Chip packaging cover plate with single-phase and two-phase cooling
By designing a single-phase and two-phase cooling system in the chip package cover, and utilizing the cooling channels of the separator plate and porous metal structure, the problem of poor chip heat dissipation was solved, achieving more efficient cooling and improved chip stability.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-11
- Publication Date
- 2026-03-20
AI Technical Summary
The heat dissipation effect of existing chip packaging covers is poor, resulting in high chip temperature and uneven temperature distribution, which causes thermal stress or thermal deformation and affects the stability of the chip.
The chip packaging cover design with single-phase and two-phase cooling is adopted. The internal structure of the housing is divided into upper and lower cooling channels by a partition plate. Coolant is introduced into the upper and lower channels respectively to cool the chip and the partition plate. The heat exchange efficiency is improved by a porous metal structure heat dissipation mechanism.
It effectively reduces chip temperature, improves cooling effect, reduces thermal stress and thermal deformation, and enhances chip stability.
Smart Images
Figure CN224022242U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to chip cover plate technical field, especially a kind of chip package cover plate with single-phase two-phase cooling. BACKGROUND
[0002] With the rapid development of chip to integration and miniaturization, packaging density and power consumption increase continuously, so that chip heat flux density also rapidly promotes. Common chip packaging shell is generally single or composite metal material, limited to the thermal conductivity of material itself, the continuous promotion of chip unit heat flux density will lead to the increase of diffused thermal resistance, and the thermal stress or thermal deformation generated by uneven temperature distribution will cause wafer damage, deformation or fracture, affect the stability of components and system. Chip packaging cover plate in the prior art is provided with radiator, for cooling chip, but the heat dissipation effect of the current radiator is poor, resulting in high temperature of chip. SUMMARY
[0003] According to the utility model embodiment, a kind of chip package cover plate with single-phase two-phase cooling is provided, comprising: chip, shell, partition plate and heat dissipation mechanism;
[0004] Chip is located below shell, shell is hollow structure, partition plate is located in shell, partition plate divides into upper layer and lower layer in shell, lower layer is first cooling flow channel, upper layer is second cooling flow channel, cooling liquid is introduced into first cooling flow channel and second cooling flow channel, cooling liquid in first cooling flow channel is used to cool chip, and cooling liquid in second cooling flow channel is used to cool partition plate, and heat dissipation mechanism is arranged at the bottom of first cooling flow channel and corresponds to chip.
[0005] Further, the heat dissipation mechanism is a heat dissipation layer, which is laid below the first cooling flow channel.
[0006] Further, the porous metal structure is sintered.
[0007] Further, the heat dissipation mechanism is a heat dissipation fin, which is uniformly arranged below the first cooling flow channel.
[0008] Further, the shell is an integral structure, and a back-shaped mounting foot is arranged below the shell.
[0009] Further, the cooling liquid is pure water or fluorinated liquid or glycol solution.
[0010] Further, the wall thickness of the contact surface between the shell and the chip is 0.2mm-0.3mm.
[0011] According to the chip packaging cover plate with single-phase and two-phase cooling, heat generated during use of the chip is transferred to the outer wall of the shell in contact with the chip, cooling liquid is introduced into the first cooling flow channel, the heat exchange efficiency of the cooling liquid on heat can be improved through the heat dissipation mechanism, after long-time use of the chip, the temperature on the partition plate is relatively high, which leads to poor cooling effect of the cooling liquid in the first cooling flow channel on the chip, the partition plate is cooled by introducing cooling liquid into the second cooling flow channel, the temperature of the partition plate is reduced, the cooling liquid in the first cooling flow channel can effectively cool the chip, the cooling effect on the chip is improved, and the temperature of the chip is effectively reduced.
[0012] It is to be understood that both the foregoing general description and the following detailed description are exemplary and intended to provide further explanation of the subject technology claimed. BRIEF DESCRIPTION OF DRAWINGS
[0013] Fig. 1 It is to be understood that both the foregoing general description and the following detailed description are exemplary and intended to provide further explanation of the subject technology claimed.
[0014] Fig. 2 It is to be understood that both the foregoing general description and the following detailed description are exemplary and intended to provide further explanation of the subject technology claimed.
[0015] In the drawing, reference numeral 1 is a chip, 2 is a shell, 21 is a mounting foot, 3 is a partition plate, 4 is a heat dissipation layer, 5 is a heat dissipation fin, 6 is a first cooling flow channel, and 7 is a second cooling flow channel. DETAILED DESCRIPTION
[0016] The preferred embodiments of the utility model will be described in detail below with reference to the drawings, and the utility model will be further described.
[0017] As shown in the drawing, Figs. 1-2 A two-phase cooling chip 1 packaging cover plate according to the utility model embodiment, characterized in that, including: chip 1, shell 2, partition plate 3 and heat dissipation mechanism,
[0018] The chip 1 is arranged below the shell 2, the shell 2 is a hollow structure, the partition plate 3 is arranged in the shell 2, the partition plate 3 divides the shell 2 into an upper layer and a lower layer, the lower layer is the first cooling flow channel 6, and the upper layer is the second cooling flow channel 7, cooling liquid is introduced into the first cooling flow channel 6 and the second cooling flow channel 7, the cooling liquid in the first cooling flow channel 6 is used to cool the chip 1, and the cooling liquid in the second cooling flow channel 7 is used to cool the partition plate 3, and the heat dissipation mechanism is arranged at the bottom of the first cooling flow channel 6 and corresponds to the chip 1. The cooling liquid is pure water or fluorinated liquid or glycol solution.
