Heat dissipation device for chip production and processing

Abstract

The utility model discloses a heat dissipation device for chip production and processing, which comprises an external connection frame, a heat conduction and heat dissipation mechanism, a rapid clamping mechanism and a clamping auxiliary mechanism, and is characterized in that the heat conduction and heat dissipation mechanism comprises a detection assembly, a copper pipe, heat dissipation fins and a heat dissipation fan; the rapid clamping mechanism comprises a clamping pipe, a pressing rod, a clamping groove, a locking frame, a rotating ring, a radian plate and a radian groove, and the clamping auxiliary mechanism comprises a threaded ring, a directional ring, a plug pin, a slot, a rotating block, a winding rod and a reset spring. The detection assembly can monitor the temperature of the chip in real time, it is ensured that the chip works within the optimal temperature range, the detection assembly is rapidly replaced or maintained through the design of a clamping pipe, a pressing rod and a clamping groove, the detection assembly is stably installed through the combination of a locking frame and a rotating ring, and operation is more visual and convenient through the design of a pressing block.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of processing heat dissipation, more specifically, it relates to a heat dissipation device for chip production and processing. BACKGROUND

[0002] A heat dissipation device for chip production and processing is a high-efficiency cooling system designed specifically for thermal management in the process of semiconductor chip manufacturing. This device can effectively control the heat generated during chip production or detection, ensuring processing precision and product quality, while improving production efficiency.

[0003] In the existing technology, firstly, the heat generated by the chip during the detection process cannot be dissipated in time, which may cause the chip to overheat. High temperature can cause the performance of the chip to decline, affecting the production quality and efficiency. Long-term high-temperature operation can significantly shorten the service life of the chip. Overheating may cause fire or other safety problems. Insufficient heat dissipation may require the system to consume more energy to maintain normal operation. Secondly, the device cannot quickly replace or adjust the detection components, increasing the operation time. This may cause the chip to loosen or fall off during use, making it difficult to perform routine inspection and maintenance, increasing maintenance costs, and requiring more time to replace the chip or adjust the equipment, affecting production efficiency. It is difficult to adapt to changes in different types of chips or production requirements, increasing the difficulty and frequency of maintenance, and increasing maintenance costs. Overheating and unstable fixation may cause safety problems. SUMMARY

[0004] (I) Technical problems solved

[0005] In view of the problems existing in the prior art, the utility model provides a heat dissipation device for chip production and processing to solve the technical problems mentioned in the background art, such as the heat generated by the chip during the detection process cannot be dissipated in time, and the detection components cannot be quickly replaced or adjusted.

[0006] (II) Technical solutions

[0007] To achieve the above objectives, this utility model provides the following technical solution: a heat dissipation device for chip manufacturing and processing, comprising an external frame, a heat conduction and heat dissipation mechanism, a quick-connect mechanism, and a connecting auxiliary mechanism. The heat conduction and heat dissipation mechanism includes a detection component, a copper pipe, a heat sink, and a cooling fan. The external frame is connected to the required external location. The detection component is connected to the external frame through the quick-connect mechanism. The copper pipe is installed at the bottom of the detection component, connecting the detection component and the heat sink. The cooling fan is installed on the heat sink. The quick-connect mechanism includes a connecting tube, a pressing rod, a slot, a locking frame, a rotating ring, an arc plate, and an arc groove. The slot is located on the side wall of the pressing rod. The locking frame is laterally slidably installed through the outer wall of the connecting tube. The rotating ring is limited to rotating on the outer wall of the connecting tube. The arc plate is installed at one end of the locking frame. The arc groove is located inside the rotating ring. The rotating arc groove drives the arc plate inside the groove to rotate, causing the locking frame to extend into or away from the slot.

[0008] The present invention is further configured such that the snap-fit ​​auxiliary mechanism includes a threaded ring, a directional ring, a pin, a slot, a rotating block, a winding rod, and a return spring. The threaded ring is threadedly connected to the outer wall of the snap-fit ​​tube. The directional ring is slidably disposed on the outer wall of the snap-fit ​​tube. The pin is installed at the bottom of the directional ring. Multiple sets of slots are disposed at the top of the rotating ring. The rotating block is installed at the bottom of the rotating ring. The winding rod is fixedly disposed on the outer wall of the snap-fit ​​tube. The return spring is disposed on the winding rod. The rotating block connected to the return spring is disposed on the winding rod to cooperate with rotation and sliding. The pin can extend into the slot to fix the rotating ring on the outer wall of the snap-fit ​​tube.

