Ultrathin silicon wafer processing workbench

Abstract

The utility model relates to the field of silicon wafer processing, and discloses an ultrathin silicon wafer processing workbench, which is characterized in that a fixed air pipe is rotatably inserted on a processing table, the lower end of the processing table is provided with a rotating mechanism for driving the fixed air pipe to rotate, the bottom of the processing table is fixedly connected with a support frame, and the support frame is fixedly connected with a fixed air pump; the input end of the fixed air pump is fixedly connected with an exhaust pipe which is rotationally connected with the end of the fixed air pipe, the upper end of the fixed air pipe is fixedly connected with a fixed air disc, and fixed air holes are evenly formed in the fixed air disc. The upper end of the machining table is fixedly connected with a positioning box coaxially arranged with the fixed air pipe, a via hole matched with the fixed air pipe is formed in the positioning box, inserting holes distributed in an annular array are formed outside the positioning box, positioning arms are slidably inserted into the inserting holes, and a centering mechanism for driving the positioning arms to synchronously slide is arranged in the positioning box. Compared with the prior art, the silicon wafer clamping device has the advantages that the surface of a silicon wafer can be effectively prevented from being damaged when the silicon wafer is clamped.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of silicon wafer processing, and particularly relates to an ultrathin silicon wafer processing workbench. BACKGROUND

[0002] Microelectronic technology is quietly entering aviation, aerospace, industry, agriculture and national defense, and is also quietly entering every family. Chips used for silicon wafer manufacturing have super computing power, and silicon wafers are widely used in various fields. When the silicon wafers are polished and processed, a clamp needs to be used to clamp the silicon wafers. However, the existing mechanical clamp is prone to scratching the surface of the silicon wafers during clamping, which affects the quality of the silicon wafers. UTILITY MODEL CONTENT

[0003] The technical problem to be solved by the utility model is to overcome the above technical difficulties, and provide an ultrathin silicon wafer processing workbench which can effectively prevent damage to the surface of the silicon wafers during clamping.

[0004] To solve the above technical problems, the utility model provides a technical scheme of an ultrathin silicon wafer processing workbench, which comprises a processing table and supporting legs. A polishing mechanism is arranged on the processing table. A fixed air pipe is rotatably inserted into the processing table. A rotating mechanism is arranged at the lower end of the processing table to drive the fixed air pipe to rotate. A supporting frame is fixedly connected to the bottom of the processing table. A fixed air pump is fixedly connected to the supporting frame. An air extraction pipe is fixedly connected to the input end of the fixed air pump. The air extraction pipe is rotatably connected to the end of the fixed air pipe. A fixed air disc is fixedly connected to the upper end of the fixed air pipe. The fixed air disc is provided with uniformly arranged fixed air holes. A positioning box coaxially arranged with the fixed air pipe is fixedly connected to the upper end of the processing table. The positioning box is provided with a through hole matched with the fixed air pipe. The positioning box is externally provided with a plurality of insertion holes arranged in an annular array. A positioning arm is slidably inserted into each insertion hole. A centering mechanism is arranged in the positioning box to drive the positioning arm to synchronously slide.

[0005] As an improvement, the positioning arm comprises a positioning plate slidably inserted into the insertion hole. One end of the positioning plate extending out of the positioning box is rotatably connected to a rotating shaft. The rotating shaft is fixedly connected to a positioning roller at the upper end.

[0006] As an improvement, the centering mechanism comprises a rotating disc rotatably sleeved to the outer wall of the fixed air pipe and located in the positioning box. The rotating disc is provided with a plurality of eccentric shafts corresponding in number to the positioning arms. An adjusting rod is hingedly connected between the eccentric shafts and the positioning arms.

[0007] As improvement, the rotating disc is fixedly connected with an adjusting knob on one side, the positioning box is provided with an adjusting hole matched with the adjusting knob, a fixing sleeve matched with the fixed air pipe is fixedly connected in the center of the positioning box, a first stopper is fixedly connected on one side of the fixing sleeve, a second stopper is fixedly connected on the rotating disc, and an arc spring is arranged between the first stopper and the second stopper.

[0008] As improvement, the polishing mechanism comprises a polishing motor slidingly connected to the machining table, and a polishing wheel is arranged at the output end of the polishing motor.

