Display device

Abstract

A display device includes: a display panel including an active area, a bendable area, and a pad area, the pad area being spaced apart from the active area in a direction and including a driving chip and a pad, the bendable area being between the pad area and the active area; and a lower member including: a flat portion overlapping the active area and contacting the display panel at the active area; a protruding portion on the flat portion and adjacent to a boundary between the active region and the bendable region; and a pad portion spaced apart from the flat portion and the protruding portion, overlapping the pad region, and contacting the display panel at the pad region. When the display panel is bent at the bendable area, the protruding portion and the pad portion are in contact with each other.

Description

[0001] This application claims priority to Korean Patent Application No. 10-2024-0031148 filed on March 5, 2024, as well as all priority claims from which it derives, the entire contents of which are incorporated herein by reference. TECHNICAL FIELD

[0002] The disclosure herein relates to a display device and a method of manufacturing (or providing) a display device. More particularly, the disclosure herein relates to a display device with reduced cost and simplified process and a method of manufacturing (or providing) a display device. BACKGROUND

[0003] Various display devices for multimedia devices such as televisions, mobile phones, tablet computers, navigation systems, and game consoles are being developed. In order to reduce the dead space of the display device, a display panel having a foldable portion to be accommodated in a housing is being developed. SUMMARY

[0004] The disclosure provides a display device and a method of manufacturing (or providing) a display device, which can reduce the cost of a lower member disposed under a display panel having a foldable portion and simplify the process.

[0005] An embodiment of the disclosure provides a display device, including: a display panel having: a first area having an active area in which pixels are disposed; a second area foldable with respect to a folding axis extending in a first direction; and a third area spaced apart from the first area in a second direction crossing the first direction, the second area being between the first area and the third area, and a driving chip and a pad being disposed in the third area; and a lower member in contact with a rear surface of the display panel, wherein the lower member includes: a flat portion overlapping an entire surface of the first area and in contact with the rear surface; a protruding portion disposed on the flat portion and overlapping the first area and adjacent to a boundary between the first area and the second area; and a pad portion overlapping the third area and in contact with the rear surface, and when the second area is folded, the protruding portion and the pad portion are in contact with each other.

[0006] Another embodiment of the present invention provides a display device including a display panel having a front surface and a rear surface opposite to each other. The display panel includes: a first region having pixels disposed therein; a second region being bendable relative to a bending axis extending along a first direction; a boundary between the first region and the second region; and a third region spaced apart from the first region along a second direction intersecting the first direction, the second region being between the first region and the third region, the third region including a driver chip on the front surface and a pad adjacent to the driver chip; and a lower member including: a flat portion overlapping the entire first region and contacting the rear surface of the display panel at the first region; a protrusion on the flat portion and adjacent to the boundary between the first region and the second region; and a pad portion spaced apart from the flat portion and the protrusion portion, overlapping the third region, and contacting the rear surface of the display panel at the third region, wherein the protrusion portion and the pad portion contact each other when the display panel is bent at the second region.

[0007] Another embodiment of the present invention provides a display device, comprising: a display panel having a front surface and a rear surface opposite to each other, the display panel including: a first region having pixels disposed therein; a second region being bendable relative to a bending axis extending along a first direction; and a third region spaced apart from the first region along a second direction intersecting the first direction, the second region being between the first region and the third region, the third region including a driver chip on the front surface and a pad adjacent to the driver chip; and a lower member including: a flat portion overlapping the entire first region and contacting the rear surface of the display panel at the first region; a pad portion overlapping the third region and contacting the rear surface of the display panel at the third region; and a protrusion on the pad portion, the protrusion and the pad portion being spaced apart from the flat portion, wherein when the display panel is bent at the second region, the flat portion and the protrusion contact each other.

[0008] In one embodiment, the protrusion may expose a portion of the upper surface of the flat portion.

[0009] In one embodiment, the flat portion may have a first thickness, the protrusion may have a second thickness less than the first thickness, and the pad portion may have a third thickness less than the second thickness.

[0010] In one embodiment, the first thickness may be from about 100 micrometers (μm) to about 300 μm, the second thickness may be from about 50 μm to about 200 μm, and the third thickness may be from about 50 μm to about 150 μm.

[0011] In an embodiment, the flat portion, the protruding portion, and the pad portion can each include a polymer resin and carbon black.

[0012] In an embodiment, the flat portion, the protruding portion, and the pad portion can each further include at least one of graphite, copper (Cu), aluminum (Al), carbon nanotube (CNT), and graphene.

[0013] In an embodiment, the flat portion and the protruding portion can include a polymer resin and carbon black, and the pad portion can include only the polymer resin.

[0014] In an embodiment, the lower member can have an optical density of about 3 to about 5.

[0015] In an embodiment, the lower member can have a thermal conductivity of about 20 Watts per meter Kelvin (W / mk) to about 100 W / mk.

[0016] In an embodiment, the lower member can have a storage modulus of about 0.01 MegaPascal (MPa) to about 1 MPa.

[0017] In an embodiment, the display device can further include an input sensor disposed directly on the display panel.

[0018] In an embodiment, the display device can further include an optical film overlapping the first area and disposed on the display panel.

[0019] In an embodiment, the display device can further include a window disposed on the optical film.

[0020] In an embodiment, the display device can further include a bendable cover layer overlapping the second area and covering an upper surface of the display panel.

[0021] In an embodiment, the display device can further include a flexible circuit film connected to the pad, and a portion of the flexible circuit film can be in contact with the flat portion when the second area is bent.

[0022] In an embodiment, the display device can further include a conductive film covering the flexible circuit film overlapping the driving chip and the pad.

[0023] In one embodiment of the present application, a manufacturing method of a display device includes: providing a display panel having first to third regions arranged in sequence in one direction; forming a flat portion on a rear surface of the display panel and overlapping the first region; forming a protruding portion on the flat portion and adjacent to a boundary between the first region and the second region; forming a pad portion on the rear surface of the display panel and overlapping the third region; and bending the second region with respect to a bending axis extending in a cross direction crossing the one direction, and after the bending of the second region, the protruding portion and the pad portion contact each other.

[0024] In one embodiment, the flat portion, the protruding portion, and the pad portion can be formed by jetting ink onto the rear surface of the display panel by an inkjet process using a nozzle, and the ink can be ink in which a polymer resin contains carbon black.

[0025] In one embodiment, a material contained in the ink can have an optical density of about 3 to about 5, a thermal conductivity of about 20 W / mk to about 100 W / mk, and a storage modulus of about 0.01 MPa to about 1 MPa.

[0026] In one embodiment of the present application, a manufacturing method of a display device includes: providing a display panel having first to third regions arranged in sequence in one direction; forming a flat portion on a rear surface of the display panel and overlapping the first region; forming a pad portion on the rear surface of the display panel and overlapping the third region; forming a protruding portion on the pad portion; and bending the second region with respect to a bending axis extending in a cross direction crossing the one direction, and after the bending of the second region, the protruding portion and the flat portion contact each other. BRIEF DESCRIPTION OF DRAWINGS

[0027] The accompanying drawings are included to provide a further understanding of the present application, and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the present application and, together with the specification, serve to explain principles of the present application. In the drawings:

[0028] Figure 1 is a perspective view of a display device according to one embodiment of the present application;

[0029] Figure 2 is an exploded perspective view of a display device according to one embodiment of the present application;

[0030] Figure 3 is a cross-sectional view taken along line I-I' of Figure 2 ​

[0031] Figure 4A FIG. 6 is a cross-sectional view of a display device taken along line II-II' of FIG. 5 to illustrate a bending state of a display panel according to an embodiment of the present disclosure; Figure 2

[0032] Figure 4B FIG. 6 is a cross-sectional view of a display device taken along line II-II' of FIG. 5 to illustrate a bending state of a display panel according to an embodiment of the present disclosure; Figure 2

[0033] Figure 5 FIG. 6 is a cross-sectional view of a display device taken along line II-II' of FIG. 5 to illustrate a bending state of a display panel according to an embodiment of the present disclosure;

[0034] Figure 6 FIG. 6 is a cross-sectional view of a display device taken along line II-II' of FIG. 5 to illustrate a bending state of a display panel according to an embodiment of the present disclosure;

[0035] Figure 7 FIG. 6 is a cross-sectional view of a display device taken along line II-II' of FIG. 5 to illustrate a bending state of a display panel according to an embodiment of the present disclosure;

[0036] Figures 8A to 8D FIG. 6 is a cross-sectional view of a display device taken along line II-II' of FIG. 5 to illustrate a bending state of a display panel according to an embodiment of the present disclosure; and

[0037] Figures 9A to 9C FIG. 6 is a cross-sectional view of a display device taken along line II-II' of FIG. 5 to illustrate a bending state of a display panel according to an embodiment of the present disclosure. DETAILED DESCRIPTION

[0038] In this specification, when an element (or area, layer, part, etc.) is referred to as being (for example) "on" another element, it can be "directly on" the other element, or there can be one or more intervening elements. In contrast, when an element (or area, layer, part, etc.) is referred to as being "directly on" or "directly connected to" another element, there are no intervening elements therebetween.