[0009] The present invention is further configured such that a chip slot is provided in the center of the detection component, and power supply lines are installed on both sides of the chip slot, the chip slot and the power supply lines providing a stable placement position and power supply for the chip.

[0010] The present invention is further configured such that a side frame is installed around the detection component, and a tension spring is installed at the top end of the side frame. The side frame and the tension spring provide guidance and reset functions for the pressing rod, thereby increasing the convenience of operation.

[0011] The present invention is further configured such that a pressing block is installed at one end of the pressing rod, and a tension spring is installed between the pressing block and the side frame, so that the pressing rod slides longitudinally on the side frame. The pressing block facilitates the operation of the pressing rod and improves the convenience of the snap-fit ​​operation.

[0012] The present invention is further configured such that mounting grooves are provided around the perimeter of the external frame, and the snap-fit ​​tube is fixedly installed in the mounting grooves. The mounting grooves provide a stable installation position for the snap-fit ​​tube, thereby enhancing the overall structural stability.

[0013] The present invention is further configured such that one end of the pressing rod extends through the side frame and presses the pressing block, so that one end of the pressing rod extends into the locking tube for quick locking. The locking tube and the pressing rod provide a quick and stable locking function, which facilitates the installation and disassembly of the testing components.

[0014] The present invention is further provided that an mounting plate is installed on the side of the heat sink, and the heat sink is installed at the required external position through the mounting plate. The mounting plate facilitates the installation and positioning of the heat sink and increases the applicability of the equipment.

[0015] (III) Beneficial Effects

[0016] Compared with the prior art, the present invention provides a heat dissipation device for chip manufacturing and processing, which has the following beneficial effects:

[0017] This invention features a heat dissipation mechanism that combines a detection component, copper pipe, heat sink, and cooling fan to achieve rapid and effective heat transfer and dissipation. The detection component can monitor the chip temperature in real time, ensuring that the chip operates within its optimal temperature range. Effective heat dissipation can significantly extend the chip's lifespan. Maintaining a suitable temperature helps the chip maintain its optimal performance, prevents overheating, reduces safety hazards, and reduces energy consumption, thereby improving the overall system efficiency.

[0018] This utility model is equipped with a quick-connect mechanism. The design of the locking tube, pressing rod and locking groove enables quick replacement or maintenance of the detection components. The combination of the locking frame and the rotating ring ensures that the detection components are securely installed. The pressing block design makes the operation more intuitive and convenient, facilitates daily inspection and maintenance, and reduces maintenance costs.

[0019] This utility model is equipped with a snap-fit ​​auxiliary mechanism. The design of the threaded ring and the directional ring allows for fine adjustment of the snap-fit ​​position. The design of the pin and the slot further fixes the rotating ring and improves the overall stability. The design of the rotating block and the return spring makes the unlocking operation more flexible. The multiple fixing mechanisms effectively prevent loosening during use. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the overall structure of the device in the unused state of this utility model;

[0021] Figure 2 This is a structural diagram illustrating the connection method of the detection components in this utility model. Figure One ;

[0022] Figure 3 This is a structural diagram illustrating the connection method of the detection components in this utility model. Figure Two ;

[0023] Figure 4 This is a schematic diagram of the quick-connect mechanism and the connecting auxiliary mechanism in this utility model;

[0024] Figure 5 This is a schematic diagram of the internal structure of the quick-connect mechanism and the connecting auxiliary mechanism in this utility model.

[0025] In the diagram: 1. External frame; 2. Detection component; 3. Copper pipe; 4. Heat sink; 5. Cooling fan; 6. Snap-fit ​​pipe; 7. Pressing rod; 8. Snap-fit ​​slot; 9. Locking frame; 10. Rotating ring; 11. Curved plate; 12. Curved groove; 13. Threaded ring; 14. Orientation ring; 15. Pin; 16. Slot; 17. Rotating block; 18. Winding rod; 19. Reset spring; 20. Chip slot; 21. Power supply line; 22. Side frame; 23. Tension spring; 24. Pressing block; 25. Mounting slot; 26. Mounting plate. Detailed Implementation

[0026] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0027] It should be noted that, unless otherwise specified, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains.

