High-integration-level KuKa double-frequency time-sharing up-conversion power amplifier device

Abstract

The utility model relates to a high-integration-level KuKa double-frequency time-sharing up-conversion power amplifier device, which comprises a common intermediate frequency input and switching module used for time-sharing switching of intermediate frequency signals of Ku / Ka channels; the time-sharing frequency conversion processing module is used for realizing Ku single frequency conversion and Ka double frequency conversion; the high-power GaN amplification module is used for supporting Ku and Ka frequency band power amplification respectively; and the deep sharing subsystem comprises a shared local oscillation source generation unit, an intelligent power distribution module for time-sharing power supply, an integrated radiator and an MCU (Microprogrammed Control Unit) control unit. High integration of a double-frequency function is realized by sharing an intermediate-frequency link, time-sharing frequency conversion and sharing a subsystem. Through time-sharing power supply and intermediate-frequency switching, dual-band multiplexing of an intermediate-frequency link, a reference source and a heat dissipation system is realized, a subverted split structure is adopted, a single device realizes a dual-frequency function, and compared with a traditional split scheme, the device size is reduced by 40%, the weight is reduced by 35%, and the hardware cost is reduced by 30%. The spectrum expansibility is high, and the design of twice frequency conversion and LO3 adjustability supports three-segment seamless coverage of the Ka frequency band.

Description

Technical Field

[0001] This utility model relates to the field of microwave communication equipment technology, and in particular to a highly integrated Ku / Ka dual-frequency time-division upconversion power amplifier device. It is a highly integrated Ku / Ka dual-frequency upconversion power amplifier device that achieves high integration through time-division power supply, shared intermediate frequency link and reference source, and is suitable for scenarios with high requirements for lightweight equipment and multi-frequency compatibility, such as satellite communication terminals and portable radar. Background Technology

[0002] The Ku / Ka dual-band system is a satellite communication technology that combines the Ku band (12-18GHz) and the Ka band (26.5-40GHz), enhancing overall performance through complementary advantages. The Ku band offers strong penetration and good resistance to rain attenuation, making it suitable for scenarios with high stability requirements; the Ka band boasts wider bandwidth and higher transmission rates, supporting large-capacity data transmission. The dual-band system can dynamically switch bands based on environmental conditions (e.g., prioritizing the Ku band to ensure connectivity during severe weather) or use them in parallel in demand scenarios to optimize resource allocation (e.g., using the Ka band for high-definition video and the Ku band for basic communications). This system is widely used in in-flight internet, military communications, emergency response, and broadband access in remote areas, balancing high throughput and high reliability, and represents an important future direction for satellite communications.

[0003] In existing technologies, Ku / Ka dual-band systems mostly adopt a split design, requiring independent intermediate frequency processing links, local oscillator sources, and power amplifier modules. They cannot share subsystems such as power supply, temperature control, and reference clock, resulting in large equipment size, high power consumption, and high cost.

[0004] Reference Figure 1 and Figure 2 Traditional Ku and Ka band upconversion power amplifiers need to be designed as two separate devices, which has the following drawbacks:

[0005] Hardware redundancy: Two independent intermediate frequency processing links, local oscillator, power amplifier module and heat dissipation system result in large size and heavy weight of the equipment, making it difficult to deploy in space-constrained scenarios;

[0006] High cost: Double the material costs (such as high-precision local oscillator, high-power power supply, heat dissipation system) and maintenance costs;

[0007] Poor coordination: Split devices cannot share reference clocks, power supplies, and control units, resulting in high system synchronization complexity.

[0008] Therefore, in summary, traditional Ku / Ka dual-band systems are difficult to meet the requirements of lightweight design and multi-frequency compatibility. Utility Model Content

[0009] In view of the shortcomings of the existing technology, the purpose of this utility model is to provide a highly integrated KuKa dual-frequency time-sharing upconversion power amplifier device, which aims to solve the problems of large size, heavy weight and high cost of the existing equipment.

[0010] The above-mentioned utility model objective is achieved through the following technical solution:

[0011] A highly integrated KuKa dual-frequency time-division upconversion power amplifier device includes:

[0012] A shared intermediate frequency input and switching module is used for time-division switching of the intermediate frequency signals of the Ku / Ka channels;

[0013] The time-sharing frequency conversion processing module is used to realize Ku single frequency conversion and Ka double frequency conversion;

[0014] High-power GaN amplifier modules are used to support power amplification in the Ku and Ka bands, respectively.