[0039] The same reference numbers or symbols are used throughout the drawings and specification to refer to the same or like elements. In the drawings and the text of the present disclosure, a reference numeral indicated in the singular form can be used to refer to a plurality of singular elements. In the drawings, the proportions and sizes (for example, thicknesses) of elements are exaggerated for the sake of effective description of the technical content.

[0040] ​​The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting. As used herein, "a," "an," and "the" are not intended to refer to only a singular entity but include the general class of which a specific example can be used for illustration. The

[0041] It will be understood that, although the terms "first," "second," etc. can be used herein to describe various elements, components, regions, layers and / or sections, these elements, components, regions, layers and / or sections should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the scope of the present application. Similarly, a second element, component, region, layer or section discussed below could be termed a first element, component, region, layer or section.

[0042] In addition, the terms "under," "below," "on," "above," and the like can be used in relation to the illustrated elements of the drawings. These terms have relative concepts and are described based on the directions indicated in the drawings.

[0043] It will be further understood that the terms "comprises" and / or "comprising," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof.

[0044] "About" or "approximately," as used herein, includes the recited value and means within an acceptable range of deviation for the particular value as determined by one of ordinary skill in the art to be within the scope of the present application considering the measurement in question and the error in measuring the particular quantity (i.e., the limitations of the measurement system). For example, "about" can mean within one or more standard deviations, or within ± 30%, 20%, 10%, or 5% of the recited value.

[0045] Unless otherwise defined, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. It will be further understood that terms such as those defined in common dictionaries shall be interpreted as having the same meaning as their meaning in the foregoing context of the relevant art, and shall not be interpreted in an idealized or overly formal sense unless expressly defined herein.

[0046] In the following description, embodiments of the present invention will be described with reference to the accompanying drawings.

[0047] Figure 1 This is a perspective view of a display device as an electronic device (ED) according to an embodiment of the present invention. Figure 2 This is an exploded perspective view of a display device DD according to an embodiment of the present invention. Figure 3 For along Figure 2 The cross-sectional view taken from line I-I'. Figure 4A As shown in one embodiment of the present invention, the bending state of the display panel DP is along... Figure 2 The cross-sectional view of the display device DD taken from line II-II'. Figure 4B As shown in one embodiment of the present invention, the bending state of the display panel DP is along... Figure 2 The cross-sectional view of display device DD-A taken from line II-II'.

[0048] refer to Figures 1 to 3 The electronic device ED can be activated in response to an electrical signal. The electronic device ED can include various embodiments. For example, the electronic device ED can be a display device DD, such as a smartwatch, a computer (e.g., a tablet computer and a laptop computer), and a smart television.

[0049] The electronic device ED can display an image IM on a display surface IS parallel to a plane defined by a first direction DR1 and a second direction DR2 that intersect each other, facing a third direction DR3. The display surface IS on which the image IM is displayed may correspond to or define the front surface of the electronic device ED. The image IM may include still images and moving images.

[0050] In this embodiment, the front (or upper) surface and rear (or lower) surface of each component are defined based on a third direction DR3 along which the displayed image IM is directed. The front and rear surfaces may be opposite to each other on the third direction DR3, and the normal direction of each of the front and rear surfaces may be parallel to the third direction DR3.

[0051] The distance between the front surface and the rear surface in the third direction DR3 can correspond to the thickness of the electronic device ED in the third direction DR3. The thickness of the electronic device ED and various components or layers thereof can be defined along the third direction DR3 (i.e., the thickness direction). The directions indicated by the first direction to the third direction DR1, DR2, and DR3 are relative concepts, and thus can be changed to other directions.

[0052] The electronic device ED can detect an external input applied from the outside. The external input can include various types of inputs provided from the outside of the electronic device ED. For example, the external input can include not only an external input applied by contact of an input tool such as a part of a user's body such as a hand, but also an external input applied by an input tool that is close or adjacent (e.g., hovering) to the electronic device ED at a predetermined distance. In addition, the external input can have various forms such as power, pressure, temperature, and light.

[0053] The display surface IS of the electronic device ED can be divided into a transmission area TA and a bezel area BZA. The transmission area TA can be an area in which an image IM is displayed. A user outside the electronic device ED views the image IM through the transmission area TA. In this embodiment, the transmission area TA is exemplified as a quadrangular shape having rounded corners. However, this is exemplarily illustrated, and the transmission area TA can have various planar shapes, and is not limited to any one embodiment of the present utility model.

[0054] The bezel area BZA is adjacent to the transmission area TA. The bezel area BZA can have a predetermined color. In a plan view (e.g., a view seen in the third direction DR3), the bezel area BZA can surround the transmission area TA. Accordingly, the planar shape of the transmission area TA can be substantially defined by the bezel area BZA. A boundary can be defined between the transmission area TA and the bezel area BZA. However, this is exemplarily illustrated, and the bezel area BZA can also be provided adjacent to only one side of the transmission area TA, and can also be omitted. The electronic device ED according to an embodiment of the present utility model can include various embodiments, and is not limited to any one embodiment of the present utility model.

[0055] The electronic device ED can include a display device DD and a housing EDC. As Figure 2 exemplified in the middle, the display device DD can include a window WM, a display module DM, a driving module EM, an optical film OTF, and a lower member LM. The display module DM can include a display panel DP and an input sensor ISP disposed on the display panel DP. The display panel DP generates an image IM, and the input sensor ISP acquires coordinate information about an external input (e.g., a touch event).

[0056] The window WM can be made of (or include) a transparent material that can transmit an image and / or light. For example, the window WM can be made of glass, sapphire, plastic, etc. The window WM is exemplified as a single layer, but embodiments of the present application are not limited thereto, and the window WM can include multiple layers. Although not exemplified in the drawings, the bezel area BZA of the display device DD described previously can be provided as an area of the window WM that is substantially printed with a material having a predetermined color.

[0057] The display module DM can include the display panel DP and the input sensor ISP. According to an embodiment of the present application, the display panel DP can be an emissive display panel (e.g., a display panel DP that self-emits light), but embodiments of the present application are not particularly limited thereto. For example, the display panel DP can be an organic light emitting display panel, an inorganic light emitting display panel, or a quantum dot light emitting display panel. The light emitting layer of the organic light emitting display panel can include an organic light emitting material, and the light emitting layer of the inorganic light emitting display panel can include an inorganic light emitting material. The light emitting layer of the quantum dot light emitting display panel can include quantum dots, quantum rods, etc. Hereinafter, the display panel DP is described as an organic light emitting display panel.

[0058] The input sensor ISP can be a layer that is "directly disposed" on the display panel DP. According to an embodiment of the present application, the input sensor ISP can be formed (or provided) on the display panel DP through a continuous process. That is, when the input sensor ISP is directly disposed on the display panel DP, an adhesive film for bonding the input sensor ISP to the display panel DP is not disposed between the input sensor ISP and the display panel DP. In an embodiment, the input sensor layer can be in contact with the display panel DP. Since in (physical) contact, elements or layers can form an interface therebetween.

[0059] The optical film OTF is a layer that reduces the reflectance of external light incident from the upper side of the window WM. According to an embodiment of the present application, the optical film OTF can include a retarder and / or a polarizer. The retarder can be of a film type or a liquid crystal coating type, and can include a / 2 retarder and / or a / 4 retarder. The polarizer can also be of a film type or a liquid crystal coating type. The film type can include a stretchable synthetic resin film, and the liquid crystal coating type can include liquid crystals arranged in a predetermined arrangement. The retarder and the polarizer can be provided as one polarizing film. The optical film OTF can further include a protective film disposed above or below the polarizing film.

[0060] The optical film OTF can be disposed on the input sensor ISP. That is, the optical film OTF can be disposed between the input sensor ISP and the window WM. The input sensor ISP, the optical film OTF, and the window WM can be bonded to each other by one or more adhesive layers therebetween, respectively. In an embodiment, the optical film OTF can face the first area A1 of the display panel DP. In an embodiment, the window WM can face the display panel DP, and the optical film OTF can be between the display panel DP and the window WM.