[0028] In this utility model, unless otherwise stated, the orientations used, such as "up" and "down", usually refer to the direction shown in the accompanying drawings, or to the vertical, perpendicular, or gravitational direction; similarly, for ease of understanding and description, "left" and "right" usually refer to the left and right shown in the accompanying drawings; "inner" and "outer" refer to the inner and outer contours of each component itself, but the above directional terms are not used to limit this utility model.

[0029] Please see Figures 1-5 A heat dissipation device for chip manufacturing includes an external frame 1, a heat conduction and heat dissipation mechanism, a quick-connect mechanism, and a connecting auxiliary mechanism. The heat conduction and heat dissipation mechanism includes a detection component 2, a copper pipe 3, a heat sink 4, and a cooling fan 5. The external frame 1 is connected to the required external location. The detection component 2 is connected to the external frame 1 via the quick-connect mechanism. The copper pipe 3 is installed at the bottom of the detection component 2, connecting the detection component 2 and the heat sink 4. The cooling fan 5 is installed on the heat sink 4. The quick-connect mechanism includes... The device includes a retaining tube 6, a pressing rod 7, a retaining groove 8, a locking frame 9, a rotating ring 10, an arc plate 11, and an arc groove 12. The retaining groove 8 is located on the side wall of the pressing rod 7. The locking frame 9 is laterally slidably installed through the outer wall of the retaining tube 6. The rotating ring 10 is limited to rotating on the outer wall of the retaining tube 6. The arc plate 11 is installed at one end of the locking frame 9. The arc groove 12 is located inside the rotating ring 10. The rotating arc groove 12 drives the arc plate 11 inside the groove to rotate, causing the locking frame 9 to extend into or away from the retaining groove 8.

[0030] In this embodiment, the manufactured chip needs to be tested. At this time, the chip is placed in the chip slot 20 of the testing component 2 and powered by the power supply line 21. The testing component 2 detects the temperature of the chip. The heat is transferred from the testing component 2 to the heat sink 4 through the copper pipe 3. The heat sink 4 increases the heat dissipation area, and the cooling fan 5 blows heat to achieve quick installation and disassembly of the external frame and the testing component 2. The operator presses the pressing rod 7 with the pressing block 24, so that one end of it extends into the locking tube 6. The locking slot 8 is aligned with the locking frame 9. The rotating ring 10 is rotated, which drives the arc plate 11 in the arc groove 12 to rotate. The rotation of the arc plate 11 causes the locking frame 9 to move laterally and extend into the locking slot 8. The locking frame 9 enters the locking slot 8 to achieve quick locking.

[0031] The snap-fit ​​auxiliary mechanism includes a threaded ring 13, a directional ring 14, a pin 15, a slot 16, a rotating block 17, a winding rod 18, and a return spring 19. The threaded ring 13 is threadedly connected to the outer wall of the snap-fit ​​tube 6. The directional ring 14 is slidably disposed on the outer wall of the snap-fit ​​tube 6. The pin 15 is installed at the bottom of the directional ring 14. Multiple slots 16 are disposed at the top of the rotating ring 10. The rotating block 17 is installed at the bottom of the rotating ring. The winding rod 18 is fixedly installed on the outer wall of the snap-fit ​​tube 6. The return spring 19 is installed on the winding rod 18. The rotating block 17, which is connected to the return spring 19, is disposed on the winding rod 18 and rotates and slides in cooperation. The pin 15 can extend into the slot 16 to fix the rotating ring on the outer wall of the snap-fit ​​tube 6.

[0032] In this embodiment, rotating the threaded ring 13 adjusts the position of the directional ring 14, which in turn moves the pin 15. The pin 15 extends into the slot 16 at the top of the rotating ring 10, fixing the rotating ring 10. The rotating block 17 slides on the winding rod 18, and the return spring 19 provides a restoring force. When unlocking is required, rotating the threaded ring 13 in the opposite direction loosens the connection between the pin 15 and the slot 16. The return spring 19 pulls the rotating block 17 and the rotating ring to rotate, causing the locking bracket 9 to move away from the slot 8.

