Nickel deposition prevention structure of electroplating bath for electroplating nickel on metal
By designing the flow guide base and baffle structure, the problem of nickel ion deposition in the nickel plating tank was solved, achieving efficient cleaning and uniform electrolyte flow, thereby improving production efficiency and reducing maintenance costs.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-21
- Publication Date
- 2026-03-24
AI Technical Summary
In traditional nickel plating baths, nickel ions form dense oxide or sulfide deposits on the anode surface, leading to decreased anode activity, increased bath voltage, and frequent cleaning, which affects production efficiency and cost.
The system employs a flow guide base and a baffle structure, combined with a drive motor to control the lifting and lowering of the deposition plate and the rotation of the baffle. This forces the removal of deposits and ensures uniform electrolyte flow, preventing nickel layer adhesion. The system also uses backflow through the filter holes and turbulence to disrupt the concentration polarization layer.
It reduces nickel deposition at the bottom of the tank, improves cleaning efficiency, reduces maintenance costs, ensures the uniformity and stability of the plating solution, and achieves continuous and efficient production.
Smart Images
Figure CN224031145U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to a kind of nickel deposition structures of metal electroplating nickel's electroplating tank. BACKGROUND
[0002] Electroplating nickel is a kind of surface treatment technology widely used in mechanical manufacturing, electronic components and automobile industry, which improves corrosion resistance, wear resistance and appearance quality by depositing nickel layer on the surface of metal matrix. Electroplating tank is the core equipment of electroplating process, and its structure design directly affects the uniformity of plating layer, plating solution stability and production cost.
[0003] Traditional electroplating nickel tank usually adopts conventional configuration of nickel anode and workpiece cathode. In the long-term operation process, nickel ions are easy to form dense oxide or sulfide deposition layer on the surface of anode, which leads to the decrease of anode activity and the increase of tank voltage. The deposition will fall off in the tank bottom during electroplating, which needs frequent cleaning and affects production efficiency. The existing technology relies on mechanical cleaning, periodic filtration or chemical inhibitors, but has problems such as high maintenance cost during shutdown, interference of chemical additives with plating solution composition, and difficulty in realizing continuous and efficient production.
[0004] Therefore, it is necessary to invent a kind of nickel deposition structure of metal electroplating nickel's electroplating tank to solve the above problems. CONTENT OF UTILITY MODEL
[0005] (I) Purpose of utility model
[0006] To solve the technical problems in the background art, the utility model provides a kind of nickel deposition structure of metal electroplating nickel's electroplating tank, which can reduce compound deposition during electroplating and salvage the deposits to an easy-to-clean position.
[0007] (II) Technical scheme
[0008] To achieve the above purpose, the utility model provides the following technical scheme: a kind of nickel deposition structure of metal electroplating nickel's electroplating tank, including the flow guide base arranged at the inner bottom of the electroplating tank for metal electroplating nickel, the anti-deposition assembly is installed in the middle of the flow guide base, the turbulence plate is also installed on both sides of the inner wall of the electroplating tank, and the turbulence plate disturbs the flow of electrolyte inside the electroplating tank;
[0009] The anti-deposition assembly includes a deposition plate, the deposition plate extends on both sides with a guard plate, a plurality of fixed threaded sleeves are installed at both ends of the deposition plate, a plurality of threaded rods are matched in the fixed threaded sleeves, and drive motors are provided at the top ends of the threaded rods on the same side. The drive motors on both sides simultaneously drive a plurality of threaded rods to move the deposition plate upward.
[0010] The inner wall of the electroplating tank is provided with a moving groove for accommodating the fixed threaded sleeve and the threaded rod, and the driving motor is fixed on the top of the tank body.
[0011] Preferably, the deposition plate is connected with the guard plates on both sides, and the deposition plate is inclined as a whole.
[0012] Preferably, the filter area is a plane, and the plurality of filter holes are arranged in the same plane.
[0013] Preferably, the flow guide base is two triangular flow guide blocks closely attached to the inner wall of the electroplating tank, and the distance between the two triangular flow guide blocks matches the width of the deposition plate.
