Overvoltage LED lighting system

Abstract

The utility model relates to the field of lighting equipment, in particular to an over-voltage LED lighting system. The over-voltage LED lighting system comprises an LED light source, a driving power supply, a sensor and a processor. And the LED light source is used for illumination. And the driving power supply is used for supplying power to the LED light source. The sensor is used for collecting regulation and control parameters of the LED light source; wherein the regulation and control parameter is one or a combination of more of voltage, current and temperature. And the processor is used for acquiring the regulation and control parameters and adjusting the output voltage of the driving power supply according to the regulation and control parameters so as to adjust the current of an internal loop of the LED light source. The processor is in communication connection with the sensor and the driving power supply. According to the over-voltage LED lighting system provided by the utility model, the power supply of the LED light source can be intelligently regulated and controlled according to the regulation and control parameters acquired by the sensor, so that the emergent light of the LED light source is in an optimal control state, and the stable and efficient operation of the LED lighting system is ensured.

Description

Technical Field

[0001] This utility model relates to the field of lighting equipment, and in particular to an overpressure LED lighting system. Background Technology

[0002] High-power LED lighting systems play a crucial role in modern industrial, commercial, and specialized applications. These systems are typically used in environments requiring high-intensity light output, such as large warehouses, stadiums, outdoor event spaces, and film and television shooting locations. However, the performance of high-power LED lighting systems depends not only on their initial design and manufacturing quality but also on the operating environment, particularly temperature, which directly impacts the luminous efficiency of the light source. As ambient temperature rises, the electronic components inside the luminaire experience greater stress, potentially leading to increased operating current and consequently affecting the lifespan and brightness stability of the light source. High temperatures can cause LEDs or other types of light sources to experience light decay, resulting in reduced luminous efficiency; while low temperatures can increase startup difficulty and alter the color performance of the light source. Therefore, adjusting the operating current is necessary to maintain optimal lighting performance under varying temperature conditions.

[0003] Traditional high-power LED lighting systems often use fixed parameter settings, meaning they cannot automatically adjust their operating status according to changes in the actual environment. This lack of flexibility limits the system's adaptability and energy efficiency. For example, in some situations, the system may still operate at maximum power even when light demand decreases, resulting in energy waste. At other times, a fixed output may not be sufficient to provide the required lighting level, especially under extreme temperature conditions.

[0004] To address these issues, modern high-power LED lighting systems are increasingly incorporating intelligent dimming technology. By integrating advanced sensors and control systems, ambient temperature, light source temperature, and other key parameters can be monitored in real time, and the operating current can be dynamically adjusted accordingly to ensure optimal light output under various conditions. Utility Model Content

[0005] The purpose of this invention is to overcome the problem that existing high-power LED lighting systems typically operate with fixed parameters and lack dimming functionality, and to provide an overvoltage LED lighting system that can automatically adjust the operating current of the LED lighting system under different operating environments, especially under different temperatures.

[0006] In a first aspect, this utility model provides an overpressure LED lighting system, comprising: an LED light source, a driving power supply, a sensor, and a processor. The LED light source is used for illumination. The driving power supply is used to power the LED light source. The sensor is used to acquire control parameters of the LED light source; wherein the control parameters are one or a combination of voltage, current, and temperature. The processor is used to acquire the control parameters and adjust the output voltage of the driving power supply according to the control parameters, thereby adjusting the current in the internal circuit of the LED light source. The processor is communicatively connected to both the sensor and the driving power supply.

[0007] According to a preferred embodiment, the LED light source includes a substrate and a plurality of LED chips. The plurality of LED chips are arranged on one side surface of the substrate through an encapsulating adhesive layer.

[0008] According to a preferred embodiment, the arrangement of the LED beads on the substrate is as follows: at least two LED beads are connected in series to form a primary lamp group; at least two primary lamp groups are connected in parallel to form a secondary lamp group; the secondary lamp groups arrange the LED beads on the substrate by connecting them end to end; wherein the sum of the voltage differences between the two primary lamp groups is less than the maximum isolation voltage between two adjacent LED beads.

