Fingerprint identification module with enhanced optical performance and durability

Abstract

The utility model discloses a fingerprint identification module with enhanced optical performance and durability, which comprises a glass substrate, an FPC (Flexible Printed Circuit) and a fingerprint identification module, the upper surface of the glass substrate is provided with a silicon dioxide layer, a methacryloxysilane layer and a magnesium fluoride layer which are sequentially superposed from bottom to top, the thickness of the silicon dioxide layer is 50nm-100nm, and the thickness of the magnesium fluoride layer is 50nm-100nm. The thickness of the glass substrate is 80-120 nm, the thickness of the methylacryloyloxy silane layer and the thickness of the magnesium fluoride layer are 10-20 nm, the thickness of the magnesium fluoride layer is 80-120 nm, the FPC is arranged below the glass substrate, and the fingerprint identification module is arranged below the FPC. Through a multi-layer coating structure, the light transmittance and the anti-reflection performance of the glass surface are remarkably improved, light loss is reduced, the fingerprint recognition precision is improved, methacryloyloxysilane serves as the middle layer, the adhesive force of the coating layer is enhanced, and excellent fingerprint resistance, grease resistance and scraping resistance are provided. The optical performance and durability of the fingerprint recognition module are enhanced, and the fingerprint recognition module is prevented from being eroded by fingerprint grease, sweat and the external environment in long-term use.

Description

TECHNICAL FIELD

[0001] The utility model relates to a kind of fingerprint identification technical field, more specifically, it relates to a kind of fingerprint identification module with enhanced optical performance and durability. BACKGROUND

[0002] Fingerprint identification technology is widely used in smart phones, tablet computers and access control systems and other devices, and its core component is fingerprint identification module. Fingerprint identification module is usually composed of glass surface, optical sensor and circuit. In order to improve the accuracy of fingerprint identification and user experience, the optical performance and durability of the module surface are crucial.

[0003] The surface of the existing fingerprint identification module usually uses a single coating material, such as silicon dioxide or magnesium fluoride, to enhance the light transmittance and anti-reflection performance. However, these materials are easily eroded by fingerprint grease, sweat and external environment in long-term use, resulting in a decline in optical performance. SUMMARY

[0004] The technical problem to be solved by the utility model is how to enhance the optical performance and durability of the fingerprint identification module, avoid erosion by fingerprint grease, sweat and external environment in long-term use, and avoid a decline in optical performance.

[0005] The technical problem to be solved by the utility model is solved by the following technical solution:

[0006] To solve the above technical problem, the utility model provides a fingerprint identification module with enhanced optical performance and durability, which includes a glass substrate, an FPC and a fingerprint identification module. The upper surface of the glass substrate is sequentially stacked with a silicon dioxide layer, a methacryloxy silane layer and a magnesium fluoride layer from bottom to top. The thickness of the silicon dioxide layer is 50-100 nm, the thickness of the methacryloxy silane layer and the magnesium fluoride layer is 10-20 nm, and the thickness of the magnesium fluoride layer is 80-120 nm. The FPC is arranged below the glass substrate, and the fingerprint identification module is arranged below the FPC.

[0007] As a preferred embodiment of the fingerprint identification module with enhanced optical performance and durability provided by the utility model, the lower surface of the glass substrate is provided with a photosensitive color-changing ink layer.

[0008] As a preferred embodiment of the fingerprint identification module with enhanced optical performance and durability provided by the utility model, the thickness of the photosensitive color-changing ink layer is 5-10 μm.

[0009] As a preferred embodiment of the fingerprint identification module with enhanced optical performance and durability provided by the utility model, the FPC includes a non-bending area and bending areas arranged on both sides of the non-bending area, the bending areas are provided with PI reinforcing plates and a plurality of through holes, and the PI reinforcing plates completely cover the plurality of through holes.

[0010] As a preferred embodiment of the fingerprint identification module with enhanced optical performance and durability provided by the utility model, the plurality of through holes are arranged in a line segment shape.

[0011] As a preferred embodiment of the fingerprint identification module with enhanced optical performance and durability provided by the utility model, the FPC includes a lower protective film, a lower copper layer, a base material layer, an upper copper layer and an upper protective film arranged from bottom to top, and the PI reinforcing plate is arranged above the upper protective film.

[0012] As a preferred embodiment of the fingerprint identification module with enhanced optical performance and durability provided by the utility model, the PI reinforcing plate is a PI cover film.

