Circuit board slotted hole electroplating device

Abstract

The utility model relates to the technical field of circuit board processing, in particular to a circuit board slot electroplating device which comprises electroplating equipment, the top of the electroplating equipment is fixedly connected with a hydraulic rod, the free end of the hydraulic rod is fixedly connected with a clamping frame, and a circuit substrate is mounted below the clamping frame; reciprocating mechanisms fixedly connected with the electroplating equipment are arranged on the two sides of the hydraulic rod, and air spraying pipes are fixedly connected to the bottoms of the reciprocating mechanisms. The top of the electroplating equipment is fixedly connected with an air pump, the output end of the air pump communicates with an exhaust pipe, the other end of the exhaust pipe communicates with a hose, and the other end of the hose communicates with an air spraying pipe. According to the utility model, the circuit substrate is taken out from the electrolyte through the clamping frame, and external air flows through the exhaust pipe and the hose and is exhausted from one side of the air spraying pipe by starting the air pump, so that the surface of the circuit substrate can be blown, the attached electrolyte is helped to drop into the electrolytic bath, the resource waste is avoided, and the working environment is ensured to be clean and tidy.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of circuit board processing, specifically to a circuit board slot hole electroplating device. BACKGROUND

[0002] In recent years, the electronic industry technology develops rapidly, and the volume of electronic products is getting smaller and smaller, and the functions are getting more and more concentrated. Many electronic products not only have powerful functions, but also have good portability. As the mother of electronic products, the circuit board must also try to improve the circuit density to save limited space, so the fine and thin trend of the circuit board is inevitable. The complete circuit of the circuit board is composed of plane wiring and interlayer hole intercommunication, and the combination of small through holes and fine circuit technology is the premise of realizing high density of printed circuit board. In the case of small aperture, in order to guarantee the electrical performance of interlayer circuit, hole filling copper plating is generally used.

[0003] At present, the existing electroplating equipment is driven by the clamping frame to sink into the electrolyte when used, and after the electrolytic copper plating is completed, the clamping frame is driven to move upwards to take out the circuit board from the electrolyte for the next step work. Since a large amount of electrolyte is attached to the surface of the circuit board after it is taken out, it is easy to cause the electrolyte to drop on the workbench when the next step work is carried out, not only easy to pollute the working environment, but also cause the waste of electrolyte resources. Therefore, aiming at the above problems, a circuit board slot hole electroplating device is provided. UTILITY MODEL CONTENTS

[0004] The utility model aims at providing a circuit board slot hole electroplating device to solve the problems in the above background technology.

[0005] In order to achieve the above purpose, the utility model provides the following technical scheme: a circuit board slot hole electroplating device, comprising electroplating equipment, hydraulic rod and clamping frame;

[0006] The top of the electroplating equipment is fixedly connected with the hydraulic rod, the free end of the hydraulic rod is fixedly connected with the clamping frame, and the lower part of the clamping frame is installed with the circuit board;

[0007] The two sides of the hydraulic rod are provided with reciprocating mechanisms fixedly connected with the electroplating equipment, and the bottom of the reciprocating mechanism is fixedly connected with the air jet pipe;

[0008] The top of the electroplating equipment is fixedly connected with the air pump, the output end of the air pump is communicated with the exhaust pipe, and the other end of the exhaust pipe is communicated with the hose, and the other end of the hose is communicated with the air jet pipe.

[0009] Further, the air jet pipe is inclined, and the end of the air jet pipe facing the circuit board is provided with uniformly distributed exhaust nozzles.

[0010] Further, the outer side of the hose is fixedly connected with a fixing ring, one side of the fixing ring is fixedly connected with a spring, and the other end of the spring is fixedly connected with the exhaust pipe.

