Testing device for high-temperature bias test

Abstract

The utility model discloses a testing device for a high-temperature bias test, which relates to the technical field of product testing and comprises a base and an electric contact testing plate, the electric contact testing plate is fixedly connected to the top end of the base, and a semiconductor device is placed at the top end of the electric contact testing plate. According to the utility model, the adjusting block moves on the outer side of the adjusting frame and the telescopic rod moves in the adjusting rod, so that the transverse and longitudinal adjustment of the pressing area of the bottom pressing block is realized, different use requirements are met, the pressing block is further contacted with the semiconductor device, and a four-point fixing mode is adopted. The overall limiting and fixing effect can be guaranteed while the contact area is reduced, the adjusting frame is further driven to move downwards through the action of the spring, namely, the pressing block is driven to press downwards for fixing, semiconductor devices of different thicknesses can be used, operation is easy, use is convenient and fast, multi-direction adjustment use can be conducted, and the fixing requirements of chips of different models and sizes can be met.

Description

Technical Field

[0001] This utility model relates to the field of product testing technology, and in particular to a high-temperature bias test device. Background Technology

[0002] High-temperature bias testing is a test method used to evaluate the performance and reliability of electronic components, circuit boards, assemblies, or entire systems under high-temperature conditions and specific bias conditions. This test is typically used to ensure that products can operate stably in the intended operating environment, especially in applications where the ambient temperature is high or components need to withstand a certain voltage or current bias for extended periods.

[0003] During high-temperature bias testing, the test sample needs to be mounted on a test fixture or test plate to ensure good thermal and electrical contact. Currently, the fixation methods for test samples mostly use designs such as spring clips, threaded clips, or vacuum suction cups. However, spring clips and threaded clips have a large contact area with the test sample, making it difficult for the test sample to be heated evenly when entering the oven for high-temperature testing. At the same time, vacuum suction cups have high surface requirements and are relatively cumbersome to clean afterward, leaving room for optimization. Therefore, it is necessary to design a high-temperature bias testing device to solve the above-mentioned problems. Utility Model Content

[0004] The purpose of this invention is to provide a high-temperature bias test device to solve the problem of inconvenience in clamping and limiting the test sample mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a high-temperature bias test device, comprising a base and an electrical contact test plate, wherein the electrical contact test plate is fixedly connected to the top of the base;

[0006] A semiconductor device is placed on the top of the electrical contact test plate. Adjustment frames are movably connected to both sides of the top of the base, and adjustment blocks are slidably connected to the outer sides of the adjustment frames. Adjustment rods are fixed to the inner sides of the adjustment blocks, and telescopic rods are movably connected to the inner sides of the adjustment rods. Connecting rods are fixed to the inner sides of the telescopic rods, and pressure blocks are fixed to both sides of the bottom end of the connecting rods. Receiving grooves are evenly arranged on both sides inside the base, and movable blocks are movably connected to the inner sides of the receiving grooves. Pull rods are fixed to the top of the movable blocks, and the top of the pull rods is fixed to the bottom end of the adjustment frames. Springs are sleeved on the outer sides of the pull rods.

[0007] Preferably, the outer side of the adjustment frame is provided with first friction texture, and the first friction texture is in contact with the inside of the adjustment block.

[0008] Preferably, a limit block is fixed on one side of the telescopic rod, and the limit block is movably connected to the adjusting rod.

[0009] Preferably, the width of the limiting block is matched with the internal width of the adjusting rod, and the two sides inside the adjusting rod are provided with second friction textures, and the second friction textures are in contact with the limiting block.

[0010] Preferably, the width of the movable block matches the width of the receiving groove, and four sets of movable blocks and pull rods are provided.

[0011] Preferably, the cross-section of the pressing block is circular, and there are two sets of pressing blocks, with two blocks in each set.

[0012] Preferably, the electrical contact test plate is connected to the base by bolts to form a detachable connection structure, and four bolts are provided.

