Support capable of enhancing adhesive force

Abstract

The utility model discloses a bracket for enhancing adhesive force. The bracket comprises a bracket main body structure, the support main body structure comprises an etching material sheet and a carrier plate for bearing the etching material sheet, a mounting groove is formed in the top of the carrier plate, the etching material sheet is mounted in the mounting groove through a transfer molding process, a groove is formed in the etching material sheet, and the support main body structure comprises a plurality of groups of unit support structures. The carrier plate is provided with a groove, the two ends of the groove are ensured not to be in contact with the edge of the etching material sheet, the two ends of the groove are sealed, and when the etching material sheet and the carrier plate are subjected to transfer molding, the redundant part of the carrier plate cannot spread into the groove, so that the groove is still located in an independent space; when the bracket is in use, the colloid flows into the groove and is solidified in the groove, so that the colloid and the bracket main body structure form a riveting structure, the firmness of a colloid solidification layer is increased, and the colloid solidification layer is prevented from falling off.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor technology, specifically to a support for enhancing adhesion. Background Technology

[0002] Semiconductor substrates typically refer to semiconductor packaging substrates made of plastic molding compound. A semiconductor substrate consists of two parts: a circuit and a carrier. The circuit is etched out using an etching process and then molded together with the carrier. After the semiconductor is soldered, adhesive is applied.

[0003] Since the planar semiconductor substrate has a flat structure, it is relatively easy to fall off after the adhesive application process. This is due to the adhesion problem between the adhesive and the circuit plane and the carrier plane. Utility Model Content

[0004] The purpose of this invention is to provide a support that enhances adhesion. Grooves are etched into the circuit, and then adhesive is applied. The adhesive flows into the grooves and solidifies, forming a better connection between the adhesive and the main structure of the support, effectively preventing the adhesive from falling off, thus solving the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a support for enhancing adhesion, comprising:

[0006] The main structure of the support frame;

[0007] The main structure of the bracket includes an etched sheet and a carrier plate that supports the etched sheet. The top of the carrier plate has an installation groove. The etched sheet is installed in the installation groove through a transfer molding process. The etched sheet has a groove. The main structure of the bracket includes multiple unit bracket structures. Each unit bracket structure includes two sets of circuit channels and a carrier plate.

[0008] Preferably, the groove is formed at the top of the circuit channel, and the groove has a non-linear structure, and the two ends of the groove form a sealed structure that is not connected to the edge of the circuit channel.

[0009] Preferably, the two sets of circuit channels within the same unit support structure are not connected, and the etched sheet includes circuit channels and connecting parts.

[0010] Preferably, the corners of the inner wall of the groove are rounded corners, and the outer edges of the etched sheet are also rounded corners.

[0011] Preferably, the top of the connecting portion is flush with the top of the circuit channel, and the thickness of the connecting portion is half the thickness of the carrier plate.

[0012] Preferably, the angle between the groove wall and the vertical etched sheet is -20 to 20 degrees.

[0013] Preferably, the angle between the groove wall and the etched material sheet is -20 degrees.

[0014] Preferably, the surface of the etched sheet is treated with a frosted finish.

[0015] Preferably, the groove is a groove formed around the functional area connecting the diode; or,

[0016] The non-functional areas other than the diode area are etched away in whole or in part to form a groove.

[0017] Compared with the prior art, the beneficial effects of this utility model are:

[0018] 1. By limiting the position of the groove, this utility model ensures that the two ends of the groove will not contact the edge of the etched material. The two ends of the groove are sealed so that when the etched material is transferred to the carrier plate for molding, the excess part of the carrier plate will not spread into the groove, so that the groove remains in an independent space. Subsequently, when the adhesive is applied to the surface of the main structure of the bracket in the subsequent process, the adhesive will flow into the groove and solidify in the groove, so that the adhesive and the main structure of the bracket form a riveted structure, increasing the firmness of the adhesive solidification layer and preventing the adhesive solidification layer from falling off.

[0019] 2. The groove designed in this utility model can prevent the colloid from shrinking inside the linear structure and failing to form a firm connection with the inner wall of the groove, and can form a ring-shaped enveloping structure, increasing the firmness of the colloid solidification layer. Attached Figure Description

[0020] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0021] Figure 2 This is a three-dimensional structural diagram showing the separation of the etching material sheet and the carrier plate of this utility model;

[0022] Figure 3 This is a bottom-view three-dimensional structural diagram showing the separation of the etching material sheet and the carrier plate of this utility model.