[0013] As a preferred embodiment of the fingerprint identification module with enhanced optical performance and durability provided by the utility model, the thickness of the PI cover film is 0.1mm.

[0014] As a preferred embodiment of the fingerprint identification module with enhanced optical performance and durability provided by the utility model, the PI reinforcing plate does not exceed the non-bending area.

[0015] As a preferred embodiment of the fingerprint identification module with enhanced optical performance and durability provided by the utility model, the shape of the through hole is circular.

[0016] The utility model has the following beneficial effects:

[0017] The silica layer as the bottom layer has excellent light transmittance and chemical stability, which can effectively improve the hardness and wear resistance of the glass surface. The methacryloxy silane layer as the intermediate layer has organic-inorganic hybrid characteristics, which can form a firm chemical bond with silica and magnesium fluoride, enhance the adhesion of the coated layer, and effectively prevent the adhesion of fingerprints and grease due to its hydrophobicity and anti-fouling performance. The magnesium fluoride layer as the outermost layer has extremely low refractive index, which can significantly reduce light reflection and improve light transmittance, especially in the visible and near-infrared wave bands. Through the multilayer coating structure, the light transmittance and anti-reflection performance of the glass surface are significantly improved, the light loss is reduced, the accuracy of fingerprint identification is improved, the methacryloxy silane as the intermediate layer enhances the adhesion of the coated layer, and provides excellent anti-fingerprint, anti-grease and anti-scratch performance. The optical performance and durability of the fingerprint identification module are enhanced, the fingerprint grease, sweat and external environment are avoided from eroding for a long time, and the optical performance is avoided from being reduced. BRIEF DESCRIPTION OF DRAWINGS

[0018] In order to more clearly illustrate the scheme in the present application, the drawings needed in the following embodiment description will be briefly introduced. Obviously, the drawings in the following description are some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0019] Figure 1 The structure diagram of the fingerprint identification module with enhanced optical performance and durability provided by the present application.

[0020] Figure 2 The side view of the FPC. Figure 1

[0021] The side view of the FPC. Figure 3 Figure 2 The enlarged view of A in the FPC.

[0022] Figure 4 The improved structure diagram of the FPC.

[0023] Figure 5 The side view of the FPC. Figure 4

[0024] Explanation of reference numerals:

[0025] Glass substrate 1; FPC 2; fingerprint identification module 3; silica layer 11; methacryloxy silane layer 12; magnesium fluoride layer 13; photosensitive color-changing ink layer 14;

[0026] Non-bending area 201; bending area 202; PI reinforcing plate 21; via hole 22. DETAILED DESCRIPTION ​​

[0027] In order to make the person skilled in the art better understand the technical scheme of the present application, the technical scheme in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by the person skilled in the art without creative labor should belong to the scope of protection of the present application.

[0028] In the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the devices or elements indicated must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0029] In addition, the terms "first", "second", "third" are only for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features limited by "first", "second", "third" can explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise specifically limited.

[0030] The present application provides a kind of with enhanced optical performance and durability fingerprint identification module, it includes glass substrate, FPC and fingerprint identification module, the upper surface of the glass substrate is sequentially stacked from bottom to top with silica layer, methyl methacryloyl oxysilane layer and magnesium fluoride layer, the thickness of the silica layer is 50nm-100nm, the thickness of the methyl methacryloyl oxysilane layer and magnesium fluoride layer is 10nm-20nm, the thickness of the magnesium fluoride layer is 80nm-120nm, the FPC is set below the glass substrate, the fingerprint identification module is set below the FPC.

[0031] The silica layer as the bottom layer has excellent light transmittance and chemical stability, which can effectively improve the hardness and wear resistance of the glass surface. The methacryloxy silane layer as the intermediate layer has organic-inorganic hybrid characteristics, which can form a firm chemical bond with silica and magnesium fluoride, enhance the adhesion of the coating layer, and its hydrophobicity and anti-fouling performance can effectively prevent the adhesion of fingerprints and grease. The magnesium fluoride layer as the outermost layer has extremely low refractive index, which can significantly reduce light reflection and improve light transmittance, especially in the visible and near-infrared wave bands. Through the multilayer coating structure, the light transmittance and anti-reflection performance of the glass surface are significantly improved, the light loss is reduced, the accuracy of fingerprint identification is improved, the methacryloxy silane as the intermediate layer enhances the adhesion of the coating layer, and provides excellent anti-fingerprint, anti-grease and anti-scratch performance. The optical performance and durability of the fingerprint identification module are enhanced, the erosion of fingerprints, grease, sweat and external environment during long-term use is avoided, and the decline of optical performance is avoided.