[0061] Referring to Figure 3 , the optical adhesive layer AF1 is disposed between the input sensor ISP and the optical film OTF, and the window adhesive layer AF2 is disposed between the optical film OTF and the window WM. Accordingly, the optical film OTF is bonded to the input sensor ISP through the optical adhesive layer AF1, and the window WM is bonded to the optical film OTF through the window adhesive layer AF2.

[0062] As an example of the present disclosure, the adhesive layers AF1 and AF2 can each include an optically clear adhesive (OCA) film. However, the material of each of the adhesive layers AF1 and AF2 is not limited thereto, and can include a general adhesive or a cement. For example, the adhesive layers AF1 and AF2 can each include a pressure sensitive adhesive (PSA), an optically clear adhesive (OCA), or an optically clear resin (OCR).

[0063] In addition to the optical film OTF, a functional layer performing another function, such as a protective layer, etc., can be further disposed between the display module DM and the window WM.

[0064] The display module DM can display an image in response to an electrical signal, and can transmit and / or receive information as an external input. The display module DM can be defined or divided into an active area AA and a non-active area NAA. The active area AA can be defined as a planar region (e.g., a display region) in which an image IM provided from the display module DM is displayed. The non-active area NAA can be defined as a planar region (e.g., a non-display region) in which the image IM is not displayed.

[0065] The non-active area NAA is adjacent to the active area AA. For example, in a plan view, the non-active area NAA can surround the active area AA. However, this is an exemplary illustration, and the non-active area NAA can be defined in various planar shapes, and is not limited to any one embodiment of the present disclosure. According to an embodiment, the active area AA of the display module DM can correspond to at least a portion of the transmissive area TA. That is, the active area AA of the display module DM can overlap a portion of the transmissive area TA in a thickness direction.

[0066] As Figure 2As illustrated in the middle, the display module DM can include a first area A1, a second area A2, and a third area A3 arranged along the second direction DR2. The first area A1 can include a portion of the non-active area NAA and the active area AA, and the second area A2 and the third area A3 can together include the remaining portion of the non-active area NAA other than the portion of the non-active area NAA. The second area A2 can be a folding area that can be folded with respect to the folding axis, and the first area A1 and the third area A3 can be non-folding areas. The third area A3 can be a pad area including the driving chip DIC and the pads PD (see Figure 5 ) adjacent to the driving chip DIC. In an embodiment, the driving chip DIC and the pads PD (see Figure 5 ) can be on the front surface of the display panel DP.

[0067] The length of each of the second area A2 and the third area A3 in the first direction DR1 can be less than or equal to the length of the first area A1 in the first direction DR1. An area having a short length in the direction of the folding axis can be more easily folded.

[0068] The driving module EM can control the operation of the display module DM. The driving module EM can include a flexible circuit film FCB and a driving chip DIC. The flexible circuit film FCB can be electrically connected to the display panel DP. The flexible circuit film FCB can be bonded to the display panel DP at the end portion of the third area A3 of the display module DM, such as by a bonding process. The flexible circuit film FCB can be electrically connected to the display module DM by an anisotropic conductive adhesive layer. The driving chip DIC can be mounted on the display panel DP at the third area A3 of the display module DM. The driving chip DIC can include a driving circuit, e.g., a data driving circuit, for driving the pixels PX in the active area AA of the display panel DP.

[0069] According to an embodiment, the flexible circuit film FCB can include a ground to discharge static electricity that would otherwise flow into the flexible circuit film FCB and / or the input sensor ISP.

[0070] The driving module EM can further include a plurality of driving elements mounted on the flexible circuit film FCB. The plurality of driving elements can include circuit components for converting an (electrical) signal input from the outside into an (electrical) signal required by the driving chip DIC or an (electrical) signal required to drive the display module DM. When the second area A2 and the third area A3 of the display module DM are folded, the flexible circuit film FCB can be disposed under the display module DM. That is, the folded electronic device ED can include the flexible circuit film FCB facing the display module DM in the thickness direction.

[0071] The lower member LM is disposed on or faces the rear surface of the display module DM. The lower member LM can be disposed on the rear surface of the display module DM to improve the impact resistance of the display device DD. According to an embodiment of the present disclosure, the lower member LM can be directly disposed on the rear surface D-B of the display panel DP. That is, a separate adhesive layer can be omitted between the rear surface of the display panel DP and the lower member LM. Here, an interface can be defined between the lower member LM and the rear surface D-B of the display panel DP.

[0072] The lower member LM according to an embodiment of the present disclosure can include a flat portion AR, a protruding portion SR, and a pad portion PR.

[0073] The flat portion AR can overlap the entire first area A1. The flat portion AR can be disposed under the display panel DP and can be in contact with the rear surface D-B of the display panel DP.

[0074] The protruding portion SR can overlap the planar area of the first area A1 and be adjacent to the boundary between the first area A1 and the second area A2. The protruding portion SR can be disposed on the flat portion AR. The protruding portion SR can protrude from the flat portion AR in the third direction DR3 in a direction opposite to the display panel DP. According to an embodiment, the protruding portion SR can have an inverted trapezoidal shape in a cross-section (such as a DR2-DR3 cross-section). The flat portion AR and the protruding portion SR are substantially one integral pattern, but are separately illustrated for ease of description.

[0075] The pad portion PR can overlap the third area A3. The pad portion PR can be in contact with the rear surface D-B of the display panel DP. The pad portion PR can be spaced apart from the flat portion AR and the protruding portion SR in the second direction DR2. That is, a gap can be defined between the pad portion PR and each of the flat portion AR and the protruding portion SR, respectively. Such a gap can extend in the first direction DR1 and the second direction DR2.

[0076] The housing EDC can be coupled to the window WM to define the outside of the electronic device ED. The housing EDC provides a receiving space that accommodates the display device DD. The housing EDC absorbs an impact applied from the outside and prevents foreign substances (for example, moisture) from penetrating into the electronic device ED from the outside thereof, thereby protecting components accommodated in the housing EDC. As an example of the present disclosure, the housing EDC can be provided in the form of a plurality of accommodation members coupled to each other to form an overall structure of the housing EDC.

[0077] Figure 4A To illustrate the cross-sectional view of the display device DD taken along the line II-II’ of the bending state of the display panel DP according to an embodiment of the present disclosure. Figure 2 Figure 4A ​An example of a cross-section of the display device DD at a state where the display device DD is bent at the second area A2 with respect to a bending axis AX extending in the first direction DR1.

[0078] The display device DD can include a window WM, an optical film OTF, a display module DM, and a lower member LM. The lower member LM can include a flat portion AR, a protruding portion SR, and a pad portion PR. The lower member LM can be in contact with a rear surface D-B of the display panel DP.

[0079] The window WM according to an embodiment can include a base portion WB, a hard coat layer HC, and a bezel pattern BP. The base portion WB can include an optically transparent insulating material. For example, the base portion WB can include a glass substrate or a synthetic resin film. The hard coat layer HC as an outer protective layer for protecting the base portion WB can be disposed on any one of a front surface and a rear surface of the base portion WB. The hard coat layer HC can prevent damage to the base portion WB due to scratches or the like. In addition, an anti-fingerprint layer can be further disposed on the base portion WB. The outer protective layer can include the hard coat layer HC and / or the anti-fingerprint layer as a functional layer of the outer protective layer.

[0080] The bezel pattern BP defines a bezel area BZA (see Figure 1 ) of the window WM. The bezel pattern BP can be disposed adjacent to an edge of a rear surface of the base portion WB. With reference to Figure 4A , the window WM can be separated from the display module DM at the second area A2.

[0081] The bezel pattern BP as a colored layer can be formed (or provided) by applying a material in a method of providing the electronic device ED. As the material, the bezel pattern BP can include a polymer resin and a pigment combined with the polymer resin. The polymer resin can be, for example, an acrylate-based resin or a polyester, and the pigment can be a carbon-based pigment.

[0082] The optical film OTF can be disposed under the window WM. The optical film OTF can reduce reflectance of external light incident from the window WM. The window WM and the optical film OTF can be combined with each other by a window adhesive layer AF2. The display module DM and the optical film OTF can be combined with each other by an optical adhesive layer AF1.

[0083] According to an embodiment of the present disclosure, the lower member LM can function as a functional layer for protecting the display module DM. The functional protective layer provided by the lower member LM can have an electromagnetic wave shielding function, a light blocking function, a heat dissipation function, and / or a cushioning function.

[0084] The lower member LM can have a light blocking function because it prevents components disposed in the active area AA of the display module DM from being seen through the window WM. The lower member LM can include a binder material and a plurality of pigment particles dispersed therein. The binder can include a polymer resin. The pigment particles can include carbon black or the like. The optical density of the lower member LM can be about 3 to about 5. The electronic device ED according to an embodiment can have an improved light blocking effect by including a light blocking layer. In an embodiment, the flat portion AR, the protruding portion SR, and the pad portion PR can each include a polymer resin and carbon black.

