Laser defect detection system
By using a laser defect detection system, combined with laser detection and processing equipment, efficient and accurate defect detection and processing of chips or packaging structures can be achieved, solving the problems of insufficient detection accuracy and efficiency in existing technologies.
Patent Information
- Application Number
- CN202422546261.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-22
- Publication Date
- 2026-02-27
- Estimated Expiration
- 2034-10-22
AI Technical Summary
Existing technologies struggle to efficiently detect and improve the accuracy and efficiency of defect detection in chips or package structures, especially for numerous and finely sized test objects.
A laser defect detection system is adopted, including a laser detection device and a photosensitive device. It forms an optical image by emitting and receiving laser beams to identify defects. It is combined with a laser processing device for processing and detection. Multiple moving and transfer devices are used to move in three-dimensional space for comprehensive detection.
It enables comprehensive defect detection of the object under test, improving the accuracy and efficiency of the detection, while also taking into account the process of manufacturing. It can monitor the detection process and identify potential defects in real time.
Smart Images

Figure CN223955416U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to a system for defect detection, in particular to a system for laser detecting semiconductor defects. BACKGROUND
[0002] With the rapid development of science and technology, semiconductor processes are becoming more and more precise. The yield of chips and packaging structures used in electronic devices has a great impact on the performance of electronic devices, so defect detection of chips or packaging structures is very important. It is difficult to detect whether the size of the chip or packaging structure is fine and the amount is large.
[0003] Therefore, how to improve the detection effect and efficiency of the test object (such as a chip, wafer or die) through the improvement of detection technology, and further improve the yield of the process, has become one of the important issues that the industry wants to solve. CONTENT OF THE INVENTION
[0004] The technical problem to be solved by the present application is to provide a laser defect detection system, which comprises a control device, a base, a plurality of laser detection devices and a plurality of light sensing devices. The base supports the test object. The plurality of laser detection devices are electrically connected to the control device, each laser detection device comprises a laser light source and a laser pump, and the laser detection device is located on one side of the test object and emits a first laser beam towards the detection part of the test object. The plurality of light sensing devices are electrically connected to the control device, each light sensing device comprises a light sensing module and an image module, and each light sensing device is used to receive the reflected light of the corresponding first laser beam reflected by the detection part of the test object, or to receive the penetrating light of the first laser beam penetrating through the detection part of the test object. In each light sensing device, the light sensing module transmits an optical signal to the image module, and the image module forms an optical image according to the optical signal.
[0005] According to a feasible embodiment, at least one of the plurality of light sensing modules is a photoelastic sensor, and the optical image formed by the corresponding image module is a stress distribution feature map.
[0006] According to a feasible embodiment, at least one of the plurality of light sensing modules is a light wavefront sensor, and the optical image formed by the corresponding image module is a wave pattern.
[0007] According to a feasible embodiment, the laser defect detection system further comprises a laser processing device, the test object is a plurality of test objects, and the laser processing device emits a second laser beam to connect or weld the plurality of test objects, wherein the time point of emitting the second laser beam is the same as the time point of emitting the first laser beam.
[0008] According to an embodiment, the laser defect detection system further comprises a laser processing device, the laser processing device emitting a second laser beam to the object to be tested to cut the object to be tested, wherein the second laser beam is emitted at the same time as the first laser beam.
[0009] According to an embodiment, the laser defect detection system further comprises a laser processing device, the laser processing device emitting a second laser beam to the object to be tested to cut the object to be tested, wherein the second laser beam is emitted at the same time as the first laser beam.
[0010] According to an embodiment, the laser defect detection system further comprises an image acquisition device electrically connected to the control device, the image acquisition device being configured to acquire images of the detection area of the object to be tested.
[0011] According to an embodiment, the control device comprises an analysis module, the image acquisition device being configured to acquire a plurality of images of a shadow area of the detection area not subjected to each of the first laser beams, the analysis module being configured to receive the plurality of images and determine and calculate the defects and probabilities of the shadow area based on the plurality of images; or compensate the plurality of images and determine and calculate the defects and probabilities of the shadow area.
