Protection circuit board and battery module

Abstract

The embodiment of the utility model provides a protection circuit board and a battery module. The protection circuit board comprises a circuit board main body and a fusing assembly connected with the circuit board main body, the fusing assembly comprises a fuse, a cover body and a carrier substrate, the cover body and the carrier substrate form an accommodating cavity, the fuse is arranged in the accommodating cavity, a through hole communicated with the accommodating cavity is formed in the carrier substrate, and the fuse is arranged in the through hole. Gaps among the through hole, the circuit board main body and the carrier substrate are communicated to form a communication channel; the plastic package colloid wraps the fusing assembly and the circuit board main body; and the isolation plugging structure is separated between the plastic package colloid and the communication channel. Therefore, under the action of the isolation plugging structure, the plastic package colloid with pressure flows in the mold cavity and cannot enter the through hole, the gap between the circuit board main body and the carrier substrate to form the communication channel, so that the fuse is prevented from being damaged by the plastic package colloid, the fuse is protected, and the fusing effect of the fuse is ensured.

Description

Technical Field

[0001] This utility model relates to the field of battery manufacturing technology, and in particular to a protective circuit board and battery module. Background Technology

[0002] As smart products continue to develop, their battery capacities are also increasing. With this increase in capacity comes increased weight, making the protective circuit board at the battery tip more susceptible to damage during drops.

[0003] Based on this, in related technologies, the service life of the protection circuit board at the battery end is improved by encapsulating it with plastic and installing a fuse.

[0004] However, when the protective circuit board is encapsulated, the encapsulating material can flow into the fuse through the through-holes on the periphery of the fuse, thus affecting the fuse's fusing effect. Utility Model Content

[0005] To solve or partially solve the above problems, this utility model discloses a protective circuit board and battery module to solve the problem in the prior art that the encapsulating adhesive will flow into the fuse through the through hole opened on the periphery of the fuse, thereby affecting the fuse's fusing effect.

[0006] To address the aforementioned problems, in a first aspect, embodiments of the present invention provide a protective circuit board, the protective circuit board comprising:

[0007] The circuit board body and the fuse assembly connected to the circuit board body, the fuse assembly includes a fuse, a cover and a carrier substrate, the cover and the carrier substrate form a receiving cavity, the fuse is disposed in the receiving cavity, the carrier substrate has a through hole communicating with the receiving cavity, and the through hole, the gap between the circuit board body and the carrier substrate communicate to form a communicating channel;

[0008] A molding compound that encapsulates the fuse assembly and the circuit board body;

[0009] An isolation and sealing structure, wherein the isolation and sealing structure separates the encapsulated material from the communicating channel.

[0010] Optionally, the isolation and sealing structure includes an isolation housing;

[0011] The isolation housing is disposed around the periphery of the fuse assembly and is connected to the first surface of the circuit board body. The isolation housing is located between the encapsulant and the communicating channel, wherein the first surface is the surface of the circuit board body facing the fuse assembly.

[0012] Optionally, electrical connection lines are provided on the surface of the circuit board body facing the carrier substrate, and solder pads are provided on the surface of the carrier substrate facing the circuit board body.

[0013] The pads and the electrical connection lines are electrically connected;

[0014] The surface of the isolation housing facing the main body of the circuit board is an open structure, and the open structure of the isolation housing is connected to the pads by solder paste.

[0015] Optionally, the isolation and sealing structure is disposed between the circuit board body and the carrier substrate, and the isolation and sealing structure covers the opening of the through hole facing the circuit board body.

[0016] Optionally, electrical connection lines are provided on the surface of the circuit board body facing the carrier substrate, and solder pads are provided on the surface of the carrier substrate facing the circuit board body.

[0017] The pads and the electrical connection lines are electrically connected;

[0018] A through groove is formed on the carrier substrate, the through groove penetrating the third surface and the fourth surface of the carrier substrate, wherein the third surface and the fourth surface are two opposite surfaces of the carrier substrate in a first direction (Z), the first direction (Z) being a direction perpendicular to the plane where the circuit board is located;

[0019] The wiring in the fuse assembly passes through the through slot and is connected to the pad;

[0020] The through hole is provided on at least one side of the through groove.

