Limiting assembly and chip testing device
By designing detachable limiting components and a magnetic structure, the problem of chip test sockets being incompatible with chips of different sizes was solved, enabling efficient and low-cost chip testing.
Patent Information
- Application Number
- CN202423321717.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-31
- Publication Date
- 2026-03-06
- Estimated Expiration
- 2034-12-31
AI Technical Summary
Existing chip test sockets can only hold chips of the same size. When the chip pins remain the same but the size changes, they are incompatible, resulting in high costs and inconvenience in replacing test sockets, which affects production efficiency.
Design a detachable limiting component that cooperates with the test base plate through a magnetic structure, suitable for fixing chips of different sizes, forming a second chip test position, and realizing the testing of multiple chips.
It improves testing efficiency, reduces equipment replacement costs, facilitates chip assembly and disassembly, and adapts to the testing needs of chips of different sizes.
Smart Images

Figure CN223977311U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of chip testing technology, and in particular to a limiting component and a chip testing device. Background Technology
[0002] Before a chip can be used, it needs to undergo various tests to remove potential defects. These tests include applying voltage to it or testing it in high-temperature environments corresponding to thermal and mechanical environmental tests to make it work or store it, thereby screening out qualified and defective products. These tests are carried out in a non-destructive manner, and a test device such as a chip test socket is required for these various tests.
[0003] During testing, the tester places the chip under test into the test socket of a chip testing device equipped with test probes or conductive adhesive, and aligns the test probes with the chip's test pins one-to-one. This method has the following problems: the alignment of chip pins and probes is fixed; one test socket can only test the same product. When the chip pins remain the same, but the chip size changes, the existing test socket will be incompatible, requiring the manufacture of a new, larger test socket, which is very expensive. Furthermore, installing and replacing test sockets is inconvenient, time-consuming, and labor-intensive, impacting production efficiency. Therefore, these problems urgently need to be solved. Utility Model Content
[0004] The purpose of this application is to provide a limit component and chip testing device that is convenient to test and improves testing efficiency.
[0005] This application discloses a limiting component for fixing chips of various sizes in a chip testing device. The chip testing device includes a test base, which includes a test frame, a test base plate, and multiple test connection points. The test frame is a hollow frame structure. The test frame and the test base plate cooperate to form a first chip test position. The multiple test connection points are disposed on the test base plate within the first chip test position. The limiting component is detachably disposed within the first chip test position for fixing chips of various sizes. The limiting component and the first chip test position cooperate to form a second chip test position, wherein the size of the second chip test position is smaller than the size of the first chip test position.
[0006] Optionally, the chip to be tested is a DDR chip or an LPDDR chip, and the limiting component is fixed to the test base plate by a magnetic attraction structure.
[0007] Optionally, the limiting component includes a limiting frame and a limiting member. The limiting frame is a hollow frame structure. The limiting frame is disposed within the first chip test position and perpendicularly abuts against the test base plate. The limiting member is disposed on the outer periphery of the limiting frame and is fixedly connected to the limiting frame. The magnetic attraction structure includes a first magnetic member and a second magnetic member. The first chip test position includes a test surface formed by arranging multiple test connection points and a blank area without test connection points. The first magnetic member is disposed on the limiting member, and the second magnetic member is disposed in the blank area. The limiting member is fixed to the test base plate through the first magnetic member and the second magnetic member, and the upper surface of the limiting member is flush with the upper surface of the test frame.
[0008] Optionally, the limiting frame includes a first limiting part, a second limiting part, a third limiting part, and a fourth limiting part connected in sequence. The first limiting part and the third limiting part are disposed opposite to each other, and the second limiting part and the fourth limiting part are disposed opposite to each other. The included angles formed between the first limiting part, the second limiting part, the third limiting part, and the fourth limiting part and the test base plate are all between 35° and 80°.