[0012] According to an embodiment, the laser defect detection system further comprises a plurality of laser moving devices and a plurality of moving devices. The plurality of laser moving devices are electrically connected to the control device and respectively connected to each of the laser detection devices, each of the laser moving devices being configured to move the corresponding laser detection device in a three-dimensional space. The plurality of moving devices are electrically connected to the control device and respectively connected to the plurality of light sensing devices, each of the moving devices being configured to move the corresponding light sensing device in a three-dimensional space.
[0013] According to an embodiment, each of the moving devices comprises a steering module configured to change the emission angle of the first laser beam emitted by the laser detection device.
[0014] One of the beneficial effects of the present application is that the laser defect detection system provided by the present application can make the multiple laser detection devices electrically connected to the control device, each laser detection device includes a laser light source and a laser pump, the laser detection device is located on one side of the object to be detected, and the first laser beam is emitted towards the detection part of the object to be detected. The technical solution of "multiple light sensing devices electrically connected to the control device, each light sensing device includes a light sensing module and an image module, each light sensing device is used to receive the reflected light corresponding to the first laser beam reflected by the detection part of the object to be detected, or to receive the penetrating light of the first laser beam passing through the detection part of the object to be detected. In each light sensing device, the light sensing module transmits an optical signal to the image module, and the image module forms an optical image according to the optical signal. The multiple light sensing modules respectively receive the reflected light of the object to be detected or the penetrating light of the object to be detected, and finally form multiple optical images to judge various defects of the object to be detected. In this way, the defects of the object to be detected can be accurately grasped, and the accuracy of defect detection can be improved.
[0015] One of the beneficial effects of the present application is that the laser defect detection system provided by the present application, at least one of the multiple light sensing modules is a photoelastic sensor, and the optical image formed by the corresponding image module is a stress distribution feature map. In some embodiments, at least one is a light wavefront sensor, and the optical image formed by the corresponding image module is a waveform graph. In this way, the user can detect each part of the object to be detected by using different sensing modules based on different optical principles, comprehensively detect the defects of the object to be detected, and improve the accuracy of defect detection.
[0016] One of the beneficial effects of the present application is that the laser defect detection system provided by the present application can make the laser defect detection system also include a laser processing device, the object to be detected is multiple or at least one, and the laser processing device emits a second laser beam to process the object to be detected, such as welding, cutting or surface modification. The technical solution of "the time point of emitting the second laser beam is the same as the time point of emitting the first laser beam". In this way, the laser defect detection system can process the object to be detected while detecting defects, and can simultaneously consider the efficiency of process and detection.
[0017] One of the beneficial effects of the present application is that the laser defect detection system provided by the present application can make the image acquisition device electrically connected to the control device, and the image acquisition device is used to acquire the image of the detection part of the object to be detected. The technical solution can also monitor the detection status of the detection part of the object to be detected in real time during the detection process.
[0018] Further, according to an embodiment, the control device comprises an analysis module, the image acquisition device acquires a plurality of images of a shadow part of the detection part not receiving each first laser beam, the analysis module receives the plurality of images, and judges and calculates the defect and probability of the shadow part according to the plurality of images; or compensates the plurality of images, and judges and calculates the defect and probability of the shadow part. In this way, the image of the detection part of the to-be-tested object not receiving the first laser beam can be compensated, and the possible defects or problems of the detection part can be further judged, so that the user can master the defects or problems in the detection process.
[0019] One of the beneficial effects of the present application is that the laser defect detection system provided by the present application, through the technical solution of "the laser defect detection system further comprises a plurality of laser moving devices and a plurality of moving devices. The plurality of laser moving devices are electrically connected to the control device and are respectively connected to each laser detection device. Each laser moving device is used to move the corresponding laser detection device in the three-dimensional space. The plurality of moving devices are electrically connected to the control device and are respectively connected to the plurality of light sensing devices. Each moving device is used to move the corresponding light sensing device in the three-dimensional space", corresponding to the to-be-tested object, the laser detection device can project the first laser beam on the to-be-tested object through movement, and the light sensing device can comprehensively receive each reflected light or penetrating light through movement. In this way, the defects and problems of the to-be-tested object can be comprehensively mastered, and the detection accuracy can be improved.
