Display module and display device

Abstract

The utility model provides a display module which comprises a display area and a peripheral area located on the periphery of the display area, and the display module comprises a substrate; the display function layer is located on the substrate, and the display function layer comprises a plurality of sub-pixels located in the display area and a plurality of first bonding pads located in the peripheral area; the binding element is located on the side, away from the substrate, of the display function layer, the binding element comprises a plurality of second bonding pads, the second bonding pads are electrically connected with the first bonding pads, the substrate is provided with a first surface facing the display function layer, in at least two adjacent first bonding pads, the second bonding pads are electrically connected with the first bonding pads, and in the at least two adjacent first bonding pads, the second bonding pads are electrically connected with the second bonding pads. The distance between one first bonding pad and the first surface in the direction perpendicular to the first surface is larger than the distance between the other first bonding pad and the first surface in the direction perpendicular to the first surface.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the technical field of display, and in particular, to a display module and a display device. BACKGROUND

[0002] With the continuous development of display technology, silicon-based organic light emitting diode (Organic Light Emitting Diode, OLED for short) display products have attracted widespread attention due to their advantages of high resolution, low power consumption, small size, light weight, etc. They have good application prospects in the near-eye display industry of high-resolution wearable devices, industrial security, medical treatment, etc. How to optimize the structural design of silicon-based OLED display products is one of the topics that display product researchers are concerned about.

[0003] The above information disclosed in this section is only for understanding the background of the inventive concept of the present disclosure, and therefore, the above information can contain information that does not constitute prior art. UTILITY MODEL CONTENT

[0004] In one aspect, a display module is provided, comprising a display area and a peripheral area located at the periphery of the display area, the display module comprising:

[0005] a substrate substrate;

[0006] a display functional layer located on the substrate substrate, the display functional layer comprising a plurality of sub-pixels located in the display area and a plurality of first pads located in the peripheral area; and

[0007] a binding element located on the side of the display functional layer away from the substrate substrate, the binding element comprising a plurality of second pads, the plurality of second pads being electrically connected to the plurality of first pads,

[0008] wherein the substrate substrate has a first surface facing the display functional layer, in at least two adjacent first pads, the distance between one first pad and the first surface in the direction perpendicular to the first surface is greater than the distance between the other first pad and the first surface in the direction perpendicular to the first surface.

[0009] According to some exemplary embodiments, the plurality of first pads comprises a plurality of first sub-pads and a plurality of second sub-pads arranged at intervals, the distance between the first sub-pads and the first surface in the direction perpendicular to the first surface is greater than the distance between the second sub-pads and the first surface in the direction perpendicular to the first surface;

[0010] The plurality of second pads includes a plurality of third sub-pads arranged at intervals and a plurality of fourth sub-pads arranged at intervals, a spacing between the third sub-pads and the first surface in a direction perpendicular to the first surface is less than a spacing between the fourth sub-pads and the first surface in the direction perpendicular to the first surface; and

[0011] The first sub-pads are electrically connected to the fourth sub-pads, and the second sub-pads are electrically connected to the third sub-pads.

[0012] According to some exemplary embodiments, the plurality of first pads are arranged in an array along a first direction and a second direction on the orthographic projection of the substrate, the first direction and the second direction intersect; and

[0013] One side of the orthographic projection of the first sub-pads on the substrate and one side of the orthographic projection of the adjacent second sub-pads on the substrate are adjacent.

[0014] According to some exemplary embodiments, the display functional layer includes a first conductive layer, a first insulating layer located on a side of the first conductive layer close to the substrate, and a second conductive layer located on a side of the first insulating layer close to the substrate;

[0015] The plurality of first sub-pads are located on the first conductive layer, and the plurality of second sub-pads are located on the second conductive layer; and

[0016] The first insulating layer includes a plurality of first insulating portions arranged at intervals, the second sub-pads are located between adjacent first insulating portions, and the first sub-pads are located on a side of the first insulating portions away from the substrate.

[0017] According to some exemplary embodiments, the binding element includes a fourth conductive layer close to the display functional layer, a third insulating layer located on a side of the fourth conductive layer away from the display functional layer, and a fifth conductive layer located on a side of the third insulating layer away from the display functional layer;

[0018] The plurality of third sub-pads are located on the fourth conductive layer, and the plurality of fourth sub-pads are located on the fifth conductive layer;

[0019] The third insulating layer includes a plurality of third insulating portions arranged at intervals, the fourth sub-pads are located between adjacent third insulating portions, and the third sub-pads are located on a side of the third insulating portions close to the substrate;

[0020] A portion of the first insulating portions is located between adjacent third insulating portions, and a first sub-pad on the first insulating portion is electrically connected to the fourth sub-pads; and

[0021] A portion of the third insulating portion is located between adjacent first insulating portions, and a third sub-pad on the third insulating portion is electrically connected to the second sub-pad.

[0022] According to some exemplary embodiments, the display function layer further comprises a second insulating layer located on a side of the second conductive layer close to the substrate, and a third conductive layer located on a side of the second insulating layer close to the substrate;

[0023] The second conductive layer further comprises a plurality of first transfer portions located between adjacent second sub-pads and spaced apart from the second sub-pads, and the first insulating layer comprises a plurality of first vias, and a plurality of first sub-pads are respectively electrically connected to a plurality of first transfer portions through a plurality of first vias; and

[0024] The third conductive layer comprises a plurality of first signal lines, the second insulating layer comprises a plurality of second vias, and a plurality of first transfer portions and a plurality of second sub-pads are respectively electrically connected to a plurality of first signal lines through a plurality of second vias; and / or

[0025] The binding element further comprises a fourth insulating layer located on a side of the fifth conductive layer away from the substrate, and a sixth conductive layer located on a side of the fourth insulating layer away from the substrate;

[0026] The fifth conductive layer further comprises a plurality of second transfer portions located between adjacent fourth sub-pads and spaced apart from the fourth sub-pads, and the third insulating layer comprises a plurality of third vias, and a plurality of third sub-pads are respectively electrically connected to a plurality of second transfer portions through a plurality of third vias; and

[0027] The sixth conductive layer comprises a plurality of second signal lines, the fourth insulating layer comprises a plurality of fourth vias, and a plurality of second transfer portions and a plurality of third sub-pads are respectively electrically connected to a plurality of second signal lines through a plurality of fourth vias.

[0028] According to some exemplary embodiments, the display module further comprises first conductive particles and second conductive particles, the first pad is electrically connected to the second pad through the first conductive particles, and the second conductive particles are spaced apart from at least one of the first pad and the second pad; and

[0029] The distance between the surface of the third sub-pad away from the substrate and the surface of the first sub-pad close to the substrate in a direction perpendicular to the first surface is greater than or equal to the particle size of the second conductive particles.

[0030] According to some exemplary embodiments, the display module further includes first conductive particles and second conductive particles, the first pad is electrically connected with the second pad through the first conductive particles and the second conductive particles, and the second conductive particles are arranged to be spaced apart from at least one of the first pad and the second pad.

[0031] The interval of the first insulating portion and the adjacent third insulating portion in a direction parallel to the first surface is less than or equal to twice the particle size of the second conductive particles.

[0032] According to some exemplary embodiments, the display module further includes first conductive particles and second conductive particles, the first pad is electrically connected with the second pad through the first conductive particles and the second conductive particles, and the second conductive particles are arranged to be spaced apart from at least one of the first pad and the second pad.