[0009] According to a preferred embodiment, the LED light source further includes a heat dissipation device. The heat dissipation device includes a heat dissipation base surface, a plurality of heat dissipation fins, and a thermally conductive layer. The heat dissipation fins and the thermally conductive layer are disposed on both sides of the heat dissipation base surface. One side of the thermally conductive layer is connected to the heat dissipation base surface, and the other side is connected to the substrate, with the substrate disposed in the middle of the thermally conductive layer. The size of the thermally conductive layer is larger than the size of the substrate, and it is used to conduct the heat generated when the LED light source emits light along the extension direction of the thermally conductive layer.

[0010] According to a preferred embodiment, the heat dissipation device further includes a mounting housing, which is connected to the heat dissipation bottom surface and clamps the substrate and the heat-conducting layer.

[0011] According to a preferred embodiment, the sensor includes a current sensor disposed on each primary lamp group. The current sensor is used to detect the current of the primary lamp group. The current sensor is communicatively connected to the processor.

[0012] According to a preferred embodiment, the sensor further includes a first temperature sensor, a second temperature sensor, and a third temperature sensor. The first temperature sensor is used to detect the ambient temperature. The second temperature sensor is used to detect the temperature of the LED light source. The third temperature sensor is used to detect the temperature of the heat dissipation device. The first temperature sensor, the second temperature sensor, and the third temperature sensor are each communicatively connected to the processor.

[0013] According to a preferred embodiment, the operating voltage of the LED light source is 300–3000V. The heat dissipation power density of the LED light source is 3.7–423 W / cm². 2 The power of the LED light source is 50-1000W.

[0014] According to a preferred embodiment, the processor includes a first processor and a second processor. The first processor and the second processor are communicatively connected.

[0015] According to a preferred embodiment, the processor is communicatively connected to the sensor via a digital-to-analog converter.

[0016] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0017] The overpressure LED lighting system provided by this invention collects the control parameters of the LED light source 100 through sensors. The processor adjusts the output voltage of the driving power supply according to the control parameters, thereby regulating the current in the internal circuit of the LED light source 100. The overpressure LED lighting system provided by this invention can intelligently control the power supply of the LED light source 100 according to the control parameters collected by the sensors, ensuring that the light output of the LED light source is in an optimal control state and guaranteeing the stable and efficient operation of the LED lighting system. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of an overpressure LED lighting system according to a preferred embodiment of the present invention;

[0019] Figure 2 A schematic diagram of the structure of an overpressure LED light source in COB packaging;

[0020] Figure 3 This is a schematic diagram of an overpressure LED light source according to a preferred embodiment of the present invention;

[0021] Figure 4 This is a schematic diagram of an overpressure LED lighting system according to another preferred embodiment of the present invention.

[0022] Figure label:

[0023] LED light source 100, substrate 110, LED beads 120, encapsulating adhesive layer 130, gold wire 140.

[0024] Heat dissipation device 200, heat dissipation base 210, heat dissipation fins 220, heat conduction layer 230, mounting housing 240. Detailed Implementation

[0025] The present invention will be further described in detail below with reference to specific embodiments. However, it should not be construed as limiting the scope of the present invention to the following embodiments; all technologies implemented based on the content of the present invention fall within the scope of the present invention.

[0026] Unless otherwise specified, the use of terms such as "upper," "lower," "left," "right," "center," "inner," and "outer" to indicate orientation or positional relationships in the description of specific embodiments of this utility model is based on the orientation or positional relationships shown in the accompanying drawings, or the orientation or positional relationship in which the utility model product / equipment / device is typically placed during use. These terms are merely for the purpose of facilitating the description of the utility model solution or simplifying the description in specific embodiments, enabling those skilled in the art to quickly understand the solution, and do not indicate or imply that a specific device / component / element must have a specific orientation, or be constructed and operated in a specific positional relationship. Therefore, they should not be construed as limitations on this utility model.