[0020] Further, according to an embodiment, the moving device comprises a turning module, which is used to change the emission angle of the first laser beam emitted by the laser detection device. In this way, the laser detection device can also move (turn the laser head) or change the angle of the projected first laser beam for the specific part (specific position) of the to-be-tested object, so as to ensure that the system obtains the information of the defects of the part of the to-be-tested object, and improves the accuracy of defect detection.
[0021] The detailed contents of other effects and embodiments of the present application are described below in combination with the drawings. BRIEF DESCRIPTION OF DRAWINGS
[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed in the embodiment or prior art description will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments described in the present application, and other drawings can also be obtained by those skilled in the art without creative labor.
[0023] Figure 1 The schematic diagram of the laser defect detection system architecture of an embodiment of the present application;
[0024] Figure 2 The schematic diagram of the laser defect detection system architecture of an embodiment of the present application;
[0025] Figure 3 A schematic diagram of a laser defect inspection system according to an embodiment of the present application;
[0026] Figure 4 A schematic diagram of a laser defect inspection system according to an embodiment of the present application. DETAILED DESCRIPTION
[0027] The following is a detailed description of the implementation of the laser defect inspection system according to the present application. The advantages and effects of the present application can be understood by the content disclosed in the present specification. The present application can be implemented or applied by other different embodiments, and the details in the present specification can be modified and changed based on different viewpoints and applications without departing from the concept of the present application. In addition, the drawings of the present application are simple schematic illustrations and not actual size depictions. The following embodiments will further illustrate the technical content of the present application, but the disclosed content is not intended to limit the protection scope of the present application.
[0028] Referring to Figure 1 A schematic diagram of a laser defect inspection system according to an embodiment of the present application. The laser defect inspection system Z1 includes a control device 2, a base 4, a plurality of laser inspection devices 6, and a plurality of light sensing devices 8. The base 4 supports an object to be inspected (not shown in the figure). The plurality of laser inspection devices 6 are electrically connected to the control device 2. Each laser inspection device 6 includes a laser light source 61 and a laser pump 62. The laser inspection device 6 is located on one side of the object to be inspected and emits a first laser beam toward a detection part of the object to be inspected. The plurality of light sensing devices 8 are electrically connected to the control device 2. Each light sensing device 8 includes a light sensing module 81 and an image module 82. Each light sensing device 8 is used to receive reflected light corresponding to the first laser beam reflected by the detection part of the object to be inspected or to receive penetrating light corresponding to the first laser beam penetrating through the detection part of the object to be inspected. In each light sensing device 8, the light sensing module 81 transmits an optical signal to the image module 82, and the image module 82 forms an optical image according to the optical signal.
[0029] The control device 2 is, for example, a computer host. According to some embodiments, the base 4 is a moving base with a driving motor. According to other embodiments, the base 4 includes a conveying belt on which a plurality of objects to be inspected are carried. According to some embodiments, the base 4 has a hollow part corresponding to the object to be inspected, or is a support frame or a base made of a transparent material. The transparent material is, for example, glass or sapphire.
[0030] In some embodiments, at least one of the plurality of light sensing modules 81 is a photoelastic sensor, and the corresponding image module 82 forms a stress distribution map. In some other embodiments, at least one of the plurality of light sensing modules 81 is a wavefront sensor, and the corresponding image module 82 forms a wave pattern. In other words, the user can set the light sensing modules 81 with different optical detection principles according to the detection purpose, so as to obtain more comprehensive detection information of the object under test.
[0031] According to some embodiments, the object under test is a wafer, a chip or a die. According to some other embodiments, the object under test can be a package (finished or semi-finished). According to some other embodiments, the object under test 1 is on a substrate (e.g. a circuit board), and the substrate is carried by the base 4. The detection site can be, for example, a surface, a hole, a via or a solder structure (soldered area), without limitation. By means of the optical map (e.g. a stress distribution map or a wave pattern), the user can view the stress distribution of the detection site, and determine whether the object under test is a good product, for example, by dividing the "stress distribution" into a good product area, a stress generation area and an NG area. The NG area can have defects such as cracks, uneven surfaces or solder structure separation, etc. Thus, the problem can be solved by finding the defect site according to the stress distribution.