[0033] In at least two of the first pads, the two first pads are respectively spaced apart from the first surface by an equal interval, a first corner portion of one of the first pads is opposite to a second corner portion of the other first pad, and the interval between the orthogonal projection of the first corner portion on the substrate and the orthogonal projection of the second corner portion on the substrate is greater than the particle size of the second conductive particles.

[0034] According to some exemplary embodiments, the surface of the first pad facing the second pad is provided with a recess, and / or the surface of the second pad facing the first pad is provided with a recess.

[0035] According to some exemplary embodiments, the cross-sectional shape of the recess perpendicular to the first surface includes at least one of an arc shape, a rectangular shape, a trapezoidal shape, and a triangular shape.

[0036] According to some exemplary embodiments, the display module further includes first conductive particles and second conductive particles, the first pad is electrically connected with the second pad through the first conductive particles and the second conductive particles, and the second conductive particles are arranged to be spaced apart from at least one of the first pad and the second pad.

[0037] The orthogonal projection of the recess on the substrate has a size in at least one direction that is greater than or equal to the particle size of the second conductive particles.

[0038] According to some exemplary embodiments, the first pad and the second pad are both provided with the recess, and the depth of the recess in a direction perpendicular to the first surface is less than or equal to one-half of the particle size of the second conductive particles; or

[0039] One of the first pad and the second pad is provided with the recess, and the depth of the recess in a direction perpendicular to the first surface is less than or equal to the particle size of the second conductive particles.

[0040] According to some exemplary embodiments, a thickness of the first insulating layer in a direction perpendicular to the first surface is equal to a thickness of the third insulating layer in a direction perpendicular to the first surface.

[0041] According to some exemplary embodiments, a shape of a footprint of the first pad on the substrate includes a rectangle, and footprints of a plurality of the first pads on the substrate are closely arranged along a first direction and a second direction, the first direction being perpendicular to the second direction.

[0042] Two of the first pads adjacent along the first direction include a first sub-pad and a second sub-pad, and two of the first pads adjacent along the second direction include a first sub-pad and a second sub-pad.

[0043] A distance between the first sub-pad and the first surface in a direction perpendicular to the first surface is greater than a distance between the second sub-pad and the first surface in a direction perpendicular to the first surface.

[0044] According to some exemplary embodiments, a shape of a footprint of the first pad on the substrate includes a hexagon, and footprints of a plurality of the first pads on the substrate are arranged in a honeycomb shape.

[0045] Among two of the first pads adjacent along a second direction and one of the first pads adjacent to both of the two first pads along a first direction, distances between the three first pads and the first surface in a direction perpendicular to the first surface are different from each other, the first direction being perpendicular to the second direction.

[0046] According to some exemplary embodiments, a plurality of the first pads includes a plurality of first-type pads and a plurality of second-type pads, an area of a footprint of the first-type pad on the substrate being greater than an area of a footprint of the second-type pad on the substrate.

[0047] According to some exemplary embodiments, a plurality of the first pads includes a plurality of pad groups, and the plurality of pad groups are arranged into at least one row along a first direction.

[0048] The pad group includes one of the first-type pads and two of the second-type pads, in the pad group, the two of the second-type pads are arranged adjacent along a second direction, the two of the second-type pads and the first-type pad are arranged adjacent along a first direction, the first direction being perpendicular to the second direction.

[0049] In the pad group, the intervals of two second-type pads and one first-type pad from the first surface in the direction perpendicular to the first surface are different from each other.

[0050] According to some exemplary embodiments, the plurality of pad groups are arranged in at least two rows, in the pad groups of adjacent two rows, the first-type pads in one row of pad groups are arranged adjacent to the second-type pads in another row of pad groups in the second direction.

[0051] In another aspect, a display device is provided, comprising the display module according to any one of the above. BRIEF DESCRIPTION OF DRAWINGS

[0052] Other objects and advantages of the present disclosure will be apparent and help to understand the present disclosure by the following description of the present disclosure with reference to the accompanying drawings.

[0053] Figure 1 A plan view of a silicon-based display substrate in the prior art before and after cutting is schematically shown.

[0054] Figure 2 A plan view of a bonding pad of a silicon-based display substrate in the prior art is schematically shown.

[0055] Figure 3 A plan view of a display module according to some embodiments of the present disclosure is schematically shown.

[0056] Figure 4 A plan view of a display module according to some other embodiments of the present disclosure is schematically shown.

[0057] Figure 5 A cross-sectional view of a display module according to some embodiments of the present disclosure is schematically shown.

[0058] Figure 6 A cross-sectional view of a first pad of a display module according to some embodiments of the present disclosure is schematically shown.

[0059] Figure 7 A cross-sectional view of a first pad of a display module according to some embodiments of the present disclosure is schematically shown.

[0060] Figure 8 A cross-sectional view of a first pad of a display module according to some embodiments of the present disclosure is schematically shown.

[0061] Figure 9 A cross-sectional view of a first pad of a display module according to some embodiments of the present disclosure is schematically shown.

[0062] Figure 10A plan view of a first pad of a display module is schematically shown in accordance with some embodiments of the present disclosure.

[0063] Figure 11 A plan view of a first pad of a display module is schematically shown in accordance with some embodiments of the present disclosure. Figure 10 An enlarged view of the middle region M.

[0064] Figure 12 A plan view of a first pad of a display module is schematically shown in accordance with some embodiments of the present disclosure.

[0065] Figure 13 A plan view of a first pad of a display module is schematically shown in accordance with some embodiments of the present disclosure.

[0066] It is to be noted that, for the sake of clarity, the size of layers, structures or regions can be exaggerated or reduced in the drawings used to describe embodiments of the present disclosure, i.e. the drawings are not drawn to scale. DETAILED DESCRIPTION

[0067] In the following description, for the purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of the various exemplary embodiments. It is apparent, however, that various exemplary embodiments can be practiced without using these specific details or with one or more equivalent arrangements. In other instances, well-known structures and devices are shown in block diagram form in order to avoid unnecessarily obscuring the various exemplary embodiments. Furthermore, various exemplary embodiments can be different from one another but not necessarily mutually exclusive. For example, a specific shape, configuration, and characteristic of an exemplary embodiment can be used or implemented in another exemplary embodiment without departing from the inventive concept.

[0068] In the drawings, the size and relative sizes of elements and regions can be exaggerated for clarity and / or descriptive purposes. As such, the dimensions and relative sizes of various elements and regions shown in the figures can not be drawn to scale. When an exemplary embodiment can be implemented differently, a specific process sequence can be performed differently from the described order. For example, two consecutively described processes can be performed substantially simultaneously or in reverse order to the described order. Furthermore, the same reference numerals can denote the same elements.

[0069] When an element is described as being "on" another element, "connected to" another element, or "attached to" another element, the element may be directly on, directly connected to, or directly attached to the other element, or there may be intermediate elements present. However, when an element is described as being "directly on" another element, "directly connected to" another element, or "directly attached to" another element, there are no intermediate elements. Other terms and / or expressions used to describe relationships between elements should be interpreted in a similar manner, such as "between" versus "directly between," "adjacent" versus "directly adjacent," or "on" versus "directly on," etc. Furthermore, the term "connection" can refer to a physical connection, an electrical connection, a communication connection, and / or a fluid connection. Additionally, the X-axis, Y-axis, and Z-axis are not limited to the three axes of a Cartesian coordinate system and can be interpreted in a broader sense. For example, the X-axis, Y-axis, and Z-axis may be perpendicular to each other, or they may represent different directions that are not perpendicular to each other. For the purposes of this disclosure, “at least one of X, Y, and Z” and “at least one selected from the group consisting of X, Y, and Z” can be interpreted as only X, only Y, only Z, or any combination of two or more of X, Y, and Z such as XYZ, XY, YZ, and XZ. As used herein, the term “and / or” includes any and all combinations of one or more of the listed related items.

