Frequency converter core structure and frequency converter

Abstract

The utility model provides a frequency converter machine core structure and a frequency converter. The frequency converter machine core structure comprises an inversion assembly and a capacitor assembly. The capacitor assembly specifically comprises a bus capacitor and a bus laminated copper bar, the bus capacitor and the inversion assembly are arranged at an interval in the thickness direction of the inversion assembly, and the bus laminated copper bar is arranged between the bus capacitor and the inversion assembly. According to the utility model, the bus laminated copper bar replaces the traditional wire connection, the wiring layout is simplified, and the complex wiring mode between the bus capacitor and the inversion assembly is avoided, so that the generation of stray inductance is effectively inhibited, and the stability and efficiency of the whole circuit system are improved. The functional area of the bus laminated copper bar specifically comprises a capacitor connecting part and an inversion connecting part. The bus capacitor is electrically connected to the capacitor connecting part, the inversion assembly is electrically connected to the inversion connecting part, and the capacitor connecting part and the inversion connecting part are electrically connected with each other, so that conduction between the inversion assembly and the bus capacitor is realized.

Description

Technical Field

[0001] This application belongs to the field of electrical equipment technology, and more specifically, relates to a frequency converter core structure and a frequency converter. Background Technology

[0002] Frequency converters are widely used in motor speed control, energy saving, and automated control systems. Their core components typically include multiple bus capacitors and an inverter. The main functions of the bus capacitors include smoothing bus voltage, reducing line inductance parameters, absorbing high pulse currents, and preventing overcharging and transient voltage from affecting the controller.

[0003] In practical applications, the electrical connection between the bus capacitor and the inverter usually requires complex connecting wires. These wires are often difficult to design optimally in terms of layout and length, which inevitably introduces stray inductance. The presence of stray inductance has a significant impact on the performance of the frequency converter. Utility Model Content

[0004] The purpose of this application is to provide a frequency converter core structure and frequency converter to solve the technical problem of poor electrical connection between the bus capacitor and the inverter in the prior art.

[0005] To achieve the above objectives, the technical solution adopted in this application is as follows:

[0006] A frequency converter core structure is provided, comprising:

[0007] Inverter components;

[0008] The capacitor assembly includes a bus capacitor and a bus laminated copper busbar. The bus capacitor and the inverter assembly are arranged at intervals in the thickness direction of the inverter assembly. The bus laminated copper busbar is disposed between the bus capacitor and the inverter assembly. The bus laminated copper busbar includes a capacitor connection portion and an inverter connection portion. The bus capacitor is electrically connected to the capacitor connection portion, and the inverter assembly is electrically connected to the inverter connection portion. The capacitor connection portion and the inverter connection portion are electrically connected to each other.

[0009] As a further improvement to the above technical solution:

[0010] Optionally, the busbar laminated copper busbar further includes a vertical plate portion, the capacitor connection portion is located at one end of the vertical plate portion and is arranged at an angle to the vertical plate portion; the inverter connection portion is located at the other end of the vertical plate portion and is arranged at an angle to the vertical plate portion.

[0011] Optionally, the capacitor connection extends toward one side of the vertical plate, and the inverter connection extends toward the other side of the vertical plate.

[0012] Optionally, the busbar stacked copper bus includes a positive copper bus, a negative copper bus, and an insulating layer. The positive copper bus and the negative copper bus are stacked, and the insulating layer is disposed between the positive copper bus and the negative copper bus, as well as on the surface of the positive copper bus and / or the negative copper bus.

[0013] Optionally, the inverter assembly is located on one side of the positive copper busbar, and the negative copper busbar is located on the other side of the positive copper busbar.

[0014] Optionally, the busbar stacked copper busbar further includes an insulating washer and through holes disposed on the positive copper busbar and the negative copper busbar. The insulating washer is disposed on the through hole through which the negative lead of the busbar capacitor passes on the positive copper busbar and on the through hole through which the positive lead of the busbar capacitor passes on the negative copper busbar.

[0015] Optionally, the number of bus capacitors is at least two, and each bus capacitor is connected in parallel to the bus stacked copper busbar.

[0016] Optionally, the inverter assembly includes a heat dissipation substrate, a rectifier bridge, and an IGBT. The rectifier bridge and the IGBT are both connected to the heat dissipation substrate, and the rectifier bridge and the IGBT are arranged at a distance from each other. The inverter connection part is electrically connected to the IGBT.

[0017] Optionally, the number of rectifier bridges is at least two, and each rectifier bridge is arranged sequentially along a straight line; and / or, the number of IGBTs is at least two, and each IGBT is arranged sequentially along a straight line.

[0018] This application also provides a frequency converter, including the frequency converter core structure described above.

