Cooling fin mounting device
By employing a combination design of inclined support surface and rolling element in the heat sink mounting device, the problem of air bubbles caused by local deformation of the heat sink is solved, achieving uniform force and tight fit of the heat sink, thus improving product quality and production efficiency.
Patent Information
- Application Number
- CN202520345990.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-28
- Publication Date
- 2026-02-27
- Estimated Expiration
- 2035-02-28
AI Technical Summary
In existing technologies, the length direction of the heat sink is perpendicular to the conveying direction of the support track, and the rolling direction of the roller is consistent with the width direction of the heat sink. This results in large local deformation of the heat sink when it is squeezed, forming air bubbles, which affects product quality and efficiency.
Design a heat sink mounting device that uses a combination of inclined support surface and rolling element. The rolling axis of the rolling element extends along the conveying direction of the support track, and the rolling direction is consistent with the length direction of the heat sink. The inclined support surface is used to lift and tilt the COF tape to form an angle to expel air bubbles.
This achieves uniform stress on the heat sink, avoids localized deformation, improves product yield and production efficiency, ensures tight adhesion between the heat sink and the COF tape, and enhances product quality.
Smart Images
Figure CN223957935U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of semiconductor packaging, in particular to a heat sink mounting device. BACKGROUND
[0002] With the increase of chip integration and power consumption, the heat per unit area of the chip is higher and higher when the chip is working. Usually, a heat sink is mounted outside the chip, so that the heat generated by the packaged chip during work is transmitted to the environment by the heat sink.
[0003] The mounting of a heat sink on a COF (Chip On Film) product includes two working processes: process one, in the process of conveying the COF product on the support rail, a surface-inclined taking head is used to suck the heat sink to the top of the COF product, the suction force of the taking head disappears, the heat sink falls onto the COF product under the action of gravity, and forms an included angle with the COF product in the conveying direction; process two, the support rail continues to convey the COF product with the heat sink, and the heat sink is completely attached to the COF product by rolling and pressing along the conveying direction through a roller. In the above process, since the length direction of the heat sink is perpendicular to the conveying direction of the support rail, the rolling and pressing direction of the roller is consistent with the width direction of the heat sink, which makes the heat sink be pressed and may be deformed locally to form bubbles, thereby affecting the product quality. CONTENT OF THE UTILITY MODEL
[0004] The embodiment of the present application at least provides a heat sink mounting device, which can realize the rolling and pressing mounting of the heat sink along the length direction of the heat sink, so as to avoid the formation of bubbles due to the local large deformation of the heat sink, improve the product yield, and improve the mounting efficiency.
[0005] The embodiment of the present application provides a heat sink mounting device, which comprises two support rails, a support table, a taking head and a rolling and pressing piece.
[0006] The two support rails are oppositely arranged, and are used for conveying a COF tape.
[0007] The support table is located between the two support rails, and has an inclined support surface for supporting the COF tape, wherein the inclined direction of the inclined support surface is perpendicular to the conveying direction of the support rail.
[0008] The taking head is located above the support table, and the bottom of the taking head has a suction surface for sucking the heat sink.
[0009] The rolling and pressing piece is located above the support table, and the rolling axis of the rolling and pressing piece extends along the conveying direction of the support rail.
[0010] In an alternative embodiment, the inclination angle of the inclined support surface deviating from the horizontal plane is 2.85°±0.5°.
[0011] In an alternative embodiment, the height difference between the highest end and the lowest end of the inclined support surface is not greater than 2mm.
[0012] In an alternative embodiment, the edge of the inclined support surface is provided with a chamfer.
[0013] In an alternative embodiment, the support table has a plurality of inclined support surfaces, and the plurality of inclined support surfaces are arranged in intervals along the conveying direction of the support track.
[0014] In an alternative embodiment, the support table is detachably arranged between the two support tracks.
[0015] In an alternative embodiment, the support table is a light-transmitting structure.
[0016] In an alternative embodiment, the support table is an anti-static structure.
[0017] In an alternative embodiment, the adsorption surface of the label taking head is a plane.
[0018] In an alternative embodiment, the adsorption surface of the label taking head is an inclined surface, and the adsorption surface is opposite to the inclination direction of the inclined support surface with respect to the horizontal plane.
