Camera module drop test device

Abstract

The utility model discloses a camera module drop test device, which comprises a camera module drop test fixture, a heating device is fixedly mounted on the camera module drop test fixture, the heating device comprises a circuit board, and a heating circuit is arranged on the circuit board. According to the utility model, the constant-temperature heating circuit is added on the basis of the existing drop reliability test, and when the camera module is subjected to the drop test, the temperature environment of the whole machine can be simulated on the premise of ensuring external stress, so that the test accuracy is further ensured, and the drop test of the camera module in the temperature environment of the whole machine is ensured.

Description

TECHNICAL FIELD

[0001] The utility model belongs to camera module test technical field, specifically related to a camera module drop test device. BACKGROUND

[0002] Mobile phone is the indispensable tool in daily life, big to image design, small to code payment, all cannot leave camera module. But in the use process, it is inevitable to directly exert uncontrolled external force to the mobile phone, even accidentally drop the mobile phone, in these scenes, the mobile phone will vibrate due to external force. This is higher to the reliability of the vibration of the camera module of the mobile phone, for these scenes, camera module manufacturers will carry out drop test. But generally, camera module manufacturers stay in the stage of exerting vibration force, and do not consider that the module is affected by the internal environmental factors of the mobile phone, and temperature is a very important factor, under the influence of the temperature in the mobile phone, the tin paste, glue, plastic and other materials are affected, and subtle deformation is generated, thereby affecting the anti-vibration performance of the camera module in the mobile phone. Therefore, it is necessary for the manufacturer of the camera module of the mobile phone to add temperature conditions when carrying out drop test.

[0003] The conventional camera module drop test fixture only tests the reliability of the camera module under external force, and does not add the internal temperature environment of the whole machine. INVENTION CONTENTS

[0004] The utility model discloses a camera module drop test device that overcomes at least one of the deficiencies in the prior art.

[0005] The technical scheme of the utility model is realized as follows: the utility model discloses a camera module drop test device, including camera module drop test fixture, the camera module drop test fixture is fixedly installed with heating device, the heating device includes circuit board, is equipped with heating circuit on the circuit board.

[0006] Further, the camera module drop test fixture includes a bottom plate and a panel, the bottom plate and the panel are detachably connected, the bottom plate is provided with a first groove for accommodating the camera module and a second groove for accommodating the circuit board, the first groove and the second groove are communicated, the circuit board is provided with a heating area, and the heating area of the circuit board is fixedly installed with a heating device, and the heating area of the circuit board is located in the first groove.

[0007] Further, the circuit board is provided with a copper exposure area for conducting heat to the camera module, the copper exposure area is located on one side of the circuit board, the heating area is located on the other side of the circuit board and corresponds to the copper exposure area, and the copper exposure area is located in the first groove.

[0008] Further, the heating circuit is a constant temperature control heating circuit.

[0009] Further, the heating circuit comprises a temperature monitoring circuit, a comparator, a switch and a heating device, a first input terminal of the comparator is connected with an output terminal of the temperature monitoring circuit, a second input terminal of the comparator is connected with a reference voltage, an output terminal of the comparator is connected with a control terminal of the switch, and the switch and the heating device are connected in series between a positive electrode of a power supply and a negative electrode of the power supply.

[0010] Further, the switch is a MOS tube Q1, a gate of the MOS tube Q1 is connected with one end of a resistor R5 and one end of a resistor R6 respectively, the other end of the resistor R6 is connected with the negative electrode of the power supply, the other end of the resistor R5 is connected with the output terminal of the comparator and one end of a resistor R4 and one end of a capacitor C2 respectively, the other end of the resistor R4 is connected with the positive electrode of the power supply, the other end of the capacitor C2 is connected with the negative electrode of the power supply, a drain of the MOS tube Q1 is connected with the positive electrode of the power supply, a source of the MOS tube Q1 is connected with the negative electrode of the power supply, and the heating device is connected in series between the drain of the MOS tube Q1 and the positive electrode of the power supply or between the source of the MOS tube Q1 and the negative electrode of the power supply.