[0033] Please see Figures 1-5As a supplementary embodiment of a heat dissipation device for chip manufacturing and processing, which includes a heat conduction and heat dissipation mechanism, a quick-connect mechanism, and a connecting auxiliary mechanism: A chip slot 20 is provided in the center of the detection component 2, and power supply lines 21 are installed on both sides of the chip slot 20. A side frame 22 is installed around the detection component 2, and a tension spring 23 is installed at the top end of the side frame 22. A pressing block 24 is installed at one end of the pressing rod 7, and the tension spring 23 is installed between the pressing block 24 and the side frame 22, so that the pressing rod 7 slides longitudinally on the side frame 22. An installation groove 25 is installed around the external frame 1, and a connecting tube 6 is fixedly installed in the installation groove 25. One end of the pressing rod 7 extends through the side frame 22 and presses the pressing block 24, so that one end of the pressing rod 7 extends into the connecting tube 6 to cooperate in the quick-connect setting. An installation plate 26 is installed on the side of the heat sink 4, and the heat sink 4 is installed in the required external position through the installation plate 26.

[0034] More specifically, the chip is placed in the chip slot 20 of the detection component 2, and the chip is powered by the power supply line 21. The pressing rod 7 is pressed so that one end extends into the locking tube 6. The rotating ring 10 is rotated so that the locking bracket 9 extends into the slot 8 of the pressing rod 7. The threaded ring 13 is adjusted so that the pin 15 extends into the slot 16 of the rotating ring 10 and is fixed in position. The detection component 2 begins to detect the chip temperature. The heat is transferred to the heat sink 4 through the copper pipe 3. The cooling fan 5 starts to accelerate heat dissipation. Depending on the detected temperature, the speed of the cooling fan 5 may need to be adjusted. If the detection component 2 needs maintenance or repair, it can be unlocked through the locking auxiliary mechanism. The threaded ring 13 is rotated in the opposite direction, and the connection between the pin 15 and the slot 16 is loosened. The reset spring 19 pulls the rotating block 17 and the rotating ring to rotate, so that the locking bracket 9 moves away from the slot 8. During the chip production process, the device continuously dissipates heat, and the detection component 2 continuously monitors the temperature to ensure that the chip operates within a suitable temperature range.

[0035] In summary, when the overall equipment is in use or running: when the heat dissipation mechanism is required to run, the produced chips need to be tested. At this time, the chips are placed in the chip slot 20 of the testing component 2 and powered by the power supply line 21. The testing component 2 detects the temperature of the chips, and the heat is transferred from the testing component 2 to the heat sink 4 through the copper pipe 3. The heat sink 4 increases the heat dissipation area, and the cooling fan 5 blows the heat.

[0036] When the quick-connect mechanism is in operation, it enables the rapid installation and disassembly of the external frame and the detection component 2. The operator presses the pressing rod 7 with the pressing block 24, so that one end of it extends into the locking tube 6, the locking groove 8 and the locking frame 9 are aligned, and the rotating ring 10 is rotated, which drives the arc plate 11 in the arc groove 12 to rotate. The rotation of the arc plate 11 causes the locking frame 9 to move laterally and extend into the locking groove 8. The locking frame 9 enters the locking groove 8, realizing quick-connection.

[0037] When the auxiliary mechanism needs to be engaged, rotate the threaded ring 13 to adjust the position of the directional ring 14. The directional ring 14 drives the pin 15 to move. The pin 15 extends into the slot 16 at the top of the rotating ring 10 to fix the rotating ring 10. The rotating block 17 slides on the winding rod 18. The return spring 19 provides the rebound force. When unlocking is required, rotate the threaded ring 13 in the opposite direction. The connection between the pin 15 and the slot 16 is loosened. The return spring 19 pulls the rotating block 17 and the rotating ring to rotate, so that the locking frame 9 is away from the slot 8.

[0038] The chip is placed in the chip slot 20 of the detection component 2, and the chip is powered by the power supply line 21. Press the pressing rod 7 so that one end extends into the locking tube 6. Rotate the rotating ring 10 so that the locking bracket 9 extends into the slot 8 of the pressing rod 7. Adjust the threaded ring 13 so that the pin 15 extends into the slot 16 of the rotating ring 10 and fixes the position. The detection component 2 starts to detect the chip temperature. The heat is transferred to the heat sink 4 through the copper pipe 3. The cooling fan 5 starts to accelerate the heat dissipation. Depending on the detected temperature, the speed of the cooling fan 5 may need to be adjusted. If the detection component 2 needs maintenance or repair, it can be unlocked through the locking auxiliary mechanism. Rotate the threaded ring 13 in the opposite direction to loosen the connection between the pin 15 and the slot 16. The reset spring 19 pulls the rotating block 17 and the rotating ring to rotate, so that the locking bracket 9 moves away from the slot 8. During the chip production process, the device continuously dissipates heat, and the detection component 2 continuously monitors the temperature to ensure that the chip works within a suitable temperature range.