[0014] Preferably, the spoiler is connected with a rotating shaft on one side, the end of the rotating shaft is connected with a spoiler motor, the rotating shaft is installed in the inner wall of the electroplating tank on both sides, the spoiler motor is fixed on the outer frame of the electroplating tank, and a plurality of spoiler holes are formed in one side of the spoiler.
[0015] Preferably, the front half of the spoiler is an inclined plate inclined downward, the rear half is a flat plate, and the plurality of spoiler holes are arranged on the front half of the spoiler.
[0016] Preferably, the overall size of the flow guide base and the anti-deposition assembly matches the overall size of the bottom of the electroplating tank.
[0017] Compared with the prior art, the above technical scheme of the utility model has the beneficial effects that:
[0018] 1. The driving motor synchronously controls the threaded rod to drive the whole deposition plate to rise and fall, forcibly strips the nickel layer attached to the surface of the deposition plate, avoids the problems of plating solution pollution and uneven distribution of power lines caused by long-term deposition of the traditional fixed structure, and makes it more convenient to clean the plate surface by lifting the deposition plate above the liquid level.
[0019] 2. The inclined surface design of the top of the deposition plate on both sides cooperates with the filter holes to form a double mode of inclined flow guide and plane filtering.
[0020] 3. This utility model divides the fluid at the bottom of the tank into three channels, forcing nickel ions to accumulate in the middle of the deposition plate. The angle of the inclined plate is controlled by a turbulence motor, which, together with the turbulence holes, generates turbulence and destroys the concentration polarization layer. Attached Figure Description
[0021] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this utility model. For those skilled in the art, other drawings can be obtained based on these drawings.
[0022] Figure 1 This is a schematic diagram of the overall structure of this utility model installed inside the electroplating tank;
[0023] Figure 2 This is a schematic diagram of the internal structure of the electroplating tank of this utility model;
[0024] Figure 3 For the present utility model Figure 2 Schematic diagram of part A in the middle;
[0025] Figure 4 This is a schematic diagram of the overall structure of the deposition plate and the protective plate of this utility model;
[0026] Figure 5 For the present utility model Figure 4 Schematic diagram of Part B in the middle section;
[0027] Figure 6 This is a schematic diagram of the overall structure of the spoiler of this utility model.
[0028] Explanation of reference numerals in the attached figures:
[0029] 1. Electroplating tank; 11. Moving tank; 2. Flow guide base; 21. Triangular flow guide block; 22. Docking groove; 3. Anti-deposition component; 31. Deposition plate; 32. Protective plate; 33. Fixed threaded sleeve; 34. Threaded screw; 35. Drive motor; 36. Filtration zone; 37. Filtration hole; 4. Baffle plate; 41. Rotating shaft; 42. Baffle motor; 43. Baffle hole. Detailed Implementation
[0030] To enable those skilled in the art to better understand the technical solution of this utility model, the present utility model will be further described in detail below with reference to the accompanying drawings.
[0031] This utility model provides, for example Figures 1-6The structure shown is a nickel plating tank anti-nickel deposition structure, including a flow guide base 2 set at the bottom of the inner side of the electroplating tank 1 for nickel plating, an anti-deposition component 3 installed in the middle of the flow guide base 2, and baffles 4 installed on both sides of the inner wall of the electroplating tank 1 to agitate the flow of electrolyte inside the electroplating tank 1.
[0032] Specifically, the anti-deposition component 3 includes a deposition plate 31, with protective plates 32 extending from both sides of the deposition plate 31. Multiple fixed threaded sleeves 33 are installed at both ends of the deposition plate 31, and threaded screws 34 are matched inside the multiple fixed threaded sleeves 33. A drive motor 35 is provided at the top of the threaded screw 34 on the same side. The drive motors 35 on both sides simultaneously drive the multiple threaded screws 34 to move the deposition plate 31 upward.
[0033] Specifically, the inner wall of the electroplating tank 1 is provided with movable grooves 11 on both sides to accommodate the fixed threaded sleeve 33 and the threaded screw 34, and the drive motor 35 is fixed on both sides of the top of the electroplating tank 1.
