Integrated cold and hot coil pipe for semiconductor temperature control equipment

Abstract

The utility model relates to the technical field of semiconductor temperature control equipment, and provides an integrated cold and hot coil pipe for semiconductor temperature control equipment, which comprises a shell. The binding posts are symmetrically and fixedly connected to one side of the shell; the moisture-proof assembly is assembled on the other side of the shell and can be used for drying and dehumidifying the interior of the shell; the semiconductor coil pipe is fixedly connected to the inner bottom wall of the shell; the top cover is movably connected to the top end of the shell; the mounting assembly is assembled on one side of the top cover and one side of the shell, and the mounting assembly is used for achieving rapid disassembly and assembly between the top cover and the shell. Through the arrangement of the installation assembly, the clamping groove and the clamping block, rapid clamping installation between the top cover and the shell is achieved, the tedious and inconvenient disassembly and maintenance of each time caused by traditional bolt fixation is avoided, then workers can conveniently and rapidly maintain or replace the semiconductor coil pipe, and the practicability of the semiconductor coil pipe is improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor temperature control equipment technology, specifically to an integrated hot and cold coil for semiconductor temperature control equipment. Background Technology

[0002] Semiconductor temperature control equipment is a device that uses the properties of semiconductor materials to achieve temperature control. It is mainly based on the thermoelectric effect of semiconductor materials. By controlling the magnitude and direction of the current, the degree of heat absorption and release is adjusted, thereby achieving temperature control. The integrated hot and cold coil is the core component of semiconductor temperature control equipment, and its quality largely determines the product quality of semiconductor temperature control equipment.

[0003] Existing integrated hot and cold coils are usually disc-shaped, with a semiconductor coil inside. The semiconductor coil works through external terminals. However, the top cover is usually locked to the housing with multiple bolts. This means that maintenance of the internal semiconductor coil requires special tools, and the overall disassembly and assembly process is relatively complicated, which is not conducive to quick disassembly and maintenance.

[0004] In view of this, the present invention proposes an integrated hot and cold coil for semiconductor temperature control equipment. Utility Model Content

[0005] This invention proposes an integrated hot and cold coil for semiconductor temperature control equipment, which solves the problem of difficulty in rapid disassembly and maintenance.

[0006] The technical solution of this utility model is as follows: An integrated hot and cold coil for a semiconductor temperature control device includes a housing; terminals symmetrically fixedly connected to one side of the housing; a moisture-proof component assembled on the other side of the housing, the moisture-proof component being used to dry and dehumidify the inside of the housing; a semiconductor coil fixedly connected to the bottom wall of the housing; a top cover movably connected to the top of the housing; and a mounting component assembled on the top cover and one side of the housing, the mounting component being used to achieve quick assembly and disassembly between the top cover and the housing.

[0007] The mounting assembly includes: a mounting groove formed on the upper end of one side of the housing; a slider movably connected inside the mounting groove; a sliding rod fixedly connected to one side of the slider, one end of the sliding rod extending to the outside of the mounting groove and fixedly connected to a mounting rod; a mounting spring wound around the surface of the sliding rod, the two ends of the mounting spring being fixedly connected to the inner wall of the mounting groove and one end of the slider, respectively; and a mounting hole formed on one side of the top cover.

[0008] Preferably, one end of the mounting rod and the interior of the mounting hole form an engaging structure, and the shape of the mounting rod is an inverted L-shape.

[0009] Preferably, the slider and the interior of the mounting groove form a sliding structure, and the mounting groove and the slider are cross-shaped.

[0010] Preferably, the bottom end of the top cover is fixedly connected with a locking block at an equal angle, and the top end of the housing is provided with a locking groove at an equal angle to engage with the locking block.

[0011] Preferably, the bottom end of the top cover has grooves at both ends, and the grooves are symmetrically distributed about the vertical central axis of the top cover.

[0012] Preferably, the moisture-proof component includes a moisture-proof cover; a moisture-proof cover fixedly connected to one side of the housing, the interior of the moisture-proof cover communicating with the interior of the housing; a silica gel drying block movably connected to the interior of the moisture-proof cover; and a sealing cover movably connected to one side of the moisture-proof cover.