[0021] Optionally, the orthographic projection of the pad along the first direction (Z) and the orthographic projection of the via along the first direction (Z) overlap, and at least a portion of the pad covers the opening of the via facing the circuit board body, wherein the first direction (Z) is a direction perpendicular to the plane of the circuit board.

[0022] Optionally, the orthographic projection of the pad along the first direction (Z) and the orthographic projection of the via along the first direction (Z) do not overlap. The surface of the carrier substrate facing the circuit board body is further provided with a sealing pad, which covers the opening of the via facing the circuit board body. The first direction (Z) is a direction perpendicular to the plane of the circuit board body.

[0023] Optionally, the orthographic projection of the pad along the first direction (Z) and the orthographic projection of the via along the first direction (Z) do not overlap, and a sealing adhesive is further provided on the surface of the carrier substrate facing the circuit board body, the sealing adhesive being located between the encapsulating adhesive and the connecting channel.

[0024] Optionally, at least a portion of the sealing adhesive is attached to the first surface of the circuit board body, and at least another portion of the sealing adhesive is attached to the end of the carrier substrate in a second direction, wherein the second direction is parallel to the plane of the circuit board body.

[0025] Secondly, this utility model embodiment also provides a battery module, the battery module including the protection circuit board described in any embodiment of the first aspect of the battery cell;

[0026] The protection circuit is installed on the top of the battery cell.

[0027] In this embodiment of the invention, the fusible assembly includes a fuse, a cover, and a carrier substrate. The cover and the carrier substrate form a cavity, and the fuse is disposed in the cavity. A through hole communicating with the cavity is provided in the carrier substrate. The through hole, the gap between the circuit board body and the carrier substrate form a communication channel. The encapsulant covers the fusible assembly and the circuit board body. An isolation and sealing structure separates the encapsulant from the communication channel. Therefore, under the action of the isolation and sealing structure, the pressurized encapsulant flowing in the mold cavity cannot enter the through hole, the gap between the circuit board body and the carrier substrate to form the communication channel, thereby preventing the encapsulant from damaging the fuse and thus protecting the fuse and ensuring its fusing effect. Attached Figure Description

[0028] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0029] Figure 1 This is one of the structural schematic diagrams of a protective circuit board provided in this embodiment of the utility model;

[0030] Figure 2 This is a second schematic diagram of the structure of a protective circuit board provided in this embodiment of the present invention;

[0031] Figure 3 This is the third schematic diagram of a protective circuit board provided in this embodiment of the present invention;

[0032] Figure 4 This is the third schematic diagram of a protective circuit board provided in this embodiment of the present invention;

[0033] Figure 5 This is a schematic diagram of a circuit board structure provided in an embodiment of the present invention.

[0034] Explanation of reference numerals in the attached figures:

[0035] 1: Protective circuit board; 11: Circuit board body; 111: Electrical connection line; 12: Fuse assembly; 121: Fuse; 122: Cover; 123: Carrier substrate; 1231: Pad; 1232: Through slot; 1233: Sealing pad; 124: Through hole; 125: Connecting channel; 13: Isolation and sealing structure; 131: Isolation shell; 132: Sealing colloid; 14: Receptacle; 2: Plastic encapsulant; 3: Battery cell; 4: Top seal; 5: Hot melt adhesive; 6: Tab; 7: Nickel sheet. Detailed Implementation

[0036] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0037] It should be understood that the phrase "one embodiment" or "an embodiment" throughout the specification means that a specific feature, structure, or characteristic related to the embodiment is included in at least one embodiment of the present invention. Therefore, "in one embodiment" or "in an embodiment" appearing throughout the specification do not necessarily refer to the same embodiment. Furthermore, these specific features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

[0038] like Figures 1 to 4 As shown, this embodiment of the utility model provides a protective circuit board, which includes:

[0039] The circuit board body 11 and the fuse assembly 12 connected to the circuit board body 11 are included. The fuse assembly 12 includes a fuse 121, a cover 122 and a carrier substrate 123. The cover 122 and the carrier substrate 123 form a receiving cavity 14. The fuse 121 is disposed in the receiving cavity 14. A through hole 124 communicating with the receiving cavity 14 is opened in the carrier substrate 123. The gap between the through hole 124, the circuit board body 11 and the carrier substrate 123 forms a communicating channel 125.