[0013] Compared with the prior art, the beneficial effects of this utility model are: the high temperature bias test device realizes the function of easy adjustment and clamping;

[0014] Equipped with an adjustable frame, the semiconductor device is placed on the electrical contact test plate during use. Depending on the size of the semiconductor device and the required fixing position, the adjusting block and telescopic rod are moved. The adjusting block moves outside the adjusting frame, and the telescopic rod moves inside, thus achieving lateral and longitudinal adjustment of the bottom pressure block holding area to meet different usage needs. The pressure block contacts the semiconductor device using a four-point fixing method, which reduces the contact area while ensuring overall limiting and fixing effect, allowing for more uniform heating during subsequent heating. Furthermore, a spring action drives the adjusting frame downwards, causing the pressure block to press down for fixing. Semiconductor devices of different thicknesses can be used. The operation is simple and convenient, and multi-directional adjustment is possible to meet the fixing requirements of chips of different sizes and models. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a top view of the structure of this utility model;

[0017] Figure 2 This is a front view structural diagram of the present utility model;

[0018] Figure 3 This is a side sectional view of the present invention.

[0019] Figure 4 This is a three-dimensional structural diagram of the adjustment frame of this utility model;

[0020] Figure 5 This is a schematic diagram of the internal three-dimensional structure of the adjusting rod of this utility model.

[0021] The reference numerals in the figure are as follows: 1. Base; 2. Adjusting frame; 3. Adjusting block; 4. Adjusting rod; 5. Telescopic rod; 6. Semiconductor device; 7. Pressure block; 8. Connecting rod; 9. Receiving groove; 10. Movable block; 11. Spring; 12. Pull rod; 13. Electrical contact test plate; 14. First friction mark; 15. Limiting block; 16. Second friction mark. Detailed Implementation

[0022] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0023] Please see Figures 1-5 One embodiment of this utility model is a high-temperature bias test device, which includes a base 1 and an electrical contact test plate 13.

[0024] The electrical contact test plate 13 is connected to the base 1 by bolts to form a detachable connection structure, and four bolts are provided;

[0025] Specifically, such as Figure 1 As shown, during use, the electrical contact test plate 13 can be easily installed, removed, or replaced for maintenance, repair, or replacement.

[0026] The electrical contact test plate 13 is fixedly connected to the top of the base 1. A semiconductor device 6 is placed on the top of the electrical contact test plate 13. Adjustment brackets 2 are movably connected to both sides of the top of the base 1.

[0027] The outer side of the adjusting frame 2 is provided with first friction texture 14, and the first friction texture 14 is in contact with the inside of the adjusting block 3;

[0028] Specifically, such as Figure 4 As shown, during use, the friction of the adjusting block 3 can be increased by the action of the first friction texture 14, so that it can be moved under the manual operation of the tester and is not easy to move under the action of no external force.

[0029] Furthermore, adjustment blocks 3 are slidably connected to the outer side of the adjustment frame 2, adjustment rods 4 are fixed to the inner side of the adjustment blocks 3, and telescopic rods 5 are movably connected to the inside of the adjustment rods 4.

[0030] A limiting block 15 is fixed on one side of the telescopic rod 5, and the limiting block 15 is movably connected to the adjusting rod 4. The width of the limiting block 15 matches the internal width of the adjusting rod 4. The two sides inside the adjusting rod 4 are provided with second friction textures 16, and the second friction textures 16 are in contact with the limiting block 15.

[0031] Specifically, such as Figure 5 As shown, during use, the second friction groove 16 can increase the friction of the telescopic rod 5 when it moves, so that it can move under manual operation and is not easy to move without external force.

[0032] The inner side of the telescopic rod 5 is fixed with a connecting rod 8, and the bottom ends of the connecting rod 8 are fixed with pressure blocks 7 on both sides.

[0033] The cross-section of the pressure block 7 is circular, and there are two sets of pressure blocks 7, with two in each set;

[0034] Specifically, such as Figure 1 As shown, during use, the pressure block 7 can reduce the floor space while providing fixation;

[0035] The base 1 has two evenly spaced receiving grooves 9 inside, and each receiving groove 9 is movably connected to a movable block 10.

