Wafer gluing suction cup capable of positioning

Abstract

A positioning wafer gluing sucker comprises a sucker body and a wafer, and the sucker body is connected with a positioning device. The positioning device comprises more than three mounting rod bodies; the more than three mounting rod bodies are rotationally distributed by taking the axis of the sucking disc as the axis; the inner end of the mounting rod body is connected with the sucker, and a positioning rod is mounted at the outer end of the mounting rod body; and the wafer is limited among the positioning rods of the more than three mounting rod bodies. According to the gluing suction cup capable of positioning the wafer, the positioning rod on the mounting rod body is used for limiting, so that the wafer is positioned; and on the aspect of wafer adsorption, an existing vacuum hole structure is improved, so that the vacuum suction force is more uniform, and the adsorption effect is better.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor technology, specifically to a positioning wafer coating suction cup. Background Technology

[0002] In the semiconductor front-end photoresist coating process, manual coating equipment is commonly used. It uses a chuck to hold the wafer and rotates it at high speed to achieve coating. The chuck usually only has a few vacuum holes on its surface, which is not good. It also lacks a positioning device and relies on the naked eye and feeling to align the center. This leads to the phenomenon of misalignment when manually placing the wafer. When the chuck rotates at high speed, it is easy to cause wafer flying, large vibration, and loud noise. In addition, the coating uniformity is poor. Utility Model Content

[0003] The purpose of this invention is to solve the technical problem of providing a coating suction cup for positioning wafers.

[0004] To solve the above-mentioned technical problems, the technical solution of this utility model for a positioning wafer coating chuck is as follows:

[0005] The device includes a suction cup and a wafer, with a positioning device connected to the suction cup; the positioning device includes three or more mounting rods; the three or more mounting rods are rotatably distributed around the axis of the suction cup; the inner end of each mounting rod is connected to the suction cup, and a positioning rod is mounted on the outer end of the mounting rod; the wafer is positioned between the positioning rods of the three or more mounting rods.

[0006] The suction cup has multiple coaxial and interconnected annular grooves on its adsorption surface; the suction cup has multiple evenly arranged suction holes in the innermost annular groove.

[0007] The suction cup has eleven coaxial and interconnected annular grooves on its adsorption surface; the eleven annular grooves are evenly distributed on the adsorption surface of the suction cup.

[0008] The mounting rod has a first positioning hole for positioning an 8-inch wafer and a second positioning hole for positioning a 6-inch wafer; the mounting rod also has a connecting groove for connecting the first positioning hole and the second positioning hole; the lower end of the positioning rod is connected to a mounting slide; the mounting slide is slidably connected in the connecting groove, and the mounting slide can slide along the connecting groove into the first positioning hole or the second positioning hole; when the mounting slide slides into the first positioning hole or the second positioning hole, the mounting slide is rotatably connected in the first positioning hole or the second positioning hole and fixed by connecting bolts.

[0009] The mounting rod is connected to the suction cup by bolts.

[0010] The positioning device includes four mounting rods.

[0011] The technical effects achievable by this utility model are as follows: The wafer of this positioning wafer coating suction cup is positioned by positioning rods on four mounting rods. The positioning rods can be installed on the first positioning hole for positioning 8-inch wafers or on the second positioning hole for positioning 6-inch wafers, allowing users to install them according to their needs. In terms of wafer adsorption, the existing vacuum hole structure has been improved by designing eleven coaxial and interconnected annular grooves, which are evenly distributed on the adsorption surface of the suction cup, making the vacuum suction force more uniform and the adsorption effect better. Attached Figure Description

[0012] The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments:

[0013] Figure 1 This is a schematic diagram of the structure of a positioning wafer coating chuck of this utility model (the positioning rod is installed on the first positioning hole);

[0014] Figure 2 yes Figure 1 Enlarged view of part A;

[0015] Figure 3 This is a schematic diagram of the structure of a positioning wafer coating suction cup of this utility model (the positioning rod is installed on the second positioning hole);

[0016] Figure 4 yes Figure 3 Enlarged view of part B;

[0017] Figure 5 This is an exploded view of a positioning wafer coating suction cup according to the present invention;

[0018] Figure 6 yes Figure 5 Enlarged view of part C;

[0019] Figure 7 This is a schematic diagram showing the connection of the mounting slide being installed on the first positioning hole;

[0020] Figure 8 This is a schematic diagram showing the sliding connection of the mounting bracket within the connecting groove;

[0021] Figure 9 This is a schematic diagram of the mounting slide being installed on the second positioning hole. Detailed Implementation

[0022] The present invention will now be described in further detail with reference to the accompanying drawings.

[0023] See Figures 1 to 9 .

[0024] A wafer-positioning chuck includes a chuck 1 and a wafer. A positioning device is connected to the chuck 1. The positioning device includes three or more mounting rods 2. Preferably, the positioning device of this invention includes four mounting rods. The four mounting rods 2 are evenly distributed and rotate around the axis of the chuck 1. The inner end of the mounting rod 2 is connected to the chuck 1. Specifically, the mounting rod 2 is connected to the chuck 1 by bolts. A positioning rod 3 is installed on the outer end of the mounting rod 2. The wafer is positioned by being confined between the positioning rods 3 of the four mounting rods 2.

