Communication circuit board for intelligent analysis of edge data of oil well and extraction equipment
By using communication circuit boards in oil wells and pumping equipment for multi-channel data transmission and local intelligent analysis, the problem of real-time data collection was solved, enabling equipment self-diagnosis and efficient communication, thus avoiding equipment failure.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-01
- Publication Date
- 2026-03-06
AI Technical Summary
Existing technologies cannot collect data from oil wells and production equipment in real time, which leads to equipment failures that cannot be dealt with in a timely manner, potentially causing equipment damage and halting oil production operations.
A communication circuit board for intelligent analysis of edge data of oil wells and pumping equipment is provided. It integrates DI, DO, AO, AI, PWM and RS485 channels to realize secure and reliable transmission of multi-channel data and local intelligent analysis, and has local diagnostic and early warning functions.
It enables local self-diagnosis of oil wells and pumping equipment, ensuring secure and reliable data transmission and efficient and accurate communication, and avoiding delayed processing of equipment failures.
Smart Images

Figure CN223978812U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of intelligent analysis of edge data of oil wells and pumping equipment, and in particular to a communication circuit board for intelligent analysis of edge data of oil wells and pumping equipment. Background Technology
[0002] In today's era of advancements in artificial intelligence, big data, and other technologies, the petroleum industry is also moving towards digitalization and intelligentization. Oilfield operations are often located in complex environments such as deserts, Gobi, and offshore areas, facing extreme temperature differences and electromagnetic interference. With the continuous development of "smart oilfields," the amount of data from oil wells and production equipment is increasing daily. Currently, data acquisition and dynamometer card acquisition are generally achieved through manual on-site data collection or intermittent communication. Due to the large number of data items to be monitored, inconsistencies exist between different acquisition methods. This approach cannot reflect the real-time status of oil wells and production equipment, easily leading to equipment malfunctions that cannot be addressed promptly due to untimely data collection, and in severe cases, equipment damage and production shutdowns. How to collect and utilize this data in real time has become an urgent problem to be solved in this field.
[0003] Based on this, this application provides a communication circuit board for intelligent analysis of edge data of oil wells and pumping equipment. It can collect edge data of oil wells and pumping equipment, realize secure and reliable communication transmission of multi-channel data, and realize functions such as local intelligent analysis, local analysis, dynamometer card acquisition and diagnosis, waxing early warning, overload protection, and underload protection. This ensures the local self-diagnosis capability of oil wells and pumping equipment and enables efficient and accurate communication with the control platform. Utility Model Content
[0004] The purpose of this invention is to provide a communication circuit board for intelligent analysis of edge data of oil wells and pumping equipment, so as to solve the problems existing in the prior art.
[0005] To achieve the above objectives, this utility model provides the following solution:
[0006] This utility model provides a communication circuit board for intelligent analysis of edge data of oil wells and pumping equipment, including a top board and a bottom board, which are connected in a composite manner. The top board and the bottom board are jointly provided with a DI channel, a DO channel, an AO channel, an AI channel, a PWM channel and an RS485 channel.
[0007] Preferably, the DI channel section has 12 channels.
[0008] Preferably, the D0 channel section has 10 channels.
[0009] Preferably, the AO channel section has two channels.
[0010] Preferably, the AI channel section has 8 channels.
[0011] The present invention achieves the following beneficial technical effects compared to the prior art:
[0012] This utility model provides a communication circuit board for intelligent analysis of edge data of oil wells and pumping equipment. It includes a top board and a bottom board, which are connected in a composite manner. Both the top and bottom boards share a DI channel, a DO channel, an AO channel, an AI channel, a PWM channel, and an RS485 channel. These channels enable secure and reliable transmission of multiple data streams, achieving functions such as local intelligent analysis, local analysis, dynamometer card acquisition and diagnosis, wax deposition warning, overload protection, and underload protection. This ensures the local self-diagnostic capabilities of the oil well and pumping equipment and enables efficient and accurate communication with the control platform. Attached Figure Description
[0013] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0014] Figure 1 A schematic diagram of the top layer of the communication circuit board for intelligent analysis of edge data of oil wells and pumping equipment provided by this utility model;
[0015] Figure 2 A schematic diagram of the bottom layer of the communication circuit board for intelligent analysis of edge data of oil wells and pumping equipment provided by this utility model;
[0016] Figure 3 A schematic diagram of the composite communication circuit board for intelligent analysis of edge data of oil wells and pumping equipment provided by this utility model;
[0017] In the diagram: 1: Top layer board, 2: Bottom layer board, 3: DI channel section, 4: DO channel section, 5: AO channel section, 6: AI channel section. Detailed Implementation
[0018] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0019] The purpose of this invention is to provide a communication circuit board for intelligent analysis of edge data of oil wells and pumping equipment, so as to solve the problems existing in the prior art.