[0019] The heat generated during use of the chip 1 is transferred to the outer wall of the shell 2 in contact with the chip 1, the cooling liquid is introduced into the first cooling flow channel 6, and the heat exchange efficiency of the cooling liquid on the heat can be improved by the heat dissipation mechanism. After the chip 1 is used for a long time, the temperature on the partition plate 3 is higher, which leads to poor cooling effect of the cooling liquid in the first cooling flow channel 6 on the chip 1. By introducing the cooling liquid into the second cooling flow channel 7, the partition plate 3 is cooled, the temperature of the partition plate 3 is reduced, and the cooling liquid in the first cooling flow channel 6 can effectively cool the chip 1, improve the cooling effect of the chip 1, and effectively reduce the temperature of the chip 1.
[0020] As shown in Fig. 1 , the heat dissipation mechanism is a heat dissipation layer 4, the heat dissipation layer 4 is laid below the first cooling flow channel 6, and the heat dissipation layer 4 is a porous metal structure. The porous metal structure is sintered.
[0021] The heat dissipation layer 4 is a porous metal structure sintered or a metal powder block sintered, which has certain air permeability, so that the cooling liquid can diffuse into the heat dissipation layer 4 by capillary action. In the heat exchange process, bubbles will be generated, which will float in the first cooling flow channel 6 and heat the partition plate 3.
[0022] As shown in Fig. 2 , the heat dissipation mechanism is a heat dissipation fin 5, and the heat dissipation fin 5 is uniformly arranged below the first cooling flow channel 6.
[0023] The heat dissipation fin 5 is arranged on the inner wall of the bottom of the shell 2, and the heat generated by the chip 1 can be transferred to the heat dissipation fin 5. The cooling liquid is used to cool the heat dissipation fin 5, increase the contact area of the cooling liquid, and thus improve the cooling effect.
[0024] As shown in Figs. 1-2 , the shell 2 is an integral molding structure, the shell 2 is provided with a back-shaped mounting foot 21 below, and the chip 1 is located in the middle of the mounting foot 21. The wall thickness of the contact surface between the shell 2 and the chip 1 is 0.2mm~0.3mm. The thickness of the heat dissipation mechanism is not less than one fifth of the height of the first cooling flow channel 6.
[0025] The shell 2 is designed in an integral manner, the wall thickness of the contact surface between the shell 2 and the chip 1 is 0.2mm~0.3mm, the protection strength of the shell on the chip 1 is ensured, and the heat dissipation efficiency is improved. The thickness of the heat dissipation mechanism is not less than one fifth of the height of the first cooling flow channel 6, the flow speed of the cooling liquid and the cooling efficiency are ensured.
[0026] The above, with reference to Figs. 1-2 Figs. 1-2The application discloses a double-phase cooling chip 1 packaging cover plate, and heat generated during use of the chip 1 is transferred to the outer wall of the shell 2 in contact with the chip 1, cooling liquid is introduced into the first cooling flow channel 6, the heat exchange efficiency of the cooling liquid on heat can be improved through the heat dissipation mechanism, after long-time use of the chip 1, the temperature on the partition plate 3 is relatively high, leading to poor cooling effect of the cooling liquid in the first cooling flow channel 6 on the chip 1, the cooling liquid is introduced into the second cooling flow channel 7 to cool the partition plate 3, thereby reducing the temperature of the partition plate 3, the cooling liquid in the first cooling flow channel 6 can effectively cool the chip 1, the cooling effect on the chip 1 is improved, and the temperature of the chip 1 is effectively reduced.
[0027] It should be noted that in this specification, the terms "comprising", "including", or any other variant thereof are intended to cover non-exclusive inclusion, so that processes, methods, articles or devices including a series of elements not only include those elements, but also include other elements not explicitly listed, or further include elements inherent to such processes, methods, articles or devices. Without more limitations, the elements defined by the statement "comprising" do not exclude the presence of other identical elements in the processes, methods, articles or devices including the elements.
[0028] Although the content of the present application has been described in detail through the above preferred embodiments, it should be recognized that the above description should not be considered as a limitation of the present application. After reading the above content, various modifications and alternatives of the present application will be apparent to those skilled in the art. Therefore, the protection scope of the present application should be defined by the appended claims.
Claims
1. A chip packaging cover with single-phase and two-phase cooling, characterized in that, include: Chip, housing, partition plate, and heat dissipation mechanism; The chip is located below the housing, which is a hollow structure. A partition plate is located inside the housing, dividing the interior of the housing into an upper and a lower layer. The lower layer is a first cooling channel, and the upper layer is a second cooling channel. Coolant flows into both the first and second cooling channels. The coolant in the first cooling channel is used to cool the chip, and the coolant in the second cooling channel is used to cool the partition plate. The heat dissipation mechanism is located at the bottom of the first cooling channel and is positioned corresponding to the chip.
2. The chip packaging cover plate with single-phase and two-phase cooling as described in claim 1, characterized in that, The heat dissipation mechanism is a heat dissipation layer, which is laid below the first cooling channel and has a porous metal structure.
3. The chip packaging cover plate with single-phase and two-phase cooling as described in claim 2, characterized in that, The porous metal structure is formed by sintering.
4. The chip packaging cover plate with single-phase and two-phase cooling as described in claim 1, characterized in that, The heat dissipation mechanism is heat dissipation fins, which are evenly arranged below the first cooling channel.
5. A chip packaging cover plate with single-phase and two-phase cooling as described in claim 1, characterized in that, The housing is a one-piece molded structure, and a U-shaped mounting base is provided at the bottom of the housing, with the chip located in the middle of the mounting base.
6. The chip packaging cover plate with single-phase and two-phase cooling as described in claim 1, characterized in that, The coolant is pure water, fluorinated liquid, or ethylene glycol solution.
7. A chip packaging cover plate with single-phase and two-phase cooling as described in claim 1, characterized in that, The wall thickness of the contact surface between the shell and the chip is 0.2mm~0.3mm.