[0009] As improvement, the rotating mechanism comprises a driven pulley fixedly sleeved on the outer wall of the fixed air pipe, a control motor is fixedly connected to the bottom of the machining table, a driving pulley is fixedly connected to the output end of the control motor, and a transmission belt is arranged between the driving pulley and the driven pulley.

[0010] As improvement, the fixed air disc is internally provided with an air cavity communicated with the fixed air pipe and the fixed air hole, and a plurality of rubber gaskets with gradually increased radii are fixedly connected to the upper end of the fixed air disc.

[0011] Compared with the prior art, the advantages of the present application are that the silicon wafer is placed on the fixed air disc, the adjusting mechanism is driven to drive the positioning arm to slide synchronously, the positioning arm pushes the silicon wafer to move to a position coaxial with the fixed air disc, the fixed air pump is started to draw the fixed air disc to vacuum, and the silicon wafer is adsorbed and fixed on the fixed air disc under the cooperation of the fixed air hole, thereby effectively preventing damage to the silicon wafer. BRIEF DESCRIPTION OF DRAWINGS

[0012] Figure 1 is an explosion view of the ultra-thin silicon wafer machining workbench.

[0013] Figure 2 is a structural schematic view of the ultra-thin silicon wafer machining workbench.

[0014] Figure 3 is a sectional view of the ultra-thin silicon wafer machining workbench. Figure 1 .

[0015] Figure 4 is a sectional view of the ultra-thin silicon wafer machining workbench. Figure 2 .

[0016] Figure 5 is a bottom view of the ultra-thin silicon wafer machining workbench.

[0017] As shown in the figure: 1, processing platform; 2, support leg; 3, fixed air pipe; 4, fixed air disc; 5, positioning box; 6, positioning plate; 7, rotating shaft; 8, positioning roller; 9, rotating disc; 10, eccentric shaft; 11, adjusting rod; 12, fixed air hole; 13, rubber washer; 14, jack; 15, adjusting dial; 16, arc spring; 17, first baffle; 18, second baffle; 19, fixed sleeve; 20, adjusting hole; 21, polishing wheel; 22, screw mechanism; 23, polishing motor; 24, control motor; 25, driving pulley; 26, driven pulley; 27, support frame; 28, fixed air pump; 29, air pipe. DETAILED DESCRIPTION

[0018] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of the utility model.

[0019] As Figures 1 to 5 shown, a kind of ultra-thin silicon wafer processing workbench, including processing platform 1 and support leg 2, the polishing mechanism is equipped on the processing platform 1, the polishing mechanism includes the polishing motor 23 of sliding connection on the processing platform 1, the polishing motor 23 output end is equipped with polishing wheel 21, the processing platform 1 is equipped with the screw mechanism 22 of driving the polishing motor 23 sliding.

[0020] Fixed air pipe 3 is rotatably inserted on the processing platform 1, rotating mechanism for driving the fixed air pipe 3 to rotate is equipped at the lower end of the processing platform 1, the rotating mechanism includes driven pulley 26 of fixed sleeve connection on the outer wall of the fixed air pipe 3, control motor 24 is fixedly connected on the bottom of the processing platform 1, the control motor 24 output end is fixedly connected with driving pulley 25, transmission belt is equipped between the driving pulley 25 and driven pulley 26, support frame 27 is fixedly connected on the bottom of the processing platform 1, fixed air pump 28 is fixedly connected on the support frame 27, air pipe 29 is fixedly connected on the input end of the fixed air pump 28, the air pipe 29 is rotatably connected with the end of the fixed air pipe 3, the fixed air disc 4 is fixedly connected with the upper end of the fixed air pipe 3, the fixed air disc 4 is equipped with uniformly arranged fixed air hole 12, the fixed air disc 4 is equipped with air cavity in communication with the fixed air pipe 3 and fixed air hole 12, a plurality of rubber washers 13 with gradually increasing radius are fixedly connected with the upper end of the fixed air disc 4, and the fixed air holes 12 are uniformly distributed between adjacent rubber washers 13.