[0085] The lower member LM can effectively dissipate heat generated from the display module DM. The lower member LM can include at least one of graphite, copper (Cu), aluminum (Al), carbon nanotube (CNT), and graphene having good heat dissipation characteristics, and embodiments of the present application are not limited thereto. In an embodiment, the flat portion AR, the protruding portion SR, and the pad portion PR can each further include at least one of graphite, copper, aluminum, carbon nanotube, and graphene. According to an embodiment, the lower member LM can have a thermal conductivity coefficient of about 20 Watts per meter Kelvin (W / mk) to about 100 W / mk. Accordingly, the lower member LM can not only improve heat dissipation characteristics, but also have electromagnetic wave shielding or electromagnetic wave absorption characteristics.

[0086] The lower member LM can have a cushioning function. The lower member LM can include a matrix made of a flexible material. The matrix includes a synthetic resin. For example, the matrix can include at least one of a polymer resin, an acrylonitrile-butadiene-styrene (ABS) copolymer, polyurethane (PU), polyethylene (PE), ethylene vinyl acetate (EVA), and polyvinyl chloride (PVC). According to an embodiment, the lower member LM can have a storage modulus of about 0.01 MegaPascal (MPa) to about 1 MPa.

[0087] The protruding portion SR and the pad portion PR can contact each other in a state in which the second area A2 of the display panel DP is bent. In an embodiment, the flat portion AR can have a first thickness TH1, the protruding portion SR can have a second thickness TH2 less than the first thickness TH1, and the pad portion PR can have a third thickness TH3 less than the second thickness TH2. According to an embodiment of the present application, when a distance (e.g., a minimum distance) from the bending axis AX to the second area A2 of the rear surface D-B of the display panel DP is defined as a radius of curvature R1, twice the radius of curvature R1 can be equal to the sum of the first thickness TH1 of the flat portion AR, the second thickness TH2 of the protruding portion SR, and the third thickness TH3 of the pad portion PR.

[0088] According to an embodiment of the present application, the first thickness TH1 of the flat portion AR can be about 100 micrometers (pm) or more and about 300 pm or less. The second thickness TH2 of the protruding portion SR can be about 50 pm or more and about 200 pm or less. The third thickness TH3 of the pad portion PR can be about 50 pm or more and about 150 pm or less.

[0089] The display panel DP according to an embodiment can further include a bending cover layer BCV disposed in the second area A2. The bending cover layer BCV can reduce stress applied to the second area A2 during bending of the second area A2 and protect the second area A2. The bending cover layer BCV can include an organic material or can be provided in the form of a tape and is not limited to any one embodiment of the present application. The bending cover layer BCV can extend from the second area A2 to the first area A1 in a direction along the display module DM. In an embodiment, the bending cover layer BCV can cover a front surface of the display panel DP.

[0090] The display device DD according to an embodiment can further include a protective layer (not shown) filling an inner space defined by bending of the second area A2. The protective layer can support the display module DM so that a shape of the second area A2 can be maintained during bending of the display module DM. In addition, the protective layer can prevent foreign substances or the like from flowing into the display module DM through the second area A2. The protective layer according to an embodiment can include a resin. Referring to Figure 4A , the inner space can be defined between outer surfaces of the lower member LM and portions of the rear surface D-B facing the outer surfaces at the end portions of the display device DD.

[0091] The display device DD according to an embodiment can further include a conductive film CV disposed in the third area A3. The conductive film CV can cover the driving chip DIC to prevent electrostatic damage to the driving chip DIC introduced from the outside and prevent foreign substances or the like from flowing into the driving chip DIC. In addition, the conductive film CV can prevent an impact from being applied to the driving chip DIC. In an embodiment, when the display panel DP is bent at the second area A2, a portion of the flexible circuit film FCB can come into contact with the flat portion AR of the lower member LM. In an embodiment, the conductive film CV can be on a front surface of the display panel DP and can extend from the driving chip DIC to overlap the flexible circuit film FCB and the pad PD (see Figure 5 ).

[0092] For the display device DD-A in Figure 4B , differences from the display device DD in Figure 4A will be mainly described.

[0093] The display device DD-A can include a window WM, an optical film OTF, a display module DM, and a lower member LM-A. The lower member LM-A can include a flat portion AR, a protruding portion SR, and a pad portion PR-A. The lower member LM-A can be in contact with a rear surface D-B of the display panel DP.

[0094] According to an embodiment, the pad portion PR-A can include only a polymer resin, and the reference Figure 4A The pad portion PR described above includes a pigment particle such as carbon black. Accordingly, the pad portion PR-A according to an embodiment can have an opaque color, whereas the reference Figure 4A The pad portion PR described above has a black color.

[0095] Figure 5 A plan view of the display panel DP according to an embodiment of the present disclosure.

[0096] The display panel DP according to an embodiment of the present disclosure can be divided into a first area A1, a second area A2, and a third area A3 arranged in a second direction DR2. Figure 5 The first to third areas A1, A2, and A3 of the display panel DP illustrated above respectively correspond to the reference Figure 2 The first to third areas A1, A2, and A3 of the display module DM described above. In the present specification, "an area / part corresponding to another area / part" means an area / part overlapping with another area / part, and is not limited to the meaning of having the same area.

[0097] The display panel DP according to an embodiment can include an active area AA provided with pixels PX and a non-active area NAA adjacent to the active area AA. The active area AA and the non-active area NAA respectively correspond to the reference Figure 2 The active area AA and the non-active area NAA described above. The active area AA corresponds to an area in which the pixels PX are provided in the first area A1, and the non-active area NAA is defined as a remaining area other than the area in which the pixels PX are provided.

[0098] The first area A1 can include a part of the non-active area NAA and the active area AA, and the second area A2 and the third area A3 can include a remaining part of the non-active area NAA. In an embodiment, the third area A3 can be spaced apart from the first area A1 in the second direction DR2, and the second area A2 is between the first area A1 and the third area A3.

[0099] The display panel DP can include a scan driver SDV, an emission driver EDV, a pad PD, and a driving chip DIC in the non-active area NAA. In this embodiment, the driving chip DIC can be a data driver.

[0100] The display panel DP can include a plurality of pixels PX provided, a plurality of scan lines SL1 to SLm, a plurality of data lines DL1 to DLn, a plurality of emission lines EL1 to ELm, a first control line CSL1 and a second control line CSL2, a power line PL, and a plurality of pads PD. Here,'m' and 'n' are natural numbers greater than 1. The pixel PX can be connected to various signal lines among the scan lines SL1 to SLm, the data lines DL1 to DLn, and the emission lines EL1 to ELm.

[0101] The scan lines SL1 to SLm can extend in the first direction DR1 to be connected to the scan driver SDV. The data lines DL1 to DLn can extend in the second direction DR2 and can be connected to the driving chip DIC provided in the third area A3 via the first area A1 and the second area A2. The emission lines EL1 to ELm can extend in the first direction DR1 to be connected to the emission driver EDV.

[0102] The power line PL can include a portion extending in the first direction DR1 and a portion (not shown) extending in the second direction DR2. The portion extending in the first direction DR1 and the portion extending in the second direction DR2 can be provided on different layers from each other within the display panel DP. The portion of the power line PL extending in the second direction DR2 can extend from the first area A1 to the third area A3 via the second area A2. The power line PL can provide a reference voltage to the pixel PX.

[0103] The first control line CSL1 can be connected to the scan driver SDV and extend from the first area A1 to the third area A3 via the second area A2. The second control line CSL2 can be connected to the emission driver EDV and can extend from the first area A1 to the third area A3 via the second area A2.

[0104] The pad PD can be provided adjacent to a distal end of the display panel DP defined by the third area A3. Within the third area A3, the driving chip DIC, the power line PL, the first control line CSL1, and the second control line CSL2 can be connected to the pad PD in various ways. The flexible circuit film FCB can overlap the display panel DP at an end portion (e.g., a distal end) of the third area A3 of the display panel DP to be provided on the display panel DP. The flexible circuit film FCB can include circuit pads corresponding to the pads PD of the display panel DP and can be electrically connected to the pads PD by anisotropic conductive film (ACF). In an embodiment, the flexible circuit film FCB can be connected to the display panel DP at the pads PD of the display panel DP.

