Pinhole detector for detecting stress change of material
By designing a pinhole detector and employing X-ray diffraction and digital signal processing techniques, the problems of insufficient accuracy and unclear imaging in existing stress detection methods have been solved, achieving high-precision stress detection and low-cost clear imaging.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-15
- Publication Date
- 2026-03-10
AI Technical Summary
Existing stress detection methods suffer from insufficient accuracy, unclear imaging, and high equipment complexity and cost. In particular, the drilling method affects the accuracy of residual stress measurement, the magnetic method has limited application scope, and the X-ray/neutron diffraction method is expensive and complicated to operate.
A pinhole detector was designed, comprising a housing, a main board, a TFT board, and a read/write board. Using X-ray diffraction, the TFT board converts X-rays into analog electrical signals, the read/write board converts the analog signals into digital signals, and the main board performs image processing to achieve high-precision stress detection and clear imaging.
It improves the accuracy and image clarity of stress detection, reduces equipment complexity and cost, and makes it easier to detect slight stress changes in materials.
Smart Images
Figure CN223985799U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of material stress detection technology, and in particular to a pinhole detector for detecting changes in material stress. Background Technology
[0002] The presence and concentration of stress are the main causes of eventual failure of materials and structures. Studying the stress distribution and physical properties of materials under stress can help prevent potential damage or failure in engineering applications.
[0003] The rational utilization of beneficial changes in physical properties can enhance the mechanical properties of materials. Therefore, analyzing the stress distribution and physical properties of materials under stress states has both theoretical research and practical application value, and stress testing methods are a necessary means to realize this value. Currently, commonly used stress testing methods include drilling, magnetic measurement, and diffraction. However, existing stress testing methods have the following problems:
[0004] Drilling is convenient, simple to operate, and the equipment is inexpensive. However, during drilling, the borehole wall is subjected to plastic deformation due to the pressure of the drill bit, resulting in additional strain that affects the accuracy of residual stress measurement. Magnetic measurement is only applicable to ferromagnetic materials and depends on the geomagnetic field environment, limiting its application range. X-ray / neutron diffraction methods have high equipment costs and complex operation, and neutron diffraction requires special protective facilities.
[0005] Therefore, there are still shortcomings and deficiencies in the existing technology. How to provide a pinhole detector that can improve stress detection accuracy and imaging clarity, and has low equipment complexity and cost is a technical problem that urgently needs to be solved by those skilled in the art. Utility Model Content
[0006] The purpose of this invention is to provide a pinhole detector for detecting stress changes in materials, thereby solving the technical problems existing in the current stress detection methods described in the background art.
[0007] To achieve the above objectives, this utility model provides a pinhole detector for detecting stress changes in materials, comprising:
[0008] The housing contains a main board, a TFT board, and a read / write board. The main board is connected to the TFT board and the read / write board via signals. The TFT board is used to convert X-rays into analog electrical signals, and the read / write board is used to convert analog signals into digital signals.
[0009] A cover plate is disposed on the housing. The cover plate has a placement area for placing the product to be tested. When the cover plate is installed on the housing, the placement area is located directly above the TFT plate. A through hole is provided in the middle of the placement area. The through hole allows X-rays to pass through the product to be tested, form diffraction, and then pass through, so as to distribute the light onto the TFT plate.
[0010] Preferably, the through hole is circular, elliptical, or polygonal.
[0011] Preferably, the placement area of the cover plate is provided with a plurality of grooves, which are evenly distributed along the circumference of the through hole.
[0012] Preferably, the upper and lower sides of the TFT board are respectively provided with upper TFT foam and lower TFT foam, which are used to protect and support the TFT board.
[0013] Preferably, the housing is further provided with a synchronization plate, which is used to synchronize the pinhole detector for detecting material stress changes with the X-ray machine that emits X-rays.
[0014] Preferably, a gate driving board is provided inside the housing.
[0015] Preferably, a power board is provided inside the housing to provide power to the electronic devices inside the housing.