[0032] In order to enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings. The present application will be described in detail below in conjunction with the drawings and embodiments, the examples of the embodiments are shown in the drawings, wherein the same or similar reference numerals represent the same or similar elements or elements with the same or similar functions throughout the drawings. The embodiments described below by referring to the drawings are exemplary and are intended to explain the present application, and cannot be understood as a limitation of the present application.

[0033] Embodiment 1, please refer to Figures 1 to 3The utility model provides a kind of fingerprint identification module with enhanced optical performance and durability, it includes glass substrate 1, FPC 2 and fingerprint identification module 3, the upper surface of glass substrate 1 is sequentially stacked from bottom to top with silicon dioxide layer 11, methyl methacrylatoxy silane layer 12 and magnesium fluoride layer 13, the thickness of silicon dioxide layer 11 is 50nm-100nm, the thickness of methyl methacrylatoxy silane layer 12 and magnesium fluoride layer 13 is 10nm-20nm, the thickness of magnesium fluoride layer 13 is 80nm-120nm, FPC 2 is set below glass substrate 1, and fingerprint identification module 3 is set below FPC 2.Silicon dioxide layer 11 as bottom layer, silicon dioxide has excellent light transmittance and chemical stability, can effectively improve the hardness and wear resistance of glass surface.Methyl methacrylatoxy silane layer 12 as intermediate layer, methyl methacrylatoxy silane has organic-inorganic hybrid characteristics, can form firm chemical bond with silicon dioxide and magnesium fluoride, enhance the adhesion of coating layer, and its hydrophobicity and anti-fouling performance effectively prevent the adhesion of fingerprint and grease.Magnesium fluoride layer 13 as the outermost layer, magnesium fluoride has very low refractive index, can significantly reduce light reflection, improve light transmittance, especially in visible light and near infrared band.Through multilayer coating structure, the light transmittance and anti-reflection performance of glass surface are significantly improved, light loss is reduced, the precision of fingerprint identification is improved, methyl methacrylatoxy silane as intermediate layer, the adhesion of coating layer is enhanced, and excellent anti-fingerprint, anti-grease and anti-scratching performance is provided.To enhance the optical performance and durability of fingerprint identification module, avoid the erosion of fingerprint grease, sweat and external environment in long-term use, avoid the decline of optical performance.

[0034] First, a layer of silicon dioxide layer 11 is plated on the surface of glass by physical vapor deposition or chemical vapor deposition technology, then methyl methacrylatoxy silane layer 12 is coated on silicon dioxide layer 11 by spin coating or spraying method to form an intermediate layer, and finally a layer of magnesium fluoride layer 13 is plated on the intermediate layer by PVD technology.

[0035] Further, the lower surface of glass substrate 1 is provided with a photosensitive color-changing ink layer 14, the photosensitive color-changing ink layer 14 is treated by ultraviolet curing, and the thickness of the photosensitive color-changing ink layer 14 is 5-10 μm. The photosensitive color-changing ink layer 14 printed on the back of glass substrate 1 can automatically change color and light transmittance according to the intensity of ultraviolet light, so as to adjust the optical properties of the fingerprint identification module and adapt to different lighting environments.

[0036] Example 2, please refer to Figure 4 And Figure 5As a further optimization of embodiment 1, in this embodiment, the FPC2 includes a non-bending area 201 and bending areas 202 arranged on both sides of the non-bending area 201, the PI reinforcing plate 21 and a plurality of vias 22 are arranged on the bending area 202, the plurality of vias 22 are bridges connecting the upper and lower copper layers, and the reliability thereof is very important, the via 22 cannot be subjected to heavy pressure, and is also afraid of being scratched and being folded, therefore, the general bending area 202 is not allowed to punch the via 22, because the bending force will directly act on the via 22, affecting the reliability of the via 22, the PI reinforcing plate 21 completely covers the plurality of vias 22. A plurality of vias 22 are arranged on the non-bending area 201, the via 22 is relatively weak and is prone to stress concentration, which leads to the fracture of the via 22, because the PI reinforcing plate 21 completely covers the via 22, the stress is concentrated around the reinforcing plate instead of the via 22, preventing the risk of fracture of the via 22, and avoiding the failure of the FPC2.

[0037] Further, the plurality of vias 22 are arranged in a line segment shape. Because the reinforcing plate completely covering the via 22 is arranged, even if the via 22 is arranged in a line segment shape, the fracture of the via 22 can be prevented, the designability of the product is improved, and the competitiveness of the product is improved.

