Embedded ceramic insulating and radiating PCB (Printed Circuit Board)
By using an embedded ceramic insulating heat dissipation PCB design, and utilizing high thermal conductivity materials and low boiling point, high specific heat capacity liquids, the problem of low heat dissipation efficiency of existing PCBs is solved, achieving efficient heat dissipation and equipment miniaturization.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-30
- Publication Date
- 2026-03-10
AI Technical Summary
Existing PCB board heat dissipation methods are inefficient and cannot meet the needs of modern high-performance electronic devices. Furthermore, air-cooling or liquid-cooling solutions increase the size, weight, and cost of the devices, which is not conducive to miniaturization and portability.
The PCB board design with embedded ceramic insulation heat dissipation includes a circuit board body, a heat absorption layer, a heat conduction layer, heat dissipation channels and heat conduction fluid components, and utilizes high thermal conductivity materials and low boiling point, high specific heat capacity heat conduction fluid to achieve efficient heat dissipation.
It improves heat transfer efficiency, reduces heat accumulation, enhances heat dissipation capacity, and meets the needs of miniaturization and portability of electronic devices.
Smart Images
Figure CN223987215U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of printed circuit board technology, and in particular to an embedded ceramic insulating heat dissipation PCB board. Background Technology
[0002] Embedded ceramic insulating and heat-dissipating PCBs are a new type of circuit board in which ceramic materials are embedded inside the printed circuit board to achieve better insulation and heat dissipation performance. Ceramic materials have advantages such as high temperature resistance, corrosion resistance, good thermal conductivity, low coefficient of thermal expansion, high electrical insulation, and strong thermal shock resistance, making them ideal substrate materials for integrated circuits and packaging materials for electronic components.
[0003] Currently, traditional PCB heat dissipation methods have several limitations. Some methods rely solely on simple heat sinks, resulting in low heat dissipation efficiency that fails to meet the cooling requirements of modern high-performance electronic devices. While some air-cooling or liquid-cooling solutions can improve heat dissipation efficiency to some extent, they often require additional complex equipment, increasing the size and weight of electronic devices, as well as raising costs and power consumption. This hinders the miniaturization and portability of electronic devices. Therefore, this application provides a PCB board with embedded ceramic insulation heat dissipation to meet these requirements. Utility Model Content
[0004] The technical problem this invention aims to solve is to provide an embedded ceramic-insulated heat dissipation PCB board to address the shortcomings of existing heat dissipation methods that rely solely on simple heat sinks, resulting in low heat dissipation efficiency and difficulty in meeting the heat dissipation requirements of modern high-performance electronic devices. While some air-cooling or liquid-cooling solutions can improve heat dissipation efficiency to some extent, they often require additional complex equipment, increasing not only the size and weight of the electronic device but also its cost and power consumption, hindering the miniaturization and portability of electronic devices.
[0005] To solve the above technical problems, this utility model provides the following technical solution: an embedded ceramic insulating heat dissipation PCB board, comprising: a circuit board body; a heat-absorbing layer located on the circuit board body for absorbing the heat generated by the circuit board body; a heat-conducting layer located on the heat-absorbing layer for conducting the heat absorbed by the heat-absorbing layer; and a heat dissipation channel is formed on the heat-conducting layer, in which a heat-conducting fluid component is installed.
[0006] Preferably, the heat dissipation channel includes a through area and a fixing area. The through area is located in the middle of the heat-conducting layer and is configured such that the heat-conducting fluid component located in the through area is in direct contact with the heat-absorbing layer. The fixing area is located on both sides of the heat-conducting layer and is used to fix the heat-conducting fluid component.
[0007] Preferably, it further includes: a heat-absorbing partition, located on the heat-absorbing layer, for fixing the circuit board body.
[0008] Preferably, it further includes: a heat dissipation layer, located on the heat-conducting layer, for dissipating the energy transferred by the heat-conducting layer; and a substrate, located on the heat dissipation layer, for fixing and supporting the heat dissipation layer.
[0009] Preferably, both ends of the heat dissipation layer are provided with heat dissipation fin structures, and the thickness of the heat dissipation fins gradually decreases from the center of the heat dissipation layer to both ends.