[0015] The deep shared subsystem includes a shared local oscillator generation unit, a time-sharing intelligent power distribution module, an integrated heat sink, and an MCU control unit.

[0016] As a further technical solution of this utility model: the shared intermediate frequency input and switching module supports switching between Ku band 0.95-1.7GHz and Ka band 0.95-2.15GHz input signals.

[0017] As a further technical solution of this utility model: the time-division frequency conversion processing module includes a Ku-channel single up-conversion unit and a Ka-channel secondary up-conversion unit. The Ku-channel single up-conversion unit adopts a 12.8GHz local oscillator, and the Ka-channel secondary up-conversion unit adopts a combination of a 4.9GHz local oscillator and an adjustable local oscillator.

[0018] As a further technical solution of this utility model: the high-power GaN amplifier module includes a Ku power amplifier unit and a Ka power amplifier unit, and the output terminals of the Ku power amplifier unit and the Ka power amplifier unit are both integrated with ferrite isolators for isolation and protection.

[0019] As a further technical solution of this utility model: the output frequency of the adjustable local oscillator is three levels: 21.65GHz, 22.8GHz, and 23.95GHz, which can be switched by the MCU control unit.

[0020] As a further technical solution of this utility model: the Ku power amplifier unit adopts a two-stage GaN HEMT amplification structure with an output power ≥50W; the Ka power amplifier unit adopts a three-stage GaN HEMT amplification structure with an output power ≥25W.

[0021] As a further technical solution of this utility model: the isolation degree of the ferrite isolator is ≥25dB, and it supports VSWR>3:1 reflection protection.

[0022] As a further technical solution of this utility model: the up-conversion power amplifier device is installed on the dual-frequency shipborne moving mid-channel antenna.

[0023] In summary, this utility model has at least one of the following beneficial technical effects:

[0024] This utility model discloses a highly integrated KuKa dual-band time-sharing upconversion power amplifier device. It achieves a high degree of integration of dual-band functionality through a shared intermediate frequency link, time-sharing frequency conversion, and a shared subsystem. By using time-sharing power supply and intermediate frequency switching, it achieves dual-band reuse of the intermediate frequency link, reference source, and heat dissipation system. Adopting a revolutionary split architecture, a single device achieves dual-band functionality, reducing the device size by 40%, weight by 35%, and hardware cost by 30% compared to traditional split solutions. It boasts high spectrum scalability, with a double-conversion + LO3 adjustable design, supporting seamless coverage of three Ka-band segments. It is suitable for scenarios such as satellite communication terminals and portable radar, combining high throughput and high reliability. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of the overall structure of the Ku-type upconverter power amplifier in the prior art of this utility model.

[0026] Figure 2 This is a schematic diagram of the overall structure of the Ka upconversion power amplifier in the prior art of this utility model.

[0027] Figure 3 This is a schematic diagram of the overall structure of this utility model.

[0028] Figure 4 This is a schematic diagram of the dual-frequency upconverter power amplifier of this utility model.

[0029] Figure 5 This is a schematic diagram of the overall structure of the dual-frequency shipborne mobile communication antenna in this embodiment.

[0030] Figure 6 This is a schematic diagram of the dual-frequency common-feed antenna surface assembly in this embodiment.

[0031] Figure 7 This is a schematic diagram of the dual-frequency integrated feed network in this embodiment.

[0032] Figure 8 This is a schematic diagram of the connection of the dual-frequency integrated feed network device in this embodiment.

[0033] Figure 9 This is a schematic diagram of the internal structure of the KuKa integrated power amplifier in this embodiment.

[0034] Reference numerals: 1. Dual-band common-feed antenna surface assembly; 2. Elevation arm; 3. Moving center-pass support structure; 4. Dual-band common-feed antenna surface; 5. Dual-band integrated feed network; 6. KaLNB; 7. KuKa integrated power amplifier; 8. Ka transmitting waveguide; 9. Ka waveguide switching switch; 10. Ku receiving waveguide; 11. Ku transmitting waveguide; 12. Ka receiving waveguide; 13. KuLNB; 14. Ku transmitting waveguide port; 15. Ka transmitting waveguide port; 16. Main board; 17. Ku power amplifier module; 18. Ku filter; 19. Ka driver module; 20. Ka filter; 21. Ka power amplifier module; 22. Intermediate frequency input port. Detailed Implementation

[0035] The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0036] In the description of this application, it should be noted that the terms "upper," "lower," "inner," "outer," "top / bottom," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0037] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installed," "equipped with," "sleeved / connected," "connected," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0038] Example 1:

[0039] Reference Figure 3 and Figure 4 This invention discloses a highly integrated KuKa dual-frequency time-sharing upconversion power amplifier device, which includes a shared intermediate frequency input and switching module, a time-sharing upconversion processing module, a high-power GaN amplification module, and a deeply shared subsystem.