[0011] Further, the drain of the MOS tube Q1 is connected with one end of the heating device, the other end of the heating device is connected with the positive electrode of the power supply, and the source of the MOS tube Q1 is connected with the negative electrode of the power supply.

[0012] Further, the heating device is a power resistor R3.

[0013] Further, the temperature monitoring circuit comprises an NTC resistor R7, one end of the NTC resistor R7 is connected with the first input terminal of the comparator and one end of a resistor R1 respectively, the other end of the resistor R1 is connected with the positive electrode of the power supply, the other end of the NTC resistor R7 is connected with the negative electrode of the power supply, the second input terminal of the comparator is connected with one end of a resistor R2 and one end of a resistor R8 respectively, the other end of the resistor R2 is connected with the positive electrode of the power supply, and the other end of the resistor R8 is connected with the negative electrode of the power supply.

[0014] The NTC resistor R7 is located in the first recess.

[0015] Further, the heating circuit further comprises a capacitor C1, one end of the capacitor C1 is connected with the positive electrode of the power supply, and the other end of the capacitor C1 is connected with the negative electrode of the power supply.

[0016] Further, the circuit board is provided with a fixing hole, and the bottom plate of the camera module drop test fixture is also provided with a fixing hole corresponding to the fixing hole on the circuit board, and the circuit board is fixedly connected with the bottom plate of the camera module drop test fixture through bolts.

[0017] This invention has at least the following beneficial effects: Combining a drop test fixture structure with a designed constant-temperature heating circuit, the circuit board (circuit board) is assembled into the drop test fixture, forming a miniaturized camera module drop test device. This invention adds a constant-temperature heating circuit to existing drop reliability testing methods. During camera module drop testing, while ensuring external force, it can simulate the temperature environment of the entire device (e.g., 50°C), further ensuring the accuracy of the test and guaranteeing that the camera module undergoes drop testing within the temperature environment of the entire device (e.g., 50°C).

[0018] The camera module drop test device of this utility model can also be compatible with multiple camera modules, so as to achieve the purpose of reusing this constant temperature heating drop fixture for multiple modules.

[0019] Meanwhile, the constant temperature heating circuit scheme of this utility model has the characteristics of low cost, high reliability, and good stability. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 This is a circuit diagram of a heating device disclosed in one embodiment of the present invention;

[0022] Figure 2 This is a schematic diagram of one side of the heating device disclosed in one embodiment of the present utility model;

[0023] Figure 3 This is a schematic diagram of the other side of the heating device disclosed in one embodiment of the present utility model;

[0024] Figure 4 This is a partial structural schematic diagram of a camera module drop test device disclosed in one embodiment of the present invention.

[0025] In the attached diagram, 1 is the circuit board, 11 is the exposed copper area, 12 is the mounting hole, 2 is the heating device, 3 is the thermistor, 4 is the base plate, 41 is the first groove, 42 is the second groove, and 5 is the camera module. Detailed Implementation

[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present utility model.

[0027] In the description of this utility model, it should be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0028] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature; in the description of this utility model, unless otherwise stated, "a plurality of" or "several" means two or more.

[0029] See Figures 1 to 4 This utility model provides a camera module drop test device, including a camera module drop test fixture. A heating device is fixedly installed on the camera module drop test fixture. The heating device includes a circuit board 1, and the circuit board 1 is provided with a heating circuit.

[0030] This invention adds a constant temperature heating circuit to the existing drop reliability test. When the camera module is dropped, it can simulate the 50°C temperature environment of the whole machine while ensuring the external force, thus further ensuring the accuracy of the test and ensuring that the camera module is dropped in the temperature environment (50°C) of the whole machine.

[0031] Furthermore, the camera module drop test fixture includes a base plate 4 and a panel, the base plate and the panel are detachably connected, the base plate is provided with a first groove 41 for accommodating the camera module 5 and a second groove 42 for accommodating the circuit board, the first groove 41 and the second groove 42 are connected, the circuit board 1 is provided with a heating area, the heating area of ​​the circuit board is fixedly installed with a heating device 2, and the heating area of ​​the circuit board is located in the first groove.