[0010] Preferably, the heat-absorbing partition is made of a metal material with a high thermal conductivity.
[0011] Preferably, the heat-conducting fluid component is a sealed flexible pipe, and the interior of the heat-conducting fluid component is filled with a heat-conducting liquid with a low boiling point and high specific heat capacity.
[0012] Preferably, the thermally conductive layer is made of aluminum nitride ceramic material.
[0013] Compared with the prior art, this utility model has at least the following beneficial effects: In the above solution, by setting heat dissipation channels, the through-area design of the heat dissipation channels allows the heat-conducting fluid component to directly contact the heat-absorbing layer, shortening the heat transfer path and improving the efficiency of heat transfer from the heat-absorbing layer to the heat-conducting fluid component; at the same time, the heat-absorbing baffle is made of a metal material with a high thermal conductivity, which can assist the heat-absorbing layer in absorbing and transferring heat, further improving the heat dissipation efficiency; the heat-conducting layer is made of aluminum nitride ceramic material, which has good thermal conductivity and can quickly conduct heat, preventing local heat accumulation; the heat-conducting fluid component is filled with a low-boiling-point, high-specific-heat-capacity heat-conducting liquid, which absorbs a large amount of heat through the rapid vaporization phase change of the liquid, enhancing the heat dissipation capacity. Attached Figure Description
[0014] Furthermore, the accompanying drawings, which form part of this specification, illustrate embodiments of the present disclosure and, together with the specification, further serve to explain the principles of the present disclosure and enable those skilled in the art to implement and use the present disclosure.
[0015] Figure 1 This is a schematic diagram of the structure of this utility model;
[0016] Figure 2 This is a schematic diagram of the heat-absorbing layer in this utility model;
[0017] Figure 3 This is an exploded view of the heat-conducting layer in this utility model;
[0018] Figure 4 This is a schematic diagram of the heat dissipation layer and the substrate in this utility model.
[0019] [Figure Labels]
[0020] 1. Circuit board body; 2. Heat-absorbing layer; 3. Heat-conducting layer; 4. Heat dissipation channel; 5. Heat-conducting fluid component; 6. Through area; 7. Fixing area; 8. Heat-absorbing partition; 9. Heat dissipation layer; 10. Substrate.
[0021] As shown in the figure, specific structures and devices are marked in the figure to clearly illustrate the structure of the embodiments of this utility model. However, this is only for illustrative purposes and is not intended to limit this utility model to the specific structure, device and environment. According to specific needs, those skilled in the art can adjust or modify these devices and environments, and such adjustments or modifications are still included in the scope of the appended claims. Detailed Implementation
[0022] The following is a detailed description of an embedded ceramic insulating heat dissipation PCB board provided by this utility model, with reference to the accompanying drawings and specific embodiments. It should be noted that, to make the embodiments more detailed, the following embodiments are the best and preferred embodiments; those skilled in the art can also use other alternative methods to implement some known technologies; and the accompanying drawings are only for more specific description of the embodiments and are not intended to specifically limit this utility model.
[0023] Example 1: As Figures 1 to 4 As shown, an embodiment of the present invention provides an embedded ceramic insulating heat dissipation PCB board, comprising: a circuit board body 1; a heat-absorbing layer 2 located on the circuit board body 1 for absorbing the heat generated by the circuit board body 1; a heat-conducting layer 3 located on the heat-absorbing layer 2 for conducting the heat absorbed by the heat-absorbing layer 2; and a heat dissipation channel 4 formed on the heat-conducting layer 3, wherein a heat-conducting fluid component 5 is installed in the heat dissipation channel 4.
[0024] It should be noted that the circuit board body 1 is the core part of the entire PCB board, carrying various electronic components and undertaking important functions such as circuit connection and signal transmission; at the same time, the main function of the heat absorption layer 2 is to efficiently absorb the heat generated by the circuit board body 1 during operation due to the flow of current and the operation of components. It acts like a heat collector, promptly gathering heat and laying the foundation for subsequent heat dissipation processes.
[0025] like Figure 3 As shown, the heat dissipation channel 4 includes a through area 6 and a fixing area 7. The through area 6 is located in the middle of the heat-conducting layer 3, and the heat-conducting fluid component 5 located in the through area 6 is configured to directly contact the heat-absorbing layer 2. The fixing area 7 is located on both sides of the heat-conducting layer 3 and is used to fix the heat-conducting fluid component 5.
