LED lamp bead mixed pasting substrate
By setting LED beads with different X and Y axis color coordinates on the LED bead mixed substrate, the color difference and light spot problems in the existing technology are solved, and a more uniform light color distribution and higher visual comfort are achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-01
- Publication Date
- 2026-03-17
AI Technical Summary
In existing LED chip technology, the LED chip substrate is divided into multiple color zones, resulting in large color differences between small color zones, causing serious color difference problems in backlighting, and obvious light spot phenomenon, which affects lighting quality and visual comfort.
The design employs a mixed-lay substrate for LED beads. By placing LED beads with different X and Y axis color coordinates within the same color block, light mixing with different color coordinates is achieved. Alternating arrangement of LED beads reduces color difference and light spots, improving light uniformity and visual comfort.
It achieves a more uniform light color distribution, reduces color difference and light spots, improves lighting quality, makes the light softer, and enhances color reproduction and visual comfort.
Smart Images
Figure CN224007045U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of LEDs, and in particular to a substrate for mixed bonding of LED beads. Background Technology
[0002] Surface-Mounted Device LED (SMD LED) technology is a technique that involves directly mounting LED chips onto a circuit board. Compared to traditional through-hole LEDs, SMD LEDs offer advantages such as smaller size, better heat dissipation, and higher luminous efficacy, and are widely used in lighting, displays, and other fields.
[0003] In the existing technology, the existing LED chip technology usually divides the LED chip substrate into 4-6 color zones and applies the chip separately to each color zone. However, this method may result in large color differences between small color zones, and the backlight is prone to serious color difference problems after chip application. Utility Model Content
[0004] Therefore, the purpose of this utility model is to provide an LED bead mixed-mount substrate, which can effectively solve the shortcomings of the prior art.
[0005] An LED chip substrate is characterized by comprising a substrate body and a light-emitting area disposed on the top of the substrate body. The light-emitting area includes a first arrangement group disposed along the length direction of the substrate body and a second arrangement group disposed along the length direction of the substrate body and corresponding to the first arrangement group. Both the first and second arrangement groups include a plurality of color blocks arranged along the length direction of the substrate body. Each color block includes N PCB structures arranged along the length direction of the substrate body. Each PCB structure has a plurality of LED light strips disposed along the length direction of the PCB structure. The X and Y axis color coordinates of the LED light strips on the N PCB structures within the same color block are all different. Each LED light strip includes first LED chips and second LED chips alternately disposed along the length direction of the PCB structure. The X and Y axis color coordinates of the first LED chips and the second LED chips on the same PCB structure are different.
[0006] Compared with the prior art, the beneficial effects of this utility model are as follows: by setting the X and Y axis color coordinates of LED light strips on N PCB structures within the same color block to be different, and setting the X and Y axis color coordinates of the first LED bead and the second LED bead on the same PCB structure to be different, a more uniform light color distribution can be achieved by mixing LED beads with different color coordinates, reducing color difference and light spot phenomenon, improving lighting quality, and the light after mixing is softer, reducing the stimulation of single color light to the human eye, improving visual comfort, and by arranging LED beads with different color coordinates alternately, a wider color gamut coverage can be achieved, enhancing color reproduction capability.
[0007] Furthermore, the allowable tolerance of the X and Y axis color coordinates of the first LED and the second LED on the same PCB structure is ±0.002.
[0008] Furthermore, the allowable tolerance for the X and Y axis color coordinates of LED strips on N PCB structures within the same color block is ±0.015.
[0009] Furthermore, a plurality of first positioning elements for positioning the substrate body are provided on the substrate body around the first arrangement group and the second arrangement group.
[0010] Furthermore, a second positioning member for positioning the PCB structure is also provided on the substrate body, and the second positioning member is disposed on one side of the PCB structure.
[0011] Furthermore, test points for testing the PCB structure and positioning are provided at both ends of the PCB structure.
[0012] Furthermore, the PCB structure is also provided with pin structures. The pin structures of the PCB structure in the first arrangement group are arranged on the side facing the second arrangement group, and the pin structures of the PCB structure in the second arrangement group are arranged on the side facing the first arrangement group. Attached Figure Description
[0013] Figure 1 This is a schematic diagram of the overall structure of the LED bead mixed-mount substrate in an embodiment of this utility model;
[0014] Figure 2 for Figure 1 A magnified schematic diagram of part A in the middle;
[0015] Explanation of key component symbols:
[0016]
[0017]
[0018] The following detailed description, in conjunction with the accompanying drawings, will further illustrate this utility model. Detailed Implementation
[0019] To facilitate understanding of this utility model, a more complete description will be given below with reference to the accompanying drawings. Several embodiments of this utility model are shown in the drawings. However, this utility model can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the disclosure of this utility model will be more thorough and complete.