[0016] Preferably, the housing is further provided with an interface board for connecting external power supply equipment and transmitting signals, and the interface board is electrically connected to the power board.
[0017] Preferably, a control panel is also provided on the side of the housing.
[0018] Compared to the aforementioned background technology, the pinhole detector for detecting stress changes in materials provided by this utility model diffracts X-rays after they pass through the product under test and pass through a through hole located in the center of the placement area, distributing them onto a TFT board. The TFT board converts the X-rays into analog electrical signals, the read / write board converts the analog signals into digital signals, and the main board processes the digital image signals to obtain a digital X-ray image. By setting the through hole in the center of the placement area, it is ensured that the X-rays can directly hit the TFT board after penetrating the product under test, making the product image clearer and easier to detect slight changes in the product. This improves the accuracy of stress detection and the clarity of the image, and the equipment has low complexity and cost. Attached Figure Description
[0019] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.
[0020] Figure 1 This is a schematic diagram of the structure of a pinhole detector for detecting changes in material stress provided in an embodiment of the present invention;
[0021] Figure 2 for Figure 1 A magnified view of a section at point A in the middle;
[0022] Figure 3 This is a schematic diagram of the structure of a small hole detector for detecting changes in material stress provided in an embodiment of the present invention after the cover plate has been removed.
[0023] Figure 4 An exploded view of a pinhole detector for detecting changes in material stress, provided as an embodiment of this utility model.
[0024] Figures 1 to 4 Chinese figure reference numerals: 1. Housing; 2. Cover plate; 201. Placement area; 202. Through hole; 203. Groove; 3. Main board; 4. TFT board; 5. Read / write board; 6. Upper TFT foam; 7. Lower TFT foam; 8. Synchronization board; 9. Gate driver board; 10. Power board; 11. Interface board; 12. Control panel. Detailed Implementation
[0025] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0026] To enable those skilled in the art to better understand the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.
[0027] This invention provides a pinhole detector for detecting stress changes in materials, which can accurately detect the lattice strain and residual stress distribution of materials under stress.
[0028] The pinhole detector provided by this invention for detecting stress changes in materials employs X-ray diffraction residual stress measurement. Stress is measured through strain. For polycrystalline materials, the strain corresponding to residual stress is considered to be the statistical result of lattice strain in the corresponding region. Therefore, by measuring lattice strain based on the principle of X-ray diffraction, residual stress can be calculated, and the stress state of the product under test can be viewed through software.
[0029] The residual stress of a material corresponds to the macroscopic strain, which is equivalent to the lattice strain. The lattice strain is the relative change in the interplanar spacing, and the change in the interplanar spacing can be determined by using a diffraction device based on Bragg's law.
[0030] Please refer to this as well. Figures 1 to 4 The pinhole detector for detecting changes in material stress provided by this utility model includes a housing 1 and a cover plate 2.
[0031] The housing 1 contains a main board 3, a TFT board 4, and a read / write board 5. The main board 3 is connected to the TFT board 4 and the read / write board 5 via signals. The TFT board 4 is used to convert X-rays into analog electrical signals. Specifically, the TFT board 4 uses a scintillator material to convert X-rays into analog electrical signals. The read / write board 5 is used to convert analog signals into digital signals. The TFT board 4 (full name: Thin Film Transistor Substrate, abbreviated as TFT Substrate or TFT Array Board) refers to the glass substrate integrating thin-film transistor circuitry, and the read / write board 5 integrates read / write chips.
[0032] The CPU control and processing unit of motherboard 3, connected to the acquisition drive circuit, is used to process digital image signals to obtain X-ray digital images. Motherboard 3 integrates signal conversion, data processing, system control, and communication functions within the pinhole detector, directly determining imaging speed, quality, and system reliability. Housing 1 provides a mounting base and protection for the internal components.
[0033] A cover plate 2 is disposed on the housing 1. The cover plate 2 has a placement area 201 for placing the product to be tested. When the cover plate 2 is installed on the housing 1, the placement area 201 is located directly above the TFT plate 4. A through hole 202 is provided in the middle of the placement area 201. The through hole 202 allows X-rays to pass through the product to be tested, forming diffraction, and then distribute the light onto the TFT plate 4. In this embodiment, an X-ray machine is used to emit X-rays.