[0040] The encapsulating agent 2 encapsulates the fuse assembly 12 and the circuit board body 11.

[0041] The isolation and sealing structure 13 separates the encapsulated colloid 2 and the connecting channel 125.

[0042] As can be seen from the above embodiments, in this embodiment of the utility model, since the fuse assembly 12 includes a fuse 121, a cover 122, and a carrier substrate 123, the cover 122 and the carrier substrate 123 form a receiving cavity 14, the fuse 121 is disposed in the receiving cavity 14, and a through hole 124 communicating with the receiving cavity 14 is opened in the carrier substrate 123. The gap between the through hole 124, the circuit board body 11, and the carrier substrate 123 forms a communicating channel 125, and the encapsulating agent 2 covers the fuse. The component 12 and the circuit board body 11 are separated by the isolation and sealing structure 13 between the encapsulant 2 and the connecting channel 125. Therefore, under the action of the isolation and sealing structure 13, the pressurized encapsulant 2 cannot flow into the gap between the through hole 124, the circuit board body 11 and the carrier substrate 123 to form the connecting channel 125, thereby preventing the encapsulant 2 from damaging the fuse 121 and thus protecting the fuse 121 and ensuring the fusing effect of the fuse 121.

[0043] In the above embodiments, the circuit board body 11 may include a printed circuit board and a flexible circuit board. The circuit board body 11 is mainly used to ensure that the battery operates within a safe range and protect the battery from damage, including but not limited to the following functions: limiting the minimum discharge voltage, controlling the maximum charging current, and monitoring the battery temperature during the charging process. In addition, the circuit board body 11 and the fuse assembly 12 can be stacked in the first direction Z, that is, the fuse assembly 12 can be disposed on the top of the circuit board body 11.

[0044] The fuse assembly 12 includes a cover 122, which is a shell structure with an inner cavity. The cover 122 and the carrier are connected to form a receiving cavity 14, which provides a certain receiving cavity 14 for the fuse 121. In some embodiments, the cover 122 can be a cylindrical shell structure, a square shell structure, or a shell structure of other shapes. For example, the cover 122 is a shell structure with an open bottom. The bottom of the cover 122 is fastened to the carrier substrate 123, so that a sealed space is formed between the cover 122 and the carrier substrate 123, thereby forming the receiving cavity 14.

[0045] Since the gas pressure inside the accommodating cavity 14 and other external pressures need to be consistent during the fabrication and testing of the fuse 121, in this embodiment, a through hole 124 can be provided on the cover 122, on the carrier substrate 123, or on both the cover 122 and the carrier substrate 123. This embodiment does not limit the specific type of through hole 124. When the through hole 124 is provided on the carrier substrate 123, it can extend along the first and second surfaces of the carrier substrate 123 in the first direction Z. That is, the through hole 124 can penetrate both surfaces of the carrier substrate 123 in the first direction Z, allowing external gas to pass through the carrier substrate 123 and reach the interior of the accommodating cavity 14. When the through hole 124 is provided on the cover 122, it allows the cover 122 to communicate with the accommodating cavity 14, allowing external gas to pass through the cover 122 and reach the interior of the accommodating cavity 14.

[0046] The encapsulating colloid 2 simultaneously encapsulates the fuse component 12 and the circuit board body 11, thereby protecting the fuse component 12 and the circuit board body 11 from external environmental influences, improving the safety of the protective circuit board and ensuring the internal and external pressure balance of the protective circuit board.

[0047] The isolation and sealing structure 13 can be a sealing structure located at the opening of the through hole 124, or it can be a shell structure covering the periphery of the fuse assembly 12. This utility model does not limit this. That is, as long as the isolation and sealing structure is located in the gap between the through hole 124, the circuit board body 11 and the carrier substrate 123 to form a connecting channel 125, the encapsulating agent 2 can be prevented from entering the interior of the fuse assembly 12 through the connecting channel 125.

