Jet flow type cooling device for server

Abstract

The utility model relates to a jet-flow type cooling device for a server. The jet-flow type cooling device comprises a server shell and a flow dividing assembly. A mainboard and at least one memory module arranged on the mainboard are arranged in the server shell, and the memory module is formed by arranging a plurality of memories at intervals and is arranged on the mainboard, so that an arrangement interval is formed between any two adjacent memories; the flow dividing assembly is arranged in the server shell and comprises a flow divider and at least one first jet flow pipe communicated with the flow divider. Wherein the first jet flow pipe extends from the surface of the flow divider and extends into any one arrangement interval, and is provided with a first nozzle positioned in any one arrangement interval to provide positive pressure or negative pressure, and the jet flow generated by the positive pressure or the negative pressure is used for cooling the internal memory in the server.

Description

Technical Field

[0001] This application relates to a heat dissipation device, and more particularly to a server jet cooling device. Background Technology

[0002] In existing servers, multiple memory modules are often added to expand computing power, and these memory modules are vertically mounted on the motherboard with spacing between them. This causes the heat generated during memory operation to accumulate between the modules and be difficult to dissipate. This is especially true since server chassis often contain complex electronic components and other heat dissipation components, making it difficult to dissipate heat simply through external airflow such as fans, given the surrounding obstructions and configurations.

[0003] In view of this, in order to improve and solve the above-mentioned deficiencies, the applicant has devoted himself to research and applied theoretical principles, and finally proposed a design that is reasonable and effective in improving the above-mentioned deficiencies. Utility Model Content

[0004] The main objective of this application is to provide a server jet cooling device that dissipates heat from the memory within the server by generating jets with positive or negative pressure.

[0005] To achieve the above objectives, this application provides a server jet cooling device, including a server chassis and a distribution assembly; the server chassis has a motherboard and at least one memory module disposed on the motherboard, and the memory module is arranged in a plurality of memory intervals on the motherboard so that there is an arrangement gap between any two adjacent memory modules; the distribution assembly is disposed in the server chassis and includes a distributor and at least one first jet pipe communicating with the distributor; wherein, the first jet pipe extends from the surface of the distributor and extends into any one of the arrangement gaps, and has a first nozzle located in any one of the arrangement gaps to provide positive pressure or negative pressure.

[0006] In one implementation, the memory module is provided with a wind shield.

[0007] In one embodiment, a fan is provided on the memory module away from the first jet pipe.

[0008] In one implementation, the splitter extends in a long strip along the arrangement direction of the memory modules.

[0009] In one implementation, the splitter has a connecting pipe that extends to the outside of the server chassis and provides positive or negative pressure.

[0010] In one embodiment, the first jet pipe is located above, below, or in the middle of the arrangement spacing.

[0011] In one embodiment, the first jet pipe is configured to extend in accordance with the length of each memory module, and a plurality of first nozzles are also configured on the first jet pipe along the length of each memory module.

[0012] In one embodiment, the motherboard is further provided with at least one electronic component, the electronic component is provided with a cooling unit, the cooling unit is provided with a shield on the electronic component, the shield is provided with vent holes, and the diversion component further includes at least one second jet pipe and is arranged toward the electronic component.

[0013] In one embodiment, the cooling unit has multiple heat sinks attached to the surface of the electronic components, and a shield is disposed on the multiple heat sinks.

[0014] In one embodiment, multiple heat sinks are attached to the surface of the electronic component as heat sinks. Attached Figure Description

[0015] Figure 1 A perspective view of the first embodiment of this application.

[0016] Figure 2 A plan view of the first embodiment of this application.

[0017] Figure 3 A cross-sectional view of the first embodiment of this application.

[0018] Figure 3A in accordance with Figure 3 A magnified view of another design change.

[0019] Figure 4 A perspective view of the second embodiment of this application.

[0020] Figure 5 A plan view of the second embodiment of this application.

[0021] Figure 6 A cross-sectional view of the second embodiment of this application.

[0022] Figure 6A in accordance with Figure 6 A magnified view of another design change.

[0023] Figure 7 A perspective view of the third embodiment of this application.

