Battery power supply LoRa transmission sound, vibration and temperature integrated sensor

Abstract

A battery-powered LoRa transmission sound, vibration and temperature integrated sensor comprises a base assembly, the upper portion of the base assembly is connected with a middle frame assembly, the middle frame assembly is connected with a plastic upper cover assembly, and the middle frame assembly is connected with a metal upper cover and fixes the plastic upper cover assembly; the base assembly comprises a sensor base, and a sensor data acquisition mainboard is connected in the sensor base; the plastic upper cover assembly comprises a plastic upper cover, the LoRa mainboard and the data analysis mainboard are both fixedly connected with the plastic upper cover, and the LoRa mainboard is connected with the data analysis mainboard through a data line; the middle frame assembly comprises a middle frame shell, a battery is installed in the middle frame shell, the battery supplies power to the sensor data acquisition mainboard, the data analysis mainboard and the LoRa mainboard, an FPC flat cable is arranged in the middle frame shell, and the data analysis mainboard is connected with the sensor data acquisition mainboard through the FPC flat cable; according to the utility model, detected equipment is detected through sound, vibration and temperature, power is supplied by a battery, wireless LoRa signals are transmitted to terminal equipment, and the functions are comprehensive.

Description

Technical Field

[0001] This utility model relates to the field of sensor technology, specifically to a battery-powered LoRa transmission integrated acoustic, vibration, and temperature sensor. Background Technology

[0002] With the advancement of predictive maintenance in recent years, there is a need for online monitoring of the operational health status of equipment, especially critical mechanical equipment, in industrial settings.

[0003] The existing sensor, named "Temperature and Vibration Composite Sensor" (Publication No.: CN209485552U), mainly relies on detecting the sound, vibration, and temperature of the device to determine its health status. It is powered and transmits data via a wired power supply. The disadvantages of this type of sensor are: 1) poor installation flexibility, relying on power supply and wired network, complex wiring, and difficulty in deploying in remote, mobile, or dangerous areas; 2) limited scalability, adding nodes requires rewiring, resulting in high modification costs; 3) weak environmental adaptability, in harsh environments such as high temperature and humidity, the cables may age or be damaged. Summary of the Invention

[0004] In order to overcome the shortcomings of the prior art, the purpose of this utility model is to provide a battery-powered LoRa transmission integrated sound, vibration and temperature sensor that detects the device under test through sound, vibration and temperature, is powered by a battery and transmits the signal to the terminal device wirelessly via LoRa. It has comprehensive functions and stronger fault diagnosis capabilities.

[0005] To achieve the above objectives, the technical solution adopted by this utility model is as follows:

[0006] A battery-powered LoRa transmission integrated acoustic, vibration and temperature sensor includes a base assembly 4, the upper part of which is connected to a middle frame assembly 3, the middle frame assembly 3 is connected to a plastic top cover assembly 1, and the middle frame assembly 3 is connected to a metal top cover 2 and fixes the plastic top cover assembly 1.

[0007] The base assembly 4 includes a sensor base 5, and the sensor base 5 is internally connected to a sensor data acquisition motherboard 10;

[0008] The plastic cover assembly 1 includes a plastic cover 7, a LoRa motherboard 13 and a data analysis motherboard 12, both of which are fixedly connected to the plastic cover 7. The LoRa motherboard 13 is located inside the upper part of the plastic cover 7, and the data analysis motherboard 12 is located below the LoRa motherboard 13. The LoRa motherboard 13 and the data analysis motherboard 12 are connected by a data cable.

[0009] The mid-frame assembly 3 includes a mid-frame housing 6, in which a battery 9 is installed. The battery 9 supplies power to the sensor data acquisition motherboard 10, the data analysis motherboard 12, and the LoRa motherboard 13. An FPC cable is provided inside the mid-frame housing 6, and the data analysis motherboard 12 is connected to the sensor data acquisition motherboard 10 through the FPC cable.

[0010] The plastic cover 7 has an integrated indicator light 8, which is used to indicate whether the integrated sound, vibration and temperature sensor is powered on.