[0048] Regarding the location and type of the isolation and sealing structure 13, such as Figure 4 As shown, in one possible implementation, the isolation sealing structure 13 includes an isolation housing 131, which covers the periphery of the fuse assembly 12 and is connected to the first surface of the circuit board body 11. The isolation housing 131 is located between the encapsulant 2 and the communication channel 125, wherein the first surface is the surface of the circuit board body 11 facing the fuse assembly 12.

[0049] In this embodiment, the isolation housing 131 can be a housing structure with an isolation shielding cavity, thereby accommodating the fuse assembly 12 within the isolation shielding cavity of the isolation housing 131. This prevents pressurized encapsulating material 2 from flowing within the mold cavity and entering the through hole 124, the circuit board body 11, and the carrier substrate 123 to form the connecting channel 125. It should be noted that the isolation housing 131 can be a cylindrical housing structure, a square housing structure, or a housing structure of other shapes; this embodiment of the invention does not limit this. For example, when the isolation housing 131 is a square housing structure, the distance between the side wall of the isolation housing 131 and the fuse assembly 12 is greater than or equal to 0.15 mm, and the distance between the top wall of the isolation housing 131 and the fuse assembly 12 is greater than or equal to 0.1 mm, thereby preventing the installation of the fuse assembly 12 from being affected by the arrangement of the isolation housing 131.

[0050] Furthermore, in some embodiments, the surface of the circuit board body 11 facing the carrier substrate 123 is provided with electrical connection lines 111, and the surface of the carrier substrate 123 facing the circuit board body 11 is provided with pads 1231; the pads 1231 and the electrical connection lines 111 are electrically connected; the surface of the isolation housing 131 facing the circuit board body 11 is an open structure, and the open structure of the isolation housing 131 is connected to the pads 1231 by solder paste.

[0051] In this embodiment, since the surface of the isolation housing 131 facing the circuit board body 11 is an open structure, and the open structure of the isolation housing 131 is connected by solder paste and pads 1231, the isolation housing 131 can be connected by pads 1231, so that the isolation housing 131 and the circuit board body 11 are an integral structure, thereby ensuring the isolation effect of the isolation housing 131.

[0052] In another possible implementation, a through hole 124 is provided on the cover 122, between the circuit board body 11 and the carrier substrate 123, and an isolation sealing structure 13 covers the opening of the through hole 124 facing the circuit board body 11.

[0053] In this embodiment, the through hole 124 is provided on the cover 122. It can be understood that the through hole 124 is provided through the outer wall and the inner wall of the cover 122. Therefore, the isolation and sealing structure 13 can cover the opening of the through hole 124 facing the encapsulant 2. That is, the isolation and sealing structure 13 covers the position of the through hole 124 on the outer wall of the cover 122. In this way, when the encapsulant 2 is encapsulated, under the action of the isolation and sealing structure 13, the pressurized encapsulant 2 cannot flow into the accommodating cavity 14 formed by the cover 122 and the carrier substrate 123, thereby preventing the encapsulant 2 from damaging the fuse 121 and thus protecting the fuse 121.

[0054] In some embodiments, an electrical connection line 111 is provided on the surface of the circuit board body 11 facing the carrier substrate 123, and a pad 1231 is provided on the surface of the carrier substrate 123 facing the circuit board body 11; the pad 1231 and the electrical connection line 111 are electrically connected.

[0055] In this embodiment, since the circuit board body 11 has an electrical connection line 111 on its surface facing the carrier substrate 123, and the carrier substrate 123 has a pad 1231 on its surface facing the circuit board body 11, and the pad 1231 and the electrical connection line 111 are electrically connected, the electrical connection between the circuit board body 11 and the carrier substrate 123 can be indirectly achieved through the electrical connection between the pad 1231 and the electrical connection line 111.