[0025] Regarding the adsorption of the suction cup 1, the suction cup 1 of this utility model has multiple coaxial and interconnected annular grooves 11 on its adsorption surface. Specifically, the suction cup 1 has eleven coaxial and interconnected annular grooves 11 on its adsorption surface, and the eleven annular grooves 11 are evenly distributed on the adsorption surface of the suction cup 1. The innermost annular groove 11 of the suction cup 1 has multiple evenly arranged suction holes 12. Specifically, the innermost annular groove 11 of the suction cup 1 has four evenly arranged suction holes 12.

[0026] This utility model incorporates a detachable positioning device based on the original design, which is assembled to the suction cup 1 around its perimeter using bolts (e.g., ...). Figure 1 , Figure 3 The improved design keeps the wafer centered during placement, eliminating eccentricity when the chuck 1 holds the wafer and rotates at high speed. Furthermore, the vacuum aperture structure has been improved, designed as a uniformly distributed annular groove 11 structure across the entire surface (e.g., Figure 1 , 3 4) This results in greater vacuum suction and more uniform vacuum distribution. The above improvements effectively solve problems such as wafer flying, vibration noise, and poor uniformity of the coating film during the photoresist coating process.

[0027] In the connection of the positioning rod 3, the mounting rod body 2 is provided with a first positioning hole 21 for positioning an 8-inch wafer and a second positioning hole 22 for positioning a 6-inch wafer. The mounting rod body 2 is also provided with a connecting groove 23 for connecting the first positioning hole 21 and the second positioning hole 22. The lower end of the positioning rod 3 is connected to a mounting slide 24, which is slidably connected in the connecting groove 23. The mounting slide 24 can slide along the connecting groove 23 into the first positioning hole 21 or the second positioning hole 22. When the mounting slide 24 slides into the first positioning hole 21 or the second positioning hole 22, the mounting slide 24 is rotatably connected in the first positioning hole 21 or the second positioning hole 22 and is fixed by the connecting bolt 25.

[0028] This utility model utilizes the aforementioned connection structure of the positioning rod 3 (see reference). Figure 6 , 7(8) The positioning rods 3 can be installed in either the first positioning hole 21 or the second positioning hole 22; when the four positioning rods 3 are respectively installed in the first positioning holes 21 on the four mounting rod bodies 2, the four positioning rods 3 are used to position the 8-inch wafer (see reference). Figure 1 When the four positioning rods 3 are respectively installed in the second positioning holes 22 on the four mounting rod bodies 2, the four positioning rods 3 are used to position the 6-inch wafer (reference). Figure 3 ).

Claims

1. A positionable wafer coating chuck comprising a chuck (1) and a wafer, characterized in that: The positioning device is connected to the suction disc (1); the positioning device comprises three or more mounting rods (2); the three or more mounting rods (2) are distributed in rotation around the axis of the suction disc (1); the inner end of the mounting rod (2) is connected to the suction disc (1), and the outer end of the mounting rod (2) is provided with a positioning rod (3); the wafer is positioned between the positioning rods (3) of the three or more mounting rods (2).

2. The positionable wafer spin coater chuck of claim 1, wherein: The suction disc (1) is provided with a plurality of coaxial and communicating annular grooves (11) on the suction surface; the suction disc (1) is provided with a plurality of uniformly arranged suction holes (12) in the innermost annular groove (11).

3. The positionable wafer spin coater chuck of claim 1, wherein: The suction disc (1) is provided with eleven coaxial and communicating annular grooves (11) on the suction surface; the eleven annular grooves (11) are uniformly distributed on the suction surface of the suction disc (1).

4. The positionable wafer spin coater chuck of claim 1, wherein: The mounting rod (2) is provided with a first positioning hole (21) for positioning an 8-inch wafer and a second positioning hole (22) for positioning a 6-inch wafer; the mounting rod (2) is further provided with a connecting sliding groove (23) for connecting the first positioning hole (21) and the second positioning hole (22); the lower end of the positioning rod (3) is connected to a mounting sliding seat (24); the mounting sliding seat (24) is slidingly connected in the connecting sliding groove (23), and the mounting sliding seat (24) can slide along the connecting sliding groove (23) to the first positioning hole (21) or the second positioning hole (22); when the mounting sliding seat (24) slides into the first positioning hole (21) or the second positioning hole (22), the mounting sliding seat (24) is rotationally connected in the first positioning hole (21) or the second positioning hole (22) and is fixed by a connecting bolt (25).

5. The positionable wafer spin coater chuck of claim 1, wherein: The mounting rod (2) is connected to the suction disc (1) by a bolt.

6. The positionable wafer spin coater chuck of claim 1, wherein: The positioning device comprises four mounting rods.

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