[0036] The width of the movable block 10 matches the width of the receiving groove 9, and both the movable block 10 and the pull rod 12 are provided with four sets;

[0037] Specifically, such as Figure 3 As shown, when in use, by matching the width of the movable block 10 with the width of the receiving groove 9, the movable block 10 can be limited and guided when it moves.

[0038] Each movable block 10 has a pull rod 12 fixed at its top, and the top of each pull rod 12 is fixed to the bottom of the adjusting frame 2. Each pull rod 12 has a spring 11 sleeved on its outer side.

[0039] Working principle: In use, the semiconductor device 6 is placed on the electrical contact test plate 13. According to the size of the semiconductor device 6 and the required fixed position, the adjusting block 3 is moved and the telescopic rod 5 is pulled. The adjusting block 3 moves outside the adjusting frame 2, and the telescopic rod 5 moves inside the adjusting rod 4, thereby realizing the lateral and longitudinal adjustment of the pressing area of ​​the bottom pressure block 7. The pressure block 7 is driven down by the spring 11 to fix the semiconductor device 6. Then, the necessary test equipment, such as power supply, data acquisition system, temperature controller, etc., is connected. According to the test conditions, a predetermined voltage or current bias is applied to the semiconductor device 6, and the test sample is placed in a high-temperature environment, usually using an oven or heating plate. During the test, the electrical performance of the test sample, such as resistance, capacitance, inductance, etc., and temperature are continuously monitored.

[0040] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0041] The device embodiments described above are merely illustrative. The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs. Those skilled in the art can understand and implement this without any creative effort.

[0042] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and not to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model.

Claims

1. A high temperature bias test test device, comprising a base (1), an electrical contact test plate (13) is fixedly connected at the top end of the base (1); characterized in that The top end of the electrical contact test plate (13) is placed with a semiconductor device (6), both sides of the top end of the base (1) are movably connected with an adjusting frame (2), and the outer sides of the adjusting frame (2) are slidably connected with an adjusting block (3), the inner sides of the adjusting block (3) are fixedly connected with an adjusting rod (4), and the interiors of the adjusting rod (4) are movably connected with an extension rod (5), the inner sides of the extension rod (5) are fixedly connected with a connecting rod (8), and the bottom ends of the connecting rod (8) are fixedly connected with a pressing block (7), both sides of the interior of the base (1) are uniformly provided with a containing groove (9), and the interiors of the containing groove (9) are movably connected with a movable block (10), the top ends of the movable block (10) are fixedly connected with a pull rod (12), and the top ends of the pull rod (12) are fixedly connected with the bottom ends of the adjusting frame (2), the outer sides of the pull rod (12) are sleeved with a spring (11).

2. The high temperature bias test device of claim 1, wherein: The outer sides of the adjusting frame (2) are provided with a first friction pattern (14), and the first friction pattern (14) is in contact with the interior of the adjusting block (3).

3. The high temperature bias test apparatus of claim 1, wherein: One side of the extension rod (5) is fixedly connected with a limiting block (15), and the limiting block (15) is movably connected with the adjusting rod (4).

4. The high temperature bias test device of claim 3, wherein: The widths of the limiting block (15) are matched with the internal widths of the adjusting rod (4), both sides of the interior of the adjusting rod (4) are provided with a second friction pattern (16), and the second friction pattern (16) is in contact with the limiting block (15).

5. The high temperature bias test apparatus of claim 1, wherein: The width of the movable block (10) is matched with the width of the containing groove (9), and the movable block (10) and the pull rod (12) are provided with four groups.

6. The high temperature bias test device of claim 1, wherein: The cross section of the pressing block (7) is circular, the pressing block (7) is provided with two groups, and each group is provided with two.

7. The high temperature bias test device of claim 1, wherein: The electrical contact test plate (13) is connected with the base (1) in a detachable manner through bolts, and the bolts are provided with four.

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