[0027] Furthermore, the use of terms such as "horizontal," "vertical," "suspended," and "parallel" does not imply that the corresponding device / component / element must be absolutely horizontal, vertical, suspended, or parallel, but rather that it can be slightly tilted or have a deviation. For example, "horizontal" merely means that its direction is more horizontal relative to "vertical," not that the structure must be completely horizontal, but can be slightly tilted. Alternatively, it can be simplified to mean that the corresponding device / component / element, when set in a "horizontal," "vertical," "suspended," or "parallel" direction, can have an error / deviation of ±10% relative to the corresponding direction, more preferably within ±8%, more preferably within ±6%, more preferably within ±5%, and more preferably within ±4%. As long as the corresponding device / component / element is within the error / deviation range, it can still achieve its function in the present invention.

[0028] Furthermore, the use of terms such as "first," "second," and "third" in terminology is merely for distinguishing between identical or similar components and should not be interpreted as emphasizing or implying the relative importance of a particular component.

[0029] Furthermore, in the description of the embodiments of this utility model, "several", "multiple", and "several" represent at least two. The number can be any number, such as two, three, four, five, six, seven, eight, or nine, and can even exceed nine.

[0030] Furthermore, in the description of the technical solution of this utility model, unless otherwise explicitly specified / limited / restricted, the terms "set up," "install," "connect," "link," "equipped with," "laid out," and "arranged" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to common connection methods in the art, such as welding, riveting, bolting, and threaded connections. Such connections can be mechanical, electrical, or communication connections; they can be direct connections or indirect connections through an intermediate medium; and they can refer to the internal communication between two components.

[0031] Example 1

[0032] This embodiment provides an overpressure LED lighting system. See also... Figure 1 The overpressure LED lighting system includes: an LED light source 100, a driver power supply, a sensor, and a processor. The LED light source 100 is used for illumination. The driver power supply provides power to the LED light source 100. The sensor acquires the control parameters of the LED light source 100; these control parameters are one or a combination of voltage, current, and temperature. The processor acquires the control parameters and adjusts the output voltage of the driver power supply accordingly, thereby regulating the current in the internal circuit of the LED light source 100. The processor is communicatively connected to both the sensor and the driver power supply. The processor is communicatively connected to the sensor via a digital-to-analog converter.

[0033] The overpressure LED lighting system collects the control parameters of the LED light source 100 through sensors. The processor adjusts the output voltage of the drive power supply according to the control parameters, thereby regulating the current in the internal circuit of the LED light source 100. The overpressure LED lighting system provided in this embodiment can intelligently control the power supply of the LED light source 100 according to the control parameters collected by the sensors, so that the light output of the LED light source is in the optimal control state, ensuring the stable and efficient operation of the LED lighting system.

[0034] Example 2

[0035] This embodiment is a further improvement on embodiment 1, and the repeated content will not be described again.

[0036] See Figure 2The LED light source 100 includes: a substrate 110, an encapsulating layer 130, LED chips 120, and gold wires 140. The LED chips 120 are mounted on the substrate 110, the gold wires 140 are used for electrical connection of the LED chips 120, and the encapsulating layer 130 encapsulates the LED chips 120 and the gold wires 140 on the substrate 110. Preferably, a plurality of LED chips 120 are mounted on one side of the substrate 110 via the encapsulating layer 130.

[0037] Preferably, the arrangement of the LED beads 120 on the substrate 110 is as follows: at least two LED beads 120 are connected in series to form a primary lamp group; at least two primary lamp groups are connected in parallel to form a secondary lamp group; and the secondary lamp groups are arranged on the substrate 110 by connecting the ends of each other. Preferably, the sum of the voltage differences between the two primary lamp groups is less than the maximum isolation voltage between two adjacent LED beads 120.