[0009] Optionally, a first cutout portion is provided on the side of the first limiting portion near the test base plate and the side of the third limiting portion near the test base plate, and a second cutout portion is provided on the side of the second limiting portion near the test base plate and the side of the fourth limiting portion near the test base plate; a third cutout portion is formed between the first limiting portion and the second limiting portion and the fourth limiting portion respectively; a fourth cutout portion is formed between the third limiting portion and the second limiting portion and the fourth limiting portion respectively; the first cutout portion, the second cutout portion, the third cutout portion and the fourth cutout portion are all recessed in a direction away from the chip to be tested.
[0010] Optionally, the test surface includes multiple sub-test surfaces, the empty area includes a first empty area and multiple second empty areas, the multiple first empty areas are configured one-to-one with the multiple sub-test surfaces, and the second empty areas are disposed on the outer periphery of the multiple first empty areas; the limiting frame includes multiple sub-limiting frames, the multiple sub-limiting frames are spaced apart, the limiting member is disposed on the outer periphery of the multiple limiting frames, the multiple sub-limiting frames and the multiple first empty areas are configured one-to-one to form multiple second sub-chip test positions, and the limiting member is configured to cooperate with the second empty areas.
[0011] Optionally, both the empty area and the test surface are rectangular structures, as are the limiting frame and the limiting member.
[0012] Optionally, the empty area is an elliptical structure, the test surface is a rectangular structure, the limiting frame is a rectangular structure, and the limiting component is an elliptical structure.
[0013] Optionally, there are multiple first magnetic elements and multiple second magnetic elements. The multiple first magnetic elements are arranged at intervals around the test surface along the empty area, and the multiple second magnetic elements are arranged at intervals along the surrounding direction of the limiting element. The multiple first magnetic elements and the multiple second magnetic elements are arranged in a one-to-one correspondence.
[0014] Optionally, multiple sub-limiting frames can be fixed in conjunction with ten different sizes of the chip to be tested.
[0015] This application also discloses a chip testing device, including a test socket, a cover, and a limiting component as described above. The test socket includes a test frame, a test base plate, and multiple test connection points. The test frame is a hollow frame structure. The test frame and the test base plate cooperate to form a first chip testing position. The multiple test connection points are disposed within the first chip testing position. The limiting component is detachably disposed within the first chip testing position and cooperates with the first chip testing position to form a second chip testing position. The cover is disposed on the test frame and is movably connected to the test frame. When the chip to be tested of a corresponding size is placed in the second chip testing position, the cover is closed to test the chip to be tested.
[0016] Compared to traditional test sockets that can only test the same product and become incompatible when the chip pins remain the same but the chip size changes, the limiting component of this application is detachably installed in the first chip test position of the chip testing device to fix chips of various sizes. The limiting component and the first chip test position cooperate to form a second chip test position, wherein the size of the second chip test position is smaller than that of the first chip test position. In this way, when the chip size does not match the original size of the first chip test position, only the limiting component of the corresponding size needs to be replaced, so that the same testing device can test chips of various sizes. Therefore, testing efficiency is improved while saving equipment costs. Attached Figure Description
[0017] The accompanying drawings, which form part of the specification, are used to provide a further understanding of the embodiments of this application and illustrate the implementation methods of this application, together with the textual description, to explain the principles of this application. Obviously, the drawings described below are merely some embodiments of this application, and those skilled in the art can obtain other drawings based on these drawings without any creative effort. In the drawings:
[0018] Figure 1This is a schematic diagram of the structure of the limiting component provided in the first embodiment of this application;
[0019] Figure 2 This is an exploded structural diagram of the chip testing device provided in the first embodiment of this application;
[0020] Figure 3 yes Figure 2 Top view of the assembled structure;
[0021] Figure 4 This is a schematic diagram of the structure of the limiting component and the test base plate provided in the second embodiment of this application;
[0022] Figure 5 This is a schematic diagram of the overall structure of the chip testing device provided in the second embodiment of this application.