[0032] Furthermore, the circuit board 1 is provided with an exposed copper area 11 for conducting heat to the camera module. The exposed copper area 11 is located on one side of the circuit board 1, and the heating area is located on the other side of the circuit board, corresponding to the exposed copper area. The exposed copper area is located in the first groove.

[0033] Furthermore, the heating circuit is a constant temperature control heating circuit.

[0034] Further, see Figure 1 The heating circuit includes a temperature monitoring circuit, a comparator, a switch, and a heating device. The first input terminal of the comparator is connected to the output terminal of the temperature monitoring circuit, the second input terminal of the comparator is connected to a reference voltage, the output terminal of the comparator is connected to the control terminal of the switch, and the switch and the heating device are connected in series between the positive and negative terminals of the power supply.

[0035] Furthermore, the number of heating devices can be one or more, each corresponding to one or more camera modules. Preferably, there are multiple heating devices on the circuit board, each corresponding to one of the multiple camera modules, and each used to heat the multiple camera modules. One heating device corresponds to one set of heating circuits. The heating devices on the circuit board also correspond one-to-one with the first groove on the base plate.

[0036] In this embodiment, the circuit board has two heating elements, located on the left and right sides of the board. The left and right sides of the circuit board have protrusions, making the board T-shaped. The heating elements are located on these protrusions on the left and right sides of the circuit board. The protrusions on the left and right sides of the circuit board are designed to at least partially extend into the first groove of the base plate. The middle portion of the circuit board is located in the second groove of the base plate. The heating area is located on one side of the protrusions on the circuit board, and the exposed copper area is located on the other side of the protrusions on the circuit board.

[0037] Furthermore, the switch is a MOSFET Q1. The gate of the MOSFET Q1 is connected to one end of resistor R5 and one end of resistor R6, respectively. The other end of resistor R6 is connected to the negative terminal of the power supply. The other end of resistor R5 is connected to the output terminal of the comparator, one end of resistor R4, and one end of capacitor C2, respectively. The other end of resistor R4 is connected to the positive terminal of the power supply, and the other end of capacitor C2 is connected to the negative terminal of the power supply. The drain of the MOSFET Q1 is connected to the positive terminal of the power supply, and the source of the MOSFET Q1 is connected to the negative terminal of the power supply. The heating device is connected in series between the drain of the MOSFET Q1 and the positive terminal of the power supply or between the source of the MOSFET Q1 and the negative terminal of the power supply.

[0038] In this embodiment, the drain of MOSFET Q1 is connected to one end of the heating device, the other end of the heating device is connected to the positive terminal of the power supply, and the source of MOSFET Q1 is connected to the negative terminal of the power supply.

[0039] Furthermore, the heating device is a power resistor R3.

[0040] Furthermore, the temperature monitoring circuit employs a thermistor 3. The thermistor is positioned close to the heating element, corresponding to the exposed copper area.

[0041] The temperature monitoring circuit includes an NTC resistor R7. One end of the NTC resistor R7 is connected to the first input terminal of the comparator and one end of the resistor R1. The other end of the resistor R1 is connected to the positive terminal of the power supply. The other end of the NTC resistor R7 is connected to the negative terminal of the power supply. The second input terminal of the comparator is connected to one end of the resistor R2 and one end of the resistor R8. The other end of the resistor R2 is connected to the positive terminal of the power supply. The other end of the resistor R8 is connected to the negative terminal of the power supply.

[0042] The NTC resistor R7 is located in the first groove.

[0043] Furthermore, the heating circuit also includes a capacitor C1, one end of which is connected to the positive terminal of the power supply, and the other end of which is connected to the negative terminal of the power supply.

[0044] In some embodiments, the positive terminal of the power supply is 5V, and the negative terminal is grounded.

[0045] Furthermore, the circuit board is provided with fixing holes 12, and the base plate of the camera module drop test fixture is also provided with fixing holes, corresponding to the fixing holes on the circuit board. The circuit board is fixedly connected to the base plate of the camera module drop test fixture by bolts.