[0070] It should be understood that although the terms first, second, etc., may be used herein to describe different elements, these elements should not be limited by these terms. These terms are merely used to distinguish one element from another. For example, without departing from the scope of the exemplary embodiments, a first element may be named a second element, and similarly, a second element may be named a first element.

[0071] Figure 1 The diagram schematically shows a silicon-based display substrate before and after dicing. Figure 2 A schematic plan view of bonding pads of a silicon-based display substrate in the related art is shown.

[0072] Reference Figure 1 The fabrication process of a silicon-based OLED display substrate includes: forming a circuit structure for driving the display on a wafer using semiconductor processes, such as CMOS processes, and then forming an array of OLED devices on the circuit structure. Figure 1 As shown in the left figure, multiple display substrate PNL related structures are formed on a wafer, and multiple display substrate PNL arrays are arranged on a silicon substrate.

[0073] Multiple display substrates (PNLs) can be obtained by cutting through a cutting process. A planar view of a display substrate 10 is shown below. Figure 1As shown in the right view, the display substrate PNL includes a display region AA and a peripheral region NA located at the periphery of the display region AA. A plurality of sub-pixels are arranged in the display region AA, and a plurality of bonding pads Pad are arranged in the peripheral region NA.

[0074] With reference to Figure 1 and Figure 2 The plurality of bonding pads Pad can include a plurality of first bonding pads Pa, a plurality of second bonding pads Pb, and a plurality of third bonding pads Pc. The plurality of first bonding pads Pa are arranged in multiple rows and are spaced apart from each other, and are used for electrical connection with the driving chip. The plurality of third bonding pads Pc are located on the side of the plurality of first bonding pads Pa away from the display region AA, and are used for connecting a test device to perform performance testing on the display substrate 10. The plurality of second bonding pads Pb are located on the side of the plurality of third bonding pads Pc away from the display region AA, and are arranged in two rows and are spaced apart from each other, and are used for electrical connection with the flexible circuit board.

[0075] At present, with the gradual increase of the resolution of the display substrate, the number of bonding pads also increases, and the space occupied by the bonding pads in the display substrate is relatively large, which leads to a small number of display substrates that can be produced from a wafer, and high manufacturing cost. In addition, it also leads to a wide frame on the side of the display substrate where the bonding pads are arranged, which is not conducive to realizing a narrow frame display.

[0076] Figure 3 A plan view of a display module according to some embodiments of the present disclosure is schematically shown. Figure 4 A plan view of a display module according to some other embodiments of the present disclosure is schematically shown.

[0077] With reference to Figure 3 The display module includes a display substrate 10 and a bonding element 20 electrically connected to the display substrate 10. The display substrate 10 includes a substrate 100 and a display functional layer 200 located on the substrate 100, and the display functional layer 200 includes a plurality of sub-pixels SP located in a display region AA and a plurality of first pads P1 located in a peripheral region NA. The plurality of sub-pixels SP are arranged in an array along a first direction X and a second direction Y, and one sub-pixel SP includes a pixel driving circuit and a light emitting device located on the pixel driving circuit, for example, which can include an OLED light emitting device.

[0078] The display substrate 10 can include a first binding area BA1 and a second binding area BA2, the first binding area BA1 and the second binding area BA2 can be located at one side of the display area AA along the second direction Y, and the second binding area BA2 is located at the side of the first binding area BA1 away from the display area AA. The binding element 20 includes a driving chip IC and a flexible circuit board FPC, the driving chip IC is electrically connected with a plurality of first pads P1 located in the first binding area BA1, and the flexible circuit board FPC is electrically connected with a plurality of first pads P1 located in the second binding area BA2.

[0079] According to some exemplary embodiments, referring to Figure 4 , the related circuit of the driving chip IC can also be integrated in the substrate 100, and the display substrate 10 only needs to be electrically connected with the flexible circuit board FPC, that is, the display substrate 10 can only include the second binding area BA2, and the flexible circuit board FPC is electrically connected with a plurality of first pads P1 located in the second binding area BA2.

[0080] According to some exemplary embodiments, the substrate 100 can be a silicon-based substrate, the active layer of the transistor in the driving circuit is located in the silicon-based substrate, and the display substrate 10 is a silicon-based OLED display substrate.

[0081] According to some exemplary embodiments, the substrate 100 can be a glass substrate or a flexible substrate including a polyimide film, the active layer of the transistor in the driving circuit is located on the substrate 100, and the display substrate 10 can be a glass-based OLED display substrate 10 or a Micro LED display substrate 10, a liquid crystal display substrate 10, etc.

[0082] Figure 5 The cross-sectional view of the display module according to some embodiments of the present disclosure is schematically shown.

[0083] Referring to Figure 5 , the substrate 100 has a first surface 100a facing the display functional layer 200, and in the at least two adjacent first pads P1, the distance G1 between one first pad P1 and the first surface 100a in the direction perpendicular to the first surface 100a is greater than the distance G2 between the other first pad P1 and the first surface 100a in the direction perpendicular to the first surface 100a. By staggered arrangement of the adjacent first pads P1, the distance between the adjacent first pads P1 (understood as the distance between the orthogonal projections of the adjacent first pads P1 on the substrate 100) can be greatly reduced, thereby effectively reducing the space in the display substrate 10 for arranging a plurality of first pads P1. At the same time, due to the staggered structure, the two adjacent first pads P1 are spaced apart by a certain distance in the direction perpendicular to the first surface 100a, effectively avoiding the risk of short circuit of the two adjacent first pads P1.

[0084] It should be noted that the distance between the pad and the first surface 100a herein should be understood as the distance between the surface of the pad facing the substrate 100 and the first surface 100a.

[0085] It should be noted that, due to the limitation of the precision of the patterning process and other factors, it is currently still difficult to make the edge portions of the orthographic projections of the adjacent first pads P1 on the substrate 100 coincide, but the distance between the orthographic projections of the adjacent first pads P1 on the substrate 100 can be greatly reduced.

[0086] For example, the distance between the orthographic projections of the adjacent first pads P1 on the substrate 100 is less than or equal to one third of the size of the first pad P1 along the first direction X (or the second direction Y), or the distance between the orthographic projections of the adjacent first pads P1 on the substrate 100 is less than or equal to one fifth of the size of the first pad P1 along the first direction X (or the second direction Y), or the distance between the orthographic projections of the adjacent first pads P1 on the substrate 100 is less than or equal to one tenth of the size of the first pad P1 along the first direction X (or the second direction Y).

[0087] In addition, Figure 5 The schematic cross-sectional view can be a cross-sectional view taken along Figure 3 the center line AA', or Figure 5 The schematic cross-sectional view can be a cross-sectional view taken along Figure 3 the center line BB', or Figure 5 The schematic cross-sectional view can be a cross-sectional view taken along Figure 4 the center line CC'. That is, according to the actual process requirements, the first pad P1 electrically connected with the driving chip IC, and / or the first pad P1 electrically connected with the flexible circuit board FPC can be arranged according to Figure 5 the schematic structure.