[0020] It should be noted that when a component is said to be "fixed to" another component, it can be directly on the other component or there may be an intervening component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there may be an intervening component. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.
[0021] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.
[0022] Please see Figures 1 to 2 The LED chip substrate in this embodiment includes a substrate body 10 and a light-emitting area 20 disposed on the top of the substrate body 10. The light-emitting area 20 includes a first arrangement group 21 disposed along the length direction of the substrate body 10 and a second arrangement group 22 disposed along the length direction of the substrate body 10 corresponding to the first arrangement group 21. Both the first arrangement group 21 and the second arrangement group 22 include a plurality of color blocks 30 disposed along the length direction of the substrate body 10. The color block 30 includes N PCB structures 40 disposed along the length direction of the substrate body 10. There are a plurality of LED light strips 41 disposed along the length direction of the PCB structure 40 on the PCB structure 40. The X and Y axis color coordinates of the LED light strips 41 on the N PCB structures 40 within the same color block 30 are all different. The LED light strip 41 includes a first LED chip 42 and a second LED chip 43 disposed alternately along the length direction of the PCB structure 40. The X and Y axis color coordinates of the first LED chip 42 and the second LED chip 43 on the same PCB structure 40 are different.
[0023] Furthermore, the X and Y axis color coordinates of the first LED bead 42 and the second LED bead 43 on the same PCB structure 40 have a tolerance of ±0.002.
[0024] It should be noted that, specifically in this embodiment, the color block 30 includes three PCB structures 40 arranged along the length of the substrate body 10, namely a first PCB structure 50, a second PCB structure 60, and a third PCB structure 70.
[0025] Specifically, the X-axis color coordinate of the first LED on the first PCB structure 50 is 0.2605, and the Y-axis color coordinate of the first LED on the first PCB structure 50 is 0.2705; the X-axis color coordinate of the second LED on the first PCB structure 50 is 0.2615, and the Y-axis color coordinate of the second LED on the first PCB structure 50 is 0.2715; the X-axis color coordinate of the first LED on the second PCB structure 60 is 0.2635, and the Y-axis color coordinate of the first LED on the second PCB structure 60 is 0.273. 5; The X-axis color coordinate of the second LED on the second PCB structure 60 is 0.2655, and the Y-axis color coordinate of the second LED on the second PCB structure 60 is 0.2755; The X-axis color coordinate of the first LED on the third PCB structure 70 is 0.2675, and the Y-axis color coordinate of the first LED on the third PCB structure 70 is 0.2775; The X-axis color coordinate of the second LED on the third PCB structure 70 is 0.2695, and the Y-axis color coordinate of the second LED on the third PCB structure 70 is 0.2795.
[0026] Furthermore, the allowable tolerance for the X and Y axis color coordinates of the LED strips 41 on N PCB structures 40 within the same color block is ±0.015.
[0027] Specifically, in this embodiment, the X-axis color coordinate within the same color block 30 is 0.265±0.015, and the Y-axis color coordinate within the same color block 30 is 0.275±0.015.
[0028] Understandably, by setting three PCB structures 40 within the color block 30, namely the first PCB structure 50, the second PCB structure 60, and the third PCB structure 70, and by setting the X and Y axis color coordinates of the LED light strips 41 on the first PCB structure 50, the second PCB structure 60, and the third PCB structure 70 to be different, and by setting the X and Y axis color coordinates of the first LED bead 42 and the second LED bead 43 on the same PCB structure 40 to be different, a more uniform light color distribution can be achieved by mixing LED beads with different color coordinates, reducing color difference and light spot phenomenon, improving lighting quality, and the light after mixing is softer, reducing the stimulation of the human eye by single color light, improving visual comfort, and by arranging LED beads with different color coordinates alternately, a wider color gamut coverage can be achieved, enhancing color reproduction capability.
[0029] Furthermore, a plurality of first positioning members 11 for positioning the substrate body 10 are provided on the substrate body 10 around the first arrangement group 21 and the second arrangement group 22.