[0011] The existing electroplating equipment is used by clamping frame to drive the circuit board to sink into the electrolyte, and after the electrolytic copper plating is completed, the clamping frame is moved up to take out the circuit board from the electrolyte for the next work, and since a large amount of electrolyte is attached to the surface of the circuit board after being taken out, the electrolyte is easily dropped on the workbench during the next work, which not only easily pollutes the working environment, but also causes the waste of electrolyte resources, and when the device is used, the circuit board is taken out from the electrolyte through the clamping frame, and at this time, the air pump is started, the external air flows through the exhaust pipe and the hose, and is discharged from the side of the air jet pipe, so that the surface of the circuit board is blown, which helps the attached electrolyte to drop into the electrolytic tank, avoids the waste of resources, and ensures that the working environment is clean and tidy.

[0012] Further, the reciprocating mechanism comprises a mounting frame, a motor and a reciprocating screw rod, the outer side of the mounting frame is fixedly connected with the electroplating equipment, the inner side of the mounting frame is fixedly connected with the motor, the main shaft end of the motor is fixedly connected with the reciprocating screw rod, the outer side of the reciprocating screw rod is slidably connected with a sliding block, the outer side of the sliding block is fixedly connected with a moving sleeve, the bottom of the moving sleeve is fixedly connected with symmetrically arranged connecting rods, the bottom of the connecting rod is fixedly connected with a connecting block, and the bottom of the connecting block is fixedly connected with the air jet pipe.

[0013] Further, the outer side of the connecting rod is provided with a sliding groove, and the connecting rod is slidably connected with a guide block through the sliding groove.

[0014] The motor drives the reciprocating screw rod to rotate, the reciprocating screw rod drives the sliding block to move up and down, so that the moving sleeve, the connecting rod and the connecting block move up and down, the air jet pipe is conveniently driven to reciprocate and blow the surface of the circuit board, the surface treatment of the circuit board is realized, and the next work of the circuit board is facilitated.

[0015] The guide block is slidably arranged in the sliding groove on the outer side of the connecting rod, so that the stable up-and-down movement of the connecting rod is ensured, and the stable up-and-down movement of the air jet pipe below is driven to realize the cleaning purpose of the circuit board.

[0016] Compared with the prior art, the beneficial effects of the utility model are:

[0017] The utility model discloses when using, its circuit board is taken out from electrolyte through the clamping frame, at this time, through starting the air pump, the outside air flows through the exhaust pipe and the hose, and discharges from the side of the air jet pipe, at this time, can blow the circuit board surface, help the electrolyte drop to the electrolytic cell and avoid resource waste, guarantee the clean and neat working environment.

[0018] The motor drives the reciprocating screw rod to rotate, the reciprocating screw rod drives the sliding block to move up and down, thereby the moving sleeve, the connecting rod and the connecting block move up and down, the air jet pipe is conveniently driven to move reciprocatingly and blow the circuit board surface, the circuit board surface is treated, and the next step work is facilitated.

[0019] The guide block slides in the sliding groove outside the connecting rod, the connecting rod can be stably moved up and down, and the air jet pipe below is stably moved up and down to clean the circuit board. BRIEF DESCRIPTION OF DRAWINGS

[0020] Figure 1 It is the whole structure schematic diagram of the utility model;

[0021] Figure 2 It is the structure schematic diagram of the utility model Figure 1 A place structure schematic diagram;

[0022] Figure 3 It is the structure schematic diagram of the reciprocating mechanism of the utility model.

[0023] In the drawing: 1, electroplating equipment;2, hydraulic rod;3, clamping frame;4, circuit board;5, reciprocating mechanism;501, mounting frame;502, motor;503, reciprocating screw rod;504, sliding block;505, moving sleeve;506, connecting rod;507, connecting block;508, guide block;6, air jet pipe;7, air pump;8, exhaust pipe;9, hose;10, fixed ring;11, spring. DETAILED DESCRIPTION

[0024] The technical scheme in the embodiments of the utility model will be described clearly and completely in combination with the drawings in the embodiments of the utility model, and apparently, the described embodiments are only part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by the ordinary skill in the art without creative labor belong to the scope of protection of the utility model.