[0023] Wherein: 10, chip testing device; 100, limiting component; 110, limiting frame; 111, first limiting part; 112, second limiting part; 113, third limiting part; 114, fourth limiting part; 115, sub-limiting frame; 116, first hollow part; 117, second hollow part; 118, third hollow part; 119, fourth hollow part; 120, limiting element; 130, magnetic structure; 131, first magnetic... Components: 132, Second magnetic component; 200, Test base; 210, Test frame; 220, Test base plate; 230, Test connection point; 240, First chip test position; 241, Test surface; 242, Empty area; 243, Sub-test surface; 244, First empty area; 245, Second empty area; 250, Second chip test position; 251, Second sub-chip test position; 300, Cover; 310, Pressing block. Detailed Implementation
[0024] It should be understood that the terminology, specific structural and functional details used herein are merely for describing particular embodiments and are representative. However, this application may be implemented in many alternative forms and should not be construed as being limited to the embodiments set forth herein.
[0025] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating relative importance or implying the number of indicated technical features. Therefore, unless otherwise stated, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature; "multiple" means two or more. The term "comprising" and any variations thereof mean a non-exclusive inclusion, which may include or add one or more other features, integers, steps, operations, units, components, and / or combinations thereof. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.
[0026] The present application will now be described in detail with reference to the accompanying drawings and embodiments.
[0027] First embodiment:
[0028] Figure 1 This is a schematic diagram of the structure of the limiting component provided in the first embodiment of this application. Figure 2 This is an exploded structural diagram of the chip testing device provided in the first embodiment of this application, as shown below. Figure 1-2 As shown, this application discloses a limiting component 100 for fixing chips of various sizes in a chip testing device 10. The chip testing device 10 includes a test base 200, which includes a test frame 210, a test base plate 220, and multiple test connection points 230. The test frame 210 is a hollow frame structure. The test frame 210 and the test base plate 220 cooperate to form a first chip testing position 240. The multiple test connection points 230 are disposed on the test base plate 220 within the first chip testing position 240. The limiting component 100 is detachably disposed within the first chip testing position 240 for fixing chips of various sizes. The limiting component 100 and the first chip testing position 240 cooperate to form a second chip testing position 250, wherein the size of the second chip testing position 250 is smaller than the size of the first chip testing position 240. The chip testing device 10 also includes a cover (not shown in the figure), which is disposed on the test frame 210 and is movably connected to the test frame 210. When the chip to be tested (not shown in the figure) of the corresponding size is placed in the second chip test position 250, the cover is closed to test the chip to be tested.
[0029] Compared to traditional test sockets 200, which can only fix and test the same product, and become incompatible when the chip pins remain the same but the chip size changes, the limiting component 100 of this application is detachably installed in the first chip test position 240 of the chip testing device 10 to fix chips of various sizes. The limiting component 100 and the first chip test position 240 cooperate to form a second chip test position 250, wherein the size of the second chip test position 250 is smaller than the size of the first chip test position 240. In this way, when the chip size does not match the original size of the first chip test position 240, it is only necessary to replace the limiting component 100 of the corresponding size to achieve the same testing device to test chips of various sizes. Therefore, testing efficiency is improved while saving equipment costs.
[0030] The number of test pins on the various sizes of chips to be tested matches the number of test connection points 230 within the first chip test position 240. The test connection points 230 are made of pressure-sensitive conductive adhesive and are used to connect to the pins on the chip. They are then connected to the test circuit within the test base plate 220, and the connected chips are tested after being turned on. The various sizes of chips are LPDDR. The limiting component 100 is made of plastic material, and its dimensions are 14.5 mm * 10 mm.
[0031] The first chip test position 240 is single, testing only one chip at a time. The limiting frame 110 can be fixed with ten different sizes of chips, including 8mm*12mm, 10mm*11mm, 9mm*10.5mm, 8mm*10.5mm, 9mm*11mm, 7.5mm*11mm, 7.5mm*12mm, 9.5mm*11mm, 10.3mm*11mm, and 8mm*11mm chips, all of which can be tested using the limiting component. The limiting component 100 is fixed to the test base plate 220 via a magnetic attraction structure 130. This facilitates easy assembly and disassembly without the need for additional tools, saving time and improving the testing rate.