[0019] The above technical solutions of the present application have the following beneficial technical effects:
[0020] The heat sink mounting device of the present application can lift the COF tape and incline it in a direction perpendicular to the conveying direction of the support track, and since the rolling axis of the rolling member extends along the conveying direction of the support track, the rolling member can roll in the direction perpendicular to the conveying direction of the support track. Therefore, the heat sink mounting device can realize rolling mounting of the heat sink in the length direction of the heat sink, and compared with the prior art rolling method in the width direction of the heat sink, rolling in the length direction of the heat sink can make the force on the heat sink more uniform, thereby avoiding the formation of air bubbles due to large local deformation of the heat sink, and is conducive to improving product yield.
[0021] In addition, since the inclined support surface can lift the COF tape and incline it in a direction perpendicular to the conveying direction of the support track, when multiple heat sinks are placed on the surface of the COF tape at the same time, the rolling member can roll on the multiple heat sinks at the same time, which is conducive to improving production efficiency.
[0022] To make the above-mentioned objectives, features and advantages of this application more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description
[0023] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly described below. These drawings are incorporated in and constitute a part of this specification. They illustrate embodiments conforming to this application and, together with the specification, serve to explain the technical solutions of this application. It should be understood that the following drawings only show some embodiments of this application and should not be considered as limiting the scope. For those skilled in the art, other related drawings can be obtained from these drawings without creative effort.
[0024] Figure 1 This paper shows a schematic diagram of the structure of a heat sink mounting device provided in an embodiment of this application;
[0025] Figure 2 It shows Figure 1 A schematic diagram of the heat sink mounting device provided for mounting heat sinks;
[0026] Figure 3 It shows Figure 2 Cross-sectional view of AA in the middle;
[0027] In the diagram: 1. Support rail; 2. Support platform; 2.1. Inclined support surface; 3. Tag pick; 3.1. Adsorption surface; 4. Rolling component; 5. COF tape roll; 6. Heat sink. Detailed Implementation
[0028] As chip integration and power consumption increase, the heat generated per unit area of the chip becomes increasingly higher during operation. Typically, a heat sink is mounted on the outside of the chip to transfer the heat generated during operation to the environment.
[0029] Mounting heat sinks on COF (Chip On Film) products involves two workflows: First, as the COF product is transported along a support track, a tilted pick-up head attracts the heat sink directly above the COF product. Once the suction disappears, the heat sink falls onto the COF product under gravity, forming an angle with it in the transport direction. Second, the support track continues to transport the COF product with the heat sink, and rollers roll it along the transport direction to ensure complete adhesion between the heat sink and the COF product. During this process, because the length of the heat sink is perpendicular to the transport direction of the support track, the rolling direction of the rollers is consistent with the width direction of the heat sink. This can cause the heat sink to deform significantly in certain areas during compression, trapping air and forming bubbles, thus affecting product quality.
[0030] To this end, the embodiment of the present application provides a fin mounting device, which can realize rolling mounting of the fin along the length direction of the fin, so that the fin can avoid forming air bubbles due to large local deformation, and the product yield can be improved.
[0031] Reference Figures 1 to 3 , shows a fin mounting device, which comprises two support rails 1, a support table 2, a label taking head 3 and a rolling piece 4. The two support rails 1 are oppositely arranged and are used to convey a COF tape 5. The support table 2 is located between the two support rails 1 and has an inclined support surface 2.1 for supporting the COF tape 5, the inclined direction of the inclined support surface 2.1 being perpendicular to the conveying direction of the support rails 1. The label taking head 3 is located above the support table 2, the bottom of the label taking head 3 has a suction surface 3.1 for adsorbing a fin 6, and the label taking head 3 is used to adsorb the fin 6 and place the fin 6 on the COF tape 5. The rolling piece 4 is located above the support table 2, the rolling axis of the rolling piece 4 extends along the conveying direction of the support rails 1, and the rolling piece 4 is used to roll in a direction perpendicular to the conveying direction of the support rails 1 to adhere the fin 6 and the COF.
