of the grinding disc is covered with a second diamond layer.

[0013] Further, the polishing tool for processing silicon core is hollow inside and has at least an internal chamber.

[0014] Further, a communication port is arranged on the end of the polishing head for contacting the silicon core, the communication port is in communication with the internal chamber, and the communication port is filled with diamond inside.

[0015] Further, notches are arranged on the opposite sides of the side wall of the communication port.

[0016] Further, a plurality of through grooves are arranged on the outer side wall of the grinding disc, the extension direction of the through grooves is parallel to the axial direction of the polishing tool for processing silicon core, and the plurality of through grooves are uniformly distributed along the circumferential direction of the grinding disc.

[0017] Further, the dismounting assembly has at least an operating section, a transition section and a mounting section; the operating section is hexagonal; and a thread is arranged on the outer side wall of the mounting section.

[0018] Further, a first annular groove is arranged between the operating section and the transition section, the first annular groove is arranged along the circumferential direction of the dismounting assembly; and a second annular groove is arranged between the transition section and the mounting section, the second annular groove is arranged along the circumferential direction of the dismounting assembly.

[0019] The beneficial effects of the present utility model are as follows:

[0020] 1. The polishing head can be installed on the rotating shaft of the punching equipment for rotation through the dismounting assembly, and the grinding disc is sleeved on the polishing head, which can polish a processing plane perpendicular to the extension direction of the processing hole around the processing hole, so that the depth of the processing hole can be kept fixed regardless of the processing depth of the punching equipment; thereby the size and assembly precision of the polysilicon product are ensured, the processing efficiency is improved, the time waste is reduced, and the material waste after the silicon material is drawn into a round silicon core product is avoided, thereby solving the problem that the punching depth of the punching equipment cannot be accurately controlled due to the difference in the diameter of the round silicon core after the round silicon core is cut into a cross beam in the prior art, resulting in increased labor cost and reduced quality of the polysilicon product. BRIEF DESCRIPTION OF DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, the drawings in the following description only constitute some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained from these drawings without creative labor.

[0022] Figure 1 The front view of the polishing tool of the embodiment of the present application;

[0023] Figure 2 The top view of the polishing tool of the embodiment of the present application;

[0024] Figure 3 The A-A side sectional view of the embodiment of the present application; Figure 2

[0025] Figure 4 The working schematic view of the polishing tool of the embodiment of the present application;

[0026] Figure 5 The front view of the polishing tool of the preferred mode of the embodiment of the present application.

[0027] Reference signs: 100-polishing head, 110-first diamond layer, 120-communication port, 130-groove, 140- chip removal groove;

[0028] 200-grinding disc, 210-second diamond layer, 220-through groove;

[0029] 300-disassembly and assembly component, 310-operation section, 320-transition section, 330-mounting section, 340-first annular groove, 350-second annular groove;

[0030] 400-internal chamber. DETAILED DESCRIPTION

[0031] In the description of the present application, it is understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.

[0032] ​The disclosure below provides many different embodiments or examples for implementing various configurations of the present application. For the purpose of simplifying the disclosure, particular examples of components and arrangements are described below. These are merely examples and are not intended to be limiting of the present application.

[0033] Embodiments of the present application will be described in detail below with reference to the drawings.

[0034] Embodiment 1

[0035] After the existing round silicon core is cut into a beam, it needs to be punched. Since the diameters of the round silicon cores are different, the punching depth of the punching equipment cannot be accurately controlled, and manual selection of beams with different diameters and a difference of <2mm is required for classification, and then a punching equipment with a specific diameter is set to punch. This process will waste manual sorting, and beams with a difference of >2mm at both ends will be directly scrapped. However, if the punching depth is not controlled by sorting, when the round silicon core is assembled later, due to the different distances between the beam hole and the interface of the upper cone and the lower top end, quality problems will occur.

[0036] To solve the above problems in the prior art, the embodiment provides a polishing tool for silicon core processing, which is used for punching operation in subsequent mechanical processing after the round silicon core is successfully drawn. The polishing tool for silicon core processing can accurately control the punching depth of the punching equipment on the round silicon core. Please refer to Figures 1-4 The polishing tool for silicon core processing mainly includes a polishing head 100, a grinding disc 200 and a dismounting assembly 300.

[0037] The polishing head 100 is used to directly contact the surface of the round silicon core to drill the hole. As shown in Figures 1-4 The polishing head 100 is roughly in the shape of a circular truncated cone. One end of the polishing head 100 has a smaller diameter, which is used to abut on the surface of the round silicon core for drilling. The other end of the polishing head 100 has a larger diameter, which is used to connect the dismounting assembly 300. The side surface of the polishing head 100 is inclined, which facilitates the gradual deepening of the polishing head 100 into the silicon core during drilling. At the same time, the surface of the polishing head 100 is covered with a first diamond layer 110, and the polishing head 100 drills a hole by rubbing the surface of the silicon core through the first diamond layer 110.