[0056] In some embodiments, a through groove 1232 is formed on the carrier substrate 123, the through groove 1232 penetrates the third surface and the fourth surface of the carrier substrate 123, wherein the third surface and the fourth surface are two opposite surfaces of the carrier substrate 123 in a first direction Z, the first direction Z being a direction perpendicular to the plane of the circuit board; the wiring in the fuse assembly 12 passes through the through groove 1232 and is connected to the pad 1231; the through hole 124 is provided on at least one side of the through groove 1232.

[0057] In this embodiment, since the through slot 1232 penetrates the third and fourth surfaces of the carrier substrate 123, the wiring in the fuse assembly 12 passes through the through slot 1232 and connects to the pad 1231. Therefore, the fuse assembly 12 can be connected to the pad 1231 through the through slot 1232, and then the electrical connection between the pad 1231 and the electrical connection line 111 is realized through the electrical connection between the circuit board body 11 and the fuse 121. Since the through hole 124 is provided on at least one side of the through slot 1232, the provision of the through hole 124 will not affect the electrical connection between the circuit board body 11 and the fuse 121, and will not cause interference between the through hole 124 and the through slot 1232.

[0058] In some embodiments, the orthographic projection of the pad 1231 along the first direction Z and the orthographic projection of the via 124 along the first direction Z overlap, and at least a portion of the pad 1231 covers the opening of the via 124 facing the circuit board body 11, wherein the first direction Z is a direction perpendicular to the plane of the circuit board.

[0059] In this embodiment, since the orthographic projection of the pad 1231 along the first direction and the orthographic projection of the via 124 along the first direction Z overlap, at least a portion of the pad 1231 covers the opening of the via 124 facing the circuit board body 11. Therefore, the pad 1231 can fill the gap between the circuit board body 11 and the carrier substrate 123, and at the same time, the pad 1231 can block the via 124. In this way, while the circuit board body 11 and the carrier substrate 123 are electrically connected, the via 124 can be blocked, preventing the encapsulant 2 from entering the accommodating cavity 14. This saves on the manufacturing process of the circuit board body 11, simplifies the manufacturing process, and helps to improve the production efficiency of the protective circuit board.

[0060] In some embodiments, the orthographic projection of the pad 1231 along the first direction Z and the orthographic projection of the via 124 along the first direction Z do not overlap. A sealing pad 1233 is also provided on the surface of the carrier substrate 123 facing the circuit board body 11. The sealing pad 1233 covers the opening of the via 124 facing the circuit board body 11. The first direction Z is a direction perpendicular to the plane where the circuit board body 11 is located.

[0061] In this embodiment, since the orthographic projection of the pad 1231 along the first direction Z and the orthographic projection of the via 124 along the first direction Z do not overlap, a sealing pad 1233 is also provided on the surface of the carrier substrate 123 facing the circuit board body 11. The sealing pad 1233 covers the opening of the via 124 facing the circuit board body 11, creating an isolation and sealing structure. Therefore, the bottom sealing pad 1233 can fill the gap between the circuit board body 11 and the carrier substrate 123, while also sealing the via 124. It should be noted that since the sealing pad 1233 can be formed simultaneously during the electrical connection of the circuit board body 11 and the carrier substrate 123 to form the pad 1231, no additional process is required to form the sealing pad 1233, thereby saving the manufacturing cost of the protection circuit board. In addition, the sealing pad 1233 is an independent pad structure without electricity. The size of the sealing pad 1233 is determined according to the size of the through hole 124. The distance between the edge of the sealing pad and the axis of the through hole 124 should be greater than or equal to 0.1 mm, so as to ensure the sealing effect of the sealing pad 1233 on the through hole 124.

[0062] In some embodiments, the orthographic projection of the pad 1231 along the first direction Z and the orthographic projection of the via 124 along the first direction Z do not overlap, and a sealing adhesive 132 is also provided on the surface of the carrier substrate 123 facing the circuit board body 11, the sealing adhesive 132 being located between the encapsulating adhesive and the connecting channel 125.