[0032] Specifically, such as Figure 1As shown, the limiting component 100 includes a limiting frame 110 and a limiting member 120. The limiting frame 110 is a hollow frame structure. The limiting frame 110 is disposed within the first chip test position 240 and is perpendicularly abutted against the test base plate 220. The limiting member 120 is disposed on the side of the limiting frame 110 away from the first chip test position 240, is fixedly connected to the limiting frame 110, and extends along a horizontal plane parallel to the test base plate 220 towards the test frame 210. The magnetic attraction structure 130 includes a first magnetic member 131 and a second magnetic member 132. The first chip test position 240... The device 0 includes a test surface 241 formed by arranging multiple test connection points 230 and a blank area 242 without test connection points 230. The first magnetic element 131 is disposed on the limiting element 120, and the second magnetic element 132 is disposed in the blank area 242. When the size of the first chip test position 240 matches the size of the chip to be tested, the limiting component 100 is not required. When the size of the first chip test position 240 does not match the size of the chip to be tested, the limiting component 100 needs to be placed into the first chip test position 240, so that the chip can be tested by the chip testing device 10. The magnetic structure 130 uses a magnet. A hole can be drilled in the empty area 242 of the test base plate to embed the magnet, and a positioning pin is reserved to facilitate the positioning and installation of the limiting component 100. On the side of the limiting component 120 facing the test base plate 220, a hole is drilled corresponding to the position of the second magnetic component 132 and a magnet is embedded. The first magnetic component 131 is the S pole and the second magnetic component 132 is the N pole. Of course, it is also possible for the first magnetic component 131 to be the N pole and the second magnetic component 132 to be the S pole. The specific design is based on the requirements and is not limited here.
[0033] The limiting member 120 is fixed to the test base plate 220 through the cooperation of the first magnetic member 131 and the second magnetic member 132, and the upper surface of the limiting member 120 is flush with the upper surface of the test frame 210. This results in a flat and aesthetically pleasing overall appearance of the test base 200. Multiple first magnetic members 131 and multiple second magnetic members 132 are arranged at intervals around the test surface 241 along the open area 242, and multiple second magnetic members 132 are arranged at intervals along the circumferential direction of the limiting member 120. Each pair of first magnetic members 131 and multiple second magnetic members 132 corresponds to one other. Multiple positions on the limiting member 120 can be fixed by the magnetic attraction structure 130, enhancing the stability of the entire limiting assembly 100.
[0034] Figure 3 yes Figure 2 A top view of the assembled structure, as shown below. Figure 1 As shown, combined with Figures 2-3The limiting frame 110 includes a first limiting part 111, a second limiting part 112, a third limiting part 113, and a fourth limiting part 114 connected in sequence. The first limiting part 111 and the third limiting part 113 are disposed opposite to each other, and the second limiting part 112 and the fourth limiting part 114 are disposed opposite to each other. The included angles formed between the first limiting part 111, the second limiting part 112, the third limiting part 113, and the fourth limiting part 114 and the test base plate 220 are all between 35° and 80°. That is, the limiting frame 110 and the test base plate 220 cooperate to form a slope, and gradually narrow from top to bottom, forming a structure that is wider at the top and narrower at the bottom. Since the chip itself is relatively small and needs to be gripped by mechanical tools, this structure facilitates the placement of the chip into the second chip test position 250.