[0088] According to some exemplary embodiments, with reference to Figure 5The plurality of first pads P1 include a plurality of first sub-pads P11 arranged at intervals and a plurality of second sub-pads P12 arranged at intervals, and a spacing G1 of the first sub-pads P11 from the first surface 100a in a direction perpendicular to the first surface 100a is greater than a spacing G2 of the second sub-pads P12 from the first surface 100a in the direction perpendicular to the first surface 100a. The binding element 20 has a plurality of second pads P2 facing the display substrate 10, and the plurality of second pads P2 include a plurality of third sub-pads P21 arranged at intervals and a plurality of fourth sub-pads P22 arranged at intervals, and a spacing G3 of the third sub-pads P21 from the first surface 100a in a direction perpendicular to the first surface 100a is less than a spacing G4 of the fourth sub-pads P22 from the first surface 100a in the direction perpendicular to the first surface 100a. The first sub-pads P11 are electrically connected to the fourth sub-pads P22, and the second sub-pads P12 are electrically connected to the third sub-pads P21.

[0089] By also arranging the plurality of second pads P2 on one side of the binding element 20 in a staggered manner, the first sub-pads P11 farther from the substrate 100 in the display substrate 10 are electrically connected to the fourth sub-pads P22 farther from the substrate 100 in the binding element 20, and the second sub-pads P12 closer to the substrate 100 in the display substrate 10 are electrically connected to the third sub-pads P21 closer to the substrate 100 in the binding element 20, so that the binding element 20 and the display substrate 10 are reliably electrically connected.

[0090] According to some exemplary embodiments, referring to Figure 5 The display functional layer 200 includes a first conductive layer M1, a first insulating layer N1 located on a side of the first conductive layer M1 close to the substrate 100, and a second conductive layer M2 located on a side of the first insulating layer N1 close to the substrate 100. The plurality of first sub-pads P11 are located on the first conductive layer M1, and the plurality of second sub-pads P12 are located on the second conductive layer M2. The first insulating layer N1 includes a plurality of first insulating portions N11 arranged at intervals, the second sub-pads P12 are located between adjacent first insulating portions N11, and the first sub-pads P11 are located on a side of the first insulating portions N11 away from the substrate 100. By arranging the first sub-pads P11 and the second sub-pads P12 in different conductive layers and elevating the first sub-pads P11 by the first insulating portions N11, the plurality of first sub-pads P11 and the plurality of second sub-pads P12 are arranged in a staggered manner.

[0091] According to some exemplary embodiments, referring to Figure 5The binding element 20 includes a fourth conductive layer M4 close to the display functional layer 200, a third insulating layer N3 located on a side of the fourth conductive layer M4 away from the display functional layer 200, and a fifth conductive layer M5 located on a side of the third insulating layer N3 away from the display functional layer 200. A plurality of third sub-pads P21 are located on the fourth conductive layer M4, and a plurality of fourth sub-pads P22 are located on the fifth conductive layer M5. The third insulating layer N3 includes a plurality of third insulating portions N31 arranged at intervals, the fourth sub-pads P22 are located between adjacent third insulating portions N31, and the third sub-pads P21 are located on a side of the third insulating portions N31 close to the substrate 100. By arranging the third sub-pads P21 and the fourth sub-pads P22 in different conductive layers and elevating the third sub-pads P21 by the third insulating portions N31, the plurality of third sub-pads P21 and the plurality of fourth sub-pads P22 are arranged in staggered layers.

[0092] According to some exemplary embodiments, referring to Figure 5 A portion of the first insulating portions N11 is located between adjacent third insulating portions N31, and the first sub-pads P11 on the first insulating portions N11 are electrically connected to the fourth sub-pads P22. A portion of the third insulating portions N31 is located between adjacent first insulating portions N11, and the third sub-pads P21 on the third insulating portions N31 are electrically connected to the second sub-pads P12.

[0093] According to some exemplary embodiments, referring to Figure 5 The thickness THK1 of the first insulating layer N1 in a direction perpendicular to the first surface 100a is equal to the thickness THK2 of the third insulating layer N3 in the direction perpendicular to the first surface 100a, i.e., the thickness THK1 of the first insulating portions N11 in the direction perpendicular to the first surface 100a is equal to the thickness THK2 of the third insulating portions N31 in the direction perpendicular to the first surface 100a. The structure of the plurality of first pads P1 in the display substrate 10 can be made substantially complementary to the structure of the plurality of second pads P2 in the binding element 20, so as to improve the connection reliability of the first pads P1 and the second pads P2.

[0094] According to some exemplary embodiments, referring to Figure 5The display functional layer 200 further includes a second insulating layer N2 located on the side of the second conductive layer M2 close to the substrate 100, and a third conductive layer M3 located on the side of the second insulating layer N2 close to the substrate 100. The second conductive layer M2 further includes a plurality of first transfer portions M21 located between and spaced apart from the adjacent second sub-pads P12, and the first insulating layer N1 includes a plurality of first vias V01, and the plurality of first sub-pads P11 are respectively electrically connected to the plurality of first transfer portions M21 through the plurality of first vias V01. The third conductive layer M3 includes a plurality of first signal lines L1, the second insulating layer N2 includes a plurality of second vias V02, and the plurality of first transfer portions M21 and the plurality of second sub-pads P12 are respectively electrically connected to the plurality of first signal lines L1 through the plurality of second vias V02. In this way, the first sub-pads P11 can be electrically connected to the first signal lines L1 through the first transfer portions M21, and the second sub-pads P12 are directly electrically connected to the first signal lines L1 through the second vias V02.

[0095] For example, the first via V01 and the second via V02 can be tungsten vias, that is, the tungsten filled in the first via V01 and the second via V02 electrically connects the structures on the upper side and the lower side of the via.

[0096] For example, the process of forming the first sub-pads P11, the second sub-pads P12, the first transfer portions M21 and the first signal lines L1, and electrically connecting the aforementioned structures can include the following steps:

[0097] forming the third conductive layer M3, that is, forming the plurality of first signal lines L1 spaced apart;

[0098] forming the second insulating layer N2 on the third conductive layer M3, the second insulating layer N2 has a plurality of second vias V02 formed therein, the orthographic projections of the plurality of second vias V02 on the substrate 100 respectively intersect and overlap the orthographic projections of the plurality of first signal lines L1 on the substrate 100, and then filling a conductive material (for example, including tungsten) in the second via V02;

[0099] forming the second conductive layer M2 on the second insulating layer N2, that is, forming the plurality of second sub-pads P12 and the plurality of first transfer portions M21 spaced apart, the plurality of second sub-pads P12 are respectively electrically connected to the plurality of first signal lines L1 through the plurality of second vias V02, and the plurality of first transfer portions M21 are respectively electrically connected to the plurality of first signal lines L1 through another plurality of second vias V02;

[0100] A first insulating layer N1 is formed on the second conductive layer M2, and a plurality of first vias V01 are formed in the first insulating layer N1, and the orthogonal projections of the plurality of first vias V01 on the substrate 100 respectively overlap the orthogonal projections of the plurality of first conversion portions M21 on the substrate 100; and a conductive material is filled in the first vias V01;

[0101] A conductive film is formed on the first insulating layer N1, and a mask is used to etch the conductive film and the first insulating layer N1 in the same patterning process to form a plurality of first insulating portions N11 and a plurality of first sub-pads P11 on the plurality of insulating portions, the first sub-pads P11 are electrically connected to the first conversion portions M21 through the first vias V01 in the first insulating portions N11, and the interval regions of the plurality of first insulating portions N11 expose the plurality of second sub-pads P12.