[0025] Embodiment 1: please refer to Figure 1 And Figure 2 The utility model provides a technical scheme:

[0026] A circuit board slot hole electroplating device, comprising an electroplating equipment 1, a hydraulic rod 2 and a clamping frame 3;

[0027] The top of the electroplating equipment 1 is fixedly connected with the hydraulic rod 2, the free end of the hydraulic rod 2 is fixedly connected with the clamping frame 3, and the lower portion of the clamping frame 3 is provided with a circuit board 4;

[0028] The two sides of the hydraulic rod 2 are provided with reciprocating mechanisms 5 fixedly connected with the electroplating equipment 1, and the bottom of the reciprocating mechanism 5 is fixedly connected with a gas jet pipe 6;

[0029] The top of the electroplating equipment 1 is fixedly connected with a gas pump 7, the output end of the gas pump 7 is communicated with an exhaust pipe 8, the other end of the exhaust pipe 8 is communicated with a hose 9, and the other end of the hose 9 is communicated with the gas jet pipe 6.

[0030] The gas jet pipe 6 is obliquely arranged, and one end of the gas jet pipe 6 facing the circuit board 4 is provided with uniformly distributed exhaust nozzles.

[0031] The outer side of the hose 9 is fixedly connected with a fixing ring 10, one side of the fixing ring 10 is fixedly connected with a spring 11, and the other end of the spring 11 is fixedly connected with the exhaust pipe 8.

[0032] The existing electroplating equipment is used by driving the circuit board into the electrolyte through the clamping frame, and after the electrolytic copper plating is completed, the circuit board is taken out from the electrolyte by moving the clamping frame upward, and the next step is performed. After the circuit board is taken out, a large amount of electrolyte is attached to the surface thereof, which can easily cause the electrolyte to drop onto the workbench when the next step is performed, which not only easily pollutes the working environment, but also causes the electrolyte resource to be wasted. When the device is used, the circuit board 4 is taken out from the electrolyte through the clamping frame 3, at this time the gas pump 7 is started, the external air flows through the exhaust pipe 8 and the hose 9, and is discharged from the exhaust nozzles on one side of the gas jet pipe 6. At this time, the surface of the circuit board 4 can be blown, which helps the attached electrolyte to drop into the electrolytic tank, avoids resource waste, and ensures that the working environment is clean and tidy.

[0033] In the embodiment, the outer side of the hose 9 is provided with the fixing ring 10, the fixing ring 10 can be pulled upward by the spring 11, the spring 11 is stretched when the gas jet pipe 6 moves downward, and the stable use of the gas jet pipe 6 is ensured. When the gas jet pipe 6 moves upward, the spring 11 pulls the fixing ring 10 upward, the gas jet pipe 6 can move upward, and the disorder of the hose 9 does not affect the use of the equipment.

[0034] Embodiment 2: The embodiment is an improvement on embodiment 1, please refer to Figure 3Specifically, the reciprocating mechanism 5 comprises a mounting frame 501, a motor 502 and a reciprocating screw rod 503, the outer side of the mounting frame 501 is fixedly connected with the electroplating equipment 1, the motor 502 is fixedly connected inside the mounting frame 501, the main shaft tail end of the motor 502 is fixedly connected with the reciprocating screw rod 503, the outer side of the reciprocating screw rod 503 is slidingly connected with a sliding block 504, the outer side of the sliding block 504 is fixedly connected with a moving sleeve 505, the bottom of the moving sleeve 505 is fixedly connected with symmetrically arranged connecting rods 506, the bottom of the connecting rods 506 is fixedly connected with connecting blocks 507, and the bottom of the connecting blocks 507 is fixedly connected with the air jet pipe 6.

[0035] The outer side of the connecting rod 506 is provided with a sliding groove, and the connecting rod 506 is slidingly connected with a guide block 508 through the sliding groove, and the outer side of the guide block 508 is fixedly connected with the mounting frame 501.