[0032] For example, the common defects of a via (TGV or TSV) include burrs on the inner wall, unevenness, hole deviation, angle error between the hole and the substrate, failure to penetrate the substrate, incorrect size or shape, etc. The stress distribution can be used to distinguish which type of defect it is, and the problem can be solved by finding the defect in the process.
[0033] Please refer to Figure 2 , which is a schematic diagram of the architecture of a laser defect detection system according to an embodiment of the present application. In this embodiment, the laser defect detection system Z2 further comprises a laser processing device 7 (with a laser light source 71 and a laser pump 72). The object under test can be multiple or one. When the object under test is multiple, the laser processing device 7 emits a second laser beam to connect or solder the multiple objects under test. The second laser beam is emitted at the same time as the first laser beam. In some embodiments, the laser processing device 7 emits a second laser beam to the multiple or one object under test to perform surface modification on the object under test. In another embodiment, the laser processing device 7 emits a second laser beam to the object under test to cut the object under test. In other words, the laser detection device 6 and the laser processing device 7 of the present application can be operated synchronously, on the one hand to process the object under test, and on the other hand to detect the object under test at the same time, so as to improve the efficiency of the process and detection.
[0034] Please refer to Figure 3This is a schematic diagram of a laser defect detection system architecture according to an embodiment of this application. In this embodiment, the laser defect detection system Z3 further includes an image acquisition device 9 and an electrical connection control device 2. The image acquisition device 9 is used to acquire images of the detection area of the object under test. The image acquisition device 9 is, for example, a camera or a video recorder. By setting up the image acquisition device 9, the detection status of the detection area of the object under test can be monitored in real time during the detection process.
[0035] in accordance with Figure 3 In the illustrated embodiment, the control device 2 includes an analysis module 21. The image acquisition device 9 acquires multiple images of the shadowed portion of the detection area that does not receive the first laser beam. The analysis module 21 receives the multiple images and, based on these images, determines and calculates the defects and probabilities present in the shadowed portion; or it compensates for the multiple images and then determines and calculates the defects and probabilities present in the shadowed portion. The image acquisition device 9 acquires the shadowed portion of the detection area of the object under test, specifically the portion that cannot receive the first laser beam. The analysis module 21 can use deep learning to determine the possible defects in the shadowed portion and the probability of those defects occurring. Alternatively, the analysis module 21 can further determine and calculate the defects and probabilities present in the shadowed portion by compensating for the images. This improves the accuracy of defect detection.
[0036] Please see Figure 4 This is a schematic diagram of a laser defect detection system architecture according to an embodiment of this application. In this embodiment, the laser defect detection system Z4 further includes multiple moving devices 102 and multiple transfer devices 104. The multiple moving devices 102 are electrically connected to the control device 2 and are respectively connected to each laser detection device 6. Each moving device 102 is used to move the corresponding laser detection device 6 in three-dimensional space. The multiple transfer devices 104 are electrically connected to the control device 2 and are respectively connected to multiple photosensitive devices 8. Each transfer device 104 is used to move the corresponding photosensitive device 8 in three-dimensional space. Through the moving devices 102, the laser detection device 6 can move in three-dimensional space, thus enabling the emission of a first laser beam at a specific detection location in the object under test. On the other hand, since the transfer module can move the photosensitive device 8 in three-dimensional space, the photosensitive device 8 can move to the position of the reflected light reflected by the detection part of the first laser beam through the detection part of the object under test, or the position of the transmitted light that passes through the detection part of the object under test. After receiving such beams, it accurately generates light signals, so that the optical image generated by the image module 82 fully presents the defects of the object under test, thereby improving the accuracy of defect detection.
[0037] Other basis Figure 4In the illustrated embodiment, each mobile device 102 includes a steering module 1021 to change the emission angle of the first laser beam emitted by the laser detection device 6. By means of the steering module 1021, the user can change the angle at which the laser detection device 6 projects the first laser beam, for example, to change the direction in which the laser head faces the object to be measured. In this way, the first laser beam can be projected onto a specific part of the object to be measured.