[0063] In this embodiment, the sealing adhesive 132 can be disposed at any location between the carrier substrate 123 and the circuit board body 1. The sealing adhesive 132 is located between the through hole 124 and the encapsulating adhesive 2, that is, the space between the sealing adhesive 132 and the through hole is blocked by the sealing adhesive 132. In this way, the sealing adhesive 132 can isolate the space between the encapsulating adhesive 2 and the connecting channel 125. Under the action of the sealing adhesive 132, the pressurized encapsulating adhesive 2 flowing in the mold cavity cannot enter the gap between the through hole 124, the circuit board body 11 and the carrier substrate 123 to form the connecting channel 125, thereby preventing the encapsulating adhesive 2 from damaging the fuse 121.

[0064] Furthermore, in some embodiments, at least a portion of the sealing adhesive 132 is attached to the first surface of the circuit board body 11, and at least another portion of the sealing adhesive 132 is attached to the end of the carrier substrate 123 in a second direction, wherein the second direction is a direction parallel to the plane of the circuit board body 11.

[0065] In this embodiment, since at least a portion of the sealing adhesive 132 is attached to the first surface of the circuit board body 11, and at least another portion of the sealing adhesive 132 is attached to the end of the carrier substrate 123 in the second direction, wherein the second direction is parallel to the plane of the circuit board body 11, and the orifice of the through hole 124 is located in the gap between the carrier substrate and the circuit board body 11, it can be ensured that the sealing adhesive 132 can completely seal the gap between the circuit board body 11 and the carrier substrate 123, thereby ensuring the sealing effect of the sealing adhesive 132.

[0066] As can be seen from the above embodiments, in this embodiment of the utility model, since the fuse assembly 12 includes a fuse 121, a cover 122, and a carrier substrate 123, the cover 122 and the carrier substrate 123 form a receiving cavity 14, the fuse 121 is disposed in the receiving cavity 14, and a through hole 124 communicating with the receiving cavity 14 is opened in the carrier substrate 123. The gap between the through hole 124, the circuit board body 11, and the carrier substrate 123 forms a communicating channel 125, and the encapsulating agent 2 covers the fuse. The component 12 and the circuit board body 11 are separated by the isolation and sealing structure 13 between the encapsulant 2 and the connecting channel 125. Therefore, under the action of the isolation and sealing structure 13, the pressurized encapsulant 2 cannot flow into the gap between the through hole 124, the circuit board body 11 and the carrier substrate 123 to form the connecting channel 125, thereby preventing the encapsulant 2 from damaging the fuse 121 and thus protecting the fuse 121 and ensuring the fusing effect of the fuse 121.

[0067] In addition, such as Figure 5 As shown, this utility model embodiment also provides a battery module, which includes a battery cell 3 and a protection circuit board 1 of any of the above embodiments; the protection circuit board 1 is disposed on the top of the battery cell 3.

[0068] In this embodiment, since the battery module includes a battery cell and a protection circuit board 1 as described in any of the above embodiments, and the protection circuit board 1 is disposed on the top of the battery cell 3, the protection strength of the fuse 121 included in the protection circuit board 1 assembly is improved, making the circuit protection function of the battery module through the fuse 121 more complete, and further ensuring the safety of battery use. Furthermore, hot melt adhesive 5, top seal 4, tab 6, nickel sheet 7, circuit board, and fuse assembly 12 are sequentially disposed on the top of the battery cell 3, and the encapsulating adhesive simultaneously encapsulates the hot melt adhesive 5, top seal 4, tab 6, nickel sheet 7, circuit board, and fuse assembly 12. In the above embodiments, the battery cell 3 can be a single cell or a dual-cell battery cell, and the battery cell 3 can be a cylindrical structure, a cuboid structure, or other shapes; this embodiment of the present invention does not limit these. The battery cell 3 has a top surface, on which the top seal 4 can be connected. Tabs 11 are connected to the top seal 4. The protection circuit board 1 contacts the top surface, and the tabs 11 are electrically connected to the protection board 2.

[0069] The various embodiments in the specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0070] Although preferred embodiments of the present invention have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments as well as all changes and modifications falling within the scope of the present invention.

[0071] Finally, it should be noted that in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or terminal device that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or terminal device. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or terminal device that includes said element.