[0020] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the utility model will be further described in detail below with reference to the accompanying drawings and specific embodiments.
[0021] Example 1:
[0022] This embodiment provides a communication circuit board for intelligent analysis of edge data from oil wells and pumping equipment, such as... Figures 1-3 As shown, it includes a top plate 1 and a bottom plate 2, which are connected in a composite manner. The top plate 1 and the bottom plate 2 are jointly provided with a DI channel section 3, a DO channel section 4, an AO channel section 5, an AI channel section 6, a PWM channel section and an RS485 channel section.
[0023] In one implementation, the DI channel section 3 has 12 channels.
[0024] The first signal is connected to pin 24 of socket P1, and connected to pin 1 of TVS diode D1 and capacitor C35. Then it is connected to pin 1 of optocoupler U2 through resistor R92. Pin 2 of optocoupler U2 is connected to the negative terminal of Zener diode Z1, and the other pin of Zener diode Z1 is grounded. Pin 4 of optocoupler U2 is connected to pin 2 of resistor R12 and pin 2 of LED DI1. Pin 1 of resistor R12 is connected to pin 1 of resistor R26. Resistor R26 is connected to pin 1 of LED DI1. Pin 2 of LED DI1 is connected to pin 97 of MCU chip U39.
[0025] The second signal is connected to pin 22 of socket P1, and then connected to pin 1 of TVS diode D2 and capacitor C34. It is then connected to pin 1 of optocoupler U25 through resistor R93. Pin 2 of optocoupler U25 is connected to the negative terminal of Zener diode Z2, and the other pin of Zener diode Z2 is grounded. Pin 4 of optocoupler U25 is connected to pin 2 of resistor R13 and pin 2 of LED DI2. Pin 1 of resistor R13 is connected to pin 1 of resistor R28. Resistor R28 is connected to pin 1 of LED DI2. Pin 2 of LED DI2 is connected to pin 98 of MCU chip U39.
[0026] The third signal is connected to pin 20 of socket P1, and then connected to pin 1 of TVS diode D3 and capacitor C4. It is then connected to pin 1 of optocoupler U4 through resistor R94. Pin 2 of optocoupler U4 is connected to the negative terminal of Zener diode Z3, and the other pin of Zener diode Z3 is grounded. Pin 4 of optocoupler U4 is connected to pin 2 of resistor R281 and pin 2 of LED DI3. Pin 1 of resistor R281 is connected to pin 1 of resistor R29. Resistor R29 is connected to pin 1 of LED DI3. Pin 2 of LED DI3 is connected to pin 1 of MCU chip U39.
[0027] The fourth signal is connected to pin 18 of socket P1, and is connected to pin 1 of TVS diode D4 and capacitor C36. Then it is connected to pin 1 of optocoupler U5 through resistor R95. Pin 2 of optocoupler U5 is connected to the negative terminal of Zener diode Z4, and the other pin of Zener diode Z4 is grounded. Pin 4 of optocoupler U5 is connected to pin 2 of resistor R15 and pin 2 of LED DI4. Pin 1 of resistor R15 is connected to pin 1 of resistor R30. Resistor R30 is connected to pin 1 of LED DI4. Pin 2 of LED DI4 is connected to pin 2 of MCU chip U39.
[0028] The fifth signal is connected to pin 16 of socket P1, and then connected to pin 1 of TVS diode D5 and capacitor C37. It is then connected to pin 1 of optocoupler U31 through resistor R96. Pin 2 of optocoupler U31 is connected to the negative terminal of Zener diode Z5, and the other pin of Zener diode Z5 is grounded. Pin 4 of optocoupler U31 is connected to pin 2 of resistor R285 and pin 2 of LED DI5. Pin 1 of resistor R285 is connected to pin 1 of resistor R31. Resistor R31 is connected to pin 1 of LED DI5. Pin 2 of LED DI5 is connected to pin 3 of MCU chip U39.
[0029] The sixth signal is connected to pin 14 of socket P1, and is connected to pin 1 of TVS diode D6 and capacitor C38. Then it is connected to pin 1 of optocoupler U32 through resistor R97. Pin 2 of optocoupler U32 is connected to the negative terminal of Zener diode Z6, and the other pin of Zener diode Z6 is grounded. Pin 4 of optocoupler U32 is connected to pin 2 of resistor R286 and pin 2 of LED DI6. Pin 1 of resistor R286 is connected to pin 1 of resistor R34. Resistor R34 is connected to pin 1 of LED DI6. Pin 2 of LED DI6 is connected to pin 4 of MCU chip U39.