[0038] The grinding disc 200 is sleeved on the end of the grinding head 100 with a larger diameter, and can rotate synchronously with the grinding head 100 to perform the punching operation on the silicon core, so as to grind a processing platform on the surface of the silicon core while the grinding head 100 drills the processing hole. The grinding disc 200 is substantially in the shape of a cylinder, and the disc surface of the grinding disc 200 is perpendicular to the axial direction of the grinding head 100 and can rotate coaxially with the grinding head 100. Meanwhile, the side surface and the surface close to the grinding head 100 of the grinding disc 200 are covered with the second diamond layer 210, and the grinding disc 200 grinds the processing platform on the surface of the silicon core through the friction of the second diamond layer 210.

[0039] The dismounting assembly 300 is arranged on the end of the grinding head 100 with a larger diameter, and is used to connect the grinding tool for processing silicon core and the punching equipment, and to install the grinding tool for processing silicon core on the rotating shaft of the punching equipment. In the embodiment, the dismounting assembly 300 is substantially in the shape of a cylinder, and can be mainly divided into an operation section 310, a transition section 320 and an installation section 330 along the axial direction. The operation section 310 is substantially in the shape of a hexagonal prism, and one end of the operation section 310 is connected to the grinding head 100. The transition section 320 is substantially in the shape of a cylinder, and the other end of the transition section 320 is connected to the operation section 310 away from the grinding head 100. The installation section 330 is substantially in the shape of a cylinder, and the other end of the installation section 330 is connected to the transition section 320 away from the operation section 310, and the outer side wall of the installation section 330 is provided with threads for screwing with the rotating shaft of the punching equipment. When the grinding tool for processing silicon core needs to be installed or dismounted on the punching equipment, the operation section 310 can be clamped and rotated by using a wrench or the like, so as to tighten or loosen the entire grinding tool for processing silicon core.

[0040] A specific working mode of the embodiment is as follows:

[0041] Firstly, the grinding tool for processing silicon core of the embodiment is installed on the punching equipment, and a circular silicon core beam is loaded on the feeding port of the punching equipment, and the circular silicon core beam is horizontally placed on the equipment and is fixed by an automatic clamp to start the punching; after the punching starts, the rotating shaft of the equipment rotates and drives the grinding tool to move downward vertically, the grinding head 100 first contacts the surface of the beam and grinds downward to a certain depth, and then the grinding disc 200 integrated with the grinding head 100 contacts the beam to grind a plane, until the circular silicon core beam is punched to form a processing hole with a plane.

[0042] In the embodiment, the polishing tool for silicon core processing is provided with a polishing head 100, which can be installed on the rotating shaft of the punching device for rotation, and a grinding disc 200 is sleeved on the polishing head 100. The grinding disc 200 can polish a processing plane perpendicular to the extension direction of the processing hole around the processing hole, so that the depth of the processing hole can be kept fixed regardless of the processing depth of the punching device. In turn, the size and assembly precision of the polysilicon product are ensured, the processing efficiency is improved, the time waste is reduced, and the material waste after the silicon material is drawn into a round silicon core product is avoided, thereby solving the problem that the punching depth of the punching device cannot be accurately controlled due to the difference in the diameter of the round silicon core after the round silicon core is cut into a cross beam in the prior art, resulting in an increase in labor cost and a decrease in the quality of the polysilicon product.

[0043] Meanwhile, the polishing tool for silicon core processing in the embodiment is designed to be hollow inside, has an internal chamber 400, and is used to enhance the heat dissipation capacity of the polishing tool for silicon core processing during use, reduce the self-weight of the polishing tool for silicon core processing, and reduce the energy consumption of the punching device and the material consumption for manufacturing the polishing tool for silicon core processing.

[0044] Specifically, the smaller end of the polishing head 100 is provided with a communication port 120, which is in communication with the internal chamber 400 and is filled with diamond sand inside. On the one hand, it is used for polishing, and on the other hand, it is used to prevent the waste silicon chips generated during polishing from entering the inside of the punching device through the internal chamber 400, thereby avoiding affecting the normal operation of the punching device. Meanwhile, the embodiment is also provided with a slot 130 on the opposite sides of the side wall of the communication port 120. The cross-sectional shape of the slot 130 is generally rectangular. The design of the slot 130 can optimize the contact area between the polishing head 100 and the silicon core, thereby improving the polishing efficiency. By reasonably designing the shape and size of the slot, it can be ensured that the polishing head can uniformly contact the surface of the silicon core during polishing, thereby reducing the polishing time and improving the polishing quality.

