FPC structure for preventing FOF binding position from being pulled

Abstract

The utility model discloses an FPC structure preventing pulling of an FOF binding position, which comprises an FPC body, the FPC body comprises an FOF binding end and a connector end, the FPC body, the FOF binding end and the connector end are integrally formed, a notch is arranged between the FOF binding end and the connector end, and the notch is used for reducing pulling of the FOF binding end. According to the utility model, the notch is arranged between the FOF binding end and the connector end, so that the FOF binding end cannot be pulled when the connector end is bent for assembling and testing, and influence on a display product is avoided.

Description

TECHNICAL FIELD

[0001] The utility model relates to FPC technical field especially relates to a kind of FPC structure for preventing FOF binding position to be pulled. BACKGROUND

[0002] FPC is usually bound on display product, and is used to connect with customer mainboard to ensure the normal use of display module. FPC is provided with binding end bound to display product and connector end connected with customer mainboard. With the continuous development of product, the requirement of product is higher and higher, and many customers have specific assembly requirements for the position of connector connected with customer mainboard. The connector end and binding end of FPC are adjacent, and the connector end of FPC needs to be bent when connected with customer mainboard. When the bent part of connector end of FPC is close to binding end, there will be pulling action on binding end during assembly and testing, which will cause display abnormality and other adverse risks. UTILITY MODEL CONTENT

[0003] The utility model aims at overcoming the deficiencies in prior art, and provides a kind of FPC structure for preventing FOF binding position to be pulled.

[0004] The utility model aims at overcoming the deficiencies in prior art, and provides a kind of FPC structure for preventing FOF binding position to be pulled.

[0005] A kind of FPC structure for preventing FOF binding position to be pulled, comprising: FPC body, FPC body includes FOF binding end and connector end, the FPC body, the FOF binding end and the connector end are integrally formed, and the FOF binding end and the connector end are provided with cutout, and the cutout is used to reduce the pulling of the FOF binding end.

[0006] In one embodiment, the connector end is provided with a bending zone near the FOF binding end, the bending zone is used to facilitate the bending of the connector end, and the cutout is located between the bending zone and the FOF binding end.

[0007] In one embodiment, the cutout is arc-shaped, and the cutout is arc-shaped from the connection between the bending zone and the FOF binding end to the inside of the FPC body, and one side of the cutout is communicated with the outside.

[0008] In one embodiment, the cutout has an opening width of 1mm-2mm, and the cutout is opened towards the position close to the inner side of the bending zone.

[0009] In one embodiment, the inner wall of the cutout is coated with thermosetting green oil.

[0010] In one embodiment, the FOF binding end is parallel or at an angle to the connector end.

[0011] In one embodiment, the FOF binding end is provided with a FOF binding position for binding a COF IC.

[0012] In one embodiment, the distance between the side of the cutout facing the FOF binding end and the FOF binding position is 2-3mm.

[0013] In one embodiment, the bending area is coated with a solder resist ink.

[0014] In one embodiment, the connector end is provided with a connector, which is a BTB connector or a ZIF connector.

[0015] Compared with the prior art, the present application has at least the following advantages:

[0016] The FPC structure for preventing the FOF binding position from being pulled, according to the present application, sets a cutout between the FOF binding end and the connector end, so that the FOF binding end will not be pulled during the bending and assembling and testing of the connector end, thereby avoiding the COF IC on the FOF binding end from being detached and affecting the display product. BRIEF DESCRIPTION OF DRAWINGS

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed in the embodiments will be briefly introduced as follows.

[0018] Figure 1 A structure schematic diagram of the FOF binding end being parallel to the connector end in the FPC structure for preventing the FOF binding position from being pulled, according to the present application, is provided.

[0019] Figure 2 A structure schematic diagram of the FOF binding end being at an angle to the connector end in the FPC structure for preventing the FOF binding position from being pulled, according to the present application, is provided.

