Lifting driving assembly and semiconductor process equipment
By designing a lifting drive component, rotational motion is converted into vertical motion, solving the problems of large space occupation and structural deformation of drive mechanisms in semiconductor process equipment, and achieving uniform drive and efficient process uniformity.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-02
- Publication Date
- 2026-03-20
AI Technical Summary
In existing semiconductor process equipment, the pipeline layout at the bottom of the lower electrode results in an excessively large radial dimension of the drive mechanism. Multi-motor synchronous drive schemes are prone to causing deflection deformation of the electrode support structure, affecting process uniformity, while single-motor bias drive schemes result in asymmetrical drive torque.
A lifting drive assembly is adopted, including a fixed cylinder, a movable cylinder, and a drive mechanism. Through the cooperation of the movable cylinder and the fixed cylinder, the rotational motion is converted into the vertical motion of the movable frame. A single motor is used to achieve uniform driving of the lower electrode and avoid structural deformation.
This achieves uniform driving force, reduces the space occupied below the lower electrode, avoids structural deformation caused by load bias, and improves process uniformity.
Smart Images
Figure CN224020732U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the field of semiconductor process equipment especially relates to a lift drive assembly and semiconductor process equipment. BACKGROUND
[0002] In the semiconductor process equipment, the reaction cavity is usually configured with a parallel plate electrode structure composed of an upper electrode and a lower electrode. To adapt to the parameter requirements of different process stages, the distance between the two electrode plates needs to be adjusted to optimize the plasma distribution. However, the lower electrode bottom is provided with process gas pipeline, cooling pipeline and electrical signal cable and other factory interface, which causes the axial space to be restricted by the pipeline layout. The existing drive mechanism mostly adopts screw-nut block transmission structure, in which the multi-motor synchronous drive scheme can ensure the uniform stress of the lower electrode, but the layout of multiple power sources leads to the excessive radial size of the drive assembly, which is easy to interfere with the pipeline bundle at the bottom of the lower electrode. If a single-motor offset drive scheme is adopted, the mechanism volume can be reduced, but the asymmetric driving torque will cause the deflection deformation of the electrode support structure, thereby affecting the parallelism of the two electrode plates and the process uniformity. SUMMARY
[0003] The utility model aims at providing a lift drive assembly and semiconductor process equipment, which has the advantages of uniform driving force and small space occupation below the lower electrode.
[0004] To achieve the above-mentioned purpose, the utility model provides a lift drive assembly, which is installed at the bottom of the reaction cavity of a semiconductor process equipment and used for driving the lower electrode arranged in the reaction cavity to move in the vertical direction. The lift drive assembly comprises:
[0005] A fixed cylinder is fixedly connected to the bottom of the reaction cavity, and a first guide groove penetrating the cylinder wall is arranged on the fixed cylinder and arranged in the vertical direction.
[0006] A movable cylinder is sleeved on the fixed cylinder, and the movable cylinder is coaxially installed with the fixed cylinder. A second guide groove penetrating the cylinder wall is arranged on the movable cylinder, and the second guide groove has a horizontal component and a vertical component.
[0007] An activity frame is connected with the lower electrode, and a driving shaft is arranged on the activity frame. The driving shaft penetrates the first guide groove and is embedded in the second guide groove.
[0008] A drive mechanism comprises an output end, and the output end is movably connected to the movable cylinder to drive the movable cylinder to pivot relative to the fixed cylinder. ， The vertical movement of the activity frame is realized.
[0009] Optionally, the second guide groove and the first guide groove have an overlapping area.
[0010] Optionally, the movable frame is provided with a plurality of drive shafts, which are evenly distributed along the circumference of the movable frame; the fixed cylinder is provided with a plurality of first guide grooves; the movable cylinder is provided with a plurality of second guide grooves; the first guide grooves, the second guide grooves and the drive shafts are arranged in a one-to-one correspondence.
[0011] Optionally, the central axis of each of the second guide grooves on the movable cylinder forms a spiral waist-shaped hole on the movable cylinder.