[0040] A shared intermediate frequency (IF) input and switching module is used for time-division switching of the IF signals between the Ku and Ka channels. This module supports switching between Ku-band (0.95-1.7 GHz) and Ka-band (0.95-2.15 GHz) input signals. In this embodiment, the shared IF input and switching module includes a wideband low-noise amplifier, a programmable filter bank, and an SPDT switch, supporting ±0.5 dB in-band flatness.

[0041] The time-division frequency conversion processing module is used to realize Ku single-frequency conversion and Ka double-frequency conversion. The module includes a Ku-channel single-frequency upconversion unit and a Ka-channel double-frequency upconversion unit. The Ku-channel single-frequency upconversion unit uses a 12.8GHz local oscillator, with an output frequency of LO1 + intermediate frequency = 13.75-14.5GHz. The Ka-channel double-frequency upconversion unit uses a combination of a 4.9GHz local oscillator and an adjustable local oscillator. The adjustable local oscillator has three output frequencies: 21.65GHz, 22.8GHz, and 23.95GHz, which are switched by the MCU control unit. Specifically, the local oscillator is used for the first-stage frequency conversion: LO2 = 4.9GHz, upconverting the intermediate frequency to 5.85-7.05GHz; the adjustable local oscillator is used for the second-stage frequency conversion: adjustable local oscillator LO3 (21.65 / 22.8 / 23.95GHz), outputting 27.5-31GHz (three continuous coverage segments).

[0042] High-power GaN amplifier modules support power amplification in both the Ku and Ka bands. These modules include Ku and Ka power amplifier units, each with integrated ferrite isolators at the output for isolation and protection. The Ku amplifier unit employs a two-stage GaN HEMT amplification structure with an output power ≥50W and efficiency ≥30%. The Ka amplifier unit employs a three-stage GaN HEMT amplification structure with an output power ≥25W and efficiency ≥25%. The ferrite isolators provide ≥25dB ​​isolation and support VSWR>3:1 reflection protection.

[0043] The deep-sharing subsystem includes a shared local oscillator generation unit, a time-sharing intelligent power distribution module, an integrated heat sink, and an MCU control unit. In the shared local oscillator generation unit, LO1 (12.8GHz) and LO2 (4.9GHz) are generated from the same frequency source. The intelligent power distribution module includes a dual-channel MOSFET switch array with a response time ≤10μs, providing time-sharing power to the Ku / Ka channels. The integrated heat sink adopts an integrated heatsink and fan design, reducing power consumption by 40%. The MCU controller in the MCU control unit centrally manages frequency band switching, local oscillator tuning, and fault diagnosis. The MCU control unit integrates these functions and communicates with an external host via an RS-422 interface.

[0044] After the device is powered on, the MCU control unit switches the operating mode according to external commands:

[0045] Ku mode: When the SPDT switch is switched to the Ku channel, the intelligent power distribution module starts LO1 (12.8GHz) and the Ku power amplifier, and the intermediate frequency signal is output at 13.75-14.5GHz after frequency conversion;

[0046] Ka mode: The SPDT switch is switched to the Ka channel, starting LO2 (4.9GHz) + LO3 (21.65 / 22.8 / 23.95GHz), and the intermediate frequency signal is output at 27.5-31GHz after two frequency conversions.

[0047] Reference Figure 4 The external intermediate frequency (IF) and reference signals enter the equipment and are separated into reference and IF signals by a duplexer. The reference signal enters the phase detector to provide a reference for the internal low phase noise reference, and the internal reference provides a reference for the two frequency sources. After amplification and filtering, the IF signal is provided to the Ku and Ka frequency conversion modules through a 1-to-2 splitter.