[0019] The advantages of the inverter core structure and inverter provided in this application are as follows:

[0020] The inverter chassis structure provided in this application includes an inverter assembly and a capacitor assembly. The capacitor assembly specifically includes a bus capacitor and a multilayer copper busbar. The bus capacitor and the inverter assembly are spaced apart along the thickness direction of the inverter assembly, thereby fully utilizing the space in the thickness direction of the inverter assembly, improving the compactness of the inverter chassis structure, and effectively reducing the area occupied by the capacitor assembly on the plane of the inverter assembly. The multilayer copper busbar is located between the bus capacitor and the inverter assembly. The multilayer copper busbar replaces traditional wire connections, simplifying the wiring layout and avoiding complex wiring methods between the bus capacitor and the inverter assembly, thus effectively suppressing the generation of stray inductance and improving the stability and efficiency of the entire circuit system. The functional areas of the multilayer copper busbar specifically include a capacitor connection section and an inverter connection section. The bus capacitor is electrically connected to the capacitor connection section, and the inverter assembly is electrically connected to the inverter connection section. The capacitor connection section and the inverter connection section are electrically connected to each other, thereby realizing the conduction between the inverter assembly and the bus capacitor.

[0021] The frequency converter provided in this application includes the above-described frequency converter core structure, and therefore also has the advantages of the above-described frequency converter core structure. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 A three-dimensional structural diagram of the inverter core structure provided in this application;

[0024] Figure 2 A schematic front view of the inverter core structure provided in this application;

[0025] Figure 3 An exploded structural diagram of the inverter core structure provided in this application;

[0026] Figure 4 A three-dimensional structural diagram of the capacitor assembly for the inverter core structure provided in this application;

[0027] Figure 5 An exploded view of the busbar laminated copper busbar of the inverter core structure provided in this application;

[0028] Figure 6 A top view of the inverter assembly of the inverter core structure provided in this application.

[0029] The following are the labeling elements in the figure:

[0030] 1. Inverter module; 11. Heat dissipation substrate;

[0031] 12. Rectifier bridge; 13. IGBT;

[0032] 2. Capacitor assembly; 21. Bus capacitor;

[0033] 22. Busbar laminated copper busbar; 221. Capacitor connection section;

[0034] 222. Inverter connection section; 223. Vertical plate section;

[0035] 224. Positive electrode copper busbar; 225. Negative electrode copper busbar;

[0036] 226. Insulating layer; 227. Insulating gasket;

[0037] 228. Through hole. Detailed Implementation

[0038] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this utility model, and should not be construed as limiting this utility model.

[0039] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0040] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0041] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0042] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0043] Furthermore, the technical solutions of the various embodiments can be combined with each other, but only if they are based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of this utility model.

[0044] In the following description, suffixes such as "circuit," "component," "assembly," or "unit" are used only for the purpose of describing this utility model and have no specific meaning in themselves. Therefore, they can be used in combination.

[0045] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments.

[0046] like Figure 1 and Figure 2 As shown, this application provides a frequency converter core structure, including an inverter assembly 1 and a capacitor assembly 2.

[0047] The capacitor assembly 2 specifically includes a bus capacitor 21 and a bus laminated copper busbar 22. The bus capacitor 21 and the inverter assembly 1 are arranged at intervals along the thickness direction of the inverter assembly 1, thereby making full use of the space in the thickness direction of the inverter assembly 1, improving the compactness of the inverter core structure, and effectively reducing the area occupied by the capacitor assembly 2 on the plane of the inverter assembly 1. The bus laminated copper busbar 22 is located between the bus capacitor 21 and the inverter assembly 1. The bus laminated copper busbar 22 replaces the traditional wire connection, simplifies the wiring layout, avoids the complex wiring method between the bus capacitor 21 and the inverter assembly 1, and effectively suppresses the generation of stray inductance, thereby improving the stability and efficiency of the entire circuit system. The functional areas of the bus laminated copper busbar 22 specifically include a capacitor connection part 221 and an inverter connection part 222. Bus capacitor 21 is electrically connected to capacitor connection part 221, inverter assembly 1 is electrically connected to inverter connection part 222, and capacitor connection part 221 and inverter connection part 222 are electrically connected to each other, thereby realizing the conduction of inverter assembly 1 and bus capacitor 21.

[0048] like Figure 1 and Figure 2 As shown in a specific embodiment of this application, the functional area of ​​the busbar laminated copper busbar 22 further includes a vertical plate portion 223, through which the electrical connection between the capacitor connection portion 221 and the inverter connection portion 222 is realized. Specifically, the vertical plate portion 223 extends along the thickness direction of the inverter assembly 1. The capacitor connection portion 221 is disposed at one end of the vertical plate portion 223 and is arranged perpendicular to the vertical plate portion 223 or at other included angles; the inverter connection portion 222 is disposed at the other end of the vertical plate portion 223 and is arranged perpendicular to the vertical plate portion 223 or at other included angles.