[0012] Optionally, the drive shaft passes through the second guide groove.
[0013] Optionally, the reaction chamber includes a first extension extending downward in a vertical direction, the first extension being annular; the top of the fixed cylinder is fixedly connected to the bottom of the first extension; the movable cylinder further includes a second extension extending upward and sleeved on the first extension.
[0014] Optionally, the lifting drive assembly further includes a bearing disposed between the first extension and the second extension.
[0015] Optionally, the movable cylinder is sleeved around the outer periphery of the fixed cylinder.
[0016] Optionally, the drive mechanism is located on the outside of the movable cylinder.
[0017] Optionally, the drive mechanism is fixedly connected to the bottom outer side of the reaction chamber.
[0018] Optionally, the output end of the drive mechanism is provided with a first gear, and the outer side of the movable cylinder is provided with a second gear. The output end of the drive mechanism and the movable cylinder are connected by meshing of the first gear and the second gear.
[0019] This utility model also provides a semiconductor process apparatus, the semiconductor process apparatus comprising:
[0020] The reaction chamber has an opening at the center of its bottom.
[0021] The lifting drive assembly described above is disposed at the opening;
[0022] The lower electrode is fixedly connected to the movable frame of the lifting drive assembly; the lower electrode moves vertically inside the reaction chamber under the drive of the lifting drive assembly.
[0023] In summary, compared with the prior art, the lifting drive assembly and semiconductor process equipment provided by this utility model have the following beneficial effects:
[0024] The utility model discloses a lifting drive assembly and semiconductor process equipment, through the drive mechanism drive movable cylinder rotation, through movable cylinder and fixed barrel's cooperation with the rotation motion is converted into the vertical direction motion of movable frame, reduces the space below the lower electrode that drive mechanism occupies, and through movable cylinder and fixed cylinder's cooperation, make single motor also can balanced drive lower electrode, avoid the problem of structural deformation due to load bias. BRIEF DESCRIPTION OF DRAWINGS
[0025] Figure 1 It is structural schematic diagram for lifting drive assembly of installation in reaction chamber bottom.
[0026] Figure 2 It is structural schematic diagram for fixed cylinder of lifting drive assembly.
[0027] Figure 3 It is structural schematic diagram for movable cylinder of lifting drive assembly.
[0028] Figure 4 It is structural schematic diagram for movable frame of lifting drive assembly.
[0029] BRIEF DESCRIPTION OF DRAWINGS:
[0030] Fixed cylinder 110
[0031] First guide slot 111
[0032] Connecting flange 112
[0033] Movable cylinder 120
[0034] Second guide slot 121
[0035] Second extension 122
[0036] Movable frame 130
[0037] Drive shaft 131
[0038] Connecting rod 132
[0039] Drive mechanism 140
[0040] Output 141
[0041] Bearing 150
[0042] Reaction chamber 20
[0043] Lower electrode 211
[0044] First extension 212
[0045] Upper electrode 213
[0046] Opening 214
[0047] Wafer W DETAILED DESCRIPTION
[0048] The technical solutions, structural features, achieved purposes and effects of the embodiments of the present application will be described in detail below with reference to the drawings of the embodiments of the present application. Figure 1 ~Appendix Figure 4 The technical solutions, structural features, achieved purposes and effects of the embodiments of the present application will be described in detail below with reference to the drawings of the embodiments of the present application.
[0049] It should be noted that the drawings are very simplified and all use non-precise proportions, only to facilitate, clear and assist in explaining the purpose of the embodiments of the present application, and are not used to limit the conditions of the embodiments of the present application, so they do not have technical substantive significance, any modification of the structure, change of the proportional relationship or adjustment of the size, without affecting the effects and purposes that can be achieved by the present application, should still fall within the scope of the technical content disclosed by the present application.