[0038] It should be noted that the wavelength of the first laser beam emitted by the laser detection device 6 of the present application can be adjusted according to the detection distance (the distance between the laser detection device 6 and the object to be measured), the characteristics of the part to be detected (such as cracks, holes, perforations, joints, concave-convex surfaces, etc.), and the material of the object to be measured. The wavelength of the first laser beam emitted by the laser detection device 6 of the present application can also be adjusted according to the material of the object to be measured.
[0039] [Advantages of the embodiments]
[0040] One of the advantages of the present application is that the laser defect detection system provided by the present application can form multiple optical images by means of the technical solutions of "a plurality of laser detection devices electrically connected to the control device, each laser detection device comprising a laser light source and a laser pump, the laser detection device being located on one side of the object to be measured and emitting a first laser beam towards the detection part of the object to be measured" and "a plurality of light sensing devices electrically connected to the control device, each light sensing device comprising a light sensing module and an image module, each light sensing device being used to receive reflected light reflected by the detection part of the object to be measured or to receive penetrating light penetrating through the detection part of the object to be measured, in each light sensing device, the light sensing module transmits an optical signal to the image module, and the image module forms an optical image according to the optical signal". In this way, multiple light sensing modules can receive reflected light or penetrating light from the object to be measured, and multiple optical images can be formed to determine various defects of the object to be measured. Therefore, the defects of the object to be measured can be determined, and the accuracy of defect detection can be improved.
[0041] One of the advantages of the present application is that the laser defect detection system provided by the present application can form multiple optical images by means of the technical solutions of "a plurality of laser detection devices electrically connected to the control device, each laser detection device comprising a laser light source and a laser pump, the laser detection device being located on one side of the object to be measured and emitting a first laser beam towards the detection part of the object to be measured" and "a plurality of light sensing devices electrically connected to the control device, each light sensing device comprising a light sensing module and an image module, each light sensing device being used to receive reflected light reflected by the detection part of the object to be measured or to receive penetrating light penetrating through the detection part of the object to be measured, in each light sensing device, the light sensing module transmits an optical signal to the image module, and the image module forms an optical image according to the optical signal". In this way, multiple light sensing modules can receive reflected light or penetrating light from the object to be measured, and multiple optical images can be formed to determine various defects of the object to be measured. Therefore, the defects of the object to be measured can be determined, and the accuracy of defect detection can be improved.
[0042] One of the benefits of the present application is that the laser defect detection system can process the workpiece while detecting defects simultaneously, thus improving the efficiency of the process and detection.
[0043] One of the benefits of the present application is that the laser defect detection system can monitor the detection status of the detection part of the workpiece in real time during the detection process.
[0044] Further, according to an embodiment, the control device includes an analysis module. The image acquisition device acquires a plurality of images of a shadow part of the detection part that does not receive each first laser beam. The analysis module receives the plurality of images, determines and calculates the defects and probabilities of the shadow part according to the plurality of images, or compensates the plurality of images and determines and calculates the defects and probabilities of the shadow part. In this way, the images of the detection part of the workpiece that does not receive the first laser beam can be compensated, and the possible defects or problems of the detection part can be further determined, so that the user can master the defects or problems in the detection process.
[0045] One of the benefits of the present application is that the laser defect detection system can monitor the detection status of the detection part of the workpiece in real time during the detection process.
[0046] Further, according to an embodiment, the control device includes an analysis module. The image acquisition device acquires a plurality of images of a shadow part of the detection part that does not receive each first laser beam. The analysis module receives the plurality of images, determines and calculates the defects and probabilities of the shadow part according to the plurality of images, or compensates the plurality of images and determines and calculates the defects and probabilities of the shadow part. In this way, the images of the detection part of the workpiece that does not receive the first laser beam can be compensated, and the possible defects or problems of the detection part can be further determined, so that the user can master the defects or problems in the detection process.
[0047] The above-described embodiments and / or implementations are merely intended for describing and / or illustrating the preferred embodiments and / or implementations of the present application, and are not intended to limit the embodiments of the present application in any form. Any person skilled in the art can make some changes or modifications to other equivalent embodiments without departing from the technical means disclosed in the present application, but such changes or modifications should be considered as substantially the same technology or embodiments as the present application.