[0021] The upper end of the processing table 1 is fixedly connected with a positioning box 5 coaxially arranged with the fixed air pipe 3, the positioning box 5 is provided with a through hole matched with the fixed air pipe 3, the positioning box 5 is externally provided with a plurality of insertion holes 14 arranged in an annular array, a positioning arm is slidably inserted into each of the insertion holes 14, the positioning arm comprises a positioning plate 6 slidably inserted into the insertion hole 14, the positioning plate 6 extends to an end outside the positioning box 5 and is rotatably connected with a rotating shaft 7, the upper end of the rotating shaft 7 is fixedly connected with a positioning roller 8, a rotating disc 9 is rotatably sleeved to the outer wall of the fixed air pipe 3 in the positioning box 5, the rotating disc 9 is provided with a plurality of eccentric shafts 10 corresponding in number to the positioning arms, and an adjusting rod 11 is hingedly connected between each of the eccentric shafts 10 and the positioning arm.

[0022] The side of the rotating disc 9 is fixedly connected with an adjusting knob 15, the positioning box 5 is provided with an adjusting hole 20 matched with the adjusting knob 15, the center of the positioning box 5 is fixedly connected with a fixed sleeve 19 matched with the fixed air pipe 3, one side of the fixed sleeve 19 is fixedly connected with a first blocking piece 17, the rotating disc 9 is fixedly connected with a second blocking piece 18, and an arc-shaped spring 16 is arranged between the first blocking piece 17 and the second blocking piece 18.

[0023] In specific use, the adjusting knob is actuated to drive the rotating disc 9 to rotate, the rotating disc 9 drives the second blocking piece 18 to move close to the first blocking piece 17, the arc-shaped spring 16 is compressed and deformed, the rotating disc 9 drives the adjusting rod 11 to synchronously extend the positioning plate 6 by the same distance outward, the positioning roller 8 is synchronously moved away from the center of the fixed air disc 4, the silicon wafer is placed on the fixed air disc 4, the adjusting knob is slowly released, the rotating disc 9 is reversely slid under the restoring force of the arc-shaped spring 16, the rotating disc 9 drives the adjusting rod 11 to reset, the positioning plate 6 is slid inward along the insertion hole 14 to reset, the positioning roller 8 is abutted against the outer edge of the silicon wafer, and the silicon wafer is centered and pushed to the coaxial position of the fixed air disc 4, the fixed air pump 28 is started to perform air suction on the air cavity of the fixed air disc 4 through the air suction pipe 29 and the fixed air pipe 3, the silicon wafer is adsorbed and fixed on the upper end of the fixed air disc 4 under the flow of air, and the rubber gasket 13 supports the bottom surface of the silicon wafer to prevent the silicon wafer from being scratched on the surface of the fixed air disc 4.

[0024] When it is necessary to polish the edge of the silicon wafer, the control motor 24 is started to drive the driving pulley 25 to rotate, the driving pulley 25 drives the driven pulley 26 to rotate through the transmission belt, the driven pulley 26 drives the fixed air pipe 3 to drive the fixed air disc 4 to rotate, the fixed air disc 4 drives the silicon wafer to rotate along the outer wall of the positioning roller 8, and the silicon wafer is polished by starting the lead screw mechanism 22 to drive the polishing motor 23 to drive the polishing wheel 21 to move close to the outer edge of the silicon wafer.

[0025] The standard parts used in the utility model can be purchased from the market, the special-shaped parts can be ordered according to the description and the drawings, the specific connection mode of each part adopts the conventional means such as bolt, rivet and welding in the prior art, the machinery, parts and equipment adopt the conventional type in the prior art, and the circuit connection adopts the conventional connection mode in the prior art, which will not be described in detail here.

[0026] It should be noted that, in this document, the term "only" is used to distinguish one entity or operation from another entity or operation, but does not necessarily require or imply any such actual relationship or order between the entities or operations. Moreover, the term "include" or "contain" or any other variant thereof is intended to cover non-exclusive inclusion, so that the process, method, article or equipment including a series of elements not only includes those elements, but also includes other elements not explicitly listed or inherent to such process, method, article or equipment.

[0027] Although the embodiments of the utility model have been shown and described, it can be understood by those skilled in the art that various changes, modifications, replacements and variations can be made to the embodiments without departing from the principles and spirits of the utility model, and the scope of the utility model is defined by the appended claims and their equivalents.