[0102] It should be noted that since the first sub-pads P11 and the first insulating portions N11 are formed by the same patterning process, the side walls of the first sub-pads P11 and the side walls of the first insulating portions N11 can be flush, and the cross-sectional shape of the first sub-pads P11 and the first insulating portions N11 in the direction perpendicular to the first surface 100a is approximately trapezoidal. However, since the second sub-pads P12 and the first insulating portions N11 are formed by two patterning processes, it may be difficult for the side walls of the second sub-pads P12 to exactly fit the side walls of the first insulating portions N11, and there can be a certain gap (as shown in FIG. 8) between the side walls of the second sub-pads P12 and the side walls of the first insulating portions N11, or the first insulating portions N11 can edge the edges of the second sub-pads P12. Figure 5

[0103] It should be noted that the number of conductive layers in the display functional layer 200 can be greater than or equal to three layers, and when the display functional layer 200 has four or more conductive layers, the first pads P1 and the first signal lines L1 can be distributed in specific three conductive layers as needed. For example, by specifically selecting the film layers, the interval between the first conductive layer M1 and the second conductive layer M2 in the direction perpendicular to the first surface 100a can be greater than the interval between the second conductive layer M2 and the third conductive layer M3 in the direction perpendicular to the first surface 100a, so as to ensure that the adjacent first sub-pads P11 and the second sub-pads P12 are spaced apart by a sufficient distance in the direction perpendicular to the first surface 100a.

[0104] According to some exemplary embodiments, reference is made to Figure 5 ​The binding element 20 further includes a fourth insulating layer N4 located on the side of the fifth conductive layer M5 away from the substrate 100, and a sixth conductive layer M6 located on the side of the fourth insulating layer N4 away from the substrate 100. The fifth conductive layer M5 further includes a plurality of second transfer portions M51 located between and spaced apart from the adjacent fourth sub-pads P22, and the third insulating layer N3 includes a plurality of third vias V03, and the plurality of third sub-pads P21 are electrically connected to the plurality of second transfer portions M51 through the plurality of third vias V03. The sixth conductive layer M6 includes a plurality of second signal lines L2, and the fourth insulating layer N4 includes a plurality of fourth vias V04, and the plurality of second transfer portions M51 and the plurality of third sub-pads P21 are electrically connected to the plurality of second signal lines L2 through the plurality of fourth vias V04. In this way, the third sub-pads P21 can be electrically connected to the second signal lines L2 through the second transfer portions M51, and the fourth sub-pads P22 are directly electrically connected to the second signal lines L2 through the fourth vias V04.

[0105] It should be noted that the processes of forming the third sub-pads P21, the fourth sub-pads P22, the second transfer portions M51 and the second signal lines L2 can refer to the processes of forming the first sub-pads P11, the second sub-pads P12, the first transfer portions M21 and the first signal lines L1 provided in the foregoing, which will not be described here.

[0106] According to some exemplary embodiments, with reference to Figure 5 The display module further includes first conductive particles A1 and second conductive particles A2, and the first pad P1 is electrically connected to the second pad P2 through the first conductive particles A1, and the second conductive particles A2 are spaced apart from at least one of the first pad P1 and the second pad P2.

[0107] The first pad P1 and the second pad P2 are electrically connected through the first conductive particles A1, and in the process of binding, the first conductive particles A1 located between the first pad P1 and the second pad P2 are subjected to a pressure in a direction perpendicular to the first surface 100a, the insulating film of the first conductive particles A1 is broken, and the first conductive particles A1 after being extruded are in the shape of a round cake, the area of the orthographic projection on the substrate 100 increases, that is, the contact area with the first pad P1 and the second pad P2 increases, and the first pad P1 and the second pad P2 can be reliably electrically connected.

[0108] However, in this process, a part of the conductive particles will roll to other positions and not exist between the first pad P1 and the second pad P2, and this part of the conductive particles is the second conductive particles A2, which will not be extruded in the process of binding. The second conductive particles A2 are approximately spherical in shape, and the particle size (diameter) thereof is D.

[0109] For example, the conductive particles (including the first conductive particles A1 and the second conductive particles A2) can be ACF (Anisotropic Conductive Film) conductive particles.

[0110] According to some exemplary embodiments, referring to Figure 5 , the interval H1 of the third sub-pad P21 away from the surface of the substrate 100 and the first sub-pad P11 close to the surface of the substrate 100 in the direction perpendicular to the first surface 100a is greater than or equal to the particle size D of the second conductive particles A2. In this way, the problem of short-circuiting between the adjacent third sub-pad P21 and the first sub-pad P11 caused by the second conductive particles A2 that may be stuck between the first insulating part N11 and the third insulating part N31 can be effectively avoided. For example, the interval H1 can be achieved by designing the thickness of the first insulating part N11 to be greater than or equal to the particle size D of the second conductive particles A2.

[0111] According to some exemplary embodiments, referring to Figure 5 , the interval W1 of the first insulating part N11 and the adjacent third insulating part N31 in the direction parallel to the first surface 100a is less than or equal to twice the particle size D of the second conductive particles A2.

[0112] When designing, the interval W1 of the first insulating part N11 and the adjacent third insulating part N31 in the direction parallel to the first surface 100a is designed to be less than or equal to the particle size D of the second conductive particles A2, so that during the binding process, the conductive particles between the first sub-pad P11 and the fourth sub-pad P22 will not roll off from the gap between the first insulating part N11 and the third insulating part N31, that is, more conductive particles are limited between the first sub-pad P11 and the fourth sub-pad P22, so as to improve the connection reliability of the first sub-pad P11 and the fourth sub-pad P22.

[0113] However, in the actual binding process, due to factors such as alignment deviation, the interval W1 of the third insulating part N31 and the first insulating part N11 on the opposite side can not be equal, and in some cases, the third insulating part N31 can be in contact with the first insulating part N11 on one side and the interval W1 of the first insulating part N11 on the other side can be 2D. With this setting, the interval W1 of the first insulating part N11 and the adjacent third insulating part N31 in the direction parallel to the first surface 100a is less than or equal to twice the particle size D of the second conductive particles A2.

[0114] Figure 6 A cross-sectional view of a first pad of a display module according to some embodiments of the present disclosure is schematically shown.

[0115] According to some exemplary embodiments, referring to Figure 5 andFigure 6 The surface of the first pad P1 facing the second pad P2 is provided with a recess K, which is recessed towards the side away from the second pad P2. The recess K can be used to limit the conductive particles, so as to avoid the conductive particles from rolling off the first pad P1, so that the first pad P1 and the second pad P2 are electrically connected through more conductive particles (i.e. the first conductive particles A1), thereby increasing the connection reliability of the first pad P1 and the second pad P2.

[0116] According to some exemplary embodiments, the surface of the first pad P1 facing the second pad P2 is provided with a plurality of recesses K, which can be arranged in an array.

[0117] According to some exemplary embodiments, the surface of the second pad P2 facing the first pad P1 is provided with a recess K, which is recessed towards the side away from the first pad P1. The structure of the recess K provided on the second pad P2 is similar to that of the recess K provided on the first pad P1, that is, it can be set according to Figure 6 .