[0032] The working principle of the fin mounting device is as follows: when the two support rails 1 convey the COF tape 5, the COF tape 5 can be lifted by the inclined support surface 2.1, and since the inclined direction of the inclined support surface 2.1 is perpendicular to the conveying direction of the support rails 1, the lifted COF tape 5 can also be inclined in a direction perpendicular to the conveying direction of the support rails 1. When the fin 6 adsorbed by the label taking head 3 falls on the COF tape 5, since the COF tape 5 is inclined, an included angle will be formed between the fin 6 and the COF tape 5, that is, along the length direction of the fin 6, one end of the fin 6 is in contact with the COF tape 5, and the other end is separated from the COF tape 5. When the rolling piece 4 rolls in a direction perpendicular to the conveying direction of the support rails 1, the rolling piece 4 performs a rolling action from the end of the fin 6 in contact with the COF tape 5 to the end of the fin 6 separated from the COF tape 5, and since the included angle exists, the purpose of discharging air bubbles is achieved, so that the fin 6 can tightly adhere to the COF tape 5, thereby improving the heat dissipation performance of the COF tape 5.
[0033] In the above scheme, the fin mounting device can lift the COF tape 5 and tilt it in a direction perpendicular to the conveying direction of the support rail 1 by the inclined support surface 2.1, and since the rolling axis of the rolling member 4 extends along the conveying direction of the support rail 1, the rolling member 4 can roll in a direction perpendicular to the conveying direction of the support rail 1. Therefore, the fin mounting device can achieve the rolling mounting of the fin 6 in the length direction of the fin 6, and compared with the prior art rolling method in the width direction of the fin 6, the rolling in the length direction of the fin 6 can make the stress on the fin 6 more uniform, thereby avoiding the formation of bubbles due to local large deformation of the fin 6, and facilitating the improvement of product yield.
[0034] In addition, since the inclined support surface 2.1 can lift the COF tape 5 and tilt it in a direction perpendicular to the conveying direction of the support rail 1, when multiple fins 6 are placed on the surface of the COF tape 5 at the same time, the rolling member 4 can simultaneously roll the multiple fins 6, which is beneficial to improve the production efficiency.
[0035] It should be noted that the COF tape 5 has multiple COF products connected in sequence, and when the fin 6 is mounted, the fin mounting device actually mounts the fin 6 on the surface of each COF product.
[0036] In some embodiments, the inclination angle of the inclined support surface 2.1 deviating from the horizontal plane is 2.85°±0.5°, and the height difference between the highest end and the lowest end of the inclined support surface 2.1 is not greater than 2mm. By reasonably controlling the inclination of the inclined support surface 2.1, the bubble can be effectively discharged, and the mounting precision can be maintained.
[0037] In some embodiments, the edge of the inclined support surface 2.1 is provided with a chamfer. In this way, the COF product can be prevented from being pressed by the inclined support surface 2.1 to form marks, thereby affecting the product quality. It should be understood that in specific implementation, the inclined support surface 2.1 can lift the COF product, especially at the edge position of the highest point of the inclined support surface 2.1. By setting the edge position of the highest point of the inclined support surface 2.1 as a chamfer, the COF product can be prevented from being pressed to form marks when it is lifted.
[0038] In some embodiments, the support table 2 has multiple inclined support surfaces 2.1, and the multiple inclined support surfaces 2.1 are arranged in a spaced manner along the conveying direction of the support rail 1. In this way, the multiple inclined support surfaces 2.1 can be used to support multiple COF products, so that the device can simultaneously mount multiple fins 6. It should be understood that in specific implementation, each inclined support surface 2.1 can correspond to the mounting position of each fin 6.
[0039] In some embodiments, the support table 2 is detachably arranged between the two support rails 1. In this way, the inclination direction of the inclined support surface 2.1 can be changed, for example, the support table 2 can be rotated by 180° and then arranged between the two support rails 1, so that the inclination direction of the inclined support surface 2.1 can be changed. Of course, in this way, the support table 2 with different support surface sizes can also be replaced to adapt to different mounting processes. For example, when used for mounting the heat sink 6 on the COF product with different width sizes, according to the size changes of the COF product and the heat sink 6, the support table 2 with the corresponding size can be selected. It should be understood that in specific implementations, the support table 2 can be installed by screws, clamping members, etc.
[0040] In some embodiments, the support table 2 is a light-transmitting structure. In this way, the light-transmitting of the support table 2 can be realized, so that the backlight module can be arranged below the support table 2, and the attachment position of the heat sink 6 can be detected by the CCD lens above, so as to ensure the mounting accuracy.