[0036] The motor 502 drives the reciprocating screw rod 503 to rotate, and the reciprocating screw rod 503 drives the sliding block 504 to move up and down, so that the moving sleeve 505, the connecting rod 506 and the connecting block 507 move up and down, facilitating the reciprocating movement of the air jet pipe 6 and the blowing of the surface of the circuit substrate 4, realizing the surface treatment of the circuit substrate 4 and facilitating the next step work of the circuit substrate 4.

[0037] The guide block 508 is slidingly arranged in the sliding groove outside the connecting rod 506, which can ensure the stable up-and-down movement of the connecting rod 506, and further drive the stable up-and-down movement of the air jet pipe 6 below to achieve the cleaning purpose of the circuit substrate 4.

[0038] It should be noted that, in the present text, relational terms such as first and second and the like can only be used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply that there is any such actual relationship or order between these entities or operations. Moreover, the terms "include", "contain" or any other variants thereof are intended to cover non-exclusive inclusion, so that the process, method, article or equipment including a series of elements not only includes those elements, but also includes other elements not explicitly listed or inherent to such process, method, article or equipment.

[0039] Although the embodiments of the present application have been shown and described, it can be understood by those skilled in the art that various changes, modifications, replacements and variations can be made to these embodiments without departing from the principles and spirits of the present application, and the scope of the present application is defined by the appended claims and their equivalents.

Claims

1. A circuit board via plating apparatus, characterized by: Including electroplating equipment (1), hydraulic rod (2) and clamping frame (3); The top of the electroplating equipment (1) is fixedly connected with the hydraulic rod (2), the free end of the hydraulic rod (2) is fixedly connected with the clamping frame (3), and the lower portion of the clamping frame (3) is provided with a circuit board (4); The two sides of the hydraulic rod (2) are provided with reciprocating mechanisms (5) fixedly connected with the electroplating equipment (1), and the bottom of the reciprocating mechanism (5) is fixedly connected with a jet pipe (6); The top of the electroplating equipment (1) is fixedly connected with an air pump (7), the output end of the air pump (7) is communicated with an exhaust pipe (8), and the other end of the exhaust pipe (8) is communicated with a hose (9), and the other end of the hose (9) is communicated with the jet pipe (6).

2. The circuit board via plating apparatus of claim 1, wherein: The jet pipe (6) is inclined, and one end of the jet pipe (6) facing the circuit board (4) is provided with uniformly distributed exhaust nozzles.

3. The circuit board via plating apparatus of claim 1 wherein: The outer side of the hose (9) is fixedly connected with a fixed ring (10), one side of the fixed ring (10) is fixedly connected with a spring (11), and the other end of the spring (11) is fixedly connected with the exhaust pipe (8).

4. The circuit board via plating apparatus of claim 1 wherein: The reciprocating mechanism (5) comprises an installation frame (501), a motor (502) and a reciprocating screw rod (503), the outer side of the installation frame (501) is fixedly connected with the electroplating equipment (1), the inside of the installation frame (501) is fixedly connected with the motor (502), the main shaft end of the motor (502) is fixedly connected with the reciprocating screw rod (503), the outer side of the reciprocating screw rod (503) is slidably connected with a sliding block (504), the outer side of the sliding block (504) is fixedly connected with a moving sleeve (505), the bottom of the moving sleeve (505) is fixedly connected with symmetrically arranged connecting rods (506), the bottom of the connecting rod (506) is fixedly connected with a connecting block (507), and the bottom of the connecting block (507) is fixedly connected with the jet pipe (6).

5. The circuit board via plating apparatus of claim 4, wherein: The outer side of the connecting rod (506) is provided with a sliding groove, and the connecting rod (506) is slidably connected with a guide block (508) through the sliding groove, and the outer side of the guide block (508) is fixedly connected with the installation frame (501).

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