[0118] In actual application, the recess K can be provided on one of the first pad P1 and the second pad P2, or the recess K can be provided on both the first pad P1 and the second pad P2.

[0119] According to some exemplary embodiments, with reference to Figure 5 and Figure 6 , the cross-sectional shape of the recess K perpendicular to the first surface 100a can include an arc shape, for example, can include a semicircular shape.

[0120] Figure 7 A cross-sectional view of a first pad of a display module according to some embodiments of the present disclosure is schematically shown. Figure 8 A cross-sectional view of a first pad of a display module according to some embodiments of the present disclosure is schematically shown. Figure 9 A cross-sectional view of a first pad of a display module according to some embodiments of the present disclosure is schematically shown.

[0121] According to some exemplary embodiments, with reference to Figure 5 , Figure 7 , Figure 8 or Figure 9 , the cross-sectional shape of the recess K perpendicular to the first surface 100a can further include a rectangular shape (with reference to Figure 7 ), a trapezoidal shape (with reference to Figure 8 ) or a triangular shape (with reference to Figure 9 ). When the cross-sectional shape of the recess K perpendicular to the first surface 100a is a trapezoidal shape, it is specifically set as an inverted trapezoidal shape.

[0122] According to some exemplary embodiments, with reference toFigure 6 , Figure 7 or Figure 8 The plurality of recesses K can be arranged at intervals.

[0123] According to some exemplary embodiments, with reference to Figure 9 The plurality of recesses K can be connected in sequence.

[0124] According to some exemplary embodiments, with reference to Figure 6 , Figure 7 or Figure 8 The size W2 of the projection of the recess K on the substrate 100 in at least one direction is greater than or equal to the particle size D of the second conductive particles A2. For example, the size W2 of the recess K in the first direction X can be greater than or equal to the particle size D of the second conductive particles A2. For another example, the size W2 of the recess K in the second direction Y can also be greater than or equal to the particle size D of the second conductive particles A2.

[0125] According to some exemplary embodiments, with reference to Figure 6 , Figure 7 or Figure 8 One of the first pad P1 and the second pad P2 is provided with a recess K, and the depth H2 of the recess K in the direction perpendicular to the first surface 100a is less than or equal to the particle size D of the second conductive particles A2. This ensures that the conductive particles falling into the recess K can be in contact with both the first pad P1 and the second pad P2, so that the conductive particles can effectively electrically connect the first pad P1 and the second pad P2.

[0126] According to some exemplary embodiments, with reference to Figure 6 , Figure 7 or Figure 8 Both the first pad P1 and the second pad P2 are provided with a recess K, and the depth H2 of the recess K in the direction perpendicular to the first surface 100a is less than or equal to half of the particle size D of the second conductive particles A2. This ensures that the conductive particles falling into the recess K of both the first pad P1 and the second pad P2 can be in contact with both the first pad P1 and the second pad P2, so that the conductive particles can effectively electrically connect the first pad P1 and the second pad P2.

[0127] According to some exemplary embodiments, with reference to Figure 9 The size W2 of the projection of the recess K on the substrate 100 in at least one direction or the depth H2 of the recess K in the direction perpendicular to the first surface 100a can be less than the particle size D of the second conductive particles A2. The smaller recess K can increase the surface roughness of the first pad P1 (or the second pad P2), weaken the rolling speed of the conductive particles on the first pad P1 (or the second pad P2), and thus have more first conductive particles A1 between the first pad P1 and the second pad P2.

[0128] According to some exemplary embodiments, the recess K with a regular shape can also not be provided, and instead the first pad P1 and / or the second pad P2 can be surface treated to increase the surface roughness of the first pad P1 and / or the second pad P2.

[0129] Figure 10 A plan view of the first pad of the display module according to some embodiments of the present disclosure is schematically shown.

[0130] According to some exemplary embodiments, in combination with reference to Figure 5 and Figure 10 , the orthographic projections of the plurality of first pads P1 on the substrate substrate 100 are arranged in an array along the first direction X and the second direction Y, and one side of the orthographic projection of the first sub-pad P11 on the substrate substrate 100 and one side of the orthographic projection of the adjacent second sub-pad P12 on the substrate substrate 100 are adjacent. The first pads P1 with adjacent sides are arranged in staggered layers, one layer being the first sub-pad P11 and the other layer being the second sub-pad P12.

[0131] Figure 11 An enlarged view of the region M in Figure 10 is schematically shown.

[0132] According to some exemplary embodiments, in combination with reference to Figure 5 , Figure 10 and Figure 11 , of the at least two first pads P1, the two first pads P1 are respectively equal in distance from the first surface 100a, the first corner J1 of one first pad P1 is opposite to the second corner J2 of the other first pad P1, and the distance W3 between the orthographic projection of the first corner J1 on the substrate substrate 100 and the orthographic projection of the second corner J2 on the substrate substrate 100 is greater than the particle size D of the second conductive particles A2. In the two first pads P1 that are not adjacent in side but are adjacent in corner, the two first sub-pads P11 are respectively equal in distance from the first surface 100a, and by setting the distance W3 between the opposite two corners (i.e., the first corner J1 and the second corner J2) to be greater than the particle size D of the second conductive particles A2, the problem of the two first pads P1 being short-circuited by the second conductive particles A2 can be effectively avoided.

[0133] For example, the first corner J1 and the second corner J2 can be set as rounded corners, so that the distance between the first corner J1 and the second corner J2 is increased without increasing the distance between the adjacent first pads P1.

[0134] For example, in the two first sub-pads P11 that are opposite in corner, the distance between the opposite two corners of the two first sub-pads P11 is greater than the particle size of the second conductive particles A2.

[0135] For example, in the two second sub-pads P12 oppositely arranged at the corners, the distance between the opposite two corners of the two second sub-pads P12 is greater than the particle size of the second conductive particles A2.

[0136] According to some exemplary embodiments, with reference to Figure 5 and Figure 10 , the shape of the orthographic projection of the first pad P1 on the substrate 100 includes a rectangle, and the orthographic projections of the plurality of first pads P1 on the substrate 100 are closely arranged along the first direction X and the second direction Y, and the first direction X is perpendicular to the second direction Y. The two first pads P1 adjacent along the first direction X include one first sub-pad P11 and one second sub-pad P12, and the two first pads P1 adjacent along the second direction Y include one first sub-pad P11 and one second sub-pad P12.

[0137] Specifically, the plurality of first pads P1 are arranged into multiple rows, each row including a plurality of first sub-pads P11 and second sub-pads P12 alternately arranged along the first direction X, and in the two adjacent rows of first pads P1, the plurality of first sub-pads P11 in one row of first pads P1 are respectively arranged adjacent to the plurality of second sub-pads P12 in the other row of first pads P1 along the second direction Y, and the distance G1 between the first sub-pad P11 and the first surface 100a in the direction perpendicular to the first surface 100a is greater than the distance G2 between the second sub-pad P12 and the first surface 100a in the direction perpendicular to the first surface 100a.

[0138] It should be noted that the orthographic projections of the plurality of first pads P1 on the substrate 100 closely arranged along the first direction X and the second direction Y should be understood as: the plurality of first pads P1 are arranged into multiple rows and multiple columns, the plurality of first pads P1 in one row are aligned and arranged along the second direction Y, and the plurality of first pads P1 in one column are aligned and arranged along the first direction X.

[0139] Figure 12 A plan view of the first pads of the display module according to some embodiments of the present disclosure is schematically shown.