[0023] Figure 4 This is a three-dimensional structural diagram of the unit support structure and the main support structure of this utility model;

[0024] Figure 5 This is a schematic diagram of the dispersed three-dimensional structure of the unit support structure of this utility model;

[0025] Figure 6 This is a cross-sectional view of the circuit channel of this utility model.

[0026] The following are the labels in the diagram: 1. Etched sheet; 2. Carrier plate; 3. Mounting groove; 4. Groove; 5. Unit support structure; 6. Circuit channel; 7. Connecting part. Detailed Implementation

[0027] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0028] This utility model provides, for example Figures 1-6 The illustrated support for enhancing adhesion includes:

[0029] The main structure of the bracket includes an etched sheet 1 and a carrier plate 2 that supports the etched sheet 1. The top of the carrier plate 2 is provided with an installation groove 3. The etched sheet 1 is installed in the installation groove 3 by a transfer molding process. Grooves 4 are etched on the etched sheet 1 by an etching process. The main structure of the bracket includes multiple sets of unit bracket structures 5. The unit bracket structure 5 includes two sets of circuit channels 6 and a carrier plate.

[0030] By limiting the position of the groove 4, it is ensured that the two ends of the groove 4 will not contact the edge of the etched material sheet 1. The two ends of the groove 4 are sealed so that when the etched material sheet 1 and the carrier plate 2 are transferred and molded, the excess part of the carrier plate 2 will not spread into the groove 4, so that the groove 4 remains in an independent space. Subsequently, when the adhesive is applied to the surface of the main structure of the bracket in the subsequent process, the adhesive will flow into the groove 4 and solidify in the groove 4, so that the adhesive and the main structure of the bracket form a riveting structure, increasing the firmness of the adhesive solidification layer and preventing the adhesive solidification layer from falling off.

[0031] Among them, such as Figure 1 , Figure 2 and Figure 5 As shown:

[0032] The groove 4 is located at the top of the circuit channel 6, and the groove 4 has a non-linear structure. The two ends of the groove form a sealed structure and are not connected to the edge of the circuit channel 6. By designing the groove 4 as a C-shaped structure, the colloid is prevented from shrinking inside the linear structure and failing to form a firm connection with the inner wall of the groove 4. The C-shaped structure can still form a ring-shaped structure even if the colloid shrinks, increasing the firmness of the colloid solidification layer.

[0033] Furthermore, such as Figure 5 As shown:

[0034] The two sets of circuit channels 6 within the same unit bracket structure 5 are not connected. The etched sheet 1 includes circuit channels 6 and connecting parts 7. By limiting the two sets of circuit channels 6 within the unit bracket structure 5, the connection of the two sets of circuit channels 6 is prevented from causing a short circuit. The two sets of circuit channels 6 can be soldered to the two pins of the light-emitting diode to form a connected circuit, thereby ensuring that the lamp bead lights up normally.

[0035] Preferred, such as Figure 2 , Figure 3 and Figure 5 As shown:

[0036] The corners of the inner wall of the groove 4 are rounded, and the outer edges of the etched sheet 1 are also rounded. By setting the rounded corners of the inner and outer corners of the groove 4, a smooth curved surface is formed. This avoids the plastic material (epoxy resin, silicone or other) from not being able to completely fill the right-angle space when it flows during transfer molding, which would lead to the formation of air bubbles and is not conducive to the firm connection between the carrier plate 2 and the etched sheet 1.

[0037] It is worth noting that, such as Figure 1 and Figure 4 As shown:

[0038] The top of the connecting part 7 is flush with the top of the circuit channel 6, and the thickness of the connecting part 7 is half the thickness of the carrier plate 2. The depth of the groove 4 is the same as the thickness of the connecting part 7. By limiting the thickness of the connecting part 7, the thickness of the connecting part 7 is prevented from being the same as the thickness of the carrier plate 2, which would cause the etched material sheet 1 to form independent spaces with multiple chambers, resulting in the plastic material not being able to fully enter the independent spaces after injection.