[0030] The 7th signal is connected to pin 12 of socket P1, and connected to pin 1 of TVS diode D8 and capacitor C39. Then it is connected to pin 1 of optocoupler U8 through resistor R98. Pin 2 of optocoupler U8 is connected to the negative terminal of Zener diode Z7, and the other pin of Zener diode Z7 is grounded. Pin 4 of optocoupler U8 is connected to pin 2 of resistor R18 and pin 2 of LED DI7. Pin 1 of resistor R18 is connected to pin 1 of resistor R35. Resistor R35 is connected to pin 1 of LED DI7. Pin 2 of LED DI7 is connected to pin 5 of MCU chip U39.
[0031] The 8th signal is connected to pin 10 of socket P1, and connected to pin 1 of TVS diode D12 and capacitor C40. Then it is connected to pin 1 of optocoupler U33 through resistor R99. Pin 2 of optocoupler U33 is connected to the negative terminal of Zener diode Z8, and the other pin of Zener diode Z8 is grounded. Pin 4 of optocoupler U33 is connected to pin 2 of resistor R291 and pin 2 of LED DI8. Pin 1 of resistor R291 is connected to pin 1 of resistor R36. Resistor R36 is connected to pin 1 of LED DI8. Pin 2 of LED DI8 is connected to pin 38 of MCU chip U39.
[0032] The 9th signal is connected to pin 8 of socket P1, and connected to pin 1 of TVS diode D13 and capacitor C41. Then it is connected to pin 1 of optocoupler U34 through resistor R100. Pin 2 of optocoupler U34 is connected to the negative terminal of Zener diode Z9, and the other pin of Zener diode Z9 is grounded. Pin 4 of optocoupler U34 is connected to pin 2 of resistor R291 and pin 2 of LED DI9. Pin 1 of resistor R293 is connected to pin 1 of resistor R37. Resistor R37 is connected to pin 1 of LED DI9. Pin 2 of LED DI9 is connected to pin 39 of MCU chip U39.
[0033] The 10th signal is connected to pin 6 of socket P1, and then connected to pin 1 of TVS diode D14 and capacitor C42. It is then connected to pin 1 of optocoupler U11 through resistor R101. Pin 2 of optocoupler U11 is connected to the negative terminal of Zener diode Z10, and the other pin of Zener diode Z10 is grounded. Pin 4 of optocoupler U11 is connected to pin 2 of resistor R21 and pin 2 of LED DI10. Pin 1 of resistor R21 is connected to pin 1 of resistor R38. Resistor R38 is connected to pin 1 of LED DI10. Pin 2 of LED DI10 is connected to pin 40 of MCU chip U39.
[0034] The 11th signal is connected to pin 5 of socket P1, and connected to pin 1 of TVS diode D32 and capacitor C10. Then it is connected to pin 1 of optocoupler U9 through resistor R41. Pin 2 of optocoupler U9 is connected to ground. Pin 4 of optocoupler U9 is connected to pin 2 of resistor R40 and pin 2 of LED DI11. Pin 1 of resistor R40 is connected to pin 1 of resistor R39. Resistor R39 is connected to pin 1 of LED DI11. Pin 2 of LED DI11 is connected to pin 41 of MCU chip U39.
[0035] The 12th signal is connected to pin 7 of socket P1, and connected to pin 1 of TVS diode D31 and capacitor C9. Then it is connected to pin 1 of optocoupler U6 through resistor R102. Pin 2 of optocoupler U6 is connected to ground. Pin 4 of optocoupler U9 is connected to pin 2 of resistor R27 and pin 2 of LED DI12. Pin 1 of resistor R27 is connected to pin 1 of resistor R25. Resistor R25 is connected to pin 1 of LED DI12. Pin 2 of LED DI12 is connected to pin 42 of MCU chip U39.
[0036] In one implementation, the D0 channel section 4 has 10 channels.
[0037] Among them, the first signal is connected to the fourth pin of relay T1 through the first pin of P3 socket, the third pin of relay T1 is connected to the second pin of P3 socket, the first pin of relay T1 is connected to resistor R19, and is connected to the 11th pin of driver chip U16 through resistor R19. The 8th pin of driver chip U16 is connected to the 81st pin of MCU chip U39.
[0038] The second signal is connected to the fourth pin of relay T2 through the third pin of P3 socket. The third pin of relay T2 is connected to the fourth pin of P3 socket. The first pin of relay T2 is connected to resistor R284. Through resistor R284, it is connected to the 12th pin of driver chip U16. The 7th pin of driver chip U16 is connected to the 82nd pin of MCU chip U39.
