Negative pressure suction device
By using a negative pressure suction device and method, the problems of low efficiency and contamination in the collection of small FPL sheets after electronic paper cutting have been solved, achieving efficient and reliable electronic paper cutting production, improving capacity and yield, and reducing production costs.
Patent Information
- Application Number
- CN202520580689.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-31
- Publication Date
- 2026-02-27
- Estimated Expiration
- 2035-03-31
AI Technical Summary
In existing technologies, the collection efficiency of small FPL sheets after laser cutting of electronic paper is low and they are prone to getting dirty, resulting in low production efficiency and low yield.
A negative pressure suction device and method are employed, which uses a vacuum cavity composed of a back plate, a perforated sealing plate, a sponge suction plate and a negative pressure air guide port to suction multiple electronic paper slices at once using a sponge through-hole array and an isolation plate, and combines a vacuum pump to achieve efficient adsorption and movement.
It improves the production capacity and product yield of electronic paper cutting, reduces the possibility of surface contamination, lowers production costs, and extends the service life of porous components.
Smart Images
Figure CN223950350U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application belongs to the field of electronic paper manufacturing, and particularly relates to a negative pressure suction device and method. BACKGROUND
[0002] Electronic paper modules are widely used in the fields of supermarket price tags, electronic books, mobile phones and other electronic devices. With the increasing market demand and the increasing maturity of automatic equipment, the production capacity bottleneck of electronic paper is obvious.
[0003] In the prior art, the production of electronic paper laser cutting has the following problems: the electronic paper cutting method also highlights the bottleneck as follows: FPL (Flexible Printed Lamination, which refers to a flexible printed lamination process) electronic paper needs to be cut into hundreds of small FPLs by laser cutting; the FPLs need to be collected manually after cutting, and more than 300 pieces are collected one by one, which is low in efficiency; if the FPLs are adhered and sucked by double-sided adhesive, the residual adhesive is easy to adhere to the FPL electronic paper.
[0004] In view of the above problems, it is urgent to improve the shortcomings of the existing operation mode by using new jigs and new methods, and to improve the production efficiency and yield. SUMMARY
[0005] The technical problem to be solved by the present application is to avoid the low collection efficiency and easy contamination of small FPLs after laser cutting of the electronic paper mother sheet in the prior art, and to provide a negative pressure suction device and method to improve the production capacity and product yield of electronic paper cutting.
[0006] The technical solution of the present application for solving the above technical problem is a negative pressure suction device for sucking multiple planar electronic components at a time, comprising: a back plate, a hole sealing plate, a sponge air suction plate, and a negative pressure air guide port; the back plate and the hole sealing plate form a vacuum cavity; the negative pressure air guide port is installed on the back plate and communicates with the vacuum cavity, and is used for connecting with an external vacuum air pump; the sponge air suction plate comprises a sponge through hole array, the sponge air suction plate covers the hole sealing plate, and the sponge through hole corresponds to the sealing plate through hole on the hole sealing plate; in a working state, the electronic components cover two or more sponge through holes, and the negative pressure suction device sucks multiple planar electronic components at a time.
[0007] The diameter of the sponge through hole is greater than the diameter of the sealing plate through hole on the hole sealing plate.
[0008] The sponge air suction plate comprises a non-through hole part and a plurality of product suction parts; the product suction part comprises two or more sponge through holes; in a working state, the electronic components correspond to the product suction part, the sponge through hole generates negative pressure, and the electronic components are adsorbed.
[0009] The size and shape of the product suction site correspond to the size and shape of the electronic component.
[0010] The negative pressure suction device further comprises an isolation plate covering the sponge air suction plate; the isolation plate comprises an isolation site and a plurality of adaptive windows, the isolation site is free of holes, and the adaptive windows are hollow windows; in a working state, the electronic component corresponds to the adaptive window, the sponge through hole generates negative pressure, and the electronic component is adsorbed.