[0034] Reference Figures 4-5 The protective plates 32 connecting both sides of the sedimentation plate 31 are inclined to the sedimentation plate 31, and the height of the top two sides of the sedimentation plate 31 is higher than the height of the middle, that is, the top two sides are inclined. The sedimentation plate 31 has a filtrate zone 36 in the middle, and the filtrate zone 36 has a plurality of neatly arranged filtrate holes 37.
[0035] Specifically, the filtrate zone 36 is planar, and multiple filtrate holes 37 are all located in the same plane, with the side guard plates 32 arranged symmetrically.
[0036] In this embodiment, the deposition plate 31 is connected to the threaded rod 34 via a fixed threaded sleeve 33, and the drive motor 35 is fixed to the top of the electroplating tank 1. The threaded rod 34 is embedded in the moving groove 11. The guard plate 32 is adjusted to align with the docking groove 22 of the guide base 2 to ensure that the deposition plate 31 can move up and down without interference.
[0037] Reference Figure 2 The flow guide base 2 consists of two triangular flow guide blocks 21 that are close to the inner wall of the electroplating tank 1 on both sides. The distance between the two triangular flow guide blocks 21 matches the width of the deposition plate 31. The triangular flow guide blocks 21 are provided with docking grooves 22 that match the shape of the guard plate 32.
[0038] In this embodiment, two triangular guide blocks 21 are symmetrically installed on both sides of the bottom of the electroplating tank 1 and fixed by welding or bolts to ensure that the docking groove 22 matches the shape of the guard plate 32, forming an electrolyte flow channel.
[0039] Reference Figure 6A rotating shaft 41 is connected to one side of the baffle plate 4, and a baffle motor 42 is connected to the end of the rotating shaft 41. The rotating shaft 41 is installed inside the inner walls on both sides of the electroplating tank 1. The baffle motor 42 is fixed on the outer frame of the electroplating tank 1, and multiple baffle holes 43 are opened on one side of the baffle plate 4.
[0040] Specifically, the front half of the spoiler 4 is a downward-sloping plate, and the rear half is a flat plate. Multiple turbulence holes 43 are set on the front half of the spoiler 4. The spoiler 4 is installed above the anti-deposition component 3, and the overall width of the two side spoilers 4 does not affect the up-and-down movement of the deposition plate 31 and the two side guard plates 32.
[0041] In this embodiment, the rotating shaft 41 is embedded in the bearing on the side wall of the electroplating tank 1, and the turbulence motor 42 is fixed to the external frame to ensure that the turbulence plate 4 is located above the anti-deposition component 3 and does not conflict with the movement of the guard plate 32.
[0042] Reference Figures 1-2 The overall dimensions of the flow guide base 2 and the anti-deposition component 3 match the overall dimensions of the bottom of the electroplating tank 1.
[0043] In this embodiment, before electroplating, the drive motor 35 needs to be started to lower the deposition plate 31 to its lowest position, forming a flat bottom of the tank. Electrolyte is injected to the working liquid level, and the drive motor 35 is started at regular intervals to drive the deposition plate 31 to rise slowly, so that the nickel layer attached to the deposition plate 31 slides off the inclined surface and flows back into the tank through the filter hole 37.
[0044] Specifically, the turbulence operation requires intermittently reversing the turbulence motor 42 to cause the turbulence plate 4 to swing, generating eddies in the turbulence holes 43 to prevent localized nickel ion deposition. After electroplating, the deposition plate 31 is raised to its highest position, and residual nickel slag is manually removed. The solution is then flushed back through the filter holes 37 to remove blockages.
[0045] In this embodiment, the periodic lifting and sloping design of the deposition plate 31 prevents the nickel layer from adhering firmly, reducing nodule formation at the bottom of the tank. The uniform pore size of the filtrate zone 36 ensures uniform electrolyte flow and prevents the accumulation of metal ions.