[0035] Furthermore, the first limiting part 111 near the test base plate 220 and the third limiting part 113 near the test base plate 220 are both provided with a first hollow part 116, and the second limiting part 112 near the test base plate 220 and the fourth limiting part 114 near the test base plate 220 are both provided with a second hollow part 117; the first limiting part 111 forms a third hollow part 118 between itself and the second limiting part 112 and the fourth limiting part 114 respectively; the third limiting part 113 forms a fourth hollow part 119 between itself and the second limiting part 112 and the fourth limiting part 114 respectively, and the first hollow part 111, the second hollow part 112, the third hollow part 113 and the fourth hollow part 114 are all recessed in a direction away from the chip to be tested. This creates multiple cutouts on the limiting frame 110, increasing the deformation capability of the four limiting parts and making it easier to insert the chip. Even if the chip size is slightly larger than the size of the second chip test position 250, it can still be inserted. Moreover, the first limiting part 111, the second limiting part 112, the third limiting part 113, and the fourth limiting part 114 can better fix the chip.
[0036] In this design, both the empty area 242 and the test surface 241 are rectangular structures, as are the limiting frame 110 and the limiting member 120. This arrangement of the limiting member 120 and the empty area 242 creates a unified and aesthetically pleasing overall shape. Alternatively, the empty area 242 could be elliptical, the test surface 241 rectangular, the limiting frame 110 rectangular, and the limiting member 120 elliptical, matching the elliptical empty area 242.
[0037] Second embodiment:
[0038] Figure 4This is a schematic diagram of the structure of the limiting component and the test base plate provided in the second embodiment of this application. Figure 5 This is a schematic diagram of the overall structure of the chip testing device provided in the second embodiment of this application, combined with... Figures 4-5 As a second embodiment of this application, this embodiment differs from the first embodiment in that the chip testing device 10 can simultaneously test chips of various sizes. The chip under test is a DDR chip. The testing device includes two sets of spaced-apart first chip test positions 240. The test surface 241 in each set of first chip test positions 240 includes multiple sub-test surfaces 243. The empty area 242 includes a first empty area 244 and multiple second empty areas 245. The multiple first empty areas 244 and multiple sub-test surfaces 245 are connected together. Each of the sub-test surfaces 243 is configured in a one-to-one correspondence, and the second empty area 245 is disposed on the outer periphery of the plurality of first empty areas 244; the limiting frame 110 includes a plurality of sub-limiting frames 115, which are spaced apart, and the limiting member 120 is disposed on the outer periphery of the plurality of limiting frames 110. The plurality of sub-limiting frames 115 and the plurality of first empty areas 244 are configured in a one-to-one correspondence to form a plurality of second sub-chip test positions 251, and the limiting member 120 is configured in cooperation with the second empty area 245.
[0039] Among them, such as Figure 5 As shown, the chip testing device 10 can have eight test surfaces 241 and four covers 300 connected to the test frame 210. Each cover 300 corresponds to two test surfaces 241, and two pressure blocks 310 are correspondingly provided on each cover 300. When the cover 300 is closed, the pressure blocks 310 are used to fix the chip to be tested. In this way, the chip testing device can simultaneously test eight different sizes or eight chips of the same size, further improving chip testing efficiency.
[0040] Of course, the number of the first chip test bits 240 can be designed according to production needs; moreover, the chip testing device 10 can also be designed according to testing requirements for testing other types of chips besides DDR and LPDDR, which is not limited here.
[0041] It should be noted that the inventive concept of this application can form many embodiments, but due to the limited space of the application documents, they cannot all be listed. Therefore, without conflict, the embodiments described above or the technical features can be arbitrarily combined to form new embodiments. After the embodiments or technical features are combined, the original technical effect will be enhanced.
[0042] The above description, in conjunction with specific optional embodiments, provides a further detailed explanation of this application and should not be construed as limiting the specific implementation of this application to these descriptions. For those skilled in the art, various simple deductions or substitutions can be made without departing from the concept of this application, and all such modifications or substitutions should be considered within the scope of protection of this application.
Claims
1. A limiting assembly for a chip testing device, the chip testing device comprising a test seat, the test seat comprising a test frame, a test base plate and a plurality of test connection points, the test frame being a hollow frame structure, the test frame cooperating with the test base plate to form a first chip testing site, the plurality of test connection points being disposed on the test base plate within the first chip testing site, characterized in that, The limiting component is detachably disposed within the first chip test position for fixing chips of various sizes to be tested. The limiting component cooperates with the first chip test position to form a second chip test position. The size of the second chip test bit is smaller than the size of the first chip test bit.