[0028] The utility model and its implementation mode have been described above, and such description is not restrictive, and the shown in the drawings is only one of the implementation modes of the utility model, and the actual structure is not limited thereto. In general, if the ordinary skilled in the art is inspired thereby, without departing from the creative purpose of the utility model, without creatively designing the similar structure mode and embodiments to the technical scheme, all should belong to the protection scope of the utility model.

Claims

1. An ultra-thin silicon wafer processing workbench, comprising a processing table (1) and supporting legs (2), the processing table (1) is provided with a polishing mechanism, characterized in that: a fixed air pipe (3) is rotatably inserted on the processing table (1), a rotating mechanism is arranged at the lower end of the processing table (1) to drive the fixed air pipe (3) to rotate, a supporting frame (27) is fixedly connected to the bottom of the processing table (1), a fixed air pump (28) is fixedly connected to the supporting frame (27), an air extraction pipe (29) is fixedly connected to the input end of the fixed air pump (28), the air extraction pipe (29) is rotatably connected to the end of the fixed air pipe (3), a fixed air disc (4) is fixedly connected to the upper end of the fixed air pipe (3), and a plurality of fixed air holes (12) are uniformly arranged on the fixed air disc (4). A positioning box (5) coaxially arranged with the fixed air pipe (3) is fixedly connected to the upper end of the processing table (1), the positioning box (5) is provided with a through hole matched with the fixed air pipe (3), and a plurality of insertion holes (14) arranged in an annular array are arranged outside the positioning box (5), a positioning arm is slidably inserted into each of the insertion holes (14), and a centering mechanism is arranged in the positioning box (5) to drive the positioning arm to slide synchronously. The positioning arm comprises a positioning plate (6) slidably inserted into the insertion hole (14), one end of the positioning plate (6) extending out of the positioning box (5) is rotatably connected with a rotating shaft (7), and a positioning roller (8) is fixedly connected to the upper end of the rotating shaft (7).

2. The ultra-thin silicon wafer processing worktable according to claim 1, wherein: The centering mechanism comprises a rotating disc (9) rotatably sleeved outside the outer wall of the fixed air pipe (3) and located in the positioning box (5), a plurality of eccentric shafts (10) corresponding to the positioning arms are arranged on the rotating disc (9), and an adjusting rod (11) is hingedly connected between each of the eccentric shafts (10) and the positioning arm.

3. The ultra-thin silicon wafer processing worktable according to claim 2, wherein: An adjusting knob (15) is fixedly connected to one side of the rotating disc (9), an adjusting hole (20) matched with the adjusting knob (15) is arranged on the positioning box (5), a fixed sleeve (19) matched with the fixed air pipe (3) is fixedly connected to the center of the positioning box (5), a first baffle (17) is fixedly connected to one side of the fixed sleeve (19), a second baffle (18) is fixedly connected to the rotating disc (9), and an arc-shaped spring (16) is arranged between the first baffle (17) and the second baffle (18).

4. The ultra-thin silicon wafer processing worktable according to claim 3, characterized in that: The polishing mechanism comprises a polishing motor (23) slidably connected to the processing table (1), a polishing wheel (21) is arranged at the output end of the polishing motor (23), and a lead screw mechanism (22) is arranged on the processing table (1) to drive the polishing motor (23) to slide.

5. The ultra-thin silicon wafer processing worktable according to claim 1, wherein: The rotating mechanism comprises a driven pulley (26) fixedly sleeved outside the outer wall of the fixed air pipe (3), a control motor (24) is fixedly connected to the bottom of the processing table (1), a driving pulley (25) is fixedly connected to the output end of the control motor (24), and a transmission belt is arranged between the driving pulley (25) and the driven pulley (26).

6. The ultra-thin silicon wafer processing worktable according to claim 1, wherein: ​ 7. The ultra-thin silicon wafer processing worktable according to any one of claims 1-6, characterized in that: The fixed air disc (4) is internally provided with an air cavity in communication with the fixed air pipe (3) and the fixed air holes (12), and the upper end of the fixed air disc (4) is fixedly connected with a plurality of rubber gaskets (13) with gradually increasing radii, and the fixed air holes (12) are uniformly distributed between adjacent rubber gaskets (13).

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