[0024] Explanation of reference numerals in the attached figures:

[0025] 1: Server casing;

[0026] 1a: Motherboard;

[0027] 1b: End face;

[0028] 10: Memory module;

[0029] 10a: Memory;

[0030] 11: Electronic components;

[0031] S: Spacing;

[0032] 2: Distributor components;

[0033] 20: Diverter;

[0034] 21: First jet pipe;

[0035] 21a: Windshield;

[0036] 210: First nozzle;

[0037] 22: Second jet pipe;

[0038] 220: Second nozzle;

[0039] 23: Connecting pipe;

[0040] 230: Interface;

[0041] 24: Fan;

[0042] 3: Cooling unit;

[0043] 30: Heat sink;

[0044] 300: Heat sink;

[0045] 31: Shielding;

[0046] 310: Vent hole. Detailed Implementation

[0047] To enable your examination committee to better understand the features and technical content of this application, please refer to the following detailed description and drawings of this application. However, the drawings are provided for reference and illustration only and are not intended to limit this application.

[0048] Please see Figure 1 , Figure 2 and Figure 3The figures shown are a perspective view, a plan view, and a cross-sectional view of the first embodiment of this application, respectively. This application provides a server jet cooling device, including a server housing 1 and a heat exchange component 2 disposed within the server housing 1. The server housing 1 has a motherboard 1a and at least one memory module 10 disposed on the motherboard 1a, and each memory module 10 consists of multiple memory modules 10a arranged at intervals on the motherboard 1a. Further, at least one electronic component 11 may be disposed on the motherboard 1a, which may be various electronic processing units or operating devices, such as a central processing unit (CPU).

[0049] As described above, the power distribution assembly 2 includes a power distribution unit 20 and at least one first jet pipe 21 that communicates with and extends from the power distribution unit 20; further, it may also include at least one second jet pipe 22. The first jet pipe 21 corresponds to the aforementioned memory module 10, while the second jet pipe 22 corresponds to the aforementioned electronic component 11. Specifically, the power distribution unit 20 of this application extends in a long strip along the arrangement direction of the memory modules 10a of each memory module 10, and the first jet pipe 21 or the second jet pipe 22 can be disposed and communicated with the surface of each memory module 10a from the power distribution unit 20. Simultaneously, the power distribution unit 20 can be supplied with positive or negative pressure by a pressure source (not shown), which can be disposed inside or outside the server housing 1; as in the embodiment described in this application, the power distribution unit 20 is provided with a connecting pipe 23 extending to the outside of the server housing 1, so that an externally disposed pressure source can provide positive or negative pressure to the power distribution unit 20. Figure 1 As shown, the connecting pipe 23 protrudes from the end face 1b of the server housing 1 to have an interface 230, which can be connected to the pressure source through the interface 230 via other components or pipes. The end face 1b can also have a ventilation effect, for example, by providing vent holes.

[0050] like Figure 2 As shown, any two adjacent memory modules 10a are spaced apart by an arrangement spacing S, and the first jet pipe 21 extends from the surface of the distributor 20 and into any one of the arrangement spacings S, and has a first nozzle 210 located within any one of the arrangement spacings S. When the pressure source provides positive or negative pressure, the heat generated by each memory module 10a during operation can be discharged through the arrangement spacing S; for example, when positive pressure is provided, it can be as follows... Figure 2 The heat is dissipated away from the distributor 20 within the spacing S, or, under negative pressure, heat is drawn into the distributor 20 through the first nozzle 210, thus providing a heat dissipation effect. For example... Figure 3As shown, in this embodiment, each first jet pipe 21 can be located above each arrangement spacing S, and a wind shield 21a can be further added to the memory module 10; Additionally, Figure 3A As shown, each first jet pipe 21 can also be located in the middle or below each arrangement spacing S (figure omitted), or the cross-sectional area of ​​each first jet pipe 21 can be increased and its cross-sectional shape can be matched with the cross-sectional shape of each arrangement spacing S, so as to completely spray positive or negative pressure within the arrangement spacing S, thereby providing its heat dissipation effect.