[0048] Time-sharing operation: When Ku is working, the external host sends a 12.8GHz local oscillator command to the device. Frequency source 1 will output 12.8GHz to supply the Ku inverter, turn on the power supply to the Ku inverter and power amplifier, turn off the power supply to frequency source 2, Ka inverter and power amplifier, and switch the intermediate frequency switch to Ku. When the external host sends other local oscillator commands (21.65 / 22.8 / 23.95GHz) to the device, frequency source 1 will output 4.9GHz to supply the Ka primary inverter, turn on the power supply to frequency source 2, Ka inverter and power amplifier, turn off the power supply to the Ku inverter and power amplifier, and switch the intermediate frequency switch to Ka.

[0049] In this embodiment, the up-conversion power amplifier device is a KuKa integrated power amplifier 7, which is installed on the dual-band shipborne mobile mid-band antenna. In this embodiment, refer to... Figure 5 The dual-frequency shipborne mobile communication antenna includes a dual-frequency common-feed antenna surface assembly 1, an elevation arm 2, and a mobile communication support structure 3. The dual-frequency common-feed antenna surface assembly 1 is mounted on the elevation arm 2, and the elevation arm 2 is mounted on the mobile communication support structure 3.

[0050] Reference Figure 6 The dual-band common-feed antenna assembly 1 includes a dual-band common-feed antenna surface 4, through which a dual-band integrated feed network 5 is located. The dual-band common-feed antenna surface 4 is a parabolic structure made of carbon fiber composite material, with a dual-band compatible metallic coating on its surface. The elevation arm 2 adopts a titanium alloy truss structure and has a built-in signal transmission line channel.

[0051] Reference Figure 7 and Figure 8The dual-frequency integrated feed network unit 5 includes a KaLNB 6, a KuKa integrated power amplifier 7, a Ka transmitting waveguide 8, a Ka waveguide switching switch 9, a Ku receiving waveguide 10, a Ku transmitting waveguide 11, a Ka receiving waveguide 12, a KuLNB 13, a Ku transmitting waveguide port 14, and a Ka transmitting waveguide port 15. The Ku transmitting waveguide 11 and the Ka transmitting waveguide 8 are arranged in an orthogonal polarization configuration.

[0052] Ka transmitting waveguide 8 is connected at one end to Ka waveguide switching switch 9 and at the other end to Ka transmitting waveguide port 15 of KuKa integrated power amplifier 7. Ka receiving waveguide 12 is connected to two KaLNBs 6. Ku transmitting waveguide 11 is connected at one end to dual-frequency integrated feed network 5 and at the other end to Ku transmitting waveguide port 14 of KuKa integrated power amplifier 7. Ku receiving waveguide 10 is connected to KuLNB 13.

[0053] Reference Figure 9 The KuKa integrated power amplifier 7 internally houses a motherboard 16, on which are mounted a Ku power amplifier module 17, a Ku filter 18, a Ka driver module 19, a Ka filter 20, and a Ka power amplifier module 21. One end of the Ku filter 18 is connected to the motherboard 16, and the other end is connected to the input of the Ku power amplifier module 17. The output of the Ku power amplifier module 17 is connected to the Ku transmitting waveguide port 14. One end of the Ka driver module 19 is connected to the motherboard 16, and the other end is connected to the input of the Ka driver module 19. The output of the Ka driver module 19 is connected to the input of the Ka filter 20, and the output of the Ka filter 20 is connected to the input of the Ka power amplifier module 21. The output of the Ka power amplifier module 21 is connected to the Ka transmitting waveguide port 15. An intermediate frequency input port 22 is located on one side of the motherboard 16.

[0054] The Ku filter 18 is a bandpass filter with an operating frequency of 12-18 GHz, and the Ka filter 20 is a dual-mode filter with an operating frequency of 26.5-40 GHz. In this embodiment, the on-the-move support structure 3 adopts a four-axis rotation mechanism with azimuth, roll, pitch, and polarization, including a servo motor and a gyro stabilization system. The maximum compensation angles of the four-axis rotation mechanism are azimuth ±180°, roll ±30°, pitch ±45°, and polarization ±90°.