2. The check assembly of claim 1, wherein, The chip to be tested is a DDR chip or an LPDDR chip, and the limiting component is fixed to the test base plate by a magnetic attraction structure.
3. The check assembly of claim 2, wherein, The limiting component includes a limiting frame and a limiting member. The limiting frame is a hollow frame structure. The limiting frame is set inside the first chip test position and is perpendicularly abutted against the test base plate. The limiting member is set on the outer periphery of the limiting frame and is fixedly connected to the limiting frame. The magnetic structure includes a first magnetic component and a second magnetic component. The first chip test position includes a test surface formed by arranging multiple test connection points and a blank area. The first magnetic component is disposed on the limiting component, and the second magnetic component is disposed in the blank area. The limiting component is fixed to the test base plate through the cooperation of the first magnetic component and the second magnetic component, and the upper surface of the limiting component is flush with the upper surface of the test frame.
4. The check assembly of claim 3, wherein, The limiting frame includes a first limiting part, a second limiting part, a third limiting part, and a fourth limiting part connected in sequence. The first limiting part and the third limiting part are disposed opposite to each other, and the second limiting part and the fourth limiting part are disposed opposite to each other. The included angles formed between the first limiting part, the second limiting part, the third limiting part, and the fourth limiting part and the test base plate are all between 35° and 80°.
5. The check assembly of claim 4, wherein, The first limiting part and the third limiting part are both provided with a first hollow part on the side near the test base plate, and the second limiting part and the fourth limiting part are both provided with a second hollow part on the side near the test base plate. A third hollow portion is formed between the first limiting portion and the second limiting portion and the fourth limiting portion, respectively; The third limiting part forms a fourth hollow part with the second limiting part and the fourth limiting part respectively; The first, second, third, and fourth cutout portions are all recessed in a direction away from the chip to be tested.
6. The check assembly of claim 3 wherein, The test surface includes multiple sub-test surfaces, and the empty area includes a first empty area and multiple second empty areas. The multiple first empty areas are arranged in a one-to-one correspondence with the multiple sub-test surfaces, and the second empty areas are arranged on the outer periphery of the multiple first empty areas. The limiting frame includes multiple sub-limiting frames, which are spaced apart. The limiting member is disposed on the outer periphery of the multiple limiting frames. The multiple sub-limiting frames and multiple first empty areas correspond one-to-one to form multiple second sub-chip test positions. The limiting member is configured to cooperate with the second empty areas.
7. The check assembly of claim 3 wherein, Both the empty area and the test surface are rectangular structures, as are the limiting frame and the limiting component.
8. The check assembly of claim 3, wherein, The empty area is an elliptical structure, the test surface is a rectangular structure, the limiting frame is a rectangular structure, and the limiting component is an elliptical structure.
9. The check assembly of claim 3 wherein, The first magnetic members are multiple, the second magnetic members are multiple, the multiple first magnetic members are arranged along the reserved area and are spaced around the test surface, the multiple second magnetic members are arranged along the circumferential direction of the limiting member and are spaced, and the multiple first magnetic members and the multiple second magnetic members are arranged one by one.
10. The check assembly of claim 3, wherein, The limiting frame can be matched with ten sizes of the to-be-detected chips to be fixed.
11. A chip testing apparatus characterized by comprising: The test seat comprises a test frame, a test bottom plate and a plurality of test connecting points, the test frame is a hollow frame structure, the test frame is matched with the test bottom plate to form a first chip test site, the plurality of test connecting points are arranged in the first chip test site, the limiting assembly is detachably arranged in the first chip test site, is matched with the first chip test site to form a second chip test site, and the cover is arranged on the test frame and is movably connected with the test frame. When the to-be-detected chip of a corresponding size is placed in the second chip test site and the cover is closed, the to-be-detected chip can be detected.