[0046] The constant temperature heating circuit in this embodiment is composed of main components such as NTC resistors, comparators, power resistors, and MOSFETs. The shape of the heating circuit board is determined based on the actual circuit design, and the internal cavity design of the fixture is adjusted accordingly. In this embodiment, one circuit board is configured with two sets of circuits to heat two camera modules. Heat is conducted to the camera modules through exposed copper areas, and the circuit board is fixed using multiple (e.g., four) screws.

[0047] A 5V power supply is provided to the entire circuit. After selecting a series of NTC resistors, the appropriate resistance value of resistor R7 is determined based on the required temperature (50℃). This, along with R1, R2, and R8, forms a temperature monitoring circuit. R2 and R8 are used to set the reference voltage V. REF R1 and R7 are configured according to temperature changes. NTC When the monitoring circuit's V NTC Greater than the reference voltage V REF When comparator U1 outputs a high level, the MOSFET turns on, and current flows through power resistor R3; when the monitoring circuit's V... NTC Less than the reference voltage V REF When comparator U1 outputs a low level, the MOSFET is cut off, and no current flows through the power resistor R3. This is a switching circuit composed of a comparator and a MOSFET.

[0048] In conjunction with the circuit of the power resistor, there are the following two operating states:

[0049] Temperature less than 50℃ → V NTC >1V → Comparator output high level → MOSFET turns on → Current flows through power resistor → Continuous heating.

[0050] Temperature above 50℃ → V NTC <1V → Comparator output low level → MOSFET cut off → No current flows through power resistor → Heating stops.

[0051] This invention evaluates and selects the structure and function of components without altering the overall structure of the drop test fixture, aiming to achieve basic temperature monitoring and heating circuitry. Subsequent optimization involves continuously refining the heating and heat conduction methods. After prototyping and verifying the circuit board's functionality, a preliminary determination is made as to whether temperature monitoring and heating functions (e.g., heating to 50°C) can be achieved. Based on the actual conditions after prototyping, the final location and heating method of the main temperature monitoring component are determined: the NTC is placed close to the power resistor; power resistor heating is used, which improves the reliability of constant temperature heating. Heat conduction is achieved through copper contact.

[0052] This invention's device can perform drop tests, compression tests (configurable as needed), heating stability tests, and heating sustainability tests. In small-batch trial production, a temperature-controlled heating circuit board was assembled into the drop test fixture after adjusting the internal cavity, forming a miniaturized temperature-controlled heating test device. Through actual project use, after preheating to 50°C, it passed all drop tests required by the customer or factory for camera modules.

[0053] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A camera module drop test device, characterized in that: The camera module drop test fixture comprises a heating device fixedly installed thereon, and the heating device comprises a circuit board provided with a heating circuit.

2. The camera module drop test device of claim 1, wherein: The camera module drop test fixture comprises a bottom plate and a panel, and the bottom plate is detachably connected with the panel.

3. The camera module drop test apparatus of claim 2, wherein: The circuit board is provided with a copper-exposed area for conducting heat to the camera module.

4. The camera module drop test apparatus of claim 1, wherein: The heating circuit is a constant-temperature control heating circuit.

5. The camera module drop test apparatus of any one of claims 1 to 4, wherein: The heating circuit comprises a temperature monitoring circuit, a comparator, a switch and a heating device. 6.The camera module drop test device of claim 5, wherein: The switch is a MOS tube Q1, and a gate of the MOS tube Q1 is connected with one end of a resistor R5 and one end of a resistor R6.

7. The camera module drop test apparatus of claim 5, wherein: The heating device is a power resistor R3. 8.The camera module drop test device of claim 5, wherein: The temperature monitoring circuit comprises an NTC resistor R7. 9.The camera module drop test device of claim 5, wherein: The heating circuit further comprises a capacitor C1. 10.The camera module drop test device of claim 1, wherein: The circuit board is provided with a fixing hole, and the bottom plate of the camera module drop test fixture is also provided with a fixing hole corresponding to the fixing hole of the circuit board. The circuit board is fixedly connected with the bottom plate of the camera module drop test fixture through bolts.

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