[0030] It is understood that by providing a plurality of first positioning members 11 around the first arrangement group 21 and the second arrangement group 22 on the substrate body 10, the present invention can be accurately installed on the display module by means of the first positioning members 11. By providing the first positioning members 11 around the first arrangement group 21 and the second arrangement group 22, the present invention is not limited by the length of the first arrangement group 21 and the second arrangement group 22.
[0031] Furthermore, a second positioning member 12 for positioning the PCB structure 40 is also provided on the substrate body 10, and the second positioning member 12 is disposed on one side of the PCB structure 40.
[0032] It is understood that by providing a second positioning member 12 for positioning the PCB structure 40 on the substrate body 10, the PCB structure 40 can be accurately mounted on the substrate body 10.
[0033] Furthermore, test points 44 for testing and positioning the PCB structure 40 are provided at both ends of the PCB structure 40.
[0034] Understandably, by setting the test point 44, the PCB structure 40 is tested before being installed on the substrate body 10. After the test is completed, the test point 44 and the second positioning member 12 can be used to achieve triangular positioning, further ensuring that the PCB structure 40 can be accurately installed on the substrate body 10.
[0035] Furthermore, a pin structure 45 is also provided on the PCB structure 40. The pin structure 45 of the PCB structure 40 in the first arrangement group 21 is arranged on the side facing the second arrangement group 22, and the pin structure 45 of the PCB structure 40 in the second arrangement group 22 is arranged on the side facing the first arrangement group 21.
[0036] Understandably, this arrangement can further save space on the top of the substrate body 10, so that more of the PCB structures 40 can be arranged on the top of the substrate body 10.
[0037] In summary, the LED chip-mounted substrate in the above embodiments of this utility model achieves a more uniform light distribution by mixing LED chips with different X and Y axis color coordinates on N PCB structures within the same color block, and by setting different X and Y axis color coordinates for the first and second LED chips on the same PCB structure. This reduces color difference and light spot phenomena, improves lighting quality, and results in softer light after mixing, reducing the stimulation of single-color light on the human eye and improving visual comfort. Furthermore, the alternating arrangement of LED chips with different color coordinates enables a wider color gamut coverage and enhances color reproduction capabilities.
[0038] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.
[0039] The embodiments described above are merely illustrative of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of this utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.
Claims
1. An LED lamp bead mixed-pasting substrate, characterized in that, The substrate body and the light-emitting area arranged on the top of the substrate body, the light-emitting area includes a first arrangement group arranged along the length direction of the substrate body and a second arrangement group arranged along the length direction of the substrate body and corresponding to the first arrangement group, the first arrangement group and the second arrangement group each include a plurality of color blocks arranged along the length direction of the substrate body, the color block includes N PCB structures arranged along the length direction of the substrate body, a plurality of LED light strips are arranged on the PCB structure along the length direction of the PCB structure, the X and Y axis color coordinates of the LED light strips on the N PCB structures in the same color block are different, the LED light strip includes first LED lamp beads and second LED lamp beads arranged alternately along the length direction of the PCB structure, the X and Y axis color coordinates of the first LED lamp beads and the second LED lamp beads on the same PCB structure are different. 2.The LED lamp bead hybridization substrate according to claim 1, characterized in that, The X and Y axis color coordinates of the first LED lamp beads and the second LED lamp beads on the same PCB structure are allowed to differ by ±0.
002. 3.The LED lamp bead hybridization substrate of claim 1, wherein, The X and Y axis color coordinates of the LED light strips on the N PCB structures in the same color block are allowed to differ by ±0.
015. 4.The LED lamp bead hybridization substrate of claim 1, wherein, A plurality of first positioning members for positioning the substrate body are arranged around the first arrangement group and the second arrangement group on the substrate body.
5. The LED lamp bead hybrid substrate according to claim 1, characterized in that, Second positioning members for positioning the PCB structure are further arranged on the substrate body, and the second positioning members are arranged on one side of the PCB structure. 6.The LED lamp bead hybridization substrate of claim 1, wherein, Test points for testing and positioning the PCB structure are arranged at both ends of the PCB structure.
7. The LED lamp bead hybrid substrate according to claim 1, characterized in that, Pin structures are further arranged on the PCB structure, the pin structures of the PCB structures in the first arrangement group are arranged on the side facing the second arrangement group, and the pin structures of the PCB structures in the second arrangement group are arranged on the side facing the first arrangement group.