[0011] The size and shape of the adaptive window correspond to the size and shape of the electronic component.
[0012] The sponge air suction plate is connected to the isolation plate through a connecting component.
[0013] The negative pressure suction device can be an electronic paper slice, which is obtained by cutting and decomposing a mother slice.
[0014] The negative pressure suction device can comprise two or more negative pressure air guide ports.
[0015] The negative pressure suction device can comprise one or more handles, the handle is fixedly connected to the back plate, and the handle is used to grasp the negative pressure suction device.
[0016] The technical solution of the application to solve the above technical problems can also be an electronic paper slice moving method for sucking and moving a plurality of electronic paper slices at a time, characterized in that it is based on the above-mentioned negative pressure suction device; comprising the following steps A10: the negative pressure suction device is attached to a plurality of electronic paper slices; step A20: starting the vacuum pump, adjusting the negative pressure state of the negative pressure suction device, sucking a plurality of electronic paper slices; step A30: under the negative pressure state of the negative pressure suction device, moving a plurality of electronic paper slices by moving the negative pressure suction device; step A20 and step A10 are not distinguished in sequence.
[0017] The electronic paper slice moving method further comprises the following step A40: after moving a plurality of electronic paper slices to a target position, releasing the negative pressure state of the negative pressure suction device to release a plurality of electronic paper slices.
[0018] One of the beneficial effects of the technical solution in the application is that when the electronic paper is cut, the electronic paper is placed above the multi-hole assembly, and when the laser cuts the electronic paper, the laser will also pass through the A through hole with a high probability, and the probability of damage to the main body of the multi-hole assembly itself by the laser cutting is small. The longer the multi-hole assembly can maintain flatness, the higher the yield of the production process. The multi-hole assembly is a high-value consumable in the production process, and the detachable design facilitates replacement. The multi-hole design also makes the replacement frequency lower, further improving production efficiency and reducing production cost.
[0019] One of the beneficial effects of the technical solution in the present application is that the back plate and the hole sealing plate form a vacuum cavity, and the planar electronic components are adsorbed by the sponge air suction plate, avoiding the gap between the planar electronic components and the vacuum adsorption surface, and making the adsorption more reliable.
[0020] One of the beneficial effects of the technical solution in the present application is that the back plate and the hole sealing plate form a vacuum cavity, and the volume of the cavity and the surface available for sucking multiple planar electronic components are large enough to meet the demand of sucking multiple planar electronic components at one time.
[0021] One of the beneficial effects of the technical solution in the present application is that the diameter of the sponge through hole is larger than the diameter of the sealing plate through hole on the hole sealing plate, which can make the vacuum cavity maintain a vacuum state more continuously; and the diameter of the sponge through hole is larger than the adsorption area of the planar electronic component, which is more conducive to stable suction.
[0022] One of the beneficial effects of the technical solution in the present application is that the sponge air suction plate includes a sponge through hole array, and the sponge material is soft and more easily protects the planar electronic component.
[0023] One of the beneficial effects of the technical solution in the present application is that the sponge through hole array makes the direct adsorption area and adsorption force strong enough to support the suction of multiple planar electronic components at one time.
[0024] One of the beneficial effects of the technical solution in the present application is that the sponge through hole corresponds to the sealing plate through hole on the hole sealing plate, making the air suction channel of the vacuum pump smoother and conducive to maintaining a vacuum state.
[0025] One of the beneficial effects of the technical solution in the present application is that multiple product suction sites can correspond to multiple planar electronic components to be sucked one by one, and can better adsorb and protect.
[0026] One of the beneficial effects of the technical solution in the present application is that the shape and size of the product suction site correspond to the shape and size of the electronic component, which is convenient for better adsorption and protection.
[0027] One of the beneficial effects of the technical solution in the present application is that the isolation plate can increase a layer of protection and reduce sponge wear.
[0028] One of the beneficial effects of the technical solution in the present application is that electronic paper slices and other screen-type flat-state electronic devices are applicable.