[0049] In one specific embodiment of this application, the capacitor connection part 221, the inverter connection part 222, and the vertical plate part 223 are an integral structure to improve the structural strength of the busbar laminated copper busbar 22.

[0050] like Figure 1 and Figure 2 As shown, in one specific embodiment of this application, the capacitor connection portion 221 extends towards one side of the vertical plate portion 223 to facilitate the connection and installation of the bus capacitor 21. The inverter connection portion 222 extends towards the other side of the vertical plate portion 223 to facilitate the connection and installation of the inverter assembly 1. In this arrangement, the bus stacked copper busbar 22 forms a "Z"-shaped structure. The "Z"-shaped structure simplifies the installation and connection of the bus capacitor 21 and the inverter assembly 1, so that there is no interference during the installation of the bus capacitor 21 and the inverter assembly 1, making the operation simpler and more convenient.

[0051] like Figure 3 and Figure 5As shown, in a specific embodiment of this application, the busbar stacked copper busbar 22 comprises a positive copper busbar 224, a negative copper busbar 225, and an insulating layer 226. The positive copper busbar 224 and the negative copper busbar 225 are stacked, with the positive copper busbar 224 connected to the positive terminal of the busbar capacitor 21 and the inverter assembly 1, and the negative copper busbar 225 connected to the negative terminal of the busbar capacitor 21 and the inverter assembly 1. The insulating layer 226 is disposed between the positive copper busbar 224 and the negative copper busbar 225 to achieve insulation between them. Furthermore, the insulating layer 226 is also disposed on the surface of the other side of the positive copper busbar 224 and / or the other side of the negative copper busbar 225 to improve the insulation performance of the positive and negative copper busbars 224 and prevent short circuits and leakage. Specifically, the insulating layer 226 can be NOMEX insulating paper.

[0052] like Figure 3 and Figure 5 As shown, in a specific embodiment of this application, the inverter component 1 is disposed on one side of the positive copper busbar 224, and the negative copper busbar 225 is disposed on the other side of the positive copper busbar 224. That is, the positive copper busbar 224 is closer to the inverter component 1 than the negative copper busbar 225. This arrangement results in a smaller stray inductance compared to the negative copper busbar 225 being closer to the inverter component 1.

[0053] like Figures 3 to 5 As shown, in a specific embodiment of this application, the busbar multilayer copper bus 22 further includes an insulating washer 227 and through holes 228 disposed on the positive copper bus 224 and the negative copper bus 225. The through holes 228 facilitate the insertion of the positive terminal pin of the busbar capacitor 21 into the busbar multilayer copper bus 22 and its electrical connection. The insulating washer 227 is made of insulating materials such as epoxy resin. The insulating washer 227 is disposed on the through hole 228 through which the negative terminal pin of the busbar capacitor 21 passes on the positive copper bus 224 to prevent the negative terminal pin of the busbar capacitor 21 from forming an electrical connection with the positive copper bus 224. It can be understood that the insulating washer 227 is also disposed on the through hole 228 through which the positive terminal pin of the busbar capacitor 21 passes on the negative copper bus 225 to prevent the positive terminal pin of the busbar capacitor 21 from forming an electrical connection with the negative copper bus 225.

[0054] like Figure 1 and Figure 4 As shown, in one specific embodiment of this application, the number of bus capacitors 21 is at least two, and each bus capacitor 21 is connected in parallel on the bus laminated copper busbar 22. Specifically, the bus capacitors 21 can be thin-film capacitors. The positive and negative leads of each bus capacitor 21 are uniformly arranged horizontally or vertically.

[0055] In one specific embodiment of this application, the capacitor assembly 2 further includes a fixed sheet metal frame for securely connecting each bus capacitor 21 to the bus laminated copper busbar 22.

[0056] like Figure 1 and Figure 6 As shown, in a specific embodiment of this application, the inverter assembly 1 includes a heat dissipation substrate 11, a rectifier bridge 12, and an IGBT 13. The rectifier bridge 12 and the IGBT 13 are both connected to the heat dissipation substrate 11 and are arranged at a relative interval. The positive copper busbar 224 and the negative copper busbar 225 of the inverter connection portion 222 are electrically connected to the positive and negative terminals of the IGBT 13, respectively. The positive copper busbar 224 and the negative copper busbar 225 of the inverter connection portion 222 are also led out to the positive and negative terminals of the rectifier bridge 12.