[0072] The present invention has been described in detail above. Specific examples have been used to illustrate the principle and implementation of the present invention. The description of the above embodiments is only for the purpose of helping to understand the method and core idea of ​​the present invention. At the same time, for those skilled in the art, there will be changes in the specific implementation and application scope based on the idea of ​​the present invention. Therefore, the content of this specification should not be construed as a limitation of the present invention.

Claims

1. A protection circuit board, characterized by, The protection circuit board comprises: a circuit board body and a fuse assembly connected with the circuit board body, the fuse assembly comprising a fuse, a cover body and a carrier substrate, the cover body and the carrier substrate forming a containing cavity, the fuse being arranged in the containing cavity, a through hole being formed in the carrier substrate and being in communication with the containing cavity, a gap between the through hole, the circuit board body and the carrier substrate being in communication to form a communication channel; a plastic encapsulation glue body, the plastic encapsulation glue body encapsulating the fuse assembly and the circuit board body; an isolation plugging structure, the isolation plugging structure being isolated between the plastic encapsulation glue body and the communication channel.

2. The protection circuit board according to claim 1, characterized by The isolation plugging structure comprises an isolation shell; the isolation shell being arranged on the side of the fuse assembly and being connected with a first surface of the circuit board body, the isolation shell being located between the plastic encapsulation glue body and the communication channel, wherein the first surface is a surface of the circuit board body facing the fuse assembly.

3. The protection circuit board according to claim 2, characterized in that, an electric connection line being arranged on a surface of the circuit board body facing the carrier substrate, a solder pad being arranged on a surface of the carrier substrate facing the circuit board body; the solder pad and the electric connection line being electrically connected; a surface of the isolation shell facing the circuit board body being an open structure, the open structure of the isolation shell being connected with the solder pad through tin paste.

4. The protection circuit board according to claim 1, characterized by The isolation plugging structure is arranged between the circuit board body and the carrier substrate, the isolation plugging structure covering an orifice of the through hole facing the circuit board body.

5. The protection circuit board according to claim 4, characterized in that, an electric connection line being arranged on a surface of the circuit board body facing the carrier substrate, a solder pad being arranged on a surface of the carrier substrate facing the circuit board body; the solder pad and the electric connection line being electrically connected; a through slot being formed in the carrier substrate, the through slot penetrating a third surface and a fourth surface of the carrier substrate, wherein the third surface and the fourth surface are two opposite surfaces of the carrier substrate in a first direction (Z), the first direction (Z) being a direction perpendicular to a plane in which the circuit board is located; a wire in the fuse assembly penetrating the through slot and being connected with the solder pad; the through hole being arranged on at least one side of the through slot.

6. The protection circuit board according to claim 5, characterized in that, a projection of the solder pad along the first direction (Z) and a projection of the through hole along the first direction (Z) being overlapped, at least a partial region of the solder pad covering the orifice of the through hole facing the circuit board body, wherein the first direction (Z) is a direction perpendicular to a plane in which the circuit board is located.

7. The protection circuit board according to claim 5, characterized by a projection of the solder pad along the first direction (Z) and a projection of the through hole along the first direction (Z) being not overlapped, a plugging solder pad being further arranged on a surface of the carrier substrate facing the circuit board body, the plugging solder pad covering the orifice of the through hole facing the circuit board body, wherein the first direction (Z) is a direction perpendicular to a plane in which the circuit board body is located.

8. The protection circuit board according to claim 5, characterized by a projection of the solder pad along the first direction (Z) and a projection of the through hole along the first direction (Z) being not overlapped, a plugging glue body being further arranged on a surface of the carrier substrate facing the circuit board body, the plugging glue body being located between the plastic encapsulation glue body and the communication channel.

9. The protection circuit board according to claim 8, characterized in that, At least one part of the sealing glue body is attached to the first surface of the circuit board body, and at least another part of the sealing glue body is attached to the end of the carrier substrate in a second direction, wherein the second direction is parallel to the plane in which the circuit board body is located. 10.A battery module, comprising a battery cell and the protection circuit board according to any one of claims 1 to 9. The protection circuit board is arranged on the top of the battery cell.

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