Electronic chip tray

Abstract

The utility model discloses an electronic chip tray which comprises a main body frame and a plurality of supporting units evenly distributed in the main body frame, an electronic chip is placed in each supporting unit, each supporting unit comprises a base and four sets of supporting pieces arranged on the base, a through groove is formed in the middle of each base, and the supporting pieces are arranged in the through grooves. The four sets of supporting pieces are distributed on the periphery of a rectangle, the four sets of supporting pieces are matched to form a rectangular supporting area matched with an electronic chip in size, and every two adjacent supporting pieces are not connected. According to the scheme, the four groups of supporting pieces are not connected with one another, and the gap between every two adjacent groups of supporting pieces can counteract the action of the stress corresponding to the electronic chip under the condition of high temperature or pressure, so that the acting force is released, and the flatness of the electronic chip is better.

Description

Technical Field

[0001] This utility model relates to the field of electronic chip trays, and more specifically, to an electronic chip tray. Background Technology

[0002] With the continuous development of electronic technology and the widespread application of integrated circuit (IC) chips, the production, transportation, and storage of electronic chips face increasingly higher requirements. Electronic chip trays (also known as IC trays), as one of the important accessories for integrated circuit chips, play a crucial role. They not only ensure the safety of chips during production and transportation but also effectively support automated packaging, testing, and assembly processes.

[0003] Chip trays are typically designed with precise slots or grooves to ensure that chips are placed stably within the tray, preventing displacement, collisions, or pressure during transportation and storage. Existing chip trays usually have enclosed support areas. In some processes, due to temperature differences and pressure, traditional enclosed support structures can cause the chips to deform under stress, resulting in poorer flatness. Utility Model Content

[0004] The purpose of this utility model is to provide an electronic chip tray to solve the technical problems existing in the background art.

[0005] This utility model provides an electronic chip tray, including a main frame and a plurality of support units evenly distributed within the main frame, with an electronic chip placed in each support unit;

[0006] The support unit includes a base and four sets of support members disposed on the base. A through groove is provided in the middle of the base. The four sets of support members are distributed in a rectangular shape around the perimeter, and the four sets of support members cooperate to form a rectangular support area adapted to the size of the electronic chip. Adjacent support members are not connected.

[0007] In a preferred embodiment, each of the four sets of support members includes a support base and a guide limiting block disposed on the support base.

[0008] In a preferred embodiment, a support strip is provided protruding from the support base, and the support strip extends from the support base into the through groove.

[0009] In a preferred embodiment, a buffer opening is formed between two adjacent support bases.

[0010] In a preferred embodiment, the length of the support bar is not unique, and the support bar is flush with the support surface of the support base.

[0011] In a preferred embodiment, the side of the guide block that contacts the electronic chip has an inclined surface.

[0012] The beneficial effects of this utility model's technical solution are:

[0013] In this solution, the four sets of support members are not connected to each other. Under high temperature or pressure conditions, the gap between two adjacent sets of support members can offset the stress on the electronic chip, thereby releasing the force and improving the flatness of the electronic chip.

[0014] The support base can support the edges of the electronic chip, and the four sets of support bars can support the electronic chip in four directions to ensure support strength, further increase support stability, and reduce the probability of chip unevenness. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the overall structure of this utility model.

[0016] Figure 2 This is a schematic diagram of a single support unit structure of this utility model.

[0017] Figure 3 This is a schematic diagram showing the electronic chip after placement.

[0018] Figure 4 This is a schematic diagram of the electronic chip after placement from a downward viewing angle.

[0019] Explanation of reference numerals in the attached drawings: 1 Main frame, 2 Support unit, 3 Support base, 4 Support bar, 5 Guide limit block, 6 Inclined surface, 7 Buffer opening, 8 Through slot, 9 Electronic chip. Detailed Implementation

[0020] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments. The embodiments of the present invention are given for the purpose of illustration and description, and are not intended to be exhaustive or to limit the present invention to the disclosed forms. Many modifications and variations will be apparent to those skilled in the art. The embodiments were chosen and described to better illustrate the principles and practical applications of the present invention, and to enable those skilled in the art to understand the present invention and design various embodiments with various modifications suitable for a particular purpose.