[0039] Preferred, such as Figure 6 As shown:

[0040] The angle between the groove wall of the groove 4 and the vertical etched material sheet 1 is -20 to 20 degrees. By setting the tilt angle of the groove wall of the groove 4, the colloid can easily form an inner wide and outer narrow structure in the groove 4. Even if the colloid shrinks, it will be firmly locked in the groove 4 to avoid falling off.

[0041] The angle between the groove wall of the groove 4 and the etched material sheet 1 is preferably -20 degrees, and the shape of the groove 4 is preferably a C-shaped structure. By setting the angle between the groove wall of the groove 4 and the etched material sheet 1 to -20 degrees, the groove 4 forms a structure with a small opening and a large groove, similar to a dovetail groove, which can further increase the adhesion of the adhesive. The groove 4 has a C-shaped structure, which can also ensure a stable connection with the groove 4 when the adhesive shrinks, thus preventing it from falling off.

[0042] The surface of the etched sheet 1 is frosted, which can increase the adhesion between the colloid and the etched sheet 1.

[0043] In another embodiment, the groove 4 is a C-shaped groove formed around the functional area of ​​the connecting diode; specifically, the groove 4 is etched directly in the initial etching stage, and then transfer molding is performed. The specific production process is as follows: the etching sheet 1 is etched, and a groove 4 structure is etched on the top of the etching sheet 1. Then the etching sheet 1 is placed in the transfer molding mold. Subsequently, the plastic material is heated and melted, and then injected into the precision mold cavity. After pressure curing, the plastic material forms a carrier plate 2 that wraps around the outside of the etching sheet 1. During the pressure process, the plastic material flows in the mold cavity. Since the top and bottom of the etching sheet 1 are in contact with the inner wall of the mold, the groove 4 and the mold form an independent space, and the plastic material cannot enter the groove 4. Therefore, the groove 4 on the main structure of the bracket still exists after transfer molding. When the subsequent glue application process is carried out, the glue covers the top of the main structure of the bracket and flows into the groove 4. After curing, the glue solidifies and forms a riveting structure in the groove 4, which is firmly locked in the groove 4, increasing the firmness of the glue solidification layer and preventing it from falling off. Then the main structure of the bracket is divided to form multiple unit bracket structures 5.

[0044] In another embodiment, all or part of the non-functional area other than the connecting diode area is etched away to form a groove; specifically, the required circuit is etched out first, then transfer molding is performed, and after the transfer molding is completed, the etching stage is returned to etch away the unnecessary metal parts to form groove 4.

[0045] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An adhesion-enhancing stent, characterized by Include: Support body structure; The support body structure includes an etching sheet (1) and a carrier plate (2) for carrying the etching sheet (1), the top of the carrier plate (2) is provided with a mounting groove (3), the etching sheet (1) is installed in the mounting groove (3) through the transfer molding process, the etching sheet (1) is provided with a groove (4), the support body structure includes a plurality of unit support structures (5), the unit support structure (5) includes two groups of circuit channels (6) and a carrier plate.

2. The enhanced adhesion stent of claim 1, wherein: The groove (4) is provided on the top of the circuit channel (6), and the groove (4) is in a non-linear structure, and the two ends of the through groove form a sealing structure which does not communicate with the edge of the circuit channel (6).

3. The enhanced adhesion stent of claim 1, wherein: The two groups of circuit channels (6) in the same unit support structure (5) are not communicated, and the etching sheet (1) includes the circuit channel (6) and the connecting part (7).

4. The enhanced adhesion stent of claim 1, wherein: The corner of the inner wall of the groove (4) is a circular arc corner, and the outer edge of the etching sheet (1) is a circular arc corner.

5. The enhanced adhesion stent of claim 3, wherein: The top of the connecting part (7) is flush with the top of the circuit channel (6), and the thickness of the connecting part (7) is half of the thickness of the carrier plate (2).

6. The enhanced adhesion stent of claim 1, wherein: The included angle between the groove wall of the groove (4) and the vertical etching sheet (1) is-20 to 20 degrees.

7. The enhanced adhesion stent of claim 6, wherein: The included angle between the groove wall of the groove (4) and the etching sheet (1) is-20 degrees.

8. The enhanced adhesion stent of claim 1, wherein: The surface of the etching sheet (1) is frosted.

9. The enhanced adhesion stent of claim 1, wherein: The groove (4) is a groove around the connection diode functional area; or, The non-functional area outside the connection diode area is etched away completely or partially to form a groove.

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