[0038] See Figure 3 The overpressure LED light source 100 also includes a heat dissipation device 200. Preferably, the heat dissipation device 200 includes a heat dissipation base surface 210, a plurality of heat dissipation fins 220, and a thermally conductive layer 230. The heat dissipation fins 220 and the thermally conductive layer 230 are connected to both sides of the heat dissipation base surface 210. The side of the thermally conductive layer 230 away from the heat dissipation base surface 210 is connected to a substrate 110, and the substrate 110 is connected to the middle of the thermally conductive layer 230. The contact area between the thermally conductive layer 230 and the substrate 110 is smaller than the contact area between the thermally conductive layer 230 and the heat dissipation base surface 210. Preferably, the heat dissipation device 200 is connected to the surface of the substrate 110 away from the LED lamp bead 120.

[0039] This embodiment first connects at least two LED beads 120 in series to form a primary lamp group; then connects at least two primary lamp groups in parallel to form a secondary lamp group; and then arranges several LED beads 120 on a substrate 110 with limited size by connecting the end of each secondary lamp group. When arranging the LED beads 120 on the substrate 110, the sum of the voltage differences between two primary lamp groups is less than the maximum isolation voltage of two adjacent LED beads 120. A heat dissipation device 200 is provided on the side of the substrate 110 where no LED beads 120 are provided to solve the heat dissipation problem of the overvoltage LED. As a result, as many LED beads 120 as possible can be arranged on the substrate 110 with limited size, thereby increasing the luminous power of the LED light source 100 without increasing the size of the LED light source 100. This is beneficial for miniaturizing and lightening the overvoltage high-power LED light source 100, and is easy to deploy on equipment with limited installation space and load-bearing capacity.

[0040] Preferably, the operating voltage of the LED light source 100 is 300–3000V. Preferably, the heat source power density of the substrate 110 after arranging the LED beads 120 is 3.7–423 W / cm². 2The heat source power density of the substrate 110 after arranging the LED beads 120 is 3.7~423w / cm³. 2 The preferred value is 3.7–44.6 w / cm². 2 Or 160~423w / cm 2 Heat source power density: power of the heat source / area of ​​the heat source, that is, the power of heat generation per unit area when the device is working. Preferably, the power of the LED light source 100 is 50-1000W, more preferably 80-100W.

[0041] When the LED light source 100 emits light, it generates a lot of heat. If it cannot be dissipated in time, it will reduce the lifespan of the LED light source 100. In severe cases, it may even cause the LED to catch fire due to excessive temperature.

[0042] Most existing LED heat dissipation methods involve placing a semiconductor heat sink on the back of the LED light source 100 (the side surface without LED beads 120). However, the semiconductor heat sink mainly conducts heat in a direction perpendicular to the surface of the LED light source 100, resulting in the area of ​​the semiconductor heat sink facing the LED light source 100 having higher heat than other areas. Even if the area of ​​the semiconductor heat sink is larger than the area of ​​the LED light source 100, the area where the semiconductor heat sink actually performs heat dissipation is still the area facing the LED light source 100.

[0043] The LED light source 100 provided in this embodiment has high power and small size. When it emits light, the heat island effect is more obvious. Existing semiconductor heat sinks are difficult to effectively dissipate heat from the LED light source 100 provided in this embodiment.

[0044] Preferably, the size of the heat-conducting layer 230 is larger than the size of the substrate 110, and it is used to conduct the heat generated when the LED light source 100 emits light along the extension direction of the heat-conducting layer 230. The area of ​​the heat-conducting layer 230 is larger than the area of ​​the substrate 110, and the area of ​​the heat-conducting layer 230 is 1.1 to 5 times the area of ​​the substrate 110. Preferably, the material used to make the heat-conducting layer 230 includes at least one of graphene, graphite, copper, silver, and gold. Preferably, the heat-conducting layer 230 is constructed of graphene. The thickness of the heat-conducting layer 230 is less than the length and width of the heat-conducting layer 210, so that the horizontal heat conduction efficiency of the heat-conducting layer 230 is higher than the vertical heat conduction efficiency.

[0045] Preferably, when one primary lamp group in a secondary lamp group is disconnected, the other primary lamp groups in that secondary lamp group can withstand the increased current; in other words, when a primary lamp group belonging to the same secondary lamp group is disconnected, its current is distributed to the other primary lamp groups and will not exceed the upper limit of the working current of a single lamp bead.

