TO-220 packaging framework

Abstract

The utility model discloses a TO-220 packaging framework, which comprises a radiating fin provided with a radiating table, a chip holding table and pins integrally formed with the chip holding table in a punching manner, the radiating fins are made of aluminum materials, and the chip containing table and the pins are made of copper materials. And the chip holding table is stacked on the heat dissipation table and is fixed together with the heat dissipation table through welding. According to the TO-220 packaging framework, the radiating fins made of aluminum are adopted, so that the cost of the TO-220 packaging framework is greatly reduced, meanwhile, damage to the chip on the chip containing table caused by assembly stress during assembly can be reduced, the qualified rate of the TO-220 packaging framework is increased, the service life of the TO-220 packaging framework is prolonged, and the TO-220 packaging framework can be widely applied to the field of TO-220 packaging frameworks.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor packaging technology, and in particular to a TO-220 packaging skeleton. Background Technology

[0002] TO-220 packaging is widely used in the semiconductor packaging field. Currently, TO-220 package frames are all made of copper through a single stamping process. Although copper has excellent heat dissipation properties, its cost is relatively high. Furthermore, due to the one-piece stamping structure, after the chip is soldered and fixed to the frame, the installation stress is directly transmitted to the chip during the later stages of TO-220 package assembly, causing chip damage and affecting the performance and lifespan of the TO-220 package. Additionally, existing copper frame structures are dense and heavy, which is not conducive to lightweight design requirements. Utility Model Content

[0003] The purpose of this invention is to provide a TO-220 package frame that solves the problem of high cost of existing TO-220 package frames.

[0004] The technical solution adopted by this utility model to solve its technical problem is: a TO-220 package frame, including a heat sink, a heat dissipation platform provided on the heat sink, a chip placement platform, and pins integrally stamped with the chip placement platform; the material of the heat sink is aluminum, and the material of the chip placement platform and the pins is copper; the chip placement platform is stacked on the heat dissipation platform and fixed together by welding.

[0005] To improve the reliability of welding and fixing, the heat sink is provided with a boss that is compatible with the chip placement platform, and the boss is provided with a set of transverse grooves; the side of the chip placement platform that mates with the boss is provided with a set of protrusions, and the other side of the chip placement platform is provided with a set of transverse stripes to facilitate bonding with the chip.

[0006] To facilitate the docking and positioning of the heat sink and the chip mounting platform, the pins include a left pin, a middle pin, and a right pin. The height of the pins is lower than the height of the chip mounting platform. After the chip mounting platform and the heat sink are soldered and fixed, the pins and the heat sink are at the same height. The end of the middle pin is connected to the chip mounting platform, while the ends of the left pin and the right pin are separated from the chip mounting platform.

[0007] To facilitate the flow of excess solder during welding and prevent it from accumulating on the boss, the heat sink is provided with a set of guide grooves on the outer edge of the boss.

[0008] The beneficial effects of this utility model are as follows: The TO-220 package frame of this utility model adopts a split structure. While ensuring that the chip mounting position uses copper, which has a higher performance, the heat dissipation part that interfaces with the outside uses aluminum, which is cheaper. The two are fixed by welding. Aluminum can significantly reduce the cost of the TO-220 package frame. At the same time, compared with copper, aluminum also has the advantages of being lightweight, having good corrosion resistance, and being easy to process and shape. In addition, aluminum has a low heat capacity, which allows it to dissipate heat to the surrounding environment more quickly after absorbing heat, making it suitable for applications requiring rapid heat dissipation. The heat sink and the chip holder are fixed by welding, which is simple, convenient, and reliable. At the same time, the split structure and the use of aluminum, which has better toughness, allow the heat sink to be relieved by the heat dissipation platform when assembling with external devices, preventing the stress from being conducted to the chip on the chip holder. This avoids chip damage caused by assembly stress. Therefore, this structure can improve the product qualification rate and service life.

[0009] The present invention will be described in more detail below with reference to the accompanying drawings and embodiments. Attached Figure Description

[0010] Figure 1 This is a three-dimensional structural diagram of multiple heat sinks in this utility model.

[0011] Figure 2 This is a three-dimensional structural diagram of multiple chip placement stages in this utility model.

[0012] Figure 3 This is a three-dimensional structural diagram of a single heat sink in this utility model.

[0013] Figure 4 This is a three-dimensional structural diagram of a single chip placement stage in this utility model.