[0140] According to some exemplary embodiments, with reference to Figure 5 and Figure 12 , the shape of the orthographic projection of the first pad P1 on the substrate 100 includes a hexagon, and the orthographic projections of the plurality of first pads P1 on the substrate 100 are arranged in a honeycomb shape. In the two first pads P1 adjacent along the second direction Y and the one first pad P1 adjacent to both of the two first pads P1 along the first direction X, i.e. Figure 12The diagram shows the first sub-pad P11, the second sub-pad P12, and the fifth sub-pad P15. The distances between these three first pads P1 and the first surface 100a in the direction perpendicular to the first surface 100a are different from each other.

[0141] exist Figure 12 In the schematic arrangement of the first pad P1, multiple first pads P1 can be staggered into three layers, so that the spacing between any two adjacent first pads P1 and the first surface 100a in the direction perpendicular to the first surface 100a is not equal.

[0142] It should be noted that, Figure 5 This diagram only schematically illustrates setting multiple first pads P1 in a two-layer configuration (first sub-pad P11 and second sub-pad P12). For a three-layer configuration, please refer to [the diagram / example]. Figure 5 The schematic structure can be modified by adding another conductive layer, and placing the first sub-pad P11, the second sub-pad P12, and the fifth sub-pad P15 on three different conductive layers.

[0143] Figure 13 A schematic plan view of the first pad of a display module according to some embodiments of the present disclosure is shown.

[0144] According to some exemplary embodiments, refer to Figure 13 The plurality of first pads P1 include a plurality of first type pads P1A and a plurality of second type pads P1B. The area of ​​the first type pads P1A projected onto the substrate 100 is larger than the area of ​​the second type pads P1B on the substrate 100. The area of ​​the first pads P1 can be differentiated according to the different signals transmitted. For example, the larger first type pads P1A are used to transmit power signals, while the smaller first type pads P1A are used to transmit other signals that drive the display.

[0145] It should be noted that, in order to more clearly illustrate the arrangement of the first type of pad P1A and the second type of pad P1B, Figure 13 Only the first type of pad P1A was pattern-filled.

[0146] According to some exemplary embodiments, in conjunction with reference to Figure 5 and Figure 13The plurality of first pads P1 comprises a plurality of pad groups Px, and the plurality of pad groups Px is arranged in at least one row along a first direction X. The pad group Px comprises one first type pad P1A and two second type pads P1B. In the pad group Px, the two second type pads P1B are arranged adjacent to each other along a second direction Y, and the two second type pads P1B and the first type pad P1A are arranged adjacent to each other along the first direction X. The first direction X is perpendicular to the second direction Y, and the two second type pads P1B and the first type pad P1A are arranged in a “triangular shape”. In the pad group Px, the distance between the two second type pads P1B and the first type pad P1A and the first surface 100a in a direction perpendicular to the first surface 100a is different from each other, i.e., the two second type pads P1B and the first type pad P1A are arranged in three layers.

[0147] According to some exemplary embodiments, referring to Figure 13 The size of the first type pad P1A along the first direction X is equal to the size of the second type pad P1B along the first direction X.

[0148] According to some exemplary embodiments, referring to Figure 13 The size of the first type pad P1A along the second direction Y is equal to the total size of the two second type pads P1B along the second direction Y, and the orthographic projection of the pad group Px on the substrate 100 is a rectangle.

[0149] According to some exemplary embodiments, referring to Figure 13 The plurality of pad groups Px is arranged in at least two rows, and in the two adjacent rows of pad groups Px, the first type pad P1A in one row of pad groups Px is arranged adjacent to the second type pad P1B in another row of pad groups Px along the second direction Y.

[0150] It should be noted that the number of rows of pad groups Px is determined by the number of first pads P1. When the number of first pads P1 is small, the plurality of pad groups Px is arranged in one row. When the number of first pads P1 is large, the plurality of pad groups Px is arranged in two or more rows.

[0151] It should be noted that the above description of the arrangement of the first pads P1 is also applicable to the second pads P2, and details are not repeated.

[0152] At least some of the embodiments of the present disclosure also provide a display device including the display module as described above. The display device can include any device or product having a display function. For example, the display device can be a smartphone, a mobile phone, an e-book reader, a desktop PC, a laptop PC, a netbook PC, a personal digital assistant (PDA), a portable multimedia player (PMP), a digital audio player, a mobile medical device, a camera, a wearable device (e.g., a head-mounted device, electronic clothing, an electronic bracelet, an electronic necklace, an electronic accessory, an electronic tattoo, or a smart watch), a television, etc.

[0153] It should be understood that the display device according to some example embodiments of the present disclosure has all the features and advantages of the display substrate described above, which can be referred to the description above for the display substrate and will not be repeated here.

[0154] As used herein, the terms "substantially," "about," "approximately," and other similar terms are used as terms of approximation and not as terms of degree, and they are intended to account for the inherent deviations in measured or calculated values that would be recognized by those of ordinary skill in the art. In view of the process fluctuations, measurement problems and errors associated with the measurement of a particular quantity (i.e., limitations of the measurement system), etc., "about" or "approximately," as used herein, includes the stated value and means a value that is determined to be within an acceptable range of deviation by those of ordinary skill in the art. For example, "about" can mean within one or more standard deviations, or within ±10% or ±5% of the stated value.

[0155] While some embodiments in accordance with the general inventive concept of the present disclosure have been illustrated and described, it will be clear to those of ordinary skill in the art that changes can be made without departing from the principles and spirit of the general inventive concept of the present disclosure, the scope of which is defined not by the embodiments but by the claims and their equivalents.

Claims

1. A display module, the display module comprising a display area and a peripheral area surrounding the display area, wherein, The display module includes: Substrate; A display functional layer is located on the substrate, the display functional layer including a plurality of sub-pixels located in the display area and a plurality of first pads located in the peripheral area; and A bonding element is located on the side of the display functional layer away from the substrate. The bonding element includes a plurality of second pads electrically connected to a plurality of first pads. The substrate has a first surface facing the display functional layer, and in at least two adjacent first pads, the distance between one first pad and the first surface in a direction perpendicular to the first surface is greater than the distance between the other first pad and the first surface in a direction perpendicular to the first surface.

2. The display module according to claim 1, wherein, The plurality of first pads include a plurality of first sub-pads spaced apart and a plurality of second sub-pads spaced apart, wherein the distance between the first sub-pads and the first surface in a direction perpendicular to the first surface is greater than the distance between the second sub-pads and the first surface in a direction perpendicular to the first surface; The plurality of second pads include a plurality of third sub-pads spaced apart and a plurality of fourth sub-pads spaced apart, wherein the distance between the third sub-pads and the first surface in a direction perpendicular to the first surface is less than the distance between the fourth sub-pads and the first surface in a direction perpendicular to the first surface; and The first sub-pad is electrically connected to the fourth sub-pad, and the second sub-pad is electrically connected to the third sub-pad.

3. The display module according to claim 2, wherein, The orthographic projections of the plurality of first pads on the substrate are arranged in an array along a first direction and a second direction, wherein the first direction and the second direction intersect. as well as One side of the orthographic projection of the first sub-pad on the substrate and one side of the orthographic projection of the adjacent second sub-pad on the substrate are adjacent.