[0105] The display panel DP according to an embodiment can include a first contact hole CN-H1 defined therein at the first area A1. The display panel DP can include an extension trace TL-L. The extension trace TL-L can extend to the third area A3 via the first area A1 and the second area A2. The extension trace TL-L can be connected one-to-one with corresponding traces among the traces TL1, TL2, and TL3 (see Figure 6 ) through the first contact hole CN-H1 or exposed outside the display panel DP at the first contact hole CN-H1. The extension trace TL-L can be connected to the traces TL1, TL2, and TL3 (see Figure 6 ) at a first end portion of the extension trace TL-L. The extension trace TL-L can be connected to the pads PD at second end portions of the extension trace TL-L opposite the first end portions thereof, respectively.

[0106] Figure 5 The extension trace TL-L is exemplarily disposed between the data lines DL1 to DLn in a plan view, but embodiments of the present application are not limited thereto. In an embodiment, the data lines DL1 to DLn can be disposed between the extension trace TL-L, and accordingly, the first contact hole CN-H1 can be provided as a plurality of them between the data lines DL1 to DLn. However, this arrangement is not limited to any one embodiment of the present application.

[0107] Figure 6 A plan view of an input sensor ISP according to an embodiment of the present application.

[0108] Referring to Figure 6 , an input sensing layer as an input sensor ISP according to an embodiment can include sensing electrodes TE1 and TE2 and traces TL1, TL2, and TL3. In a case where the input sensor ISP is directly formed on the display panel DP through a continuous process, the sensing electrodes TE1 and TE2 can be formed only in an active area AA overlapping the first area A1 of the display panel DP.

[0109] The input sensor ISP can acquire information about an external input through a change in capacitance between the first sensing electrode TE1 and the second sensing electrode TE2. The first sensing electrodes TE1 are arranged along a first direction DR1, and each of the first sensing electrodes TE1 extends along a second direction DR2. The first sensing electrodes TE1 can each include a first sensing pattern SP1 and a first connection pattern CP1.

[0110] The first sensing patterns SP1 are disposed in the active area AA. The first sensing patterns SP1 included in the same first sensing electrode TE1 can be arranged along the second direction DR2. The first sensing patterns SP1 can each have a rhombic shape. However, this is an exemplary illustration, and the first sensing patterns SP1 can have various planar shapes, and are not limited to any one embodiment of the present application.

[0111] The first connection patterns CP1 are disposed in the active area AA. The first connection patterns CP1 can be disposed between adjacent first sensing patterns SP1 along the second direction DR2. The first connection patterns CP1 and the first sensing patterns SP1 can be disposed on different layers from each other within the input sensor ISP, and thus can be connected to each other through a contact hole.

[0112] The second sensing electrodes TE2 are arranged along the second direction DR2, and each of the second sensing electrodes TE2 extends along the first direction DR1. The second sensing electrodes TE2 can each include a second sensing pattern SP2 and a second connection pattern CP2.

[0113] The second sensing patterns SP2 can be spaced apart from the first sensing patterns SP1. The first sensing patterns SP1 and the second sensing patterns SP2 can not be in contact with each other, and thus can independently transmit / receive electrical signals from each other.

[0114] The second sensing patterns SP2 are disposed in the active area AA. The second sensing patterns SP2 included in the same second sensing electrode TE2 can be arranged along the first direction DR1. The second sensing patterns SP2 can have the same planar shape as the planar shape of the first sensing patterns SP1. For example, the second sensing patterns SP2 can each have a rhombic planar shape. However, this is an exemplary illustration, and the second sensing patterns SP2 can have various shapes, and are not limited to any one embodiment of the present application.

[0115] The second connection patterns CP2 can be disposed between adjacent second sensing patterns SP2 along the first direction DR1 and / or the second direction DR2. Basically, the second sensing patterns SP2 and the second connection patterns CP2 included in one second sensing electrode TE2 can be formed in an integral shape or an integral pattern. Here, the second sensing patterns SP2 and the second connection patterns CP2 can be in the same layer from each other. Since in the same layer, elements can be formed in the same process and / or contain the same materials as each other, elements can be respective portions of the same material layer, elements can be on the same layer by forming an interface with the same layer or an upper layer, etc., but are not limited thereto.

[0116] According to an embodiment, the first sensing pattern SP1, the second sensing pattern SP2, and the second connection pattern CP2 are provided on (or in) the same layer, and the first connection pattern CP1 can be provided on (or in) a different layer. The first sensing pattern SP1, the second sensing pattern SP2, and the second connection pattern CP2 can be provided as a plurality of grid lines extending in a diagonal direction with respect to each of the first direction DR1 and the second direction DR2. The grid lines can indicate solid portions of the material of the same layer forming the first sensing pattern SP1, the second sensing pattern SP2, and the second connection pattern CP2. The solid portions (or solid lines) can be spaced apart from each other to define openings or gaps therebetween, and the solid portions together with the openings and / or gaps can define a grid shape in a plan view.

[0117] The traces TL1, TL2, and TL3 are provided in the peripheral area NAA of the input sensor ISP. The traces TL1, TL2, and TL3 can include a first trace TL1, a second trace TL2, and a third trace TL3.

[0118] The first trace TL1 is connected to the first sensing electrodes TE1 at first ends of the first trace TL1, respectively. In this embodiment, the first trace TL1 is connected to the first sensing electrodes TE1 at lower end portions of opposite end portions of the first sensing electrodes TE1, respectively. The second trace TL2 is connected to the first sensing electrodes TE1 at upper end portions of the opposite end portions of the first sensing electrodes TE1, respectively. According to an embodiment of the present application, one first sensing electrode TE1 can be connected to the first trace TL1 and the second trace TL2. Accordingly, for the first sensing electrodes TE1, each of which has a relatively large length (e.g., a main dimension along the first direction DR1) than a length of each of the second sensing electrodes TE2 (e.g., a main dimension along the second direction DR2), the sensitivity for sensing an external input according to the area can be uniformly maintained.

[0119] In the input sensor ISP according to an embodiment of the present application, any one of the first trace TL1 and the second trace TL2 can also be omitted, and the input sensor ISP is not limited to any one embodiment of the present application.

[0120] The third trace TL3 is connected to the second sensing electrodes TE2 at first ends of the third trace TL3, respectively. In this embodiment, the third trace TL3 is connected to the second sensing electrodes TE2 at left end portions of opposite end portions of the second sensing electrodes TE2, respectively.

[0121] In the input sensor ISP, the second contact hole CN-H2 can be defined by passing through one or more layers of the input sensor ISP, such as passing through at least any one of the insulating layers included in the input sensor ISP. The second contact hole CN-H2 can overlap the first contact hole CN-H1 defined in the first area A1 of the display panel DP.

[0122] The second end portion of each of the traces TL1, TL2, and TL3 can be disposed in the second contact hole CN-H2. The second end portion of the traces TL1, TL2, and TL3 disposed in the second contact hole CN-H2 can be connected to the end portion of the extended trace TL-L (see Figure 5 ) respectively. The second end portion of the traces TL1, TL2, and TL3 can be exposed to the outside of the input sensor ISP through or at the second contact hole CN-H2. The traces TL1, TL2, and TL3 of the input sensor ISP can be connected to the display panel DP at the pad PD (see Figure 5 ) through the extended trace TL-L (see Figure 5 ) of the display panel DP.

[0123] Figure 7 An enlarged sectional view of the display module DM according to an embodiment of the present disclosure.

[0124] Figure 7 A cross section corresponding to the first transistor T1, the second transistor T2, and the light emitting element OLED of a partial configuration of the pixel PX (see Figure 5 ) as a display area is exemplified.

[0125] The display panel DP (see Figure 5 ) can include a base layer BL, a circuit element layer DP-CL disposed on the base layer BL, a display element layer DP-OLED, and an encapsulation layer TFE. The display panel DP can further include functional layers (not shown) such as an anti-reflection layer and a refractive index control layer. The circuit element layer DP-CL includes at least a plurality of insulating layers and circuit elements. As described below, the insulating layers can include organic layers and / or inorganic layers.

[0126] The circuit elements of the circuit element layer DP-CL include signal lines, driving circuits of the pixels PX, etc. The circuit element layer DP-CL can be formed by a process of forming insulating material layers, semiconductor material layers, and conductive material layers using coating, deposition, etc., and a process of patterning the insulating material layers, the semiconductor material layers, and the conductive material layers using a photolithography process. The display element layer DP-OLED can include light emitting elements OLED and a pixel definition film PDL. The circuit element layer DP-CL can be connected to the display element layer DP-OLED to generate light, provide an image IM, etc.

[0127] The base layer BL can include a synthetic resin layer. The synthetic resin layer can include a thermosetting resin. In particular, the synthetic resin layer can be a polyimide-based resin layer, and there is no particular limitation on the material. The synthetic resin layer can include at least one of an acrylate-based resin, a methacrylate-based resin, a polyisoprene, a vinyl-based resin, an epoxy-based resin, a urethane-based resin, a cellulose-based resin, a siloxane-based resin, a polyamide-based resin, and a perylene-based resin. In addition, the base layer BL can include a glass substrate, a metal substrate, an organic / inorganic composite material substrate, or the like.