[0029] One of the beneficial effects of the technical solution in the present application is that two or more negative pressure air guide ports ensure that the interface of the air pump for vacuum pumping is sufficient; the negative pressure air guide ports are evenly distributed, the vacuum pressure is more balanced, and the adsorption and grabbing are more stable.
[0030] One of the beneficial effects of the technical solution in the present application is that the handle is used to grab the negative pressure suction device, which is convenient for batch grabbing.
[0031] One of the beneficial effects of the technical solutions in the present application is that the electronic paper slice moving method utilizes the negative pressure suction device, which greatly improves the efficiency and reduces the possibility of surface contamination. BRIEF DESCRIPTION OF DRAWINGS
[0032] Figure 1 is a schematic diagram of the bottom of the negative pressure suction device;
[0033] Figure 2 is a schematic diagram of the bottom of the negative pressure suction device;
[0034] Figure 3 is a sectional view along the central axis of the negative pressure suction device;
[0035] Figure 4 is a sectional view along the central axis of the negative pressure suction device; Figure 3
[0036] Figure 5 is a schematic diagram of the bottom of the negative pressure suction device;
[0037] Figure 6 is a sectional view along the central axis of the negative pressure suction device in the combined state;
[0038] Figure 7 is a sectional view along the central axis of the negative pressure suction device in the disassembled state;
[0039] Figure 8 is a schematic diagram of the isolation plate;
[0040] Figure 9 is a schematic diagram of the negative pressure suction device sucking multiple small FPL display screens. DETAILED DESCRIPTION
[0041] The embodiments of the present application will be further described in detail below with reference to the accompanying drawings.
[0042] It should be noted that the following is a description of the preferred embodiments of the present application and does not constitute any limitation on the present application. The description of the preferred embodiments of the present application is only as an illustration of the general principles of the present application. The embodiments described in the present application are only a part of the embodiments of the present application, not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative labor fall within the scope of protection of the present application.
[0043] In the description of the present application, it needs to be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise" and the like indicate the orientation or positional relationship shown in the drawings, which are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second", and the technical features numbered with Arabic numerals 1, 2, 3, etc., and the numbering of "A" and "B" are only for the purpose of description, for the convenience of description, and do not represent the chronological or spatial sequence; cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first", "second", and the technical features numbered with Arabic numerals 1, 2, 3, etc. can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "several" is two or more, unless otherwise explicitly specified.
[0044] As described above, the production of electronic paper laser cutting has many problems: electronic paper needs to be cut into hundreds of small FPLs by laser cutting; FPLs need to be collected manually after cutting, and more than 300 pieces are collected one by one, which is low in efficiency; if FPLs are adhered by double-sided adhesive and sucked, residual adhesive is easy to adhere to FPL electronic paper. Manual collection is very low in efficiency and easy to contaminate, reducing the yield.
[0045] As Figures 1 to 5 An embodiment of a negative pressure suction device for sucking multiple planar electronic components at a time includes a back plate 0120, a hole sealing plate 0130, a sponge air suction plate 0140, and a negative pressure air guide; the back plate 0120 and the hole sealing plate 0130 form a vacuum cavity 0360.
[0046] As Figures 1 to 3 An embodiment of a negative pressure suction device, the negative pressure air guide is installed on the back plate 0120 and communicates with the vacuum cavity 0360, and the negative pressure air guide is used to connect with an external vacuum air pump.
[0047] As Figures 1 to 4 An embodiment of a negative pressure suction device, the sponge air suction plate 0140 includes a sponge through hole array, the sponge air suction plate 0140 covers the hole sealing plate 0130, and the sponge through hole 0420 corresponds to the sealing plate through hole 0430 on the hole sealing plate 0130.
[0048] As Figure 4The diameter of the sponge through hole 0420 is greater than the diameter of the sealing plate through hole 0430 on the sealing plate 0130.