[0046] Preferably, the LED chip 120 has the following dimensions: length × width 559±38μm × 889±38μm, and thickness 150±15μm. Preferably, the photoelectric characteristics of the LED chip 120 at 22℃ are shown in the table below:

[0047]

[0048] Preferably, the LED beads 120 in the LED light source 100 are arranged in a long string design, that is, the number of primary light groups is much greater than the number of secondary light groups.

[0049] Preferably, the number of primary light groups can be ten times, tens of times, or even hundreds of times more than the number of secondary light groups.

[0050] Preferably, the number of LED beads 120 connected in series in the primary light group can be dozens or even hundreds.

[0051] Preferably, the LED light source 100 provided in this embodiment can adopt an overvoltage driving scheme, with an operating voltage of 300-3000V. Compared with the existing low-voltage driving scheme with a driving voltage of less than 100V, the current in the LED light source 100 circuit is smaller under the same power, which can significantly reduce the heat dissipation of the circuit. The LED light source 100 directly adopts overvoltage driving. For applications that require long-distance DC power supply or have specific requirements on cable weight, there is no need to step down the overvoltage DC power to the low-voltage power supply required by the constant current driver chip through a step-down module, which reduces the weight of the end and improves energy efficiency.

[0052] In the LED light source 100, the LED beads 120 are arranged in a long string design. Within the suitable operating voltage range of the LED light source 100, the operating voltage range of the entire string of LED beads 120 is widened, and the power of the light source can be directly adjusted by adjusting the input voltage. This can replace the traditional PWM dimming method and simplify the complexity of the peripheral circuit design of the lamp.

[0053] In the LED light source 100, the LED beads 120 are arranged and connected in a long string design. Under the same power, the current of the LED beads 120 is smaller than that of the low-voltage driving scheme. Whether gold wire connection is used or the circuit is printed on the substrate, the wire diameter of the gold wire 140 or the thickness and width of the PCB printed circuit can be reduced, making the process simpler and the cost lower.

[0054] In terms of physical spatial layout, the LED light source 100 provided in this embodiment is configured with multiple secondary lamp groups to divide the voltage drop from VCC to GND into several segments, and control the voltage of each secondary lamp group within a reasonable range of 50-200V, which can effectively reduce the voltage between the secondary lamp groups and avoid the situation of wire breakdown.

[0055] The LED light source 100 provided in this embodiment uses a high voltage of 300V or more. Compared with the low voltage driving scheme, it is used to connect the parallel circuit path of each string of chips, and the current is small, which effectively reduces the line loss and improves the luminous efficiency of the entire LED light source 100.

[0056] The LED beads 120 are arranged in parallel within segments and in series across multiple segments, avoiding a single string throughout the entire length. This reduces the risk of overvoltage in the LED beads 120 due to uneven voltage distribution caused by fluctuations in individual LED beads 120 within a long string. Furthermore, if a single LED bead 120 in the LED light source 100 provided in this embodiment fails, the chips in the other primary LED groups within the same secondary LED group can share the current, preventing it from affecting the LED beads 120 in their respective secondary LED groups.

[0057] In this embodiment, the parallel cables of each primary lamp group and the series lines of each secondary lamp group are placed outside the light-emitting surface area, making the process controllable.

[0058] The LED light source 100 provided in this embodiment adopts an overvoltage DC direct drive design, eliminating the need for end voltage regulator constant current chip and current limiting circuit at the end of the lamp, thus reducing the requirements for electrical clearance and creepage distance of the lamp due to component reasons.