[0050] It should be noted that in the present application, relationship terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between the entities or operations. Moreover, the terms "include", "contain" or any other variant thereof are intended to cover non-exclusive inclusion, so that the process, method, article or equipment including a series of elements not only includes the explicitly listed elements, but also includes other elements not explicitly listed or inherent to such process, method, article or equipment.
[0051] As shown in Figure 1 The present application provides a lifting drive assembly, which is installed at the bottom of a reaction chamber 20 of a semiconductor process equipment. An upper electrode 213 and a lower electrode 211 are arranged inside the reaction chamber 20. In the reaction chamber 20, the upper electrode 213 includes a gas shower head for introducing reaction gas into the reaction chamber 20; the lower electrode 211 includes a susceptor, the upper surface of which is used to carry a wafer W to be processed; an electric field generated between the upper electrode 213 and the lower electrode 211 ionizes the reaction gas to form a plasma for processing the surface of the wafer W. A lifting drive assembly is arranged below the lower electrode 211 for driving the lower electrode 211 in the reaction chamber 20 to move in the vertical direction, so as to adjust the distance between the upper electrode 213 and the lower electrode 211. The lifting drive assembly includes a fixed cylinder 110, a movable cylinder 120, a movable frame 130 and a driving mechanism 140.
[0052] The fixed cylinder 110 is fixedly connected to the bottom of the reaction chamber 20. The structure of the fixed cylinder 110 is as shown in Figure 2As shown, the fixed cylinder 110 is provided with a first guide slot 111 penetrating the cylinder wall. The first guide slot 111 is arranged in the vertical direction. Specifically, the fixed cylinder 110 is a whole annular part, and a connecting flange 112 is arranged on the side of the fixed cylinder 110 connected with the reaction cavity 20, and the fixed cylinder 110 is connected with the bottom of the reaction cavity 20 through the connecting flange 112.
[0053] As shown, the movable cylinder 120 is sleeved on the fixed cylinder 110, and the movable cylinder 120 is coaxially arranged with the fixed cylinder 110. The specific structure of the movable cylinder 120 is shown in Figure 1 As shown, the movable cylinder 120 is sleeved on the fixed cylinder 110, and the movable cylinder 120 is coaxially arranged with the fixed cylinder 110. The specific structure of the movable cylinder 120 is shown in Figure 3 As shown, the movable cylinder 120 is sleeved on the fixed cylinder 110, and the movable cylinder 120 is coaxially arranged with the fixed cylinder 110. The specific structure of the movable cylinder 120 is shown in
[0054] As shown, the movable cylinder 120 is sleeved on the fixed cylinder 110, and the movable cylinder 120 is coaxially arranged with the fixed cylinder 110. The specific structure of the movable cylinder 120 is shown in Figure 1 As shown, the movable cylinder 120 is sleeved on the fixed cylinder 110, and the movable cylinder 120 is coaxially arranged with the fixed cylinder 110. The specific structure of the movable cylinder 120 is shown in Figure 4 As shown, the movable cylinder 120 is sleeved on the fixed cylinder 110, and the movable cylinder 120 is coaxially arranged with the fixed cylinder 110. The specific structure of the movable cylinder 120 is shown in Figure 1 As shown, in this embodiment, when the movable cylinder 120, the fixed cylinder 110 and the movable frame 130 are installed, the movable frame 130 is located inside the fixed cylinder 110, the movable cylinder 120 is sleeved outside the fixed cylinder 110, and the drive shaft 131 on the side of the movable frame 130 penetrates the first guide slot 111 from inside to outside and is embedded in the second guide slot 121. When the movable cylinder 120 and the fixed cylinder 110 are sleeved and installed, the second guide slot 121 and the first guide slot 111 have an overlapping area, so that the drive shaft 131 on the movable frame 130 can penetrate the first guide slot 111 and the second guide slot 121 at the same time, realizing the movable connection of the movable frame 130, the movable cylinder 120 and the fixed cylinder 110.