[0049] As Figures 5 to 9 An embodiment of the negative pressure suction device, in a working state, the electronic components cover two or more sponge through holes 0420, and the negative pressure suction device suctions multiple planar electronic components at one time.
[0050] As Figure 5 An embodiment of the negative pressure suction device, the sponge air suction plate 0140 includes 050520, multiple product suction sites 0510; the product suction site 0510 includes two or more sponge through holes 0420.
[0051] As Figures 5 to 9 An embodiment of the negative pressure suction device, in a working state, the electronic components correspond to the product suction site 0510, the sponge through hole 0420 generates negative pressure, and the electronic components are adsorbed.
[0052] As Figures 5 to 9 An embodiment of the negative pressure suction device, the shape and size of the product suction site 0510 correspond to the shape and size of the electronic components.
[0053] As Figures 6 to 9 An embodiment of the negative pressure suction device further includes a separation plate 0610, and the separation plate 0610 covers the sponge air suction plate 0140. Figure 8 The separation plate 0610 includes a separation site 0830 and multiple adaptive windows 0820, the separation site 0830 is hole-free, and the adaptive window 0820 is a hollow window. Figure 8 The separation plate 0610 is installed on the sponge air suction plate 0140 through the cooperation of the mounting hole 0850 and the fastener.
[0054] As Figure 9 In a working state, the electronic components correspond to the adaptive window 0820, the sponge through hole 0420 generates negative pressure, and the electronic components are adsorbed. The electronic components can be a display screen 0910 or an electronic paper slice.
[0055] As Figures 5 to 9 An embodiment of the negative pressure suction device, the shape and size of the adaptive window 0820 correspond to the shape and size of the electronic components.
[0056] As Figure 6 The separation plate 0610 is connected to the sponge air suction plate 0140 through a connecting component.
[0057] In some embodiments, the electronic components are electronic paper slices, and the electronic paper slices are obtained by cutting and decomposing a mother sheet.
[0058] As Figures 1 to 3 An embodiment of the negative pressure suction device comprises two or more negative pressure air guides; it comprises negative pressure air guide A0151 and negative pressure air guide B0152; negative pressure air guide A0151 and negative pressure air guide B0152 are symmetrically arranged on the back plate 0120.
[0059] As Figures 1 to 7 An embodiment of the negative pressure suction device comprises one or more handles 0110, which are fixedly connected with the back plate 0120, and the handles 0110 are used to grab the negative pressure suction device.
[0060] An embodiment of the electronic paper sheet moving method is used to move multiple electronic paper sheets at a time based on the negative pressure suction device; it comprises the following steps A10: the negative pressure suction device is attached to multiple electronic paper sheets; step A20: the vacuum pump is started to adjust the negative pressure state of the negative pressure suction device to suck the multiple electronic paper sheets; step A30: the multiple electronic paper sheets are moved by moving the negative pressure suction device under the negative pressure state of the negative pressure suction device. Step A20 and step A10 are not distinguished in sequence. The vacuum pump can be started first to adjust the negative pressure state of the negative pressure suction device, and then the multiple electronic paper sheets are attached and sucked.
[0061] An embodiment of the electronic paper sheet moving method further comprises step A40: after the multiple electronic paper sheets are moved to the target position, the negative pressure state of the negative pressure suction device is released to release the multiple electronic paper sheets.
[0062] The work jig for improving the material collection efficiency after the electronic paper is cut at present is a kind of integrated vacuum sponge suction disc customized to match the size of the electronic paper mother sheet, and has customized vacuum holes inside. The whole plate of cut materials can be sucked at a time.
[0063] The work jig for improving the material collection efficiency after the electronic paper is cut in the present application mainly solves the problems of low work efficiency, residual adhesive of the original jig adhered to the FPL, etc.
[0064] The vacuum suction device in the prior art leaks vacuum when attaching small pieces of electronic paper, and the small pieces of electronic paper have many longitudinal and transverse gaps after cutting. These gaps will leak vacuum; vacuum leakage reduces the subsequent adsorption capacity. Moreover, the vacuum suction disc in the prior art is too small to meet the demand of sucking all products at a time.