[0059] Example 3

[0060] This embodiment is a further improvement on Embodiments 1 and 2, and the repeated content will not be described again. In this embodiment, the LED light source 100 includes an LED light source 100 and a heat dissipation device 200. The LED light source 100 includes a substrate 110 and a plurality of LED beads 120, which are mounted on one side of the substrate 110 through an encapsulating adhesive layer 130. Preferably, the plurality of LED beads 120 are arranged on the substrate 110 as follows: at least two LED beads 120 are connected in series to form a primary lamp group; at least two primary lamp groups are connected in parallel to form a secondary lamp group; and the plurality of LED beads 120 are arranged on the substrate 110 by connecting the ends of each secondary lamp group. Preferably, the sum of the voltage differences between two primary lamp groups is less than the maximum isolation voltage between two adjacent LED beads 120. A driving power supply is used to supply power to the LED light source 100. A sensor is used to collect the control parameters of the LED light source 100; wherein the control parameters are one or a combination of voltage, current, light source temperature, and ambient temperature. The processor acquires control parameters and adjusts the output voltage of the drive power supply according to the control parameters, thereby regulating the current in the internal circuit of the LED light source 100. The processor is communicatively connected to both the sensor and the drive power supply.

[0061] The heat dissipation device 200 includes: a mounting housing 240, a heat dissipation base 210, a plurality of heat dissipation fins 220, and a thermally conductive layer 230. The heat dissipation fins 220 and the thermally conductive layer 230 are disposed on both sides of the heat dissipation base 210. A substrate 110 is connected to the side of the thermally conductive layer 230 away from the heat dissipation base 210. The substrate 110 is connected to the middle of the thermally conductive layer 230. The thermally conductive layer 230 is larger than the substrate 110 and is used to conduct heat generated when the LED light source 100 emits light along the extension direction of the thermally conductive layer 230. The mounting housing 240 is connected to the heat dissipation base 210 and clamps the substrate 110 and the thermally conductive layer 230.

[0062] Preferably, the sensor includes a current sensor disposed on each primary lamp group for detecting the current of the primary lamp group. The processor determines the on / off status of each primary lamp group through the current sensor and adjusts the output voltage of the drive power supply according to the on / off status of each primary lamp group.

[0063] Preferably, the sensor further includes a temperature sensor for detecting at least the temperature of the LED light source 100. The processor can determine a driving scheme based on the detection data from the current sensor and the temperature sensor, and adjust the output voltage of the driving power supply according to the driving scheme.

[0064] Preferably, the driving scheme includes three driving schemes.

[0065] First driving scheme: The processor adjusts the output voltage and adjustment range of the driving power supply through upper and lower limit control. Preferably, the processor presets several limits: second lower control limit < first lower control limit < control center line < first upper control limit < second upper control limit. The processor determines the output voltage and adjustment range of the driving power supply by vertically comparing the detected current or temperature value of the LED light source 100 with each limit.

[0066] The second driving scheme: The processor detects the loop current and light source temperature of the LED light source 100 through sensors, calculates the real-time slope of the loop current and light source temperature change curves, and sends a voltage adjustment command to the driving power supply to control the rate of change of the loop current and light source temperature.

[0067] The third driving scheme: The processor detects the loop current, light source temperature and heat sink temperature of the LED light source 100 through sensors, and controls the output of the driving power supply according to the deviation between the detected value and the preset value, so that the detected value is close to the preset value.

[0068] See Figure 1 Preferably, the overpressure LED lighting system includes: an LED light source 100; a driver power supply for supplying power to the LED light source 100; a processor; several sensors; and a digital-to-analog converter. The driver power supply is a programmable DC power supply.

[0069] The drive power supply and the digital-to-analog converter are respectively connected to the processor. The sensor includes a current sensor disposed at the current input port of the LED light source 100. Preferably, if multiple LED light sources 100 are connected in parallel, each LED light source 100 has a current sensor disposed at its current input port.

[0070] The sensors also include: a first temperature sensor for detecting ambient temperature; a second temperature sensor for detecting the temperature of the LED light source 100; and a third temperature sensor for detecting the temperature of the heat dissipation device 200. The sensors are connected to the processor via a digital-to-analog converter.

[0071] Preferably, the current sensor collects the current data of the LED light source 100 and transmits it to the processor via a digital-to-analog converter.

[0072] Preferably, the first temperature sensor, the second temperature sensor, and the third temperature sensor also transmit the collected temperature data to the processor via a digital-to-analog converter.

[0073] The processor adjusts the loop current of the LED light source 100 based on the collected current and temperature data.