[0026] It should be noted that the through-area 6 is located in the middle of the thermally conductive layer 3. Its unique design allows the thermally conductive fluid component 5 located in the through-area 6 to directly contact the heat-absorbing layer 2. This design cleverly shortens the heat transfer path and improves the efficiency of heat transfer from the heat-absorbing layer 2 to the thermally conductive fluid component 5. The fixing area 7 is located on both sides of the thermally conductive layer 3. Its function is to firmly fix the thermally conductive fluid component 5, preventing the heat dissipation effect from being affected by vibration, displacement, or other factors during PCB board operation.
[0027] like Figure 2 As shown, it also includes: a heat-absorbing partition 8, located on the heat-absorbing layer 2, used to fix the circuit board body 1.
[0028] like Figure 4 As shown, it also includes: a heat dissipation layer 9, located on the heat conduction layer 3, for dissipating the energy transferred by the heat conduction layer 3; and a substrate 10, located on the heat dissipation layer 9, for fixing and supporting the heat dissipation layer 9.
[0029] Example 2: Both ends of the heat dissipation layer 9 are configured with heat dissipation fins, and the thickness of the heat dissipation fins gradually decreases from the center of the heat dissipation layer 9 to both ends.
[0030] The heat-absorbing baffle 8 is made of a metal material with a high thermal conductivity; it can not only fix the circuit board body 1, but also help the heat-absorbing layer 2 absorb the heat emitted by the circuit board body 1 and transfer it to other heat dissipation components, thereby further improving the heat dissipation efficiency.
[0031] The heat-conducting fluid component 5 is a sealed flexible pipe, and the interior of the heat-conducting fluid component 5 is filled with a heat-conducting liquid with a low boiling point and high specific heat capacity.
[0032] It should be noted that the heat-conducting fluid component 5 is a sealed flexible pipe. This flexible design allows it to better adapt to the shape of the heat dissipation channel 4 and the slight deformation that the PCB board may undergo under different operating conditions. Furthermore, the interior of the heat-conducting fluid component 5 is filled with a low-boiling-point, high-specific-heat-capacity heat-conducting liquid. The low boiling point allows the heat-conducting liquid to rapidly vaporize after absorbing heat, absorbing a large amount of heat through phase change, while the high specific heat capacity ensures that it can absorb more heat per unit temperature change, thereby greatly enhancing the heat dissipation capacity of the heat-conducting fluid component 5.
[0033] The heat-conducting layer 3 is made of aluminum nitride ceramic material; this material has good thermal conductivity and can quickly conduct the heat absorbed by the heat-absorbing layer 2, ensuring that heat does not accumulate locally.
[0034] The technical solution provided by this utility model involves mounting the circuit board body 1 on the heat-absorbing layer 2 and enhancing the fixing effect through the heat-absorbing partition 8. When the circuit board body 1 is working, heat is generated due to the current passing through and the operation of the components. The heat-absorbing layer 2 located on the circuit board body 1 acts as a heat collector, efficiently absorbing the heat generated by the circuit board body 1, laying the foundation for the subsequent heat dissipation process.
[0035] The absorbed heat is transferred to the heat-conducting layer 3 located above the heat-absorbing layer 2. The heat-conducting layer 3 is made of aluminum nitride ceramic material, which, with its good thermal conductivity, quickly conducts the heat absorbed by the heat-absorbing layer 2, preventing heat from accumulating locally.
[0036] The heat dissipation channel 4 on the heat-conducting layer 3 has a through-section 6 in the middle, which allows the heat-conducting fluid component 5 located there to directly contact the heat-absorbing layer 2, greatly shortening the heat transfer path and accelerating the transfer of heat from the heat-absorbing layer 2 to the heat-conducting fluid component 5. The fixing areas 7 on both sides of the heat dissipation channel 4 provide a stable fixing effect for the heat-conducting fluid component 5, preventing the heat dissipation effect from being affected by factors such as vibration and displacement during PCB board operation.