[0013] Preferably, one side of the sealing cover surface is provided with an external thread, and the inner wall of the moisture-proof cover is provided with an internal thread that is threadedly engaged with the external thread.

[0014] Preferably, anti-slip textures are formed at equal angles on one side of the sealing cover surface, and the anti-slip textures are arc-shaped.

[0015] The beneficial effects of this utility model are as follows:

[0016] In this utility model, the engagement of the card block and the inside of the card slot is used to achieve the initial engagement and installation between the top cover and the shell. Then, the elastic force of the installation spring is used to make the sliding rod slide and drive the installation rod to slide into the installation hole, ensuring a firm engagement and installation between the top cover and the shell. This allows for quick disassembly and assembly of the top cover and the shell, reducing the cumbersome and inconvenient disassembly and assembly of the top cover caused by the traditional bolt fixing. This also makes it easier for staff to maintain or replace the semiconductor coil after the top cover is disassembled, thus improving its practicality.

[0017] In this invention, the air inside the housing and the moisture-proof cover are interconnected, allowing the silica gel desiccant to absorb moisture from the housing, further improving its dryness and preventing moisture buildup that could affect the normal operation of the semiconductor coil. This avoids unnecessary maintenance costs and improves practicality. Furthermore, the use of external and internal threads allows for easy assembly and disassembly of the sealing cap and moisture-proof cover, facilitating the removal and replacement of the saturated silica gel desiccant after the sealing cap is rotated open, ensuring effective dehumidification. Attached Figure Description

[0018] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments.

[0019] Figure 1 This is a frontal cross-sectional view of the present invention.

[0020] Figure 2 This is a bottom view of the structure of this utility model;

[0021] Figure 3 This is a partial cross-sectional exploded structural diagram of the present invention;

[0022] Figure 4 This is an exploded magnified structural diagram of the moisture-proof component of this utility model;

[0023] Figure 5 This is an exploded enlarged cross-sectional view of the mounting component of this utility model.

[0024] In the diagram: 1. Top cover; 2. Groove; 3. Housing; 4. Moisture-proof component; 401. Sealing cap; 402. Moisture-proof cover; 403. Internal thread; 404. Anti-slip texture; 405. External thread; 406. Silica gel drying block; 5. Mounting component; 501. Mounting hole; 502. Mounting rod; 503. Sliding rod; 504. Mounting spring; 505. Mounting groove; 506. Slider; 6. Terminal; 7. Semiconductor coil; 8. Slot; 9. Locking block. Detailed Implementation

[0025] The technical solutions of this utility model will be clearly and completely described below with reference to the embodiments of this utility model. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this utility model. Example 1

[0026] A preferred embodiment of the integrated hot and cold coil for semiconductor temperature control equipment provided by this utility model is, for example... Figures 1 to 5 As shown: An integrated hot and cold coil for a semiconductor temperature control device includes a housing 3; terminals 6 symmetrically fixedly connected to one side of the housing 3; a moisture-proof component 4 assembled on the other side of the housing 3, which can be used to dry and dehumidify the inside of the housing 3; a semiconductor coil 7 fixedly connected to the bottom wall of the inner wall of the housing 3; a top cover 1 movably connected to the top of the housing 3; and a mounting component 5 assembled on the top cover 1 and one side of the housing 3, which is used to realize quick assembly and disassembly between the top cover 1 and the housing 3.

[0027] The mounting assembly 5 includes: a mounting groove 505 formed on the upper end of one side inside the housing 3; a slider 506 movably connected inside the mounting groove 505; a sliding rod 503 fixedly connected to one side of the slider 506, one end of the sliding rod 503 extending to the outside of the mounting groove 505 and fixedly connected to a mounting rod 502; a mounting spring 504 wound around the surface of the sliding rod 503, the two ends of the mounting spring 504 being fixedly connected to the inner wall of the mounting groove 505 and one end of the slider 506 respectively; and a mounting hole 501 formed on one side of the top cover 1.

[0028] It should be noted that the existing integrated hot and cold coils for semiconductor temperature control equipment still have certain shortcomings in actual use. The top cover 1 is usually locked to the housing 3 by multiple bolts, which means that when maintaining the internal semiconductor coil 7, corresponding tools are required, and the overall disassembly and assembly process is relatively complicated, which is not conducive to quick disassembly and maintenance.