[0039] The third signal is connected to the fourth pin of relay T3 through the fifth pin of P3 socket. The third pin of relay T3 is connected to the sixth pin of P3 socket. The first pin of relay T3 is connected to resistor R287. Through resistor R287, it is connected to the third pin of driver chip U16. The sixth pin of driver chip U16 is connected to the eighth pin of MCU chip U39.
[0040] The fourth signal is connected to the fourth pin of relay T4 through the seventh pin of P3 socket. The third pin of relay T4 is connected to the eighth pin of P3 socket. The first pin of relay T4 is connected to resistor R290. Through resistor R290, it is connected to the fourth pin of driver chip U16. The fifth pin of driver chip U16 is connected to the eighth pin of MCU chip U39.
[0041] The fifth signal is connected to the fourth pin of relay T5 through the ninth pin of P3 socket. The third pin of relay T5 is connected to the tenth pin of P3 socket. The first pin of relay T5 is connected to resistor R290, and then to the fifth pin of driver chip U16 through resistor R292. The fourth pin of driver chip U16 is connected to the eighth pin of MCU chip U39.
[0042] The 6th signal is connected to the 4th pin of relay T6 through the 11th pin of P3 socket. The 3rd pin of relay T6 is connected to the 12th pin of P3 socket. The 1st pin of relay T6 is connected to resistor R80. Through resistor R80, it is connected to the 16th pin of driver chip U16. The 3rd pin of driver chip U16 is connected to the 86th pin of MCU chip U39.
[0043] The 7th signal is connected to the 4th pin of relay T7 through the 13th pin of P3 socket. The 3rd pin of relay T7 is connected to the 14th pin of P3 socket. The 1st pin of relay T7 is connected to resistor R90. Through resistor R90, it is connected to the 17th pin of driver chip U16. The 2nd pin of driver chip U16 is connected to the 87th pin of MCU chip U39.
[0044] The 8th signal is connected to the 4th pin of relay T8 through the 15th pin of P3 socket. The 3rd pin of relay T8 is connected to the 16th pin of P3 socket. The 1st pin of relay T8 is connected to resistor R297. Through resistor R297, it is connected to the 18th pin of driver chip U16. The 1st pin of driver chip U16 is connected to the 88th pin of MCU chip U39.
[0045] The 9th signal is connected to the 4th pin of relay T9 through the 17th pin of P3 socket. The 3rd pin of relay T9 is connected to the 18th pin of P3 socket. The 1st pin of relay T9 is connected to resistor R20, which is connected to the 3rd pin of MOSFET Q34 through resistor R20. The 1st pin of MOSFET Q34 is connected to resistor R283 and the 55th pin of MCU chip U39.
[0046] The 10th signal is connected to the 4th pin of relay T10 through the 19th pin of the P3 socket. The 3rd pin of relay T10 is connected to the 20th pin of the P3 socket. The 1st pin of relay T10 is connected to resistor R288, which is connected to the 3rd pin of MOSFET Q35. The 1st pin of MOSFET Q34 is connected to resistor R289 and the 56th pin of MCU chip U39.
[0047] In one implementation, the AO channel section 5 has 2 channels.
[0048] In the first circuit, the second pin of socket P2 is connected to resistor R306 via diode D19, and then connected to the first pin of capacitor C117, the first pin of TVS diode D91, and the fifth, sixth, seventh, and eighth pins of chip U36 via resistor R306. The fourth pin of chip U36 is connected to the first pin of Zener diode Z13 and the first pin of resistor R305. The seventh pin of chip U37 is connected to the first, second, and third pins of chip U36. The first pin of chip U37 is connected to the second pin of resistor R302, the sixth pin of chip U13, and the sixth pin of chip U39. The second pin of chip U37 is connected to the second pin of resistor R303, the fifth pin of chip U13, and the sixth pin of chip U39.
[0049] In the second circuit, the fourth pin of socket P2 is connected to resistor R311 via diode D21. Resistor R311 is connected to the first pin of capacitor C118, the first pin of TVS diode D24, and the fifth, sixth, seventh, and eighth pins of chip U38. The fourth pin of chip U36 is connected to the first pin of Zener diode Z12 and the first pin of resistor R310. The seventh pin of chip U40 is connected to the first, second, and third pins of chip U38. The first pin of chip U40 is connected to the second pin of resistor R307 and the fourth and sixth pins of chip U39. The second pin of chip U40 is connected to the second pin of resistor R308 and the fourth and seventh pins of chip U39.
[0050] In one implementation, the AI channel section 6 has 8 channels.