4. The display module according to claim 2 or 3, wherein, The display functional layer includes a first conductive layer, a first insulating layer located on the side of the first conductive layer near the substrate, and a second conductive layer located on the side of the first insulating layer near the substrate. A plurality of first sub-pads are located on the first conductive layer, and a plurality of second sub-pads are located on the second conductive layer; and The first insulating layer includes a plurality of first insulating portions spaced apart, and the second sub-pads are located between adjacent first insulating portions, with the first sub-pads located on the side of the first insulating portion away from the substrate.

5. The display module according to claim 4, wherein, The bonding element includes a fourth conductive layer close to the display functional layer, a third insulating layer located on the side of the fourth conductive layer away from the display functional layer, and a fifth conductive layer located on the side of the third insulating layer away from the display functional layer. Multiple third sub-pads are located on the fourth conductive layer, and multiple fourth sub-pads are located on the fifth conductive layer; The third insulating layer includes a plurality of third insulating portions spaced apart, and the fourth sub-pad is located between adjacent third insulating portions, with the third sub-pad located on the side of the third insulating portion closer to the substrate. A portion of the first insulating portion is located between adjacent third insulating portions, and a first sub-pad on the first insulating portion is electrically connected to the fourth sub-pad; and A portion of the third insulating portion is located between adjacent first insulating portions, and the third sub-pad on the third insulating portion is electrically connected to the second sub-pad.

6. The display module according to claim 5, wherein, The display functional layer further includes a second insulating layer located on the side of the second conductive layer near the substrate and a third conductive layer located on the side of the second insulating layer near the substrate. The second conductive layer further includes a plurality of first transition portions, the first transition portions being located between adjacent second sub-pads and spaced apart from the second sub-pads, and the first insulating layer including a plurality of first vias, the plurality of first sub-pads being electrically connected to the plurality of first transition portions through the plurality of first vias respectively; as well as The third conductive layer includes multiple first signal lines, the second insulating layer includes multiple second vias, and multiple first adapter portions and multiple second sub-pads are electrically connected to the multiple first signal lines through the multiple second vias; and / or The bonding element further includes a fourth insulating layer located on the side of the fifth conductive layer away from the substrate and a sixth conductive layer located on the side of the fourth insulating layer away from the substrate. The fifth conductive layer further includes a plurality of second transition portions, which are located between adjacent fourth sub-pads and spaced apart from each other. The third insulating layer includes a plurality of third vias, and the plurality of third sub-pads are electrically connected to the plurality of second transition portions through the plurality of third vias. as well as The sixth conductive layer includes multiple second signal lines, the fourth insulating layer includes multiple fourth vias, and the multiple second transition portions and the multiple third sub-pads are electrically connected to the multiple second signal lines through the multiple fourth vias.

7. The display module according to any one of claims 2-3 and 5-6, wherein, The display module further includes a first conductive particle and a second conductive particle. The first pad is electrically connected to the second pad through the first conductive particle and the second pad. The second conductive particle is spaced apart from at least one of the first pad and the second pad. as well as The distance between the surface of the third sub-pad away from the substrate and the surface of the first sub-pad close to the substrate in a direction perpendicular to the first surface is greater than or equal to the particle size of the second conductive particle.

8. The display module according to claim 5 or 6, wherein, The display module further includes a first conductive particle and a second conductive particle. The first pad is electrically connected to the second pad through the first conductive particle and the second pad. The second conductive particle is spaced apart from at least one of the first pad and the second pad. as well as The distance between the first insulating portion and the adjacent third insulating portion in a direction parallel to the first surface is less than or equal to twice the particle size of the second conductive particle.

9. The display module according to any one of claims 1-3 and 5-6, wherein, The display module further includes a first conductive particle and a second conductive particle. The first pad is electrically connected to the second pad through the first conductive particle and the second pad. The second conductive particle is spaced apart from at least one of the first pad and the second pad. as well as In at least two first pads, the two first pads are each equidistant from the first surface, a first corner of one first pad faces a second corner of the other first pad, and the distance between the orthographic projection of the first corner on the substrate and the orthographic projection of the second corner on the substrate is greater than the particle size of the second conductive particle.

10. The display module according to any one of claims 1-3 and 5-6, wherein, The surface of the first pad facing the second pad has a recessed portion, and / or the surface of the second pad facing the first pad has a recessed portion.

11. The display module according to claim 10, wherein, The cross-sectional shape of the recessed portion perpendicular to the first surface includes at least one of the following: arc-shaped, rectangular, trapezoidal, and triangular.

12. The display module according to claim 10, wherein, The display module further includes a first conductive particle and a second conductive particle, wherein the first pad is electrically connected to the second pad via the first conductive particle, and the second conductive particle is spaced apart from at least one of the first pad and the second pad; and The size of the recessed portion projected onto the substrate along at least one direction is greater than or equal to the particle size of the second conductive particle.

13. The display module according to claim 12, wherein, Both the first and second pads are provided with the recessed portion, wherein the depth of the recessed portion in the direction perpendicular to the first surface is less than or equal to half the particle size of the second conductive particle; or One of the first pad and the second pad is provided with the recessed portion, and the depth of the recessed portion in the direction perpendicular to the first surface is less than or equal to the particle size of the second conductive particle.

14. The display module according to claim 5, wherein, The thickness of the first insulating layer in the direction perpendicular to the first surface is equal to the thickness of the third insulating layer in the direction perpendicular to the first surface.

15. The display module according to any one of claims 1-3, 5-6, and 11-14, wherein, The shape of the orthographic projection of the first pad on the substrate includes a rectangle, and the orthographic projections of the plurality of first pads on the substrate are closely arranged along a first direction and a second direction, wherein the first direction is perpendicular to the second direction; Two adjacent first pads along the first direction each include a first sub-pad and a second sub-pad; two adjacent first pads along the second direction each include a first sub-pad and a second sub-pad; and The distance between the first sub-pad and the first surface in the direction perpendicular to the first surface is greater than the distance between the second sub-pad and the first surface in the direction perpendicular to the first surface.

16. The display module according to any one of claims 1-3, 5-6, and 11-14, wherein, The orthographic projection of the first pad on the substrate has a hexagonal shape, and the orthographic projections of the plurality of first pads on the substrate are arranged in a honeycomb pattern; and In the two first pads adjacent along the second direction and the first pad adjacent to both of the two first pads along the first direction, the spacing between the three first pads and the first surface in a direction perpendicular to the first surface is different from each other, and the first direction is perpendicular to the second direction.

17. The display module according to any one of claims 1-3, 5-6, and 11-14, wherein, The plurality of first pads include a plurality of first type pads and a plurality of second type pads, wherein the area of ​​the first type pads projected onto the substrate is larger than the area of ​​the second type pads on the substrate.

18. The display module according to claim 17, wherein, The plurality of first pads include a plurality of pad groups, and the plurality of pad groups are arranged in at least one row along a first direction; The pad group includes one first-type pad and two second-type pads. In the pad group, the two second-type pads are arranged adjacently along a second direction, and the two second-type pads and the first-type pad are arranged adjacently along a first direction, which is perpendicular to the second direction. In the pad group, the two second type pads and one first type pad are spaced differently from each other from the first surface in a direction perpendicular to the first surface.

19. The display module according to claim 18, wherein, Multiple pad groups are arranged in at least two rows, and in two adjacent rows of the pad groups, the first type of pads in one row of the pad groups and the second type of pads in the other row of the pad groups are arranged adjacent to each other along the second direction.

20. A display device, wherein, The display device includes a display module according to any one of claims 1-19.

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