[0051] Please see again Figure 2 and Figure 3 As shown, the electronic component 11 may be provided with a cooling unit 3. The cooling unit 3 has a plurality of heat sinks 30 attached to the surface of the electronic component 11 and a shield 31 covering each heat sink 30. The shield 31 is provided with vent holes 310. Furthermore, the second jet pipe 22 extends from the surface of the distributor 20 and passes through the shield 31 to have a second nozzle 220 located within the shield 31. When the pressure source provides positive or negative pressure, the heat generated by the electronic component 11 during operation can be conducted through the heat sinks 30. Each heat sink 30 can be discharged by heat conduction to each heat sink 30 through the heat sink plate 300 attached to the electronic component 11. For example, when positive pressure is provided, the second jet pipe 22 discharges the heat on the heat sink 30 through the vent holes 310 of the shield 31, or when negative pressure is provided, the heat can be drawn into the distributor 20 through the second nozzle 220, etc., to provide a heat dissipation effect.

[0052] In other embodiments of this application, such as Figures 4 to 6 As shown, each first jet pipe 21 can be further extended to match the length of each memory module 10a, and the first nozzle 210 of each first jet pipe 21 is arranged along its length direction to dissipate heat within each arrangement spacing S. Wherein, as Figure 6 As shown, each first jet pipe 21 can be located above each arrangement spacing S, with its first nozzle 210 positioned below the first jet pipe 21; conversely, when the first jet pipe 21 is located below each arrangement spacing S, its first nozzle 210 is positioned above the first jet pipe 21. Figure 6A As shown, similarly, the first jet pipe 21 can also be located at the middle of each arrangement spacing S, and the first nozzle 210 can be provided above and below the first jet pipe 21. In the above embodiment, the cross-sectional area of ​​each first jet pipe 21 is necessarily smaller than the cross-sectional area of ​​each arrangement spacing S.

[0053] In addition, such as Figure 7As shown, this application may further add a fan 24 to the memory module 10 away from each of the first jet pipes 21. The fan exhausts air into the memory module 10 when the distributor 20 provides positive pressure and blows air into the memory module 10 when the distributor 20 provides negative pressure, thereby assisting the jet to dissipate heat more quickly.

[0054] Therefore, by means of the above-described structure, the server jet cooling device of this application can be obtained.

[0055] However, the above description is only a preferred embodiment of this application and does not limit the patent scope of this application. Therefore, all equivalent technical and means variations made using the description and drawings of this application are also included in the scope of this application and are hereby stated.

Claims

1. A server jet stream cooling device, characterized by, The application relates to a server casing, which has a mainboard and at least one memory module arranged on the mainboard, wherein the memory module is arranged on the mainboard by a plurality of memory intervals, and each of the memory intervals has an interval spacing. The server casing further comprises a flow distribution assembly, which comprises a flow distributor and at least one first jet pipe connected to the flow distributor. The first jet pipe extends from the surface of the flow distributor and enters each of the memory intervals, and has a first jet opening in each of the memory intervals to provide positive pressure or negative pressure. The memory module is provided with a wind shield. The memory module is provided with a fan away from the first jet pipe.

2. The server jet impingement cooling arrangement of claim 1, wherein, The flow distributor extends along the arrangement direction of the memory modules in a strip shape.

3. The server jet impingement cooling arrangement of claim 1 or 2, wherein, The flow distributor is provided with a communication pipe and extends to the outside of the server casing to provide the positive pressure or the negative pressure.

4. The server jet impingement cooling arrangement of claim 1, wherein, The first jet pipe is arranged above, below or in the middle of the interval spacing.

5. The server jet impingement cooling arrangement of claim 1, wherein, The first jet pipe is arranged along the length of the memory modules, and a plurality of the first jet openings are arranged on the first jet pipe along the length of the memory modules.

6. The server jet impingement cooling arrangement of claim 1, wherein, The mainboard is further provided with at least one electronic component, and the electronic component is provided with a cooling unit.

7. The server jet impingement cooling arrangement of claim 1 or 6, wherein, The cooling unit is arranged on the electronic component by a shielding cover, the shielding cover is provided with air holes, and the flow distribution assembly further comprises at least one second jet pipe and is arranged towards the electronic component.

8. The server jet impingement cooling arrangement of claim 1, wherein, The cooling unit has a plurality of heat dissipation fins attached to the surface of the electronic component, and the shielding cover is arranged on the plurality of heat dissipation fins.

9. The server jet impingement cooling arrangement of claim 8, wherein, The plurality of heat dissipation fins are attached to the surface of the electronic component by a heat dissipation plate.

10. The server jet impingement cooling arrangement of claim 9, wherein, ​

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