[0011] The middle frame housing 6 cooperates with the battery pressure plate 11 to press and fix the battery 9.

[0012] The data analysis motherboard 12 integrates a control module that supports multi-channel analog signal conditioning and 24-bit high-precision analog-to-digital conversion.

[0013] The sensor data acquisition motherboard 10 integrates a MEMS microphone chip and a MEMS accelerometer chip, and the MEMS accelerometer chip has a built-in temperature measurement module.

[0014] The LoRa motherboard 13 integrates a LoRa communication module that supports adaptive spread spectrum communication technology.

[0015] The sensor base 5 has a magnetic mounting hole 14 at the center of its bottom. The magnetic mounting hole 14 is used to attach the sensor to the device under test by a permanent magnet.

[0016] The battery 9 is a high-capacity lithium battery and employs an intelligent sleep mechanism: it automatically enters a low-power mode during non-working periods.

[0017] Compared with the prior art, the present invention has the following technical effects:

[0018] (A) This utility model enables multi-dimensional equipment status monitoring. The sensor data acquisition motherboard 10 uses a MEMS microphone chip and a MEMS accelerometer chip, along with a built-in temperature measurement module, to simultaneously collect sound, vibration, and temperature parameters of the equipment. The vibration signal sampling frequency can reach up to 10kHz, ensuring accurate capture of high-frequency vibration components. The data analysis motherboard 12 has a built-in low-power control module that supports multi-channel analog signal conditioning and 24-bit high-precision analog-to-digital conversion. The LoRa motherboard 13 integrates a LoRa communication module, supporting adaptive spread spectrum communication technology, with a transmission distance of up to 3km in open environments. It seamlessly connects with the cloud management platform via the LoRaWAN protocol, enabling real-time generation of equipment health status maps and early fault warnings. The device is powered by a battery 9, providing over 12 months of battery life at a 10Hz sampling frequency.

[0019] (B) This utility model adopts LoRa (long-range low-power wireless communication technology), and the transmission distance can reach several kilometers, which is suitable for remote monitoring scenarios.

[0020] (C) This utility model adopts an intelligent sleep mechanism: it automatically enters a low-power mode during non-working periods. The high-capacity lithium battery power supply combined with the low-power characteristics of LoRa enables long-term operation.

[0021] (D) This utility model is flexible to install and requires no wiring, making it suitable for scenarios where wiring is difficult (such as field equipment, high-altitude equipment, rotating equipment).

[0022] (E) This utility model has wide network coverage, supports the LoRaWAN protocol, can access wide area networks, and realizes centralized management of multi-node data.

[0023] (F) This utility model has strong anti-interference ability. LoRa can still transmit stably under low signal-to-noise ratio and is suitable for complex electromagnetic environments. Attached Figure Description

[0024] Figure 1 This is a front view of an embodiment of this utility model.

[0025] Figure 2 This is a three-dimensional structural outline drawing of an embodiment of this utility model.

[0026] Figure 3 This is a cross-sectional view of an embodiment of this utility model.

[0027] Figure 4 This is a top view of an embodiment of the present invention. Detailed Implementation

[0028] The present invention will now be described in detail with reference to the embodiments and accompanying drawings.

[0029] like Figure 1 As shown, a battery-powered LoRa transmission integrated acoustic, vibration and temperature sensor includes a plastic top cover assembly 1, a metal top cover 2, a middle frame assembly 3, and a base assembly 4. The plastic top cover assembly 1 and the middle frame assembly 3 are installed through a slot, the metal top cover 2 and the middle frame assembly 3 are connected by threads to fix the plastic top cover assembly 1, and the middle frame assembly 3 and the base assembly 4 are connected by welding.

[0030] like Figure 2 , Figure 3 As shown, the base assembly 4 includes a sensor base 5, a sensor data acquisition motherboard 10, and a magnetic mounting hole 14. The sensor base 5 is connected to the sensor data acquisition motherboard 10 through a first bolt 15. This design can prevent the sensor data acquisition motherboard 10 from shaking during the monitoring process and ensure that it can stably receive the sound, vibration and temperature signals of the device.