[0057] like Figure 1 and Figure 6 As shown, in one specific embodiment of this application, the number of rectifier bridges 12 is at least two, and each rectifier bridge 12 is arranged sequentially along a straight line; and / or, the number of IGBTs 13 is at least two, and each IGBT 13 is arranged sequentially along a straight line. Compared with the traditional arrangement of each rectifier bridge 12 and each IGBT 13 in two or more rows, in this application, each rectifier bridge 12 and each IGBT 13 is arranged in a straight line. Under the condition of satisfying heat dissipation, the width of the heat dissipation substrate 11 can be reduced, the utilization rate of the heat dissipation substrate 11 is higher, the overall size of the inverter component 1 is relatively smaller, and the structural cost is lower; in addition, as Figure 1 and 5 As shown, when each IGBT 13 is arranged sequentially in a straight line, its positive and negative pins can also be arranged in a straight line with intervals. In this way, when connected to the stacked positive copper busbar 224 and negative copper busbar 225 respectively, the positive copper busbar 224 and negative copper busbar 225 can be insulated in a way that avoids gaps at the corresponding positions, so there is no need to put insulating paper in the electrical connection through hole. In order to ensure the insulation between the positive and negative pins, an insulating block can be set between the positive and negative pins. In this way, the installation operation is more convenient and quick.

[0058] This application also provides a frequency converter, including the frequency converter core structure in the above embodiments, and therefore also has the advantages of the frequency converter core structure in the above embodiments.

[0059] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A frequency inverter core structure, characterized by comprising: The application relates to an inverter assembly (1) and a capacitor assembly (2) comprising bus capacitors (21) and a bus laminated copper bar (22), wherein the bus capacitors (21) are arranged in a thickness direction of the inverter assembly (1) and the bus laminated copper bar (22) is arranged between the bus capacitors (21) and the inverter assembly (1), the bus laminated copper bar (22) comprises a capacitor connecting portion (221) and an inverter connecting portion (222), the bus capacitors (21) are electrically connected to the capacitor connecting portion (221), the inverter assembly (1) is electrically connected to the inverter connecting portion (222), and the capacitor connecting portion (221) and the inverter connecting portion (222) are electrically connected to each other. The bus laminated copper bar (22) further comprises a vertical plate portion (223), the capacitor connecting portion (221) is arranged at one end of the vertical plate portion (223) and is arranged at an angle with the vertical plate portion (223), and the inverter connecting portion (222) is arranged at the other end of the vertical plate portion (223) and is arranged at an angle with the vertical plate portion (223). The capacitor connecting portion (221) extends towards one side of the vertical plate portion (223), and the inverter connecting portion (222) extends towards the other side of the vertical plate portion (223).

2. The frequency inverter movement according to claim 1, wherein The bus laminated copper bar (22) comprises a positive copper bar (224), a negative copper bar (225) and an insulating layer (226), the positive copper bar (224) and the negative copper bar (225) are arranged in a laminated mode, the insulating layer (226) is arranged between the positive copper bar (224) and the negative copper bar (225) and the surface of the positive copper bar (224) and / or the negative copper bar (225).

3. The frequency inverter movement according to claim 2, wherein The inverter assembly (1) is arranged at one side of the positive copper bar (224), and the negative copper bar (225) is arranged at the other side of the positive copper bar (224).

4. The frequency inverter movement according to claim 1, wherein The bus laminated copper bar (22) further comprises an insulating gasket (227) and through holes (228) arranged on the positive copper bar (224) and the negative copper bar (225), the insulating gasket (227) is arranged on the through hole (228) through which the negative pin of the bus capacitor (21) passes on the positive copper bar (224) and on the through hole (228) through which the positive pin of the bus capacitor (21) passes on the negative copper bar (225).

5. The frequency inverter movement according to claim 4, wherein The number of the bus capacitors (21) is at least two, and each bus capacitor (21) is connected in parallel to the bus laminated copper bar (22).

6. The frequency inverter movement according to claim 4, wherein The inverter assembly (1) comprises a heat dissipation substrate (11), a rectifier bridge (12) and an IGBT (13), the rectifier bridge (12) and the IGBT (13) are connected to the heat dissipation substrate (11), the rectifier bridge (12) and the IGBT (13) are arranged at opposite positions, and the inverter connecting portion (222) is electrically connected to the IGBT (13).

7. The frequency inverter movement according to any one of claims 1 to 6, characterized in that ​ 8. The frequency inverter movement according to any one of claims 1 to 6, characterized in that ​ 9. The frequency inverter movement according to claim 8, wherein The number of the rectifier bridges (12) is at least two, and each of the rectifier bridges (12) is arranged in a straight line direction; and / or the number of the IGBTs (13) is at least two, and each of the IGBTs (13) is arranged in a straight line direction.

10. A frequency converter, characterized in that The frequency converter movement structure comprises the frequency converter movement structure as claimed in any one of claims 1 to 9.

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