[0038] Further, the FPC2 includes a lower protective film, a lower copper layer, a substrate layer, an upper copper layer and an upper protective film arranged in sequence from bottom to top, and the PI reinforcing plate 21 is arranged above the upper protective film.

[0039] Further, the PI reinforcing plate 21 is a PI cover film, which has lower cost and simpler assembly process.

[0040] Further, the thickness of the PI cover film is 0.1 mm, so as to ensure that the PI cover film has sufficient strength, the PI cover film is fixed by double-sided adhesive, the thickness of the double-sided adhesive is 0.025 mm, and the distance between the edge of the cover film and the via 22 is greater than 0.5 mm, so as to ensure that the stress concentration does not affect the via 22, prevent the risk of fracture of the via 22, and avoid the failure of the FPC2.

[0041] Further, the PI reinforcing plate 21 does not exceed the non-bending area 201. That is, the PI reinforcing plate 21 is arranged in the non-bending area 201, so as to prevent stress concentration in the bending area 202, and avoid fracture of the bending area 202.

[0042] Further, the shape of the via 22 is a circle.

[0043] In the utility model, unless another definite provision and limitation, the term " install " " link " " connect " " fixed " and so on term should do broad sense understanding, for example, can be fixed connection, also can be detachable connection, or be integrated;Can be mechanical connection, also can be electric connection or each other can communicate;Can be direct connection, also can indirectly connect through intermediate medium, can be two element internal communication or two element mutual action relation, unless another definite limitation.For ordinary skilled person in the art, can understand the above-mentioned term in the utility model concrete meaning according to specific circumstances.

[0044] Obviously, the above-described embodiments are only part of the embodiments of the present application, rather than all the embodiments, the preferred embodiments of the present application are given in the drawings, but do not limit the patent scope of the present application. The present application can be realized in many different forms, and contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present application more thorough and comprehensive. Although the present application is described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions recorded in the foregoing specific embodiments, or make equivalent replacement for part of the technical features. Any equivalent structure made by using the contents of the specification and drawings, directly or indirectly used in other related technical fields, is also within the scope of the patent protection of the present application.

Claims

1. A fingerprint recognition module with enhanced optical performance and durability, characterized in that, It includes a glass substrate, an FPC, and a fingerprint recognition module. The upper surface of the glass substrate is sequentially stacked with a silicon dioxide layer, a methacryloxysilane layer, and a magnesium fluoride layer from bottom to top. The thickness of the silicon dioxide layer is 50nm-100nm, the thickness of the methacryloxysilane layer and the magnesium fluoride layer is 10nm-20nm, and the thickness of the magnesium fluoride layer is 80nm-120nm. The FPC is located below the glass substrate, and the fingerprint recognition module is located below the FPC.

2. The fingerprint recognition module with enhanced optical performance and durability according to claim 1, characterized in that, A photosensitive color-changing ink layer is provided on the lower surface of the glass substrate.

3. The fingerprint recognition module with enhanced optical performance and durability according to claim 2, characterized in that, The thickness of the photosensitive color-changing ink layer is 5μm-10μm.

4. The fingerprint recognition module with enhanced optical performance and durability according to claim 1, characterized in that, The FPC includes a non-bending area and bending areas located on both sides of the non-bending area. The bending areas are provided with PI reinforcing plates and several through holes, and the PI reinforcing plates completely cover the several through holes.

5. The fingerprint recognition module with enhanced optical performance and durability according to claim 4, characterized in that, Several of the vias are arranged in a line segment shape.

6. The fingerprint recognition module with enhanced optical performance and durability according to claim 4, characterized in that, The FPC includes a lower protective film, a lower copper layer, a substrate layer, an upper copper layer, and an upper protective film arranged sequentially from bottom to top, and the PI reinforcing plate is disposed above the upper protective film.

7. The fingerprint recognition module with enhanced optical performance and durability according to claim 4, characterized in that, The PI reinforcing plate is a PI cover film.

8. The fingerprint recognition module with enhanced optical performance and durability according to claim 7, characterized in that, The thickness of the PI cover film is 0.1 mm.

9. The fingerprint recognition module with enhanced optical performance and durability according to claim 4, characterized in that, The PI reinforcing plate does not extend beyond the non-bending area.

10. The fingerprint recognition module with enhanced optical performance and durability according to claim 4, characterized in that, The via is circular in shape.

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