[0031] The plastic cover assembly 1 includes a plastic cover 7, a data analysis motherboard 12, a LoRa motherboard 13, and an indicator light 8. The indicator light 8 is integrated into the plastic cover 7. The LoRa motherboard 13 and the data analysis motherboard 12 are both fixedly connected to the plastic cover 7 by bolts. The LoRa motherboard 13 is located inside the upper part of the plastic cover 7 and is fixed to the plastic cover 7 by a second bolt 17. The data analysis motherboard 12 is located below the LoRa motherboard 13 and is fixed to the plastic cover 7 by a third bolt 16. The LoRa motherboard 13 and the data analysis motherboard 12 are connected by a data cable.

[0032] The mid-frame assembly 3 consists of a mid-frame housing 6, a battery pressure plate 11, and a battery 9. The battery 9 is installed inside the mid-frame housing 6. The battery pressure plate 11 is threaded into the mid-frame housing 6 to tightly press and fix the battery 9, preventing power interruption due to vibration and ensuring stable power supply. The battery 9 supplies power to the sensor data acquisition motherboard 10, the data analysis motherboard 12, and the LoRa motherboard 13. An FPC cable is provided inside the mid-frame housing 6, and the data analysis motherboard 12 is connected to the sensor data acquisition motherboard 10 through the FPC cable.

[0033] During operation, indicator light 8 remains constantly lit. The sensor data acquisition motherboard 10, fixed inside the sensor base 5, collects the device's sound, vibration, and temperature signals. These signals are transmitted to the data analysis motherboard 12 via the FPC cable inside the mid-frame housing 6. The data analysis motherboard 12 converts the electrical signals into digital signals. Subsequently, the digital signals are transmitted to the LoRa motherboard 13 via the data connection cable, and then the collected data is transmitted to the terminal device using the LoRa transmission protocol. By analyzing the collected data received on the terminal device, the health status of the device can be understood.

[0034] The data analysis motherboard 12 integrates a control module that supports multi-channel analog signal conditioning and 24-bit high-precision analog-to-digital conversion.

[0035] The sensor data acquisition motherboard 10 integrates a MEMS microphone chip and a MEMS accelerometer chip, and the MEMS accelerometer chip has a built-in temperature measurement module.

[0036] The LoRa motherboard 13 integrates a LoRa communication module that supports adaptive spread spectrum communication technology.

[0037] like Figure 3 , Figure 4 As shown, the sensor base 5 has a magnetic mounting hole 14 at the center of its bottom. The magnetic mounting hole 14 is used to attach the sensor to the device under test with a permanent magnet for data acquisition.

[0038] The battery 9 mentioned above uses a high-capacity lithium battery; it adopts an intelligent sleep mechanism: it automatically enters a low-power mode during non-working periods. The high-capacity lithium battery power supply combined with the low-power characteristics of LoRa enables long-term operation.

[0039] The principle of this invention is as follows: The sensor is installed and fixed on the surface of the device under test by magnetic mounting hole 14 with permanent magnet. The MEMS microphone chip is used to convert the structural noise of the device under test into an electrical signal. When the device under test generates sound, the sound wave acts on the diaphragm, and the diaphragm vibrates with the change of sound pressure, causing the capacitance value between the diaphragm and the back plate to change. This capacitance change is converted into an electrical signal by the built-in ASIC chip, and after amplification and analog-to-digital conversion, the final output is an electrical signal corresponding to the sound wave, realizing high-precision sound acquisition and conversion to achieve the function of structural noise detection and control. The MEMS chip accelerometer chip (with built-in temperature measurement module) is used to convert the vibration intensity of the device under test into an electrical signal. When subjected to acceleration, the mass block is displaced due to inertia, causing the spacing or area of ​​the capacitor plates connected to it to change, thereby changing the capacitance value. This capacitance change is converted into an electrical signal output proportional to the acceleration by the built-in circuit, realizing accurate acceleration measurement. At the same time, the multi-axis structure can detect movement in different directions, and the temperature can be accurately measured by the change of resistance value in the temperature measurement module. The LoRa communication module is based on linear frequency modulation spread spectrum (CSS) technology. It achieves long-distance, low-power communication by spreading the signal over a wide bandwidth. Its core is to adjust the spreading factor (SF) and bandwidth to balance the transmission rate and coverage (up to tens of kilometers). It also uses the LoRaWAN protocol to realize network communication between terminal devices, gateways, and servers. The electrical signal data collected by the MEMS microphone chip and MEMS accelerometer chip are transmitted to the control module on the data analysis motherboard 12 through the data line, thereby converting the electrical signals into digital signals. In this way, sound, vibration, and temperature are collected. The collected data is transmitted to the LoRa motherboard 13 through the data line between the data analysis motherboard 12 and the LoRa motherboard 13. Through the LoRaWAN protocol, it is seamlessly connected to the cloud management platform and transmitted to the terminal device. It can generate a device health status map in real time. The terminal device can analyze the collected data to obtain the health status of the device and realize early fault warning.