[0020] BRIEF DESCRIPTION OF DRAWINGS: 10, FPC body; 20, FOF binding end; 21, FOF binding position; 30, connector end; 31, connector; 40, bending area; 41, solder resist ink; 50, cutout; 60, thermosetting green oil. DETAILED DESCRIPTION

[0021] In order to facilitate the understanding of the present application, the present application will be more fully described below with reference to the relevant drawings.

[0022] A FPC structure for preventing the FOF binding position from being pulled, according to the present application, is described with reference to Figure 1 andFigure 2 , including the FPC body 10, the FPC body 10 including the FOF binding end 20 and the connector end 30, the FPC body 10, the FOF binding end 20 and the connector end 30 being integrally formed, a cutout 50 being provided between the FOF binding end 20 and the connector end 30, the cutout 50 being used to reduce the pulling of the FOF binding end 20. It should be noted that the FOF binding end 20 is used to bind the COF IC, and the connector end 30 is provided with a connector 31 to connect with the customer's mainboard. The FPC body 10 is composed of a substrate layer and a wiring layer, and the wiring layer is wired to the connector end 30, so that the FPC body 10 is connected with the customer's mainboard through the connector 31 of the connector end 30. The cutout 50 is used to reduce the pulling of the FOF binding end 20 by the connector end 30 during assembly or testing after the FOF binding end 20 binds the COF IC, to avoid the risk of the COF IC on the FOF binding end 20 being detached.

[0023] Further, referring to Figure 1 and Figure 2 , the FOF binding end 20 is provided with a FOF binding position 21, and the FOF binding position 21 is used to bind the COF IC. When the FPC body 10 is bound with the display product, the COF IC of the display product is bound to the FOF binding position 21. It should be noted that the size of the FOF binding position 21 is smaller than the size of the FOF binding end 20.

[0024] Further, referring to Figure 1 and Figure 2 , the connector 31 of the connector end 30 is a BTB connector or a ZIF connector.

[0025] Referring to Figure 1 and Figure 2 , the FOF binding end 20 and the connector end 30 are two ends respectively extending from the FPC body 10, and the connector end 30 is provided with a bending area 40 near the position of the FOF binding end 20, and the bending area 40 is used to facilitate the bending of the connector end 30 to connect with the customer's mainboard. It should be noted that the bending area 40 is softened and has good flexibility to facilitate bending when the connector end 30 is connected with the customer's mainboard.

[0026] Further, referring to Figure 1 and Figure 2 , the bending area 40 is coated with a solder resist ink 41, which can improve the bending resistance of the bending area 40, so that it is not easy to break when bending.

[0027] Referring to Figure 1 and Figure 2, the cutout 50 is located between the bending area 40 and the FOF binding end 20, the cutout 50 plays a role in separating the bending area 40 and the FOF binding end 20, so as to reduce the pulling degree of the FOF binding end 20 when the bending area 40 is bent. The cutout 50 is arc-shaped, the cutout 50 is arc-shaped from the connection between the bending area 40 and the FOF binding end 20 to the inside of the FPC body 10, one side of the cutout 50 is communicated with the outside, so as to reduce the pulling degree of the FOF binding end 20 when the connector end 30 is bent.

[0028] Further, referring to Figure 1 and Figure 2 , the cutout 50 is located between the bending area 40 and the FOF binding end 20, the cutout 50 plays a role in separating the bending area 40 and the FOF binding end 20, so as to reduce the pulling degree of the FOF binding end 20 when the bending area 40 is bent. The cutout 50 is arc-shaped, the cutout 50 is arc-shaped from the connection between the bending area 40 and the FOF binding end 20 to the inside of the FPC body 10, one side of the cutout 50 is communicated with the outside, so as to reduce the pulling degree of the FOF binding end 20 when the connector end 30 is bent.