[0029] In this embodiment, by pulling the mounting rod 502 until it is disengaged from the mounting hole 501, the top cover 1 can be removed from the top of the housing 3, which facilitates the disassembly, maintenance or replacement of the semiconductor coil 7. During installation, the top cover 1 is placed on the top of the housing 3, and the elastic force of the mounting spring 504 is used to make the sliding rod 503 slide and drive the mounting rod 502 to slide, so that one end of it is locked into the mounting hole 501, thereby achieving a firm locking installation between the top cover 1 and the housing 3.

[0030] In a further preferred embodiment of the present invention, one end of the mounting rod 502 and the interior of the mounting hole 501 form a locking structure, and the shape of the mounting rod 502 is an inverted L-shape.

[0031] In this embodiment, the top cover 1 and the housing 3 are securely engaged by the engagement of one end of the inverted L-shaped mounting rod 502 with the inside of the mounting hole 501.

[0032] In a further preferred embodiment of the present invention, a sliding structure is formed between the slider 506 and the interior of the mounting groove 505, and the shapes of the mounting groove 505 and the slider 506 are cross-shaped.

[0033] In this embodiment, the sliding smoothness of the sliding rod 503 is improved by utilizing the sliding of the cross-shaped slider 506 and the inside of the mounting groove 505.

[0034] In a further preferred embodiment of the present invention, a locking block 9 is fixedly connected to the bottom end of the top cover 1 at an equal angle, and a locking groove 8 that engages with the locking block 9 is opened at the top end of the housing 3 at an equal angle.

[0035] In this embodiment, the initial and accurate engagement between the top cover 1 and the housing 3 is achieved by utilizing the engagement between the card block 9 and the card slot 8.

[0036] In a further preferred embodiment of the present invention, grooves 2 are provided at both ends of the bottom end of the top cover 1, and the grooves 2 are symmetrically distributed about the vertical central axis of the top cover 1.

[0037] In this embodiment, the symmetrically opened grooves 2 facilitate the insertion of the operator's fingers, thereby facilitating the disassembly and assembly of the top cover 1. Example 2

[0038] Based on Embodiment 1, a preferred embodiment of the integrated hot and cold coil for semiconductor temperature control equipment provided by this utility model is, for example... Figures 1 to 5 As shown: The moisture-proof component 4 includes a moisture-proof cover 402; a moisture-proof cover 402 fixedly connected to one side of the housing 3, the interior of the moisture-proof cover 402 communicating with the interior of the housing 3; a silica gel drying block 406 movably connected inside the moisture-proof cover 402; and a sealing cover 401 movably connected to one side of the moisture-proof cover 402.

[0039] In this embodiment, the air inside the housing 3 is in communication with the air inside the moisture shield 402, so the moisture inside the housing 3 can be adsorbed by the silica gel drying block 406, which further improves the dryness of the housing 3 and prevents moisture from accumulating and affecting the normal operation of the semiconductor coil 7.

[0040] In a further preferred embodiment of the present invention, an external thread 405 is provided on one side of the surface of the sealing cover 401, and an internal thread 403 is provided on the inner wall of the moisture cover 402 to engage with the external thread 405.

[0041] In this embodiment, the threaded engagement between the external thread 405 and the internal thread 403 enables quick assembly and disassembly of the sealing cap 401 and the moisture cover 402.

[0042] In a further preferred embodiment of the present invention, anti-slip textures 404 are provided at equal angles on one side of the surface of the sealing cover 401, and the anti-slip textures 404 are arc-shaped.

[0043] In this embodiment, the arc-shaped anti-slip texture 404 is used to increase the rotational anti-slip friction between the worker's hand and the surface of the sealing cover 401, thereby facilitating the rotation of the sealing cover 401.

[0044] The working principle of this utility model is as follows: First, the terminal 6 is connected to the external wire, which then provides power to the semiconductor coil 7 to achieve temperature control. At the same time, since the air inside the housing 3 is interconnected with the air inside the moisture cover 402, the silica gel drying block 406 can adsorb the moisture inside the housing 3, further improving the dryness of the housing 3 and preventing moisture accumulation from affecting the normal operation of the semiconductor coil 7. Meanwhile, the sealing cover 401 can be rotated to open it, making it easy to remove and replace the saturated silica gel drying block 406.