[0021] like Figures 1-4 As shown, the present invention provides an electronic chip tray, including a main frame 1 and a plurality of support units 2 evenly distributed within the main frame 1. Each support unit 2 holds an electronic chip 9, and the electronic chip 9 is supported by the plurality of support units 2 for subsequent processing steps.

[0022] The support unit 2 includes a base and four sets of support members disposed on the base. A through slot is formed in the center of the base. The four sets of support members are distributed in a rectangular pattern around the perimeter, and they cooperate to form a rectangular support area adapted to the size of the electronic chip 9. Adjacent support members are not connected. The support area formed by the four sets of support members is used to support the electronic chip 9. The size of the support area is adapted to the size of the electronic chip 9 to prevent displacement of the electronic chip 9 in subsequent steps, thereby increasing the stability of the intelligent support. In this design, the four sets of support members are not connected to each other. Under high temperature or pressure conditions, the gap between adjacent sets of support members can offset the stress acting on the electronic chip 9, releasing the force and thus improving the flatness of the electronic chip 9.

[0023] Each of the four sets of support components includes a support base 3 and a guide limiting block 5 disposed on the support base 3. A support strip 4 protrudes from the support base 3 and extends into the through slot 8. The support base 3 can support the edge of the electronic chip 9, and the four sets of support strips 4 can support the electronic chip 9 in four directions, ensuring support strength, further increasing support stability, and reducing the probability of chip unevenness. The through slot can dissipate heat from the electronic chip 9, preventing damage to the electronic chip due to excessive temperature.

[0024] The length of the support bar 4 is not unique, and the support bar 4 is flush with the support surface of the support base 3. The support bar 4 can be set according to specific usage requirements, as long as it can avoid the solder balls at the bottom of the electronic chip 9. This is because when the solder balls come into contact with the support unit 2, they are prone to wear, which affects the performance of the electronic chip. The powder generated by the wear can also contaminate the electronic chip.

[0025] A buffer opening 7 is formed between two adjacent support bases 3. The buffer opening 7 is used to release the force on the chip, making the chip flatter. At the same time, the setting of the buffer opening 7 also increases the heat dissipation effect on the electronic chip 9 over a certain length.

[0026] The guide limiting block 5 has an inclined surface 5 on the side that contacts the electronic chip 9. The inclined surface 5 facilitates the placement of the electronic chip 9 into the support area and avoids damage to the edges of the electronic chip 9.

[0027] Obviously, the described embodiments are only a part of the embodiments of this utility model, and not all of them. All other embodiments obtained by those skilled in the art and related fields based on the embodiments of this utility model without creative effort should fall within the protection scope of this utility model. Structures, devices, and operating methods not specifically described and explained in this utility model, unless otherwise specified or limited, shall be implemented according to conventional means in the art.

Claims

1. An electronic chip tray, characterized by: The main body frame and several support units are evenly distributed in the main body frame, and each support unit is used for placing an electronic chip; The support unit comprises a base and four groups of support pieces arranged on the base, a through slot is formed in the middle of the base, the four groups of support pieces are distributed around the base in a rectangular shape, and the four groups of support pieces cooperatively form a rectangular support area matching the size of the electronic chip, and two adjacent support pieces are not connected.

2. An electronic chip tray as claimed in claim 1, characterized in that: The four groups of support pieces each comprise a support base and a guide limiting block arranged on the support base.

3. An electronic chip tray as claimed in claim 2, characterized in that: A support strip is protrusively arranged on the support base and extends from the support base to the through slot.

4. An electronic chip tray as claimed in claim 2, characterized in that: A buffer opening is formed between two adjacent support bases.

5. An electronic chip tray as claimed in claim 3, characterized in that: The length of the support strip is not unique, and the support strip is flush with the support surface of the support base.

6. An electronic chip tray as claimed in claim 2, characterized in that: An inclined surface is arranged on the side of the guide limiting block in contact with the electronic chip.

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