[0074] Preferably, the processor directly sends a voltage regulation command to the programmable power supply based on the collected current and temperature data, adjusting the output voltage of the drive power supply, thereby regulating the current of the LED light source 100 related to the input value.

[0075] Sensor data processing and programmable power regulation can be handled by two different processors.

[0076] See Figure 4 The processor may include a first processor and a second processor. Preferably, the first processor is communicatively connected to a digital-to-analog converter and is used to process data collected by each sensor. The second processor is communicatively connected to a drive power supply and is used to adjust the output voltage value of the drive power supply.

[0077] Preferably, the communication connection between the first processor and the second processor can be a direct communication connection between the first processor and the second processor, or a communication connection between the first processor and the second processor through a relay communication device.

[0078] Preferably, the first processor can transmit the current and temperature data collected by the sensor to the second processor. The second processor then directly sends a voltage regulation command to the programmable power supply based on the collected current and temperature data, adjusting the output voltage of the drive power supply, thereby regulating the current of the LED light source 100 related to the input value.

[0079] Preferably, the feedback adjustment performed by the processor based on the collected current and temperature data can be achieved using control chart upper and lower limit control, slope control, or PID control.

[0080] Example 4

[0081] This embodiment is a further improvement on the overpressure LED lighting system described in Embodiments 1, 2, and 3. See also... Figure 3 The heat dissipation device 200 includes a heat dissipation base surface 210, heat dissipation fins 220, and a heat-conducting layer 230. The heat dissipation fins 220 and the heat-conducting layer 230 are connected to both sides of the heat dissipation base surface 210. A substrate 110 is connected to the side of the heat-conducting layer 230 away from the heat dissipation base surface 210, and the substrate 110 is connected to the middle of the heat-conducting layer 230. Preferably, the size of the heat-conducting layer 230 is larger than the size of the substrate 110, for conducting the heat generated when the LED light source 100 emits light along the extension direction of the heat-conducting layer 230. Preferably, the material used to fabricate the heat-conducting layer 230 includes at least one of graphene, graphite, copper, silver, and gold. Preferably, the heat-conducting layer 230 is constructed of graphene, and the thickness of the heat-conducting layer 230 is less than its length and width, such that the heat conduction efficiency of the heat-conducting layer 230 in its extension direction is higher than that in its extension direction. The heat dissipation device 200 also includes a mounting housing 240. The mounting housing 240 is used to mount the substrate 110 to the heat dissipation device 200, and the mounting housing 240 can also be used to dissipate heat from the overpressure LED light source 100. The mounting housing 240 is connected to the heat dissipation bottom surface 210 and clamps the substrate 110 and the thermally conductive layer 230. Preferably, the LED light source 100 is embedded in the bottom of the mounting housing 240, and the mounting housing 240 is slightly lower than the top surface of the light source by 0.01 to 1 cm. The thermally conductive layer 230 and several heat dissipation fins 220 are located above the mounting housing 240 and the LED light source 100. After installation, the mounting housing 240 is in close contact with the LED light source 100 and the heat dissipation surface 210. Preferably, the mounting housing 240 can be made of metal or other materials with good thermal conductivity.

[0082] Preferably, the thermally conductive layer 230 is a thin sheet, and its area is larger than that of the substrate 110 but smaller than that of the heat dissipation bottom surface 210. The thermal conductivity of the thermally conductive layer 230 is greater than that of the heat dissipation bottom surface 210. The heat generated when the ED chip 100 emits light can be conducted laterally within the thermally conductive layer 230, causing the temperature of the entire surface in contact with the heat dissipation bottom surface 210 to rise, thereby improving the thermal conductivity efficiency. The contact area between the thermally conductive layer 230 and the substrate 110 is smaller than the contact area between the thermally conductive layer 230 and the substrate 110. When the thermally conductive layer 230 is connected to the substrate 110, the thermally conductive layer 230 covers the substrate 110.

[0083] Preferably, the overpressure LED light source 100 provided in this embodiment can have 1 to 6 LED light sources 100 mounted on the heat dissipation device 200. The total input power of the overpressure LED light source 100 is >100W.