[0128] The base layer BL according to an embodiment can include a first base layer PI1, a first cover layer BR1, a second base layer PI2, and a second cover layer BR2, which are sequentially stacked in a third direction DR3.

[0129] The first base layer PI1 can be disposed at the lowermost side. The first base layer PI1 can include an organic material. For example, the first base layer PI1 can include any one of polyimide (PI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyaromatic ester, polycarbonate (PC), polyetherimide (PEI), and polyethersulfone (PES).

[0130] The first cover layer BR1 can be disposed on the first base layer PI1. The first cover layer BR1 can include an inorganic material. For example, the first cover layer BR1 can include at least one of silicon oxide, silicon oxynitride, aluminum oxide, titanium oxide, silicon nitride, zirconium oxide, hafnium oxide, and amorphous silicon.

[0131] The second base layer PI2 can be disposed on the first cover layer BR1. The second base layer PI2 can include an organic material. The organic material included in the second base layer PI2 can be the same as the organic material included in the first base layer PI1.

[0132] The second cover layer BR2 can be disposed on the second base layer PI2. The second cover layer BR2 can include an inorganic material. The inorganic material included in the second cover layer BR2 can be the same as the inorganic material included in the first cover layer BR1.

[0133] The light-blocking pattern BML can be disposed on the second cover layer BR2. The light-blocking pattern BML can prevent an electric potential due to a polarization phenomenon from affecting the first transistor T1. In addition, the light-blocking pattern BML can block external light from reaching the first transistor T1. According to an embodiment of the present application, the light-blocking pattern BML can also be a floating electrode in a form that is electrically isolated from other electrodes or wires. The light-blocking pattern BML can include molybdenum.

[0134] The barrier layer BRL can be disposed on the light-blocking pattern BML. The barrier layer BRL prevents foreign substances from entering from the outside. The barrier layer BRL can include a silicon oxide layer and a silicon nitride layer. These can each be provided as a plurality, and the silicon oxide layer and the silicon nitride layer can be alternately stacked.

[0135] The buffer layer BFL can be disposed on the barrier layer BRL. The buffer layer BFL can improve the bonding force between the base layer BL and each conductive pattern or between the base layer BL and each semiconductor pattern. The buffer layer BFL can include a silicon oxide layer and a silicon nitride layer. The silicon oxide layer and the silicon nitride layer can be alternately stacked.

[0136] The first semiconductor pattern OSP1 of the first semiconductor material layer is disposed on the buffer layer BFL. The first semiconductor pattern OSP1 can include a silicon semiconductor material. The first semiconductor pattern OSP1 can be a polysilicon semiconductor. However, embodiments of the present application are not limited thereto, and the first semiconductor pattern OSP1 can also include amorphous silicon.

[0137] The first semiconductor pattern OSP1 can include an input region (or first portion), an output region (or second portion), and a channel region (or third portion) defined between the input region and the output region in a direction along the first semiconductor material layer. The channel region of the first semiconductor pattern OSP1 can be defined in correspondence with the first control electrode GE1 which will be described later. The input region and the output region are doped with a dopant and thus have a relatively high (electrical) conductivity than that of the channel region. The input region and the output region can each be doped with an N-type dopant. In this embodiment, an N-type first transistor T1 is exemplarily illustrated, but the first transistor T1 can also be a P-type transistor.

[0138] The first insulating layer 10 is disposed on the buffer layer BFL. The first insulating layer 10 is commonly overlapped with a plurality of pixels PX (see Figure 5 ) and covers the first semiconductor pattern OSP1. The first insulating layer 10 can be an inorganic layer and / or an organic layer, and can have a single layer or a multi-layer structure. The first insulating layer 10 can include at least one of aluminum oxide, titanium oxide, silicon oxide, silicon oxynitride, zirconium oxide, and hafnium oxide. In this embodiment, the first insulating layer 10 can be a single layer of silicon oxide layer (e.g., a single layer of silicon oxide).

[0139] The first control electrode GE1 is disposed on the first insulating layer 10. The first control electrode GE1 overlaps with the channel region of the first semiconductor pattern OSP1.

[0140] The second insulating layer 20 covering the first control electrode GE1 is disposed on the first insulating layer 10. The second insulating layer 20 is commonly overlapped with a plurality of pixels PX (see Figure 5) are commonly overlapped. The second insulating layer 20 can be an inorganic layer and / or an organic layer, and can have a single layer or a multi-layer structure. The second insulating layer 20 can include at least one of aluminum oxide, titanium oxide, silicon oxide, silicon oxynitride, zirconium oxide, and hafnium oxide. In this embodiment, the second insulating layer 20 can be a single layer of silicon oxide.

[0141] An upper electrode UE can be further disposed on the second insulating layer 20. The upper electrode UE can overlap the first control electrode GE1.

[0142] A lower control electrode GE2-B of the second transistor T2 can be further disposed on the second insulating layer 20. The lower control electrode GE2-B can overlap the second semiconductor pattern OSP2. The lower control electrode GE2-B can form a dual gate portion together with an upper control electrode GE2-U.

[0143] A third insulating layer 30 covering the upper electrode UE and the lower control electrode GE2-B is disposed on the second insulating layer 20. The third insulating layer 30 can be an inorganic layer and / or an organic layer, and can have a single layer or a multi-layer structure. The third insulating layer 30 can include at least one of aluminum oxide, titanium oxide, silicon oxide, silicon oxynitride, zirconium oxide, and hafnium oxide. In this embodiment, the third insulating layer 30 can be a single layer of silicon oxide.

[0144] A second semiconductor pattern OSP2 of a second semiconductor material layer is disposed on the third insulating layer 30. The second semiconductor pattern OSP2 can include an oxide semiconductor. The second semiconductor pattern OSP2 can include a crystalline or amorphous oxide semiconductor. For example, the oxide semiconductor can include a metal oxide of zinc (Zn), indium (In), gallium (Ga), tin (Sn), titanium (Ti), or the like, or a combination of a metal such as zinc (Zn), indium (In), gallium (Ga), tin (Sn), titanium (Ti), or the like and an oxide thereof. The oxide semiconductor can include indium tin oxide (ITO), indium gallium zinc oxide (IGZO), zinc oxide (ZnO), indium zinc oxide (IZO), indium oxide (InO), titanium oxide (TiO), indium zinc tin oxide (IZTO), zinc tin oxide (ZTO), or the like.

[0145] The second semiconductor pattern OSP2 can include an input region (or a first portion), an output region (or a second portion), and a channel region (or a third portion) defined between the input region and the output region. The input region and the output region can include impurities. The channel region of the second semiconductor pattern OSP2 can correspond to a later-described upper control electrode GE2-U definition.

[0146] The impurities of the second semiconductor pattern OSP2 can be a reduced metal material. The input region and the output region can include a metal material reduced from a metal oxide constituting the channel region. Accordingly, the second transistor T2 can be used as a switching element capable of reducing a leakage current and thus having improved on and off characteristics.

[0147] A fourth insulating layer 40 covering the second semiconductor pattern OSP2 is disposed on the third insulating layer 30. The fourth insulating layer 40 can be an inorganic layer and / or an organic layer, and can have a single layer or a multi-layer structure. The fourth insulating layer 40 can include at least one of aluminum oxide, titanium oxide, silicon oxide, silicon oxynitride, zirconium oxide, and hafnium oxide.

[0148] An upper control electrode GE2-U is disposed on the fourth insulating layer 40. The upper control electrode GE2-U overlaps the second semiconductor pattern OSP2.

[0149] A fifth insulating layer 50 covering the upper control electrode GE2-U is disposed on the fourth insulating layer 40. The fifth insulating layer 50 can be an inorganic layer and / or an organic layer, and can have a single layer or a multi-layer structure. The fifth insulating layer 50 can include at least one of aluminum oxide, titanium oxide, silicon oxide, silicon oxynitride, zirconium oxide, and hafnium oxide.

[0150] A first input electrode DE1, a first output electrode SE1, a second input electrode DE2, and a second output electrode SE2 are disposed on the fifth insulating layer 50. The first input electrode DE1 and the first output electrode SE1 are connected to the first semiconductor pattern OSP1 through first and second contact holes CH1 and CH2 that respectively expose input and output regions of the first semiconductor pattern OSP1. The first and second contact holes CH1 and CH2 pass through the first to fifth insulating layers 10 to 50.