[0045] Specifically, the embodiment is also provided with three through-slots 220 on the outer side wall of the grinding disc 200. The extension direction of the three through-slots 220 is parallel to the axial direction of the polishing tool for silicon core processing, and the three through-slots 220 are uniformly distributed along the circumferential direction of the grinding disc 200. The three through-slots 220 can improve the heat dissipation speed of the grinding disc 200 during polishing, optimize the contact area between the grinding disc 200 and the silicon core, improve the polishing efficiency, and also can be used to remove the waste silicon chips on the contact surface of the grinding disc 200 and the silicon core, thereby avoiding affecting the polishing efficiency of the grinding disc 200.

[0046] Specifically, the first annular groove 340 is arranged between the operation section 310 and the transition section 320 of the disassembling and assembling component 300, and the second annular groove 350 is arranged between the transition section 320 and the mounting section 330 of the disassembling and assembling component 300. The first annular groove 340 and the second annular groove 350 can enhance the structural stability of the connecting section of the polishing tool for processing silicon wafers, reduce deformation and damage under high load working conditions, and reduce vibration during polishing, thereby improving the polishing precision and stability.

[0047] Preferably, as shown in Figure 5 In the embodiment, the spiral-shaped chip removal groove 140 can be arranged on the outer side wall of the polishing head 100, so that the waste silicon chips on the surface of the polishing head 100 can pass through the chip removal groove 140 and be separated from the polishing head 100 by the rotation of the polishing head 100, thereby reducing the amount of waste silicon chips adhered to the surface of the polishing head 100 and avoiding affecting the polishing efficiency of the polishing head 100.

[0048] The basic principle, main features and advantages of the present application are shown and described above. It should be understood by those skilled in the art that the present application is not limited by the above embodiments, and the above embodiments and descriptions in the specification are only preferred examples of the present application and do not limit the present application. Without departing from the spirit and scope of the present application, various changes and improvements can be made to the present application, and these changes and improvements all fall within the scope of the present application. The scope of protection of the present application is defined by the appended claims and their equivalents.

Claims

1. A grinding fixture for silicon core processing, characterized in that, The polishing head (100) comprises: a dismounting assembly (300) arranged at one end of the polishing head (100); wherein the polishing head (100) is provided with a grinding disc (200) at one end close to the dismounting assembly (300), the grinding disc (200) can rotate synchronously with the polishing head (100) to perform the punching operation of the silicon core, and when the polishing head (100) drills a hole, the grinding disc (200) can polish a processing plane perpendicular to the extension direction of the hole around the hole. The side surface of the polishing head (100) is inclined, and the diameter of the end of the polishing head (100) connected with the dismounting assembly (300) is larger than the diameter of the end of the polishing head (100) used to contact the silicon core.

2. The polishing tool for processing a silicon core according to Claim 1, wherein A spiral chip removal groove (140) is arranged on the outer side wall of the polishing head (100).

3. The polishing tool for processing a silicon core according to Claim 2, wherein The surface of the polishing head (100) is covered with a first diamond layer (110), and the surface of the grinding disc (200) is covered with a second diamond layer (210).

4. The polishing tool for processing a silicon core according to Claim 1, wherein The polishing tool for processing silicon core is hollow inside and has at least an internal chamber (400).

5. The polishing tool for processing a silicon core according to Claim 1, wherein A communication port (120) is arranged on the end of the polishing head (100) used to contact the silicon core, the communication port (120) is in communication with the internal chamber (400), and the inside of the communication port (120) is filled with diamond.

6. The polishing tool for processing a silicon core according to Claim 5, wherein Grooves (130) are arranged on the opposite sides of the side wall of the communication port (120).

7. The polishing tool for processing a silicon core according to Claim 6, wherein A plurality of through grooves (220) are arranged on the outer side wall of the grinding disc (200), the extension direction of the through grooves (220) is parallel to the axial direction of the polishing tool for processing silicon core, and the plurality of through grooves (220) are uniformly distributed along the circumferential direction of the grinding disc (200).

8. The polishing tool for processing a silicon core according to Claim 1, wherein The dismounting assembly (300) has at least an operation section (310), a transition section (320) and a mounting section (330); the operation section (310) is hexagonal in shape; and a thread is arranged on the outer side wall of the mounting section (330).

9. The polishing tool for processing a silicon core according to any one of claims 1 to 8, wherein A first annular groove (340) is arranged between the operation section (310) and the transition section (320), the first annular groove (340) is arranged along the circumferential direction of the dismounting assembly (300); and a second annular groove (350) is arranged between the transition section (320) and the mounting section (330), the second annular groove (350) is arranged along the circumferential direction of the dismounting assembly (300).

10. The polishing tool for processing a silicon core according to Claim 9, wherein ​

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