[0055] As shown, the movable cylinder 120 is sleeved on the fixed cylinder 110, and the movable cylinder 120 is coaxially arranged with the fixed cylinder 110. The specific structure of the movable cylinder 120 is shown in Figure 1As shown, the driving mechanism 140 comprises an output end 141. The output end 141 is movably connected to the movable cylinder 120 to drive the movable cylinder 120 to pivot relative to the fixed cylinder 110. When the movable cylinder 120 pivots relative to the fixed cylinder 110, the pivoting output of the driving mechanism 140 in the horizontal direction is converted into the vertical movement of the movable frame 130 by the cooperation of the driving shaft 131, the second guide groove 121 and the first guide groove 111. Specifically, the fixed cylinder 110 has the first guide groove 111 in the vertical direction, and the movable cylinder 120 is provided with the second guide groove 121 arranged obliquely. The driving shaft 131 is embedded in the first guide groove 111 and the second guide groove 121 at the same time. When the driving assembly drives the movable cylinder 120 to pivot relative to the fixed cylinder 110, the driving shaft 131 can only move in the vertical direction due to the limiting action of the first guide groove 111. Meanwhile, the second guide groove 121 is arranged obliquely. When the movable cylinder 120 rotates forward in the horizontal direction under the driving of the driving mechanism 140, the overlapping point of the first guide groove 111 and the second guide groove 121 (i.e. the position where the driving shaft 131 is embedded in the first guide groove 111 and the second guide groove 121) constantly rises. When the movable cylinder 120 rotates reversely in the horizontal direction under the driving of the driving mechanism 140, the overlapping point of the first guide groove 111 and the second guide groove 121 (i.e. the position where the driving shaft 131 is embedded in the first guide groove 111 and the second guide groove 121) constantly falls. Thus, the overlapping point embedded in the first guide groove 111 and the second guide groove 121 rises or falls under the driving of the driving mechanism 140. The pivoting movement of the output end 141 of the driving mechanism 140 in the horizontal direction is converted into the movement of the movable frame 130 in the vertical direction. Finally, the rotation movement of the output of the driving mechanism 140 in the horizontal direction is converted into the movement of the movable frame 130 in the vertical direction. In the embodiment of the present application, the cooperation of the movable cylinder 120 and the fixed cylinder 110 enables a single motor to drive the lower electrode 211 to rise and fall in the vertical direction evenly, avoiding the problem of structural deformation caused by load bias.
[0056] As a preferred embodiment, as shown in Figure 4 As shown, the movable frame 130 is provided with a plurality of driving shafts 131, which are uniformly distributed along the circumference of the movable frame 130. The plurality of driving shafts 131 are arranged on the movable frame 130 to enable the load driving the movable frame 130 to move in the vertical direction to be shared by the plurality of driving shafts 131, thereby improving the reliability of each driving shaft 131. Correspondingly, the fixed cylinder 110 is provided with a plurality of first guide grooves 111, and the movable cylinder 120 is provided with a plurality of second guide grooves 121. The first guide grooves 111, the second guide grooves 121 and the driving shafts 131 are arranged one by one.
[0057] As a preferred embodiment, as shown in Figure 3As shown, the central axis of each of the second guide grooves 121 on the movable cylinder 120 forms a spiral waist-shaped hole on the movable cylinder 120. The central axis of the second guide groove 121 is set as a spiral, which makes the drive shaft 131 on the movable frame 130 slide more smoothly in the second guide groove 121, reduces the occurrence of jamming of the drive shaft 131 and the second guide groove 121, and makes the conversion of horizontal rotational motion into vertical motion of the movable frame 130 more stable.
[0058] like Figure 1 As shown, in this embodiment, the drive shaft 131 completely penetrates the second guide groove 121 and extends to the outside of the movable cylinder 120, so as to improve the reliability of the connection between the drive shaft 131 and the movable cylinder 120 and reduce the possibility of the drive shaft 131 coming out of the second guide groove 121.
[0059] In other embodiments, the second guide groove 121 may also be a blind groove, that is, the drive shaft 131 is simply embedded in the second guide groove 121, as long as the movement of the movable frame 130 in the vertical direction can be achieved through the meshing of the second guide groove 121 and the drive shaft 131.