[0029] Referring to Figure 1 and Figure 2 , the inner wall of the cutout 50 is coated with thermosetting green oil 60, the thermosetting green oil 60 has bending resistance, which can improve the bending resistance of the cutout 50 and protect the position of the FPC body 10 at the cutout 50.

[0030] Further, referring to Figure 1 and Figure 2 , the FOF binding end 20 and the connector end 30 are parallel or at an angle, for example, at a right angle. The cutout 50 is located between the bending area 40 on one side of the connector end 30 and the FOF binding end 20, so that the FOF binding end 20 and the connector end 30 can reduce the pulling of the FOF binding end 20 regardless of the angle.

[0031] Further, referring to Figure 1 and Figure 2 , the distance between the side of the cutout 50 towards the FOF binding end 20 and the FOF binding position 21 is 2-3mm, the cutout 50 is arranged at a distance from the FOF binding position 21, so as to avoid the FOF binding position 21 on one side of the cutout 50 and directly damaging the FOF binding position 21 when the bending area 40 is bent.

[0032] The utility model discloses a cutout 50 is arranged between the FOF binding end 20 and the connector end 30, so that the connector end 30 will not pull the FOF binding end 20 during bending assembly and testing, so as to avoid the FOF binding end 20 from COF IC and affect the display product.

[0033] The above-described embodiments only express several implementation manners of the utility model, the description is more specific and detailed, but can not therefore be understood as the limitation of the utility model patent range. It should be pointed out that for ordinary skilled person in the art, without departing from the utility model concept, several modifications and improvements can be made, which belong to the protection range of the utility model. Therefore, the protection range of the utility model patent should be subject to the appended claims.

Claims

1. An FPC structure for preventing a pull on a FOF binding site, characterized by, The application relates to an FPC body (10) comprising an FOF binding end (20) and a connector end (30), wherein the FPC body (10), the FOF binding end (20) and the connector end (30) are integrally formed, a cutout (50) is arranged between the FOF binding end (20) and the connector end (30), and the cutout (50) is used for reducing pulling of the FOF binding end (20). The connector end (30) is provided with a bending area (40) near the FOF binding end (20), the bending area (40) is used for facilitating bending of the connector end (30), and the cutout (50) is arranged between the bending area (40) and the FOF binding end (20).

2. The FPC structure for preventing the FOF binding position from being pulled according to claim 1, wherein, The cutout (50) is arc-shaped, the cutout (50) is arc-shaped from the connection between the bending area (40) and the FOF binding end (20) to the inside of the FPC body (10), and one side of the cutout (50) is communicated with the outside.

3. The FPC structure for preventing the FOF binding position from being pulled according to claim 2, wherein, The cutout (50) has an opening width of 1mm-2mm, and the cutout (50) is arranged towards the inside of the bending area (40).

4. The FPC structure for preventing the FOF binding position from being pulled according to claim 3, wherein, The inner wall of the cutout (50) is coated with thermosetting green oil (60).

5. The FPC structure for preventing the FOF binding position from being pulled according to claim 4, wherein, The FOF binding end (20) and the connector end (30) are arranged in parallel or at an angle.

6. The FPC structure for preventing the FOF binding position from being pulled according to claim 5, wherein, The FOF binding end (20) is provided with an FOF binding position (21), and the FOF binding position (21) is used for binding a COF IC.

7. The FPC structure for preventing the FOF binding position from being pulled according to claim 6, wherein, The distance between one side of the cutout (50) towards the FOF binding end (20) and the FOF binding position (21) is 2mm-3mm.

8. The FPC structure for preventing the FOF binding position from being pulled according to claim 7, wherein, The bending area (40) is coated with solder resist ink (41).

9. The FPC structure for preventing the FOF binding position from being pulled according to claim 2, wherein, The connector end (30) is provided with a connector (31), and the connector (31) is a BTB connector or a ZIF connector.

10. The FPC structure for preventing the FOF binding position from being pulled according to claim 1, wherein, ​

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