Claims
1. A laser defect detection system, characterized by, The laser defect detection system comprises: a control device; a base supporting an object to be measured; a laser detection device electrically connected to the control device, the laser detection device comprising a laser source and a laser pump, the laser detection device being located on one side of the object to be measured and emitting a first laser beam in a continuous line scanning manner towards a detection part of the object to be measured; a light sensing device electrically connected to the control device, the light sensing device comprising a light sensing module and a moving module, the moving module being connected to the light sensing module, the moving module being used to move the light sensing module in a three-dimensional space, the light sensing module being used to receive reflected light reflected by the first laser beam through the detection part of the object to be measured or to receive penetrating light of the first laser beam penetrating through the detection part of the object to be measured, and output a light signal; and an optical image device electrically connected to the control device, receiving the light signal, and generating an optical image according to the light signal; wherein the control device is configured as a computer host; wherein the control device controls the laser detection device to scan by being electrically connected to the laser detection device; wherein the control device controls the laser detection device to move by being electrically connected to the light sensing device.
2. A laser defect detection system, characterized by, The laser defect detection system comprises: a control device; a base supporting an object to be measured; a laser detection device electrically connected to the control device, the laser detection device comprising a laser source and a laser pump, the laser detection device being located on one side of the object to be measured and emitting a first laser beam in a continuous line scanning manner towards a detection part of the object to be measured; a plurality of light sensing devices located on one side of the object to be measured, the plurality of light sensing devices being electrically connected to the control device respectively, each of the light sensing devices comprising a light sensing module and a fixing module, each of the fixing modules being fixedly connected to each of the light sensing modules respectively, each of the light sensing modules being used to receive reflected light reflected by the first laser beam through the detection part of the object to be measured or to receive penetrating light of the first laser beam penetrating through the detection part of the object to be measured, and output a light signal respectively; and an optical image device electrically connected to the control device, receiving the plurality of light signals, and generating an optical image according to the plurality of light signals.
3. A laser defect detection system, characterized by, The laser defect detection system comprises: a control device; a base supporting an object to be measured; a laser detection device electrically connected to the control device, the laser detection device comprising a laser source and a laser pump, the laser detection device being located on one side of the object to be measured and emitting a first laser beam in a continuous line scanning manner towards a detection part of the object to be measured; a moving device electrically connected to the control device and connected to the laser detection device, the moving device being used to selectively move the laser detection device in a three-dimensional space, the moving device comprising a turning module used to change an emission angle of the first laser beam emitted by the laser detection device; A light sensing device electrically connected to the control device, the light sensing device comprising a light sensing module configured to receive reflected light reflected by the first laser beam from the detection site of the object under test or to receive penetrated light penetrated by the first laser beam through the detection site of the object under test, and output a light signal; and An optical imaging device electrically connected to the control device, configured to receive the light signal and generate an optical image according to the light signal.
4. The laser defect detection system of any of claims 1 to 3, wherein, The light sensing module is a photoelastic sensor, and the optical image is a stress distribution feature map.
5. The laser defect detection system of any of claims 1 to 3, wherein, The light sensing module is a wavefront sensor, and the optical image is a wave pattern.
6. The laser defect detection system of any of claims 1 to 3, wherein, The laser defect detection system further comprises an image acquisition device electrically connected to the control device, the image acquisition device being configured to acquire an image of the detection site of the object under test.
7. The laser defect detection system of any of claims 1 to 3, wherein, The laser defect detection system further comprises a laser processing device, the object under test is a plurality of objects, and the laser processing device emits a second laser beam to the plurality of objects under test to connect or weld the plurality of objects under test, wherein the second laser beam is emitted at the same time point as the first laser beam.
8. The laser defect detection system of any of claims 1 to 3, wherein, The laser defect detection system further comprises a laser processing device, the laser processing device emits a second laser beam to the object under test to cut the object under test, wherein the second laser beam is emitted at the same time point as the first laser beam.
9. The laser defect detection system of any of claims 1 to 3, wherein, The laser defect detection system further comprises a laser processing device, the laser processing device emits a second laser beam to the object under test to perform surface modification on the object under test, wherein the second laser beam is emitted at the same time point as the first laser beam.