[0034] In addition, the size and shape of the cover plate 2 placement area 201 are the same as those of the TFT plate 4. Optionally, the cover plate 2 has multiple connection holes along its circumferential direction, and the cover plate 2 is connected to the housing 1 by fasteners such as fastening bolts or fastening screws. This arrangement not only ensures reliable connection but also facilitates assembly and disassembly.
[0035] In use, the product to be tested is placed in the placement area 201 of the cover plate 2. The X-ray machine emits X-rays, which diffract after passing through the product to be tested, and then pass through the through hole 202 located in the middle of the placement area 201 and are distributed on the TFT plate 4. The TFT plate 4 converts the X-rays into analog electrical signals, the read / write board 5 converts the analog signals into digital signals, and the main board 3 performs image processing on the digital image signals to obtain X-ray digital images. The algorithm analyzes the changes in interplanar spacing, calculates the residual stress value, and transmits the imaging results to an external display device to display the stress distribution map in real time.
[0036] By using the through hole 202 located in the middle of the placement area 201, X-rays can be directly projected onto the TFT plate 4 after penetrating the product under test, resulting in clearer product imaging and easier detection of minor changes in the product. This improves stress detection accuracy and imaging clarity, while also reducing equipment complexity and cost.
[0037] Please refer to this as well. Figures 1 to 4 In this embodiment, the through hole 202 can be circular, elliptical or polygonal. Preferably, the through hole 202 is a circular hole to ensure the consistency of the X-ray penetration path.
[0038] In this embodiment, the placement area 201 of the cover plate 2 is also provided with a plurality of grooves 203. The grooves 203 are evenly distributed along the circumference of the through hole 202. Since the through hole 202 is small in size, the grooves 203 facilitate the positioning by the operator during use, making it convenient to place the product to be tested in the middle of the placement area 201.
[0039] Please refer to this as well. Figures 1 to 4 The upper and lower sides of the TFT board 4 are respectively provided with upper TFT foam 6 and lower TFT foam 7, which are used to protect and support the TFT board 4.
[0040] Please refer to this as well. Figures 1 to 4 The housing 1 is also equipped with a synchronization plate 8, which is used to synchronize the pinhole detector used to detect changes in material stress with the X-ray machine that emits X-rays.
[0041] Please refer to this as well. Figures 1 to 4The housing 1 contains a gate driving board 9 (i.e., a gate plate), which provides a bias voltage to the TFT board 4. Specifically, the gate driving board 9 provides a bias voltage to the TFT board 4, thereby controlling the signals from the TFT board 4 to the read / write board 5.
[0042] Please refer to this as well. Figures 1 to 4 The housing 1 contains a power board 10, which provides power to the electronic equipment inside the housing 1. The power board 10 is a specialized subclass of printed circuit board (PCB) used for power conversion and distribution, responsible for converting the input power (such as AC or DC) into the stable voltage / current specifications required by the electronic equipment. Its function is equivalent to the "power supply heart" of the electronic system, directly affecting the stability and energy efficiency of the equipment.
[0043] Please refer to this as well. Figures 1 to 4 The housing 1 contains an interface board 11 for connecting external power supply equipment and transmitting signals. The interface board 11 is electrically connected to the power board 10. When powered on, the interface board 11 and the power board 10 work together to enable the pinhole detector to operate.
[0044] Please refer to this as well. Figures 1 to 4 The housing 1 has a connection port on its side, through which the external power supply equipment housing is connected to the interface board 11.
[0045] Please refer to this as well. Figures 1 to 4 The housing 1 also has a control panel 12 on its side. The control panel 12 is the core hardware component of the human-machine interface (HMI), used to send control commands to the system and provide real-time feedback on the device's operating status. In this embodiment, the control panel 12 can be equipped with a power button, a start button, etc., and the pinhole detector can be operated by using the power button and the start button.