[0065] In this application, a customized mold is used to make the corresponding air path of the sponge, solving the problem of overall vacuum leakage caused by local vacuum leakage. The vacuum adsorption method is used instead of the traditional adhesive method. When working: the work jig, i.e. the negative pressure suction device, uses a vacuum pump as the vacuum air source; the sponge surface of the jig, i.e. the negative pressure suction device, is attached to the product and all products are sucked at one time. When in use, the operator starts the vacuum pump; holds the handle 0110 to attach the sponge to the FPL small pieces cut by the whole machine table; takes out all the products and transfers them to the next work station table, turns off the vacuum source, and the product automatically separates from the jig, and the product transfer is completed.
[0066] The original work efficiency: after cutting, it will be divided into 18x18=324 small pieces, and each piece takes 1 second to collect, a total of 324 / 60=5.4 minutes, and in the extreme state, each piece takes 0.5S to collect, also needs 2.7 minutes. After improvement, the work efficiency of the customized jig: the whole plate takes about 0.5 minutes to suck; the efficiency is improved by 10 times. The original work method has a certain probability of adhering residual glue on the single FPL, and the improved work method using the customized jig has a probability of 0 of adhering residual glue on the FPL.
[0067] As shown in the drawings, the above is only an embodiment of the present application, and does not limit the patent scope of the present application, and any equivalent structure or equivalent process transformation using the content of the application specification and drawings, or direct or indirect application in other related technical fields, are also included in the patent protection scope of the present application.
Claims
1. A negative pressure suction device for suctioning a plurality of planar electronic components at a time, Characterized in that, It comprises a back plate, a hole sealing plate, a sponge air suction plate, and a negative pressure air guide port. The back plate and the hole sealing plate enclose a vacuum cavity. The negative pressure air guide port is installed on the back plate and communicates with the vacuum cavity. The sponge air suction plate comprises a sponge hole array, covers the hole sealing plate, and the sponge holes correspond to the sealing plate holes on the hole sealing plate. In the working state, the electronic components cover two or more sponge holes, and the negative pressure suction device sucks multiple planar electronic components at one time.
2. The negative pressure suction device according to claim 1, characterized in that, The sponge air suction plate comprises a non-hole part and multiple product suction parts, and each product suction part comprises two or more sponge holes. In the working state, the electronic components correspond to the product suction parts, the sponge holes generate negative pressure, and the electronic components are adsorbed.
3. The negative pressure suction device according to claim 2, characterized in that The shape and size of the product suction part correspond to the shape and size of the electronic components.
4. The negative pressure suction device according to claim 1, characterized in that, It further comprises an isolation plate covering the sponge air suction plate. The isolation plate comprises an isolation part and multiple adaptive windows, the isolation part is non-porous, and the adaptive windows are hollow windows. In the working state, the electronic components correspond to the adaptive windows, the sponge holes generate negative pressure, and the electronic components are adsorbed.
5. The negative pressure suction device according to claim 4, characterized in that The shape and size of the adaptive window correspond to the shape and size of the electronic components.
6. The negative pressure suction device according to claim 4, characterized in that The isolation plate is connected to the sponge air suction plate through a connecting part.
7. The negative pressure suction device according to claim 1, characterized in that, The electronic components are electronic paper slices, which are obtained by cutting and decomposing a mother sheet.
8. The negative pressure suction device according to claim 1, characterized in that, It comprises two or more negative pressure air guide ports, which are uniformly distributed.
9. The negative pressure suction device according to claim 1, characterized in that, It comprises one or more handles fixedly connected to the back plate, which are used to grab the negative pressure suction device.
10. The negative pressure suction device according to claim 1, characterized in that, The diameter of the sponge holes is larger than that of the sealing plate holes on the hole sealing plate.