[0060] Continue as Figure 1 As shown, the reaction chamber 20 includes a first extension 212 extending downward in a vertical direction, and the first extension 212 is annular. The first extension 212 is fixedly connected to the outer periphery of the opening 214 below the reaction chamber 20 to achieve a fixed connection between the fixed cylinder 110 and the reaction chamber 20. A connecting flange 112 is provided at the top of the fixed cylinder 110, and the connecting flange 112 is connected to the first extension 212, thereby fixing the top of the fixed cylinder 110 to the bottom of the first extension 212 of the reaction chamber 20.
[0061] The movable cylinder 120 also includes an upwardly extending second extension 122 that sleeves the first extension 212. The second extension 122 on the movable cylinder 120 is at the same vertical height as the first extension 212, that is, the first extension 212 and the second extension 122 are arranged opposite to each other. The lifting drive assembly also includes a bearing 150, which is disposed between the first extension 212 and the second extension 122. In this embodiment, the movable cylinder 120 is disposed outside the fixed cylinder 110, that is, the second extension 122 is located outside the first extension 212. The inner ring of the bearing 150 is fixedly sleeved on the first extension 212, and the outer ring of the bearing 150 is embedded in the inner side of the second extension 122. In this embodiment, a rolling ball bearing is selected to reduce the resistance when the drive mechanism 140 drives the movable cylinder 120 to rotate relative to the fixed cylinder 110.
[0062] In this embodiment, as Figure 1As shown, the movable cylinder 120 is sleeved on the outer periphery of the fixed cylinder 110, and the driving mechanism 140 is arranged outside the movable cylinder 120, so that the driving mechanism 140 does not occupy the space below the lower electrode 211, avoids interference between the driving mechanism 140 and various pipelines below the lower electrode 211, and the space below the lower electrode 211 can be used to install other equipment or pipelines, thereby improving the utilization rate of the space below the lower electrode 211.
[0063] In other embodiments, the movable cylinder 120 can also be sleeved on the inner side of the fixed cylinder 110, the driving mechanism 140 is arranged on the inner side of the movable cylinder 120, and an internal gear is arranged on the inner side of the movable cylinder 120 for meshing with the output shaft of the driving mechanism 140, so that the driving mechanism 140 can drive the movable cylinder 120 to rotate, and the movable frame 130 drives the lower electrode 211 to move in the vertical direction.
[0064] As shown, Figure 1 The output end 141 of the driving mechanism 140 is provided with a first gear. The driving mechanism 140 includes a motor, and the output end 141 of the driving mechanism 140 is the output shaft of the motor, and the first gear is arranged on the output end 141. A second gear is arranged on the outer side of the movable cylinder 120, and the output end 141 of the driving mechanism 140 and the movable cylinder 120 are connected through the first gear and the second gear, and the output torque of the motor is transmitted to the movable cylinder 120 through the first gear and the second gear to drive the movable cylinder 120 to rotate.
[0065] As shown, Figure 1 The utility model also provides a semiconductor process equipment, and the semiconductor process equipment includes a reaction cavity 20, a lifting driving assembly and a lower electrode 211.
[0066] The bottom center position of the reaction cavity 20 is provided with an opening 214. The lifting driving assembly is arranged at the opening 214 of the reaction cavity 20. The lower electrode 211 is fixedly connected to the movable frame 130 of the lifting driving assembly. Specifically, the movable frame 130 is also provided with a connecting rod 132, the connecting rod 132 is arranged in the vertical direction and extends into the reaction cavity 20 through the opening 214 in the bottom of the reaction cavity 20. The bottom of the connecting rod 132 is connected to the movable frame 130. The top of the connecting rod 132 is connected to the lower electrode 211. When it is necessary to take and place the wafer W or adjust the distance between the upper electrode 213 and the lower electrode 211, the lower electrode 211 moves in the vertical direction in the inside of the reaction cavity 20 under the driving of the lifting driving assembly, and the position of the lower electrode 211 in the vertical direction is adjusted. In addition, a bellows or other sealing device is sleeved on the lower periphery of the reaction cavity 20, so as to enclose the driving mechanism 140, the movable cylinder 120, the fixed cylinder 110 and the movable frame 130 on the inner side, so as to avoid that the reaction gas in the reaction cavity 20 leaks to the outside.