[0037] The heat-absorbing baffle 8 located on the heat-absorbing layer 2 is made of a metal material with a high thermal conductivity. It not only fixes the circuit board body 1, but also assists the heat-absorbing layer 2 in absorbing the heat emitted by the circuit board body 1 and transferring it to other heat dissipation components, thereby further improving heat dissipation efficiency.
[0038] The heat-conducting fluid component 5 is a sealed, flexible pipe filled with a low-boiling-point, high-specific-heat-capacity heat-conducting liquid. Upon absorbing heat, the low-boiling-point liquid rapidly vaporizes, absorbing a large amount of heat through a phase change, thus achieving efficient heat dissipation. Its flexible design allows it to better adapt to the shape of the heat dissipation channel 4 and the minute deformations that the PCB board may undergo under different operating conditions.
[0039] Heat is transferred from the heat-conducting fluid component 5 to the heat dissipation layer 9 located on the heat-conducting layer 3. The heat dissipation layer 9 has heat dissipation fins at both ends, and the thickness of the heat dissipation fins gradually decreases from the center of the heat dissipation layer 9 to both ends. This design increases the heat dissipation area, enhances the heat dissipation effect, and dissipates the energy transferred by the heat-conducting layer 3.
[0040] This utility model encompasses any substitutions, modifications, equivalent methods, and solutions made within the spirit and scope of this utility model. To provide the public with a thorough understanding of this utility model, specific details have been described in detail in the above preferred embodiments; however, those skilled in the art can fully understand this utility model even without these detailed descriptions. Furthermore, to avoid unnecessary confusion regarding the essence of this utility model, well-known methods, processes, procedures, components, and circuits have not been described in detail.
[0041] The above description is only a preferred embodiment of the present utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of the present utility model, and these improvements and modifications should also be considered within the protection scope of the present utility model.
Claims
1. An embedded ceramic insulated heat-dissipating PCB board, characterized in that, The utility model relates to a circuit board heat dissipation device, including: Circuit board body (1); Heat absorption layer (2) is located on circuit board body (1), is used for absorbing the heat that circuit board body (1) generates; Thermal conductivity layer (3) is located on heat absorption layer (2), is used for conducting the heat that heat absorption layer (2) absorbs; The thermal conductivity layer (3) is set up with heat dissipation through slot (4), and the heat dissipation through slot (4) is installed with thermal conductivity fluid spare (5).
2. The embedded ceramic insulated heat-dissipating PCB board according to claim 1, wherein, The heat dissipation through slot (4) includes through area (6) and fixed area (7), and the through area (6) is located in the middle part of thermal conductivity layer (3), and the through area (6) is set as the thermal conductivity fluid spare (5) in the through area (6) directly contacts with heat absorption layer (2); The fixed area (7) is located on both sides of thermal conductivity layer (3) and is used for fixing thermal conductivity fluid spare (5).
3. The embedded ceramic insulated heat-dissipating PCB board according to claim 1, wherein, Also including: Heat absorption partition (8) is located on heat absorption layer (2), is used for fixing circuit board body (1).
4. The embedded ceramic insulated heat spreading PCB board of claim 1, wherein, Also including: Heat dissipation layer (9) is located on thermal conductivity layer (3), is used for the energy that thermal conductivity layer (3) transmits carries out dispersion; Base plate (10) is located on heat dissipation layer (9), is used for fixing support heat dissipation layer (9).
5. The embedded ceramic insulated heat spreading PCB board of claim 4, wherein, The both ends of heat dissipation layer (9) are set as heat dissipation fin structure, and the thickness of heat dissipation fin gradually thins from the center of heat dissipation layer (9) to both ends.
6. The embedded ceramic insulated heat spreading PCB board of claim 3, wherein, The heat absorption partition (8) adopts the metal material of high thermal conductivity coefficient.
7. The embedded ceramic insulated heat spreading PCB board of claim 1, wherein, Thermal conductivity fluid spare (5) is sealed flexible pipeline, and the inside of thermal conductivity fluid spare (5) is filled with low boiling point, high specific heat capacity thermal conductivity liquid.
8. The embedded ceramic insulated heat spreading PCB board of claim 1, wherein, The thermal conductivity layer (3) is made of aluminum nitride ceramic material.