[0041] In some embodiments, the support table 2 is an anti-static structure. In this way, the probability of occurrence of electrostatic discharge can be reduced, so as to avoid permanent damage or performance degradation of sensitive electronic elements in the COF product caused by electrostatic discharge.
[0042] In some embodiments, the taking head 3 can move horizontally. In this way, the taking head 3 can move left and right to place a plurality of heat sinks 6 on different surfaces of the COF product, so that the rolling member 4 can simultaneously roll the plurality of heat sinks 6. Specifically, a plurality of support surfaces on the support table 2 can support a plurality of COF products respectively, and the taking head 3 can be moved horizontally to be above each COF product, so that a plurality of heat sinks 6 can be placed on different surfaces of the COF product.
[0043] In some embodiments, the adsorption surface 3.1 of the taking head 3 is a plane. In this way, when the adsorption force of the adsorption surface 3.1 disappears, the heat sink 6 can fall on the surface of the COF product in a horizontal state, and an included angle is formed between the heat sink 6 and the COF product.
[0044] In some embodiments, the adsorption surface 3.1 of the taking head 3 is an inclined surface, and the adsorption surface 3.1 is opposite to the inclination direction of the inclined support surface 2.1 about the horizontal plane. In this way, when the adsorption force of the adsorption surface 3.1 disappears, the heat sink 6 can fall on the surface of the COF product in an inclined state, so that an included angle can be formed between the heat sink 6 and the COF product, which is beneficial to improve the reliability.
[0045] In some embodiments, the rolling member 4 is a roller, preferably a silica gel roller, which can be matched with rollers of different hardness according to the material and structure of the heat dissipation fin 6. In a specific implementation, the rolling member 4 can be powered by a motor, and the rotating shaft of the rolling member 4 is connected with the output shaft of the motor.
[0046] The terms "first", "second" in the description and claims of the present application can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "a plurality of" is two or more, unless otherwise specified. In addition, "and / or" in the specification and claims indicates at least one of the connected objects, and the character " / ", generally indicates that the front and rear associated objects are in an "or" relationship.
[0047] In the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.
[0048] In the description of the present application, it should be noted that unless otherwise specified and limited, the terms "mounting", "connecting", "connecting" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication inside two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.
[0049] One or more embodiments of the present specification are intended to cover all such alternatives, modifications and variations falling within the broad scope of the appended claims. Therefore, any omission, modification, equivalent replacement, improvement, etc. made in the spirit and principles of one or more embodiments of the present specification shall be included in the protection scope of the present application.
[0050] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art can easily think of changes or replacements within the technical scope disclosed by the present application, which shall be included in the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Claims
1. A heat sink mounting device, characterized in that, The utility model relates to a COF label taking device, comprising: two support rails, a support table, a label taking head and a rolling piece; the two support rails are oppositely arranged and are used for conveying a COF roll tape; the support table is located between the two support rails and has an inclined support surface for supporting the COF roll tape, the inclined direction of the inclined support surface being perpendicular to the conveying direction of the support rails; the label taking head is located above the support table, and the bottom of the label taking head has a suction surface for sucking a heat dissipation fin; the rolling piece is located above the support table, and the rolling axis of the rolling piece extends along the conveying direction of the support rails.
2. The fin attaching apparatus according to claim 1, wherein The inclined angle of the inclined support surface deviating from the horizontal plane is 2.85°±0.5°.
3. The fin attaching apparatus according to claim 1, wherein The height difference between the highest end and the lowest end of the inclined support surface is not greater than 2mm.
4. The fin attaching apparatus according to claim 1, wherein The edge of the inclined support surface is provided with a chamfer.
5. The fin attaching apparatus according to claim 1, wherein The support table has a plurality of inclined support surfaces, and the plurality of inclined support surfaces are arranged at intervals along the conveying direction of the support rails.
6. The fin attaching apparatus according to claim 1, wherein The support table is detachably arranged between the two support rails.
7. The fin attaching apparatus according to claim 1, wherein The support table is a light-transmitting structure.
8. The fin attaching apparatus according to claim 1, wherein The support table is an antistatic structure.
9. The fin attaching apparatus according to claim 1, wherein The suction surface of the label taking head is a plane.
10. The fin attaching apparatus according to claim 1, wherein The suction surface of the label taking head is an inclined plane, and the suction surface is opposite to the inclined direction of the inclined support surface with respect to the horizontal plane.