[0046] Please refer to this as well. Figures 1 to 4 The housing 1 contains a lamp board, which is mounted inside the housing 1 via a support plate. The lamp board is a core component of integrated circuits and light source modules in electronic devices. It carries LED beads, control chips, and other components through a printed circuit board (PCB) to achieve efficient light energy conversion and distribution. It is used to convert electrical energy into controllable light signals and is widely used in lighting, display, and interactive devices.
[0047] This invention provides a pinhole detector for detecting stress changes in materials, employing X-ray diffraction residual stress measurement. During use, the product to be tested is placed in the placement area 201 of the cover plate 2. An X-ray machine emits X-rays, which diffract after passing through the product and then through the through-hole 202 located in the center of the placement area 201, distributing onto the TFT plate 4. The TFT plate 4 converts the X-rays into analog electrical signals, the read / write board 5 converts the analog signals into digital signals, and the main board 3 performs image processing on the digital image signals to obtain an X-ray digital image. Algorithms are used to analyze changes in interplanar spacing, calculate residual stress values, and transmit the imaging results to an external display device to display the stress distribution map in real time. This method improves stress detection accuracy and imaging clarity while maintaining low complexity and cost.
[0048] It should be noted that in this specification, relational terms such as first and second are used only to distinguish one entity from several other entities, and do not necessarily require or imply any such actual relationship or order between these entities.
[0049] This article uses specific examples to illustrate the principles and implementation methods of this utility model. The descriptions of the above embodiments are only for the purpose of helping to understand the method and core ideas of this utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made to this utility model without departing from the principles of this utility model, and these improvements and modifications also fall within the protection scope of this utility model.
Claims
1. A small hole probe for detecting changes in material stress, characterized by, The utility model relates to a kind of X-ray testing device, including: Shell (1), inside mainboard (3), TFT board (4) and read-write board (5) are equipped, the mainboard (3) is connected with the signal of the TFT board (4), the read-write board (5), the TFT board (4) is used to convert X-ray into analog electric signal, the read-write board (5) is used to convert analog signal into digital signal; Cover plate (2), be equipped in the shell (1), the cover plate (2) is equipped with placement area (201), the placement area (201) is used to place product to be tested, when the cover plate (2) is installed in the shell (1), the placement area (201) is located just above the TFT board (4), the middle part of the placement area (201) is equipped with through-hole (202), the through-hole (202) is used to X-ray to penetrate product to be tested and form diffraction and pass through, to distribute light on the TFT board (4).
2. The orifice probe for detecting changes in material stress according to claim 1, wherein, The through-hole (202) is circular, oval or polygonal.
3. A small hole probe for detecting a change in stress of a material according to claim 2, wherein The placement area (201) of the cover plate (2) is equipped with several grooves (203), and the grooves (203) are uniformly distributed along the circumference of the through-hole (202).
4. The orifice probe for detecting changes in material stress according to claim 1, wherein, The upper and lower sides of the TFT board (4) are respectively provided with TFT upper foam (6) and TFT lower foam (7), and the TFT upper foam (6) and the TFT lower foam (7) are used to protect and support the TFT board (4).
5. The orifice probe for detecting changes in material stress according to claim 1, wherein, The shell (1) is further provided with a synchronization board (8) inside, and the synchronization board (8) is used to synchronize the operation of the small hole detector for detecting material stress change and the X-ray machine for emitting X-ray.
6. The orifice probe for detecting changes in material stress according to claim 1, wherein, The shell (1) is provided with a gate drive board (9) inside.
7. The orifice probe for detecting changes in material stress according to claim 1, wherein, The shell (1) is provided with a power supply board (10) inside, for providing power for the electronic equipment inside the shell (1).
8. The orifice probe for detecting changes in material stress according to claim 7, wherein, The shell (1) is further provided with an interface board (11) inside for connecting external power supply equipment and transmitting signals, and the interface board (11) is electrically connected with the power supply board (10).
9. The orifice probe for detecting changes in material stress according to claim 1, wherein, The shell (1) is further provided with a control panel (12) on the side.