[0151] The second input electrode DE2 and the second output electrode SE2 are connected to the second semiconductor pattern OSP2 through third and fourth contact holes CH3 and CH4 that respectively expose input and output regions of the second semiconductor pattern OSP2. The third and fourth contact holes CH3 and CH4 pass through the fourth and fifth insulating layers 40 and 50.

[0152] The display panel DP according to an embodiment can further include a control bridge pattern BBP disposed on the fourth insulating layer 40. The control bridge pattern BBP can be branched from a portion of the upper control electrode GE2-U. That is, the control bridge pattern BBP and the upper control electrode GE2-U can be portions of the same material layer. The control bridge pattern BBP can be connected to the lower control electrode GE2-B through a fifth contact hole CH5. The fifth contact hole CH5 passes through the third and fourth insulating layers 30 and 40.

[0153] A sixth insulating layer 60 covering the first input electrode DE1, the first output electrode SE1, the second input electrode DE2, and the second output electrode SE2 is disposed on the fifth insulating layer 50. The sixth insulating layer 60 can be an organic layer, and can have a single layer or a multi-layer structure.

[0154] The connection electrode CNE is provided on the sixth insulating layer 60. The connection electrode CNE can be connected to the first output electrode SE1 through a sixth contact hole CH6 that passes through the sixth insulating layer 60.

[0155] A seventh insulating layer 70 (or a passivation layer) covering the connection electrode CNE is provided on the sixth insulating layer 60. The seventh insulating layer 70 can be an organic layer, and can have a single layer or a multi-layer structure.

[0156] In this embodiment, the sixth insulating layer 60 and the seventh insulating layer 70 can each be a single layer of a polyimide-based resin. The embodiments of the present application are not limited thereto, and the sixth insulating layer 60 and the seventh insulating layer 70 can include at least one of an acrylate-based resin, a methacrylate-based resin, a polyisoprene, a vinyl-based resin, an epoxy-based resin, a urethane-based resin, a cellulose-based resin, a siloxane-based resin, a polyamide-based resin, and a perylene-based resin.

[0157] A light emitting element OLED is provided on the seventh insulating layer 70. An anode AE of the light emitting element OLED is provided on the seventh insulating layer 70. The anode AE is connected to the connection electrode CNE through a seventh contact hole CH7 that passes through the seventh insulating layer 70. A pixel definition layer PDL is provided on the seventh insulating layer 70.

[0158] An opening OP of the pixel definition layer PDL exposes at least a portion of the anode AE. The opening OP of the pixel definition layer PDL can define a light emitting area PXA of the pixel PX. For example, a plurality of pixels PX (see Figure 2 ) can be provided on a flat surface of the display panel DP in some regularity or arrangement. An area (or planar region) in which the plurality of pixels PX are provided can correspond to the active area AA described with reference to Figure 5 . The active area AA (or display area) can include the light emitting area PXA and a non-light emitting area NPXA adjacent to the light emitting area PXA. The non-light emitting area NPXA can surround the light emitting area PXA.

[0159] A hole control layer HCL can be commonly provided in the light emitting area PXA and the non-light emitting area NPXA. A common layer such as the hole control layer HCL can be commonly formed across a plurality of pixels PX (see Figure 2 ). The hole control layer HCL can include a hole transport layer and a hole injection layer.

[0160] An organic emitting layer EML is provided on the hole control layer HCL. The organic emitting layer EML can be provided only in an area corresponding to the opening OP. The organic emitting layer EML can be individually formed for each of a plurality of pixels PX (see Figure 2 ). Here, the organic emitting layer EML can be a discrete pattern in a plan view, such as having a planar shape separate from other discrete patterns of light emitting layers including a plurality of organic emitting layers EML.

[0161] In this embodiment, the patterned organic light emitting layer EML is exemplarily illustrated, but the organic light emitting layer EML can be commonly provided across the plurality of pixels PX. At this time, the organic light emitting layer EML can generate white light. In addition, the organic light emitting layer EML can have a multi-layer structure.

[0162] The electron control layer ECL is provided on the organic light emitting layer EML. The electron control layer ECL can include an electron transport layer and an electron injection layer. The cathode CE is provided on the electron control layer ECL. The electron control layer ECL and the cathode CE are commonly provided across the plurality of pixels PX (see Figure 2 ).

[0163] The encapsulation layer TFE is provided on the cathode CE. The encapsulation layer TFE is commonly provided across the plurality of pixels PX. In this embodiment, the encapsulation layer TFE directly covers the cathode CE. The encapsulation layer TFE can cover the light emitting element OLED. The encapsulation layer TFE can include two inorganic encapsulation layers LIL and UIL and an organic encapsulation layer OL provided therebetween. According to an embodiment of the present disclosure, the encapsulation layer TFE can include a plurality of inorganic layers and a plurality of organic layers alternately stacked.

[0164] The inorganic encapsulation layers LIL and UIL protect the light emitting element OLED from moisture and / or oxygen, and the organic encapsulation layer OL protects the light emitting element OLED from foreign substances such as dust particles. The inorganic encapsulation layers LIL and UIL can include a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, an aluminum oxide layer, etc., and are not particularly limited thereto. The organic encapsulation layer OL can include an acrylate-based organic layer, and is not particularly limited thereto.

[0165] According to this embodiment, the first transistor T1 can include a silicon semiconductor, particularly a polysilicon semiconductor, and thus can have a high electron mobility. The second transistor T2 includes an oxide semiconductor, thereby reducing a leakage current. Accordingly, a driving voltage of the pixel PX (see Figure 2 ) is reduced and a malfunction is prevented.

[0166] The input sensor ISP can be directly provided on the display panel DP. The input sensor ISP can include sensing insulating layers TIL1, TIL2, and TIL3, and at least one conductive layer such as including conductive layers TML1 and TML2. The sensing insulating layers TIL1, TIL2, and TIL3 can contain any one of inorganic materials and organic materials.

[0167] The first sensing insulating layer TIL1 can be disposed directly on the second inorganic layer UIL of the encapsulation layer TFE. The first conductive layer TML1 is disposed on the first sensing insulating layer TIL1. The second sensing insulating layer TIL2 can be disposed on the first sensing insulating layer TIL1 and cover the first conductive layer TML1. The second conductive layer TML2 is disposed on the second sensing insulating layer TIL2. The third sensing insulating layer TIL3 can be disposed on the second sensing insulating layer TIL2 and cover the second conductive layer TML2. However, embodiments of the present application are not limited thereto, and the first sensing insulating layer TIL1 can be omitted, and the first conductive layer TML1 can be disposed directly on the second inorganic layer UIL, and the structure is not limited to any one embodiment of the present application.

[0168] According to an embodiment of the present application, the first sensing insulating layer TIL1 and the second sensing insulating layer TIL2 can include inorganic materials, and the third sensing insulating layer TIL3 can include an organic material.

[0169] Referring to Figure 6 The first connection pattern CP1 of the described sensing electrodes TE1 and TE2 can be included in the first conductive layer TML1. The first sensing pattern SP1, the second sensing pattern SP2, and the second connection pattern CP2 can be included in the second conductive layer TML2. Accordingly, adjacent first sensing patterns SP1 can be connected to the first connection pattern CP1 in a different layer from the first sensing pattern SP1 through a contact hole defined in the second sensing insulating layer TIL2.

[0170] Figures 8A to 8D A cross-sectional view of a structure in a method of manufacturing (or providing) a display device DD according to an embodiment of the present application is illustrated. Hereinafter, referring to Figures 8A to 8D A lower member LM to be formed (or provided) on the rear surface D-B of the display panel DP will be described. The manufacturing of the lower member LM to be described below can be performed by an inkjet process or a dispensing process, and is not limited to any one embodiment of the present application.

[0171] Referring to Figure 8A The method of manufacturing the display device DD can include forming a flat portion AR on the preliminary shape of the rear surface D-B of the display panel DP. The preliminary display panel can include a driving chip DIC on a front surface of the display panel DP opposite the rear surface D-B thereof. The flat portion AR can be formed on the rear surface D-B to overlap the entire surface (or planar area) of the first area A1.

[0172] In the manufacturing method of the display device DD, the flat portion AR can be formed by jetting a material such as ink IN onto the rear surface D-B of the display panel DP through a nozzle HD. The ink IN can be an ink material in which a polymer resin contains carbon black. Also, the ink IN can include at least one of graphite, copper (Cu), aluminum (Al), carbon nanotube (CNT), and graphene for a heat dissipation function. According to an embodiment of the present disclosure, the optical density of the material contained in the ink IN can be about 3 to about 5, the thermal conductivity can be about 20 W / mk to about 100 W / mk, and the storage modulus can be about 0.01 MPa to about 1 MPa.