Claims

1. A battery-powered LoRa-transmitted acoustic-vibrational-thermal integrated sensor comprising a base assembly (4), characterized in that: The base assembly (4) is connected with the middle frame assembly (3), the middle frame assembly (3) is connected with the plastic upper cover assembly (1), the middle frame assembly (3) is connected with the metal upper cover (2) and fixes the plastic upper cover assembly (1); The base assembly (4) comprises a sensor base (5), and the sensor base (5) is internally connected with a sensor data acquisition mainboard (10); The plastic upper cover assembly (1) comprises a plastic upper cover (7), and the LoRa mainboard (13) and the data analysis mainboard (12) are fixedly connected with the plastic upper cover (7), wherein the LoRa mainboard (13) is located above the plastic upper cover (7) internally, the data analysis mainboard (12) is located below the LoRa mainboard (13), and the LoRa mainboard (13) and the data analysis mainboard (12) are connected through a data line; The middle frame assembly (3) comprises a middle frame shell (6), the middle frame shell (6) is internally provided with a battery (9), and the battery (9) supplies power to the sensor data acquisition mainboard (10), the data analysis mainboard (12) and the LoRa mainboard (13); the middle frame shell (6) is internally provided with an FPC flat cable, and the data analysis mainboard (12) is connected with the sensor data acquisition mainboard (10) through the FPC flat cable.

2. The integrated acoustic-vibrational-thermal sensor of claim 1, wherein: The plastic upper cover (7) is integrated with an indicator lamp (8) for displaying whether the sound-vibration-temperature integrated sensor is powered on and works.

3. The integrated acoustic-vibrational-thermal sensor of claim 1, wherein: The middle frame shell (6) is matched with a battery pressing plate (11) to tightly fix the battery (9).

4. The integrated acoustic-vibrational-thermal sensor of claim 1, wherein: The data analysis mainboard (12) is integrated with a control module, supports multi-channel analog signal conditioning and 24-bit high-precision analog-digital conversion.

5. The integrated acoustic-vibrational-thermal sensor of claim 1, wherein: The sensor data acquisition mainboard (10) is integrated with a MEMS microphone chip and a MEMS chip acceleration sensor chip, and the MEMS chip acceleration sensor chip is provided with a temperature measuring module.

6. The integrated acoustic-vibrational-thermal sensor of claim 1, wherein: The LoRa mainboard (13) is integrated with a LoRa communication module and supports adaptive spread spectrum communication technology.

7. The integrated acoustic-vibrational-thermal sensor of claim 1, wherein: The sensor base (5) is provided with a magnetic seat mounting hole (14) at the bottom center, and the magnetic seat mounting hole (14) is mounted to a measured equipment through magnetic adsorption of a permanent magnet.

8. The integrated acoustic-vibrational-thermal sensor of claim 1, wherein: The battery (9) adopts a high-capacity lithium battery and adopts an intelligent sleep mechanism: automatically enters a low-power mode during a non-working period, and realizes long-time work.

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