[0046] Specifically, the triangular guide block 21 guides the electrolyte to concentrate in the center, forming a directional flow in conjunction with the guard plate 32. The oblique hole design of the baffle plate 4 generates turbulence, keeping the nickel ion concentration difference in the tank within ±5%.
[0047] In this embodiment, the modular design allows for quick disassembly of the deposition plate 31 and the baffle plate 4, improving cleaning efficiency by 50%. The drive motor 35 has a programmable controllable lifting frequency to adapt to different plating solution formulations.
[0048] The foregoing description only illustrates certain exemplary embodiments of the present invention. Undoubtedly, those skilled in the art can modify the described embodiments in various ways without departing from the spirit and scope of the present invention. Therefore, the above drawings and descriptions are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.
Claims
1. A nickel deposition prevention structure for a nickel plating tank, characterized in that: It includes a flow guide base (2) set at the bottom of the inner side of the electroplating tank (1) for electroplating nickel, an anti-deposition component (3) is installed in the middle of the flow guide base (2), and baffles (4) are also installed on both sides of the inner wall of the electroplating tank (1). The baffles (4) disturb the flow of electrolyte inside the electroplating tank (1). The anti-deposition component (3) includes a deposition plate (31), with protective plates (32) extending from both sides of the deposition plate (31). Multiple fixed threaded sleeves (33) are installed at both ends of the deposition plate (31), and threaded screws (34) are matched inside the multiple fixed threaded sleeves (33). A drive motor (35) is provided at the top of the threaded screws (34) on the same side. The drive motors (35) on both sides simultaneously drive the multiple threaded screws (34) to move the deposition plate (31) upward. The inner wall of the electroplating tank (1) is provided with movable grooves (11) on both sides to accommodate the fixed threaded sleeve (33) and the threaded screw (34), and the drive motor (35) is fixed on both sides of the top of the electroplating tank (1).
2. The nickel deposition prevention structure for a nickel plating tank according to claim 1, characterized in that: The protective plate (32) connecting the two sides of the deposition plate (31) is inclined to the deposition plate (31), and the height of the top two sides of the deposition plate (31) is higher than the middle height, that is, the top two sides are inclined. The middle part of the deposition plate (31) is provided with a filtrate area (36), and the filtrate area (36) is provided with a plurality of neatly arranged filtrate holes (37).
3. The nickel deposition prevention structure for a nickel plating tank according to claim 2, characterized in that: The filtrate zone (36) is planar, and the multiple filtrate holes (37) are all arranged in the same plane, and the protective plates (32) on both sides are symmetrically arranged.
4. The nickel deposition prevention structure for a nickel plating tank according to claim 1, characterized in that: The flow guide base (2) consists of two triangular flow guide blocks (21) that are close to the inner walls of the electroplating tank (1) on both sides. The distance between the two triangular flow guide blocks (21) matches the width of the deposition plate (31). The triangular flow guide blocks (21) are provided with docking grooves (22) that match the shape of the guard plate (32).
5. The nickel deposition prevention structure for a nickel plating tank according to claim 1, characterized in that: The spoiler plate (4) is connected to a rotating shaft (41) on one side, and a spoiler motor (42) is connected to the end of the rotating shaft (41). The rotating shaft (41) is installed in the inner wall on both sides of the electroplating tank (1). The spoiler motor (42) is fixed on the outer frame of the electroplating tank (1), and multiple spoiler holes (43) are opened on one side of the spoiler plate (4).
6. The nickel deposition prevention structure for a nickel plating tank according to claim 5, characterized in that: The front half of the spoiler (4) is a downward-sloping plate, and the rear half is a flat plate. Multiple spoiler holes (43) are arranged on the front half of the spoiler (4). The spoiler (4) is installed above the anti-deposition component (3), and the overall width of the spoilers (4) on both sides does not affect the up-and-down movement of the deposition plate (31) and the guard plates (32) on both sides.
7. The nickel deposition prevention structure for a nickel plating tank according to claim 1, characterized in that: The overall dimensions of the flow guide base (2) and the anti-deposition component (3) match the overall dimensions of the bottom of the electroplating tank (1).