[0173] The flat portion AR can be formed on the rear surface D-B of the display panel DP at a planar region thereof overlapping the first area A1. Based on the rear surface D-B of the display panel DP, the thickness of the flat portion AR can be 100 µm or more and 300 µm or less. After the flat portion AR is formed, a curing process can be performed. Here, the flat portion AR can be a cured pattern of the material. The flat pattern AR can have an end surface closest to the second area A2.

[0174] Thereafter, referring to Figure 8B , the manufacturing method of the display device DD can include forming a protruding portion SR on the flat portion AR. The protruding portion SR can be formed on the flat portion AR to overlap the first area A1 at a position adjacent to (or closest to) a boundary between the first area A1 and the second area A2. The protruding portion SR can expose a portion of the upper surface A-U of the flat portion AR. After the protruding portion SR is formed, a curing process can be performed. Here, the protruding portion SR can be a cured pattern of the material. The protruding portion SR can have an end surface closest to the second area A2. That is, the lower member LM can have a side surface closest to the second area A2 and formed together by the end surfaces of the flat portion AR and the protruding portion SR.

[0175] Thereafter, referring to Figure 8C , the manufacturing method of the display device DD can include forming a pad portion PR on the rear surface D-B of the display panel DP. The pad portion PR can be formed on the rear surface D-B of the display panel DP and overlap the third area A3. An exposed portion of the rear surface D-B can be between the flat portion AR and the pad portion PR. After the pad portion PR is formed, a curing process can be performed. Here, the pad portion PR can be a cured pattern of the material. The lower member LM including the cured patterns of the flat portion AR, the protruding portion SR, and the pad portion PR on the display panel DP can be completed. In an embodiment, the providing of the flat portion AR, the protruding portion SR, and the pad portion PR can include providing ink onto the rear surface of the display panel DP using an inkjet process.

[0176] The lower component LM, serving as an electromagnetic wave shielding / light blocking / heat dissipation and / or buffering (protective) layer, includes patterns that are disconnected from each other at the second region A2 (e.g., the bending region) of the display device DD. The pad portion PR may be coplanar with the flat portion AR. That is, the unbent or flat display panel DP includes the pad portion PR coplanar with the flat portion AR.

[0177] Subsequently, refer to Figure 8D A method for manufacturing a display device DD may include bending the display panel DP at a second region A2 (e.g., a bending region of the display panel DP). When the second region A2 is bent, the pad portion PR and the protrusion SR may face and contact each other along a third direction DR3. According to one embodiment of the present invention, when the distance from the bending axis AX to the second region A2 of the rear surface DB of the display panel DP is defined as the radius of curvature R1, twice the radius of curvature R1 may be equal to the total thickness TH of the flat portion AR, the protrusion SR, and the pad portion PR. Each of the components may contribute to the thickness portion of the total thickness TH. According to this embodiment, the protrusion SR may have an inverted trapezoidal shape in cross-section.

[0178] Figures 9A to 9C A cross-sectional view is shown illustrating a manufacturing method of a display device DD according to an embodiment of the present invention. The process for manufacturing the flat portion AR of the lower component LM-1 according to this embodiment is as follows: Figure 8A The manufacturing process for the flat section AR is the same as that described above, and the subsequent processes will be described.

[0179] refer to Figure 9A A method for manufacturing the display device DD may include: after manufacturing a planar portion AR, forming a pad portion PR on the rear surface DB of the display panel DP at a position spaced apart from the side surface of the planar portion AR closest to the second region A2. The pad portion PR may be formed on the rear surface DB of the display panel DP and overlap with the planar area of ​​the third region A3. After forming the pad portion PR, a curing process may be performed.

[0180] Subsequently, refer to Figure 9B A method for manufacturing a display device DD may include forming a protrusion SR-1 on a pad portion PR. The protrusion SR-1 may be formed on the pad portion PR that overlaps with the third region A3. The protrusion SR-1 may cover a portion of a planar area on the upper surface of the pad portion PR. After forming the protrusion SR-1, a curing process may be performed. That is, an unbent or flat display panel DP includes the protrusion SR-1 and the pad portion PR coplanar with the flat portion AR.

[0181] Subsequently, refer to Figure 9CThe manufacturing method of the display device DD can include bending the display panel DP at the second area A2 of the display panel DP. When the second area A2 is bent, the flat portion AR and the protruding portion SR-1 can face each other and contact each other in the third direction DR3. Here, the display panel DP bent at the second area A2 includes the flat portion AR and the protruding portion SR-1 contacting each other.

[0182] According to an embodiment of the present disclosure, when a distance from the bending axis AX to the second area A2 of the rear surface D-B of the display panel DP is defined as a curvature radius R1, twice the curvature radius R1 can be equal to a total thickness TH of the flat portion AR, the protruding portion SR-1, and the pad portion PR. According to the embodiment, the protruding portion SR-1 can have a trapezoidal shape in a cross section.

[0183] According to an embodiment of the present disclosure, in a display device DD including a display panel DP having a bendable portion, by simplifying a functional layer of a lower member LM disposed under the display panel DP, a manufacturing method of the display device DD can be reduced in cost, and a process can be simplified.

[0184] Although embodiments of the present disclosure have been described, it is understood that the present disclosure should not be limited to these embodiments, but various changes and modifications can be made by those of ordinary skill in the art within the spirit and scope of the claimed present disclosure. Therefore, the technical scope of the present disclosure should not be limited to what is described in the detailed description of the specification, but should be defined by the claims.

Claims

1. A display device, characterized in that, The display device includes: A display panel having a front surface and a rear surface opposite to each other, the display panel comprising: The first zone contains pixels. The second zone is bendable relative to the bending axis extending along the first direction. The boundary, between the first zone and the second zone, and A third region, spaced apart from the first region along a second direction intersecting the first direction, is located between the first region and the third region. The third region includes a driver chip on the front surface and pads adjacent to the driver chip. The lower component includes: A flat portion that overlaps with the entire first area and contacts the rear surface of the display panel at the first area. The protrusion is located on the flat portion and adjacent to the boundary between the first and second regions. The pad portion is spaced apart from the flat portion and the protruding portion, overlaps with the third region, and contacts the rear surface of the display panel at the third region. When the display panel is bent in the second area, the protrusion and the pad come into contact with each other.

2. The display device according to claim 1, characterized in that, The protrusion is on the upper surface of the flat portion and exposes a portion of the upper surface of the flat portion.

3. The display device according to claim 1, characterized in that, The flat portion has a first thickness, the protruding portion has a second thickness less than the first thickness, and the pad portion has a third thickness less than the second thickness.

4. The display device according to claim 3, characterized in that, The first thickness is 100 micrometers or more and 300 micrometers or less, the second thickness is 50 micrometers or more and 200 micrometers or less, and the third thickness is 50 micrometers or more and 150 micrometers or less.

5. The display device according to claim 1, characterized in that, The flat portion, the protruding portion, and the pad portion each comprise a polymer resin and carbon black.

6. The display device according to claim 1, characterized in that: The flat portion and the protruding portion each comprise a polymer resin and carbon black, and The pad portion contains only the polymer resin.

7. The display device according to claim 1, characterized in that, The lower component has an optical density of 3 to 5, a thermal conductivity of 20 W / m Kelvin to 100 W / m Kelvin, and a storage modulus of 0.01 MPa to 1 MPa.

8. The display device according to claim 1, characterized in that, The display device further includes an input sensor directly on the display panel, an optical film facing the first area of ​​the display panel, and a window facing the display panel, the optical film being between the display panel and the window.

9. The display device according to claim 1, characterized in that, The display device further includes: A bent cover layer that covers the front surface of the display panel at the second area of ​​the display panel; A flexible circuit film, the flexible circuit film being connected to the display panel at the pads of the display panel, wherein when the display panel is bent in the second area, a portion of the flexible circuit film contacts the flat portion of the lower member; and A conductive film covers the driving chip of the display panel on the front surface of the display panel and extends from the driving chip to overlap with the flexible circuit film and the pads.

10. A display device, characterized in that, The display device includes: A display panel having a front surface and a rear surface opposite to each other, the display panel comprising: The first zone contains pixels; The second zone is bendable relative to the bending axis extending along the first direction; and A third region, spaced apart from the first region along a second direction intersecting the first direction, is located between the first region and the third region. The third region includes a driver chip on the front surface and pads adjacent to the driver chip. The lower component includes: A flat portion that overlaps with the entire first area and contacts the rear surface of the display panel at the first area; The pad portion overlaps with the third region and contacts the rear surface of the display panel at the third region; and A protrusion is located on the pad portion, and the protrusion and the pad portion are spaced apart from the flat portion. When the display panel is bent in the second area, the flat portion and the protruding portion come into contact with each other.

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