[0084] Preferably, the lighting performance of the overpressure LED light source 100 provided in this embodiment is tested. Under the conditions that the overpressure LED light source 100 is 50m away from the lighting plane, and its power is 800W, luminous efficacy is 225lm / W, and luminous flux is 180000lm, the maximum distance from the point on the lighting plane with an illuminance measurement value ≥2lx to the projection point of the overpressure LED light source 100 on the lighting plane is 65m. Under the condition that the overpressure LED light source 100 is 50m away from the lighting plane, the area of ​​the region on the lighting plane with an illuminance measurement value ≥2lx is 13267m². 2 .

[0085] The lighting performance (illuminance lx) of the overpressure LED light source 100 is shown in the table below:

[0086]

[0087] In the table: height is the distance between the overpressure LED light source 100 and the illumination plane; distance is the distance between the detection point on the illumination plane and the projection point of the overpressure LED light source 100; the overpressure LED light source 100 has a power of 800W, a luminous efficacy of 225lm / W, and a luminous flux of 180000lm.

[0088] The above are merely preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. An overvoltage LED lighting system, characterized by, The LED light source (100) comprises a substrate (110) and a plurality of LED lamp beads (120), and the plurality of LED lamp beads (120) are mounted on one side surface of the substrate (110) through a packaging adhesive layer (130). The arrangement of the plurality of LED lamp beads (120) on the substrate (110) is as follows: at least two LED lamp beads (120) are connected in series to form a primary lamp group; at least two primary lamp groups are connected in parallel to form a secondary lamp group; and each secondary lamp group is arranged on the substrate (110) through a head-to-tail connection mode. The LED light source (100) further comprises a heat dissipation device (200), and the heat dissipation device (200) comprises a heat dissipation bottom surface (210), a plurality of heat dissipation fins (220) and a heat conduction layer (230). The heat dissipation fins (220) and the heat conduction layer (230) are connected on both sides of the heat dissipation bottom surface (210). The heat conduction layer (230) is connected to the substrate (110) on a side away from the heat dissipation bottom surface (210), and the substrate (110) is connected to a middle part of the heat conduction layer (230); the size of the heat conduction layer (230) is greater than that of the substrate (110), and the heat conduction layer (230) is used for conducting heat generated by the LED light source (100) during light emission along an extension direction of the heat conduction layer (230). The heat dissipation device (200) further comprises a mounting shell (240), and the mounting shell (240) is connected to the heat dissipation bottom surface (210) and clamps the substrate (110) and the heat conduction layer (230). The sensor comprises a current sensor arranged on each primary lamp group. The current sensor is used for detecting the current of the primary lamp group, and the current sensor is in communication connection with the processor.

2. An overvoltage LED lighting system according to claim 1, wherein, The sensor further comprises a first temperature sensor, a second temperature sensor and a third temperature sensor. The first temperature sensor is used for detecting the ambient temperature. The second temperature sensor is used for detecting the temperature of the LED light source (100).

3. An overvoltage LED lighting system according to claim 2, wherein, The third temperature sensor is used for detecting the temperature of the heat dissipation device (200).

4. An overvoltage LED lighting system as claimed in claim 2, characterized in that The first temperature sensor, the second temperature sensor and the third temperature sensor are in communication connection with the processor, respectively.

6. The super-pressure LED lighting system according to claim 2, wherein 5. An overvoltage LED lighting system as claimed in claim 2, characterized in that ​ ​ ​ ​ ​ ​ The working voltage of the LED light source (100) is 300-3000V; the heat power density of the LED light source (100) is 3.7-423w / cm2; the power of the LED light source (100) is 50-1000w.

7. An overvoltage LED lighting system as claimed in claim 2, characterized in that The processor comprises a first processor and a second processor, and the first processor and the second processor are communicatively connected.

8. An overvoltage LED lighting system as claimed in claim 2, characterized in that The processor is communicatively connected with the sensor through a digital-to-analog converter.

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