[0055] When the Ku-band integrated power amplifier 7 dual-band shipborne mobile satellite antenna is operating, the dual-band common-feed antenna surface 4 transmits the Ka-band signal received from the satellite through the dual-band integrated feed network and Ka receiving waveguide 12 to two KaLNBs 6. Since the Ka-band signal is divided into left-hand and right-hand polarized signals, one KaLNB 6 is responsible for receiving the left-hand polarized signal, and the other KaLNB 6 is responsible for receiving the right-hand polarized signal. The KaLNB 6 converts the received Ka-band signal into an intermediate frequency (IF) signal and outputs the IF signal to the receiving port of the mobile satellite antenna through a coaxial cable. The dual-band common-feed antenna surface 4 transmits the received Ku-band signal to the KuLNB 13 through the dual-band integrated feed network and Ku receiving waveguide 10. The KuLNB 13 converts the received Ku-band signal into an IF signal and outputs the IF signal to the receiving port of the mobile satellite antenna through a coaxial cable. The intermediate frequency (IF) transmission signal is output to the KuKa integrated power amplifier 7 via a coaxial cable through the transmit port of the mobile antenna. The IF signal is then converted into a Ka-band signal or a Ku-band signal and amplified by the Ka power amplifier module 21 and Ku power amplifier module 17 inside the KuKa integrated power amplifier 7. The signal is then output to the dual-band integrated feed network through the Ka transmit waveguide 8 or the Ku transmit waveguide 11. Finally, the signal is reflected by the dual-band common feed antenna surface 4 and transmitted to the satellite for communication.

[0056] When the ship is rocked by wind and waves, the 4-axis rotation (azimuth + roll + pitch + polarization) design of the moving support structure 3 can compensate for the impact of the ship's rocking, thus always keeping the dual-frequency co-feed antenna surface 4 aligned with the satellite that needs to communicate.

[0057] The embodiments described herein are preferred embodiments of this utility model and are not intended to limit the scope of protection of this utility model. Therefore, all equivalent changes made to the structure, shape, and principle of this utility model should be included within the scope of protection of this utility model.

Claims

1. A highly integrated KuKa dual-frequency time-division upconversion power amplifier device, characterized in that, include: A shared intermediate frequency input and switching module is used for time-division switching of the intermediate frequency signals of the Ku / Ka channels; The time-sharing frequency conversion processing module is used to realize Ku single frequency conversion and Ka double frequency conversion; High-power GaN amplifier modules are used to support power amplification in the Ku and Ka bands, respectively. The deep shared subsystem includes a shared local oscillator generation unit, a time-sharing intelligent power distribution module, an integrated heat sink, and an MCU control unit.

2. The highly integrated KuKa dual-frequency time-division upconversion power amplifier device according to claim 1, characterized in that, The shared intermediate frequency input and switching module supports switching between Ku band (0.95-1.7GHz) and Ka band (0.95-2.15GHz) input signals.

3. The highly integrated KuKa dual-frequency time-division upconversion power amplifier device according to claim 1, characterized in that, The time-division frequency conversion processing module includes a Ku-channel single up-conversion unit and a Ka-channel secondary up-conversion unit. The Ku-channel single up-conversion unit uses a 12.8GHz local oscillator, and the Ka-channel secondary up-conversion unit uses a combination of a 4.9GHz local oscillator and an adjustable local oscillator.

4. The highly integrated KuKa dual-frequency time-division upconversion power amplifier device according to claim 1, characterized in that, The high-power GaN amplifier module includes a Ku power amplifier unit and a Ka power amplifier unit. The output terminals of both the Ku power amplifier unit and the Ka power amplifier unit are integrated with ferrite isolators for isolation and protection.

5. The highly integrated KuKa dual-frequency time-division upconversion power amplifier device according to claim 3, characterized in that, The adjustable local oscillator has three output frequencies: 21.65GHz, 22.8GHz, and 23.95GHz, which can be switched by the MCU control unit.

6. The highly integrated KuKa dual-frequency time-division upconversion power amplifier device according to claim 4, characterized in that, The Ku power amplifier unit adopts a two-stage GaN HEMT amplification structure with an output power ≥50W; the Ka power amplifier unit adopts a three-stage GaN HEMT amplification structure with an output power ≥25W.

7. The highly integrated KuKa dual-frequency time-division upconversion power amplifier device according to claim 4, characterized in that, The ferrite isolator has an isolation level of ≥25dB ​​and supports VSWR>3:1 reflection protection.

8. A highly integrated KuKa dual-frequency time-division upconversion power amplifier device according to any one of claims 1-7, characterized in that, The upconversion power amplifier device is mounted on the dual-frequency shipborne moving mid-channel antenna.

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