High-brightness large-viewing-angle power type ultrathin surface-mounted LED

Abstract

The utility model provides a high brightness large visual angle power type ultrathin surface mount LED including a substrate, a flip chip, a semispherical optical lens and a reflection cup groove, the substrate is provided with array type micro through holes, the surface of the substrate is provided with a groove along the length direction of the substrate, the groove is internally provided with an insulating layer, and the surface of the substrate is provided with a light emitting diode (LED) light source. A conductive circuit is arranged in the insulating layer, a reflection cup groove is formed in the surface of the substrate, and heat dissipation electrodes are symmetrically arranged on the two sides of the substrate. The beneficial effects of the utility model are that the array micro through holes can improve the longitudinal heat conduction efficiency, the flip chip is directly welded on the substrate, and the gold thread height is eliminated; and the light emitting angle can be increased through the cooperative use of the reflection cup groove and the hemispherical optical lens.

Description

Technical Field

[0001] This invention belongs to the field of mold LED packaging technology, and is particularly suitable for a high-brightness, wide-viewing-angle, high-power ultra-thin surface mount LED. Background Technology

[0002] Surface mount LEDs, also known as SMD LEDs, are a simple type of lighting fixture. Their light-emitting principle involves passing an electric current through a compound semiconductor; through the combination of electrons and holes, excess energy is released as light, achieving the desired emission. However, existing SMD LEDs generally suffer from poor heat dissipation, leading to limited brightness. Utility Model Content

[0003] The purpose of this invention is to provide a high-brightness, wide-viewing-angle, high-power ultra-thin surface-mount LED that can improve heat dissipation efficiency and enhance brightness, making it especially suitable for everyday use.

[0004] The technical solution of this utility model is: a high-brightness, wide-viewing-angle, high-power ultra-thin surface-mount LED, comprising a substrate, a flip chip, a hemispherical optical lens, and a reflective cup groove. The substrate has an array of micro-through holes, and the substrate surface has a groove along its length. An insulating layer is provided in the groove, and conductive lines are provided in the insulating layer. The substrate surface has a reflective cup groove, and the flip chip is fixed to the substrate in the reflective cup groove by conductive adhesive and connected to the positive and negative terminals through conductive lines. The hemispherical optical lens is connected to the substrate and sleeved on the outside of the flip chip. The hemispherical optical lens is located in the reflective cup groove. Heat dissipation electrodes are symmetrically provided on both sides of the substrate, and the surface of the heat dissipation electrodes is covered with a silver plating layer.

[0005] Preferably, the substrate is a copper alloy substrate with a thickness ≤0.3mm.

[0006] Preferably, the hemispherical optical lens is a silicone lens, and the top is provided with an anti-reflective nano-coating.

[0007] Preferably, the inner wall of the reflective cup groove is coated with a high-reflectivity film.

[0008] The advantages and positive effects of this utility model are as follows: due to the adoption of the above technical solution, the array-type micro-through hole can improve the longitudinal heat conduction efficiency, the flip chip can be directly soldered to the substrate, and the gold wire height can be eliminated; the combined use of the reflector cup groove and the hemispherical optical lens can increase the light output angle. Attached Figure Description

[0009] Figure 1 This is a top view of the present invention.

[0010] Figure 2 This is a cross-sectional view of the present invention.

[0011] In the picture:

[0012] 1. Substrate; 2. Flip chip; 3. Hemispherical optical lens

[0013] 4. Reflector cup groove; 5. Micro-through hole; 6. Insulating layer.

[0014] 7. Heat dissipation electrode Detailed Implementation

[0015] like Figure 1 , 2 As shown, the technical solution of this utility model is a high-brightness, wide-viewing-angle, high-power ultra-thin surface-mount LED, including a substrate 1, a flip chip 2, a hemispherical optical lens 3, and a reflector cup groove 4. The substrate 1 is provided with an array of micro-through holes 5 to improve longitudinal heat conduction efficiency. The surface of the substrate 1 is provided with a groove along its length direction. An insulating layer 6 is provided in the groove. Conductive lines are provided in the insulating layer 6. The surface of the substrate 1 is provided with a reflector cup groove 4. The flip chip 2 is fixed to the substrate 1 in the reflector cup groove 4 by conductive adhesive and connected to the positive and negative terminals through conductive lines. The hemispherical optical lens 3 is connected to the substrate 1 and sleeved on the outside of the flip chip 2. The hemispherical optical lens 3 is located in the reflector cup groove 4. Heat dissipation electrodes 7 are symmetrically provided on both sides of the substrate 1. The surface of the heat dissipation electrodes 7 is provided with a silver plating layer.

[0016] In this embodiment, the substrate 1 is a copper alloy substrate with a thickness of ≤0.3mm. Copper alloy has high thermal conductivity, which facilitates heat dissipation.

[0017] In this embodiment, the hemispherical optical lens 3 is a silicone lens, and an anti-reflective nano-coating is provided on the top.

[0018] In this embodiment, the inner wall of the reflective cup groove 4 is coated with a high reflectivity film.

[0019] The above description provides a detailed account of one embodiment of the present invention. However, this description is merely a preferred embodiment and should not be construed as limiting the scope of the present invention. All equivalent variations and improvements made within the scope of the claims of the present invention should still fall within the patent coverage of the present invention.

Claims

1. A high-brightness large viewing angle power ultra-thin surface mount LED, characterized in that: The application relates to a substrate, flip chip, hemispherical optical lens and reflective cup groove, wherein the substrate is provided with an array type micro-through hole, the surface of the substrate is provided with a groove along the length direction, the groove is provided with an insulating layer, the insulating layer is provided with a conductive circuit, the surface of the substrate is provided with a reflective cup groove, the flip chip is fixed on the substrate of the reflective cup groove through conductive glue, and the flip chip is connected with the positive and negative poles through the conductive circuit, the hemispherical optical lens is connected with the substrate and is sleeved outside the flip chip, the hemispherical optical lens is arranged in the reflective cup groove, the two sides of the substrate are symmetrically provided with heat dissipation electrodes, and the surface of the heat dissipation electrodes is provided with a silver plating layer.

2. The high-brightness large-viewing-angle power ultra-thin surface mount LED according to claim 1, characterized in that: The substrate is a copper alloy substrate and the thickness is less than or equal to 0.3 mm.

3. The high-brightness large-viewing-angle power ultra-thin surface mount LED according to claim 1, characterized in that: The hemispherical optical lens is a silica gel lens and the top of the silica gel lens is provided with an anti-reflection nano coating layer.

4. The high-brightness large-viewing-angle power ultra-thin surface mount LED of claim 1, wherein: The inner wall of the reflective cup groove is plated with a high reflectivity film layer.

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