[0051] In the first circuit, the 6th pin of socket P2 is connected to the 1st pin of TVS diode D20, and then connected to the 1st pin of resistor R273, the 2nd pin of capacitor C174, and the 3rd pin of chip UA3 via Zener diode D33. It is then connected to the 1st and 2nd pins of chip UA3, and finally connected to the 2nd pin of capacitor C170 and the 4th pin of chip U3 via resistor R136.
[0052] In the second circuit, the 8th pin of socket P2 is connected to the 1st pin of TVS diode D7, and then connected to the 1st pin of resistor R145, the 2nd pin of capacitor C186, and the 5th pin of chip UA3 via Zener diode D34. It is then connected to the 6th and 7th pins of chip UA3, and finally connected to the 2nd pin of capacitor C57 and the 5th pin of chip U3 via resistor R137.
[0053] In the third circuit, the 10th pin of socket P2 is connected to the 1st pin of TVS diode D9, and then connected to the 1st pin of resistor R146, the 2nd pin of capacitor C187, and the 10th pin of chip UA3 via Zener diode D35. It is then connected to the 8th and 9th pins of chip UA3, and finally connected to the 2nd pin of capacitor C171 and the 6th pin of chip U3 via resistor R138.
[0054] In the fourth channel, the 12th pin of socket P2 is connected to the 1st pin of TVS diode D11, and then connected to the 1st pin of resistor R147, the 2nd pin of capacitor C188, and the 12th pin of chip UA3 via Zener diode D36. It is then connected to the 13th and 14th pins of chip UA3, and finally connected to the 2nd pin of capacitor C172 and the 7th pin of chip U3 via resistor R139.
[0055] In the fifth channel, the 14th pin of socket P2 is connected to the 1st pin of TVS diode D22, and then connected to the 1st pin of resistor R279, the 2nd pin of capacitor C194, and the 3rd pin of chip UA4 via Zener diode D40. It is then connected to the 1st and 2nd pins of chip UA4, and finally connected to the 2nd pin of resistor R274, capacitor C190, and the 8th pin of chip U3.
[0056] In the 6th channel, the 16th pin of socket P2 is connected to the 1st pin of TVS diode D16, and then connected to the 1st pin of resistor R278, the 2nd pin of capacitor C72, and the 5th pin of chip UA4 via Zener diode D37. It is then connected to the 6th and 7th pins of chip UA4, and finally connected to the 2nd pin of capacitor C191 and the 9th pin of chip U3 via resistor R275.
[0057] In the 7th channel, the 18th pin of socket P2 is connected to the 1st pin of TVS diode D10, and then connected to the 1st pin of resistor R280, the 2nd pin of capacitor C73, and the 10th pin of chip UA4 via Zener diode D38. It is then connected to the 8th and 9th pins of chip UA4, and finally connected to the 2nd pin of capacitor C192 and the 10th pin of chip U3 via resistor R276.
[0058] In the 8th channel, the 20th pin of socket P2 is connected to the 1st pin of TVS diode D23, and then connected to the 1st pin of resistor R165, the 2nd pin of capacitor C74, and the 12th pin of chip UA4 via Zener diode D39. It is then connected to the 13th and 14th pins of chip UA4, and finally connected to the 2nd pin of capacitor C193 and the 11th pin of chip U3 via resistor R277.
[0059] This utility model uses specific examples to illustrate its principles and implementation methods. The above description of the embodiments is only for the purpose of helping to understand the method and core idea of this utility model. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the idea of this utility model. In summary, the content of this specification should not be construed as a limitation of this utility model.
Claims
1. A communication circuit board for intelligent analysis of edge data of oil wells and pumping equipment, characterized by: It includes top layer board body (1) and bottom layer board body (2), top layer board body (1) and bottom layer board body (2) are connected, top layer board body (1) and bottom layer board body (2) are provided with DI channel part (3), DO channel part (4), AO channel part (5), AI channel part (6), PWM channel part and RS485 channel part.
2. The communication circuit board for intelligent analysis of edge data of oil wells and pumping equipment according to claim 1, characterized in that: DI channel part (3) is provided with 12 ways.
3. The communication circuit board for intelligent analysis of edge data of oil wells and pumping equipment according to claim 1, characterized in that: DO channel part (4) is provided with 10 ways.
4. The communication circuit board for intelligent analysis of edge data of oil wells and pumping equipment according to claim 1, characterized in that: AO channel part (5) is provided with 2 ways.
5. The communication circuit board for intelligent analysis of edge data of oil wells and production equipment according to claim 1, characterized in that: AI channel part (6) is provided with 8 ways.