[0014] Figure 5 This is a schematic diagram showing the position of the protrusions on the chip placement stage in this utility model.

[0015] Figure 6 This is a three-dimensional structural diagram of the present invention.

[0016] Figure 7 This is a side view of the present invention. Detailed Implementation

[0017] Examples, such as Figures 1 to 7As shown, a TO-220 package frame includes a separately formed heat sink 1 and a chip mounting platform 2, with pins 3 integrally stamped onto the chip mounting platform 2. The heat sink 1 is made of aluminum, and the chip mounting platform 2 is made of copper. The heat sink 1 and the chip mounting platform 2 are soldered together. Using aluminum for the heat sink 1 is cheaper than using copper. Not only is the material cost lower, but aluminum is also easier to process, resulting in lower processing costs than copper. Therefore, the cost of the heat sink 1 can be significantly reduced. Furthermore, aluminum is lightweight and corrosion-resistant.

[0018] The specific structure is as follows: the heat sink 1 is provided with a heat dissipation platform 11 and a mounting part 14 for docking with external products. The chip mounting platform 2 is stacked on the heat dissipation platform 11 and fixed together by soldering. The chip mounting platform 2 is used to mount chips. Another advantage of designing the heat sink 1 and the chip mounting platform 2 separately is that when the heat sink 1 is assembled with the external product, the aluminum heat sink 1 has better toughness, which can effectively dissipate assembly stress and avoid the problem of chip damage caused by assembly stress acting on the chip on the chip mounting platform 2 during assembly. To improve the strength of the soldering fixation, the heat dissipation platform 11 is provided with a boss 12 that matches the chip mounting platform 2. The boss 12 is provided with a set of transverse grooves 121; the side of the chip mounting platform 2 that mates with the boss 12 is provided with a set of protrusions 21. To facilitate the flow out of excess solder, the heat sink 1 is provided with a set of guide grooves 13 on the outer edge of the boss 12. To facilitate chip soldering and fixing, a set of horizontal stripes 22 are provided on the other side of the chip placement stage 2 to facilitate bonding with the chip.

[0019] To facilitate positioning during soldering, the pin 3 includes a left pin 31, a middle pin 32, and a right pin 33. The height of the pin 3 is lower than the height of the chip mounting platform 2. After the chip mounting platform 2 is soldered and fixed to the heat sink 11, the pin 3 and the heat sink 11 are at the same height. The end of the middle pin 32 is connected to the chip mounting platform 2, while the ends of the left pin 31 and the right pin 33 are separated from the chip mounting platform 2. During processing, multiple chip mounting platforms 2 and pins 3 are first stamped and then cut to form independent chip mounting platforms 2.

[0020] The present invention has been described above by way of example with reference to the accompanying drawings. Obviously, the specific implementation of the present invention is not limited to the above-described manner. Any non-substantial improvements made using the inventive concept and technical solution of the present invention; or the direct application of the inventive concept and technical solution to other situations without modification, are all within the protection scope of the present invention.

Claims

1. A TO-220 package frame, characterized by: The application relates to a heat dissipation sheet (1) which is provided with a heat dissipation platform (11), a chip containing platform (2) and a pin (3) which is integrally formed with the chip containing platform (2); the material of the heat dissipation sheet (1) is aluminum, the material of the chip containing platform (2) and the pin (3) is copper; the chip containing platform (2) is stacked on the heat dissipation platform (11) and is fixed together through welding.

2. The TO-220 package frame of claim 1, wherein: The heat dissipation platform (11) is provided with a convex platform (12) which is matched with the chip containing platform (2), a group of transverse grooves (121) are arranged on the convex platform (12); one side of the chip containing platform (2) which is matched with the convex platform (12) is provided with a group of convex points (21), and the other side of the chip containing platform (2) is provided with a group of transverse stripes (22) which are convenient for combining with chips.

3. The TO-220 package frame of claim 1, wherein: The pin (3) comprises a left pin (31), a middle pin (32) and a right pin (33), the height of the pin (3) is lower than the height of the chip containing platform (2), the pin (3) is located at the same height with the heat dissipation platform (11) after the chip containing platform (2) is welded and fixed with the heat dissipation platform (11); the end of the middle pin (32) is connected with the chip containing platform (2), and the ends of the left pin (31) and the right pin (33) are separated from the chip containing platform (2).

4. The TO-220 package frame of claim 2, wherein: A group of material guiding grooves (13) are arranged on the outer edge of the convex platform (12).

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