[0045] Furthermore, when it is necessary to disassemble, maintain, or replace the semiconductor coil 7, the mounting rod 502 can be pulled, causing the sliding rod 503 to slide and drive the slider 506 to slide inside the mounting groove 505, compressing the mounting spring 504 until one end of the mounting rod 502 disengages from the mounting hole 501. Then, a finger can be inserted into the groove 2 to facilitate the removal and disassembly of the top cover 1 from the top of the housing 3, thereby facilitating the disassembly, maintenance, or replacement of the semiconductor coil 7. During installation, the mounting rod 502 is first pulled to disengage from the mounting hole 501, and then the top cover 1 is placed on the top of the housing 3, while the locking block 9 is engaged in the slot 8. Then, the mounting rod 502 is released, and the elastic force of the mounting spring 504 is used to cause the sliding rod 503 to slide, driving the mounting rod 502 to slide, so that one end of it is engaged in the mounting hole 501, achieving a secure engagement between the top cover 1 and the housing 3.

[0046] The above are merely preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model shall be included within the protection scope of the present utility model.

Claims

1. An integrated cold-hot coil for a semiconductor temperature control apparatus, characterized by, Include: The shell (3); Symmetrically fixed to one side of the shell (3) terminal post (6); Moisture-proof assembly (4) assembled on the other side of the shell (3), the moisture-proof assembly (4) can be used for drying the inside of the shell (3); Fixedly connected to the bottom wall of the shell (3) semiconductor coil (7); Movable connection in the top of the shell (3) top cover (1); The mounting assembly (5) is assembled on one side of the top cover (1) and the shell (3), which is used for quick disassembly between the top cover (1) and the shell (3); The mounting assembly (5) comprises: The installation groove (505) is opened on the inside of the shell (3) on the upper end of one side; The sliding block (506) is movably connected in the installation groove (505); The sliding rod (503) is fixedly connected on one side of the sliding block (506), and one end of the sliding rod (503) extends to the outside of the installation groove (505) and is fixedly connected with the installation rod (502); The installation spring (504) is wound on the surface of the sliding rod (503), and the two ends of the installation spring (504) are fixedly connected with the inner wall of the installation groove (505) and one end of the sliding block (506) respectively; The mounting hole (501) is opened on one side of the top cover (1).

2. An integrated cold-hot coil for a semiconductor temperature control apparatus according to claim 1, wherein The installation rod (502) is engaged with the inside of the mounting hole (501), and the shape of the installation rod (502) is inverted L-shaped.

3. An integrated cold-hot coil for a semiconductor temperature control apparatus according to claim 1, wherein The sliding block (506) and the inside of the installation groove (505) constitute a sliding structure, and the installation groove (505) and the sliding block (506) are cross-shaped.

4. An integrated cold-hot coil for a semiconductor temperature control apparatus according to claim 1, wherein The bottom end of the top cover (1) is fixedly connected with the clamping block (9) at equal angles, and the top end of the shell (3) is fixedly connected with the clamping groove (8) at equal angles.

5. An integrated cold-hot coil for a semiconductor temperature control apparatus according to claim 1, wherein The recess (2) is opened at both ends of the bottom end of the top cover (1), and the recess (2) is symmetrically distributed about the vertical central axis of the top cover (1).

6. An integrated cold-hot coil for a semiconductor temperature control apparatus according to claim 1, wherein The moisture-proof assembly (4) comprises a moisture-proof cover (402); The moisture-proof cover (402) is fixedly connected to one side of the shell (3), and the inside of the moisture-proof cover (402) is communicated with the inside of the shell (3); The silica gel drying block (406) is movably connected in the moisture-proof cover (402); The sealing cover (401) is movably connected on one side of the moisture-proof cover (402).

7. An integrated cold-hot coil for a semiconductor temperature control apparatus according to claim 6, wherein The outer thread (405) is opened on one side of the surface of the sealing cover (401), and the inner thread (403) is opened on the inner wall of the moisture-proof cover (402).

8. An integrated cold-hot coil for a semiconductor temperature control apparatus according to claim 6, wherein The anti-skid line (404) is opened at equal angles on one side of the surface of the sealing cover (401), and the shape of the anti-skid line (404) is arc-shaped.

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