[0067] Although the content of the present application has been described in detail by the above preferred embodiments, it should be recognized that the above description should not be considered as a limitation of the present application. After reading the above content, various modifications and substitutions of the present application will be obvious to those skilled in the art. Therefore, the protection scope of the present application should be defined by the appended claims.
Claims
1. A lifting drive assembly, characterized in that, The lifting drive assembly is installed at the bottom of the reaction chamber of the semiconductor process equipment and is used to drive the lower electrode disposed in the reaction chamber to move vertically. The lifting drive assembly includes: A fixed cylinder is fixedly connected to the bottom of the reaction chamber. A first guide groove penetrating the cylinder wall is provided on the fixed cylinder, and the first guide groove is arranged in the vertical direction. A movable cylinder is sleeved on the fixed cylinder, and the movable cylinder and the fixed cylinder are coaxially installed. The movable cylinder is provided with a second guide groove that penetrates the cylinder wall. The second guide groove has a horizontal component and a vertical component. A movable frame is connected to the lower electrode, and a drive shaft is provided on the movable frame. The drive shaft passes through the first guide groove and is embedded in the second guide groove. The drive mechanism includes an output end, which is movably connected to the movable cylinder to drive the movable cylinder to pivot relative to the fixed cylinder. ， Pivoting causes the movable frame to move vertically.
2. The lifting drive assembly as described in claim 1, characterized in that, The movable frame is provided with a plurality of drive shafts, which are evenly distributed along the circumference of the movable frame; the fixed cylinder is provided with a plurality of first guide grooves; the movable cylinder is provided with a plurality of second guide grooves; the first guide grooves, the second guide grooves and the drive shafts are arranged in a one-to-one correspondence.
3. The lifting drive assembly as described in claim 1 or 2, characterized in that, The central axis of each of the second guide grooves on the movable cylinder forms a spiral waist-shaped hole on the movable cylinder.
4. The lifting drive assembly as described in claim 3, characterized in that, The drive shaft passes through the second guide groove.
5. The lifting drive assembly as described in claim 1, characterized in that, The reaction chamber includes a first extension that extends downward in a vertical direction and is annular; the top of the fixed cylinder is fixedly connected to the bottom of the first extension; the movable cylinder also includes a second extension that extends upward and is sleeved on the first extension.
6. The lifting drive assembly as described in claim 5, characterized in that, The lifting drive assembly also includes a bearing disposed between the first extension and the second extension.
7. The lifting drive assembly as described in claim 1, characterized in that, The movable cylinder is fitted onto the outer periphery of the fixed cylinder.
8. The lifting drive assembly as described in claim 7, characterized in that, The drive mechanism is located on the outside of the movable cylinder.
9. The lifting drive assembly as described in claim 8, characterized in that, The drive mechanism is fixedly connected to the bottom outer side of the reaction chamber.
10. The lifting drive assembly as described in claim 9, characterized in that, The output end of the drive mechanism is provided with a first gear, and the outer side of the movable cylinder is provided with a second gear. The output end of the drive mechanism and the movable cylinder are connected by the meshing of the first gear and the second gear.
11. The lifting drive assembly as described in claim 1, characterized in that, The second guide groove and the first guide groove have an overlapping area.
12. A semiconductor process apparatus, characterized in that, The semiconductor process equipment includes: The reaction chamber has an opening at the center of its bottom. The lifting drive assembly as described in any one of claims 1-11 is disposed at the opening; The lower electrode is fixedly connected to the movable frame of the lifting drive assembly; the lower electrode moves vertically inside the reaction chamber under the drive of the lifting drive assembly.