[0039] Of all the solutions mentioned above, those involving the connection between two components can be selected according to the actual situation, such as welding, bolt and nut connection, bolt or screw connection, or other known connection methods, which will not be elaborated here. For all the fixed connections mentioned above, welding is preferred. Although embodiments of this utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of this utility model. The scope of this utility model is defined by the appended claims and their equivalents.

Claims

1. A heat dissipation device for chip production and processing, comprising an external frame (1), a heat-conducting heat dissipation mechanism, a quick clamping mechanism and a clamping auxiliary mechanism, characterized in that: The heat-conducting heat-dissipating mechanism comprises a detection assembly (2), a copper pipe (3), a heat-dissipating fin (4) and a heat-dissipating fan (5), the outer connecting frame (1) is connected with a required position of the outside world, the detection assembly (2) is connected with the outer connecting frame (1) through the quick clamping mechanism, the copper pipe (3) is installed at the bottom of the detection assembly (2), the copper pipe (3) connects the detection assembly (2) and the heat-dissipating fin (4), the heat-dissipating fan (5) is installed on the heat-dissipating fin (4), the quick clamping mechanism comprises a clamping pipe (6), a pressing rod (7), a clamping groove (8), a locking frame (9), a rotating ring (10), an arc plate (11) and an arc groove (12), the clamping groove (8) is arranged on the side wall of the pressing rod (7), the locking frame (9) is transversely slidably arranged on the outer wall of the clamping pipe (6), the rotating ring (10) is rotationally arranged on the outer wall of the clamping pipe (6), the arc plate (11) is arranged at one end of the locking frame (9), the arc groove (12) is arranged in the rotating ring (10), and the rotating arc groove (12) drives the arc plate (11) in the groove to rotate, so that the locking frame (9) is inserted into or away from the clamping groove (8).

2. The heat sink device for chip production and processing according to claim 1, characterized in that: The clamping auxiliary mechanism comprises a threaded ring (13), a directional ring (14), a bolt (15), a slot (16), a rotating block (17), a winding rod (18) and a reset spring (19), the threaded ring (13) is threadedly connected to the outer wall of the clamping pipe (6), the directional ring (14) is arranged on the outer wall of the clamping pipe (6) in a directionally sliding manner, the bolt (15) is arranged at the bottom of the directional ring (14), a plurality of slots (16) are arranged at the top of the rotating ring (10), the rotating block (17) is arranged at the bottom of the rotating ring, the winding rod (18) is fixedly arranged on the outer wall of the clamping pipe (6), and the reset spring (19) is arranged on the winding rod (18). The rotating block (17) connected with the reset spring (19) is arranged on the winding rod (18) and is rotationally and slidably arranged in cooperation, the bolt (15) can be inserted into the slot (16) to fix the rotating ring to the outer wall of the clamping pipe (6).

3. The heat dissipation device for chip manufacturing and processing according to claim 1, characterized in that: The detection assembly (2) is provided with a chip groove (20) in the middle.

4. The heat sink of claim 1, wherein: the heat sink is configured to be used in a chip manufacturing process. A power supply wire (21) is arranged on both sides of the chip groove (20).

5. A heat dissipation device for chip manufacturing and processing according to claim 4, characterized in that: A lateral frame (22) is arranged around the detection assembly (2), and a tension spring (23) is arranged at the top end of the lateral frame (22).

6. The heat sink of claim 1, wherein: the heat sink is configured to be used in a chip manufacturing process. A pressing block (24) is arranged at one end of the pressing rod (7), and the tension spring (23) is arranged between the pressing block (24) and the lateral frame (22), so that the pressing rod (7) longitudinally slides on the lateral frame (22).

7. The heat sink of claim 5, wherein: the plurality of fins are arranged in a plurality of rows; and the plurality of rows are arranged in a staggered pattern. An installation groove (25) is arranged around the outer connecting frame (1), and the clamping pipe (6) is fixedly arranged in the installation groove (25).

8. The heat sink of claim 1, wherein: the heat sink is configured to be used in a chip manufacturing process. One end of the pressing rod (7) extends through the lateral frame (22) and presses the pressing block (24), so that one end of the pressing rod (7) is inserted into the clamping pipe (6) and is quickly clamped. An installation plate (26) is arranged on the side of the heat-dissipating fin (4), and the heat-dissipating fin (4) is installed at a required position of the outside world through the installation plate (26).

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