Voltage acquisition device for integrated circuit test

Abstract

The utility model discloses a voltage acquisition device for an integrated circuit test, and aims to realize automation of a voltage acquisition process and improve test efficiency and accuracy. The device comprises a power supply conversion unit, an MCU unit, a digital-to-analog conversion unit, an analog-to-digital conversion unit, a voltage output unit and an incubator. The power supply conversion unit supplies power to the MCU unit and the digital-to-analog conversion unit, and the MCU unit controls voltage output and acquisition through an SPI (Serial Peripheral Interface). The digital-to-analog conversion unit converts a digital signal into an analog voltage signal and supplies the analog voltage signal to a tested chip, and the analog-to-digital conversion unit collects voltage data and feeds the voltage data back to the MCU unit, thereby realizing closed-loop control. The incubator is used for testing the performance of the chip at different temperatures, is connected with the MCU unit, and controls the temperature through the MCU unit. In addition, the device also comprises a communication interface unit and an upper computer, and is used for realizing remote control and data monitoring.

Description

TECHNICAL FIELD

[0001] The utility model relates to a voltage collection device, especially to a device for integrated circuit test scene, can realize the automation of voltage collection process, belong to integrated circuit test technical field. BACKGROUND

[0002] In the modern electronic manufacturing field, the performance test of integrated circuit is the key link to ensure product quality. Especially in the voltage performance test, the traditional test method relies on a series of manual operation and various external equipment, such as adjustable power supply, table type multimeter, oscilloscope and signal generator. These testing methods not only have low efficiency, but also due to the intervention of human factors, the consistency and accuracy of test results are difficult to guarantee. In addition, the traditional test method cannot realize the simultaneous test of multiple samples, resulting in long test period, high equipment occupancy, and seriously restricting the improvement of production efficiency and product quality.

[0003] In the voltage test of integrated circuit, a significant problem is the complexity of test environment building and operation. The operator needs to manually adjust the power supply, set the chip working voltage, and use the oscilloscope and multimeter to record the voltage state. These steps are not only cumbersome, but also prone to errors. At the same time, due to the differences in performance parameters of different wafers or even different positions on the same wafer, multi-sample test becomes particularly important. However, the existing test method cannot meet this demand, resulting in uncertainty and inefficiency of test results, which is unacceptable in fast-paced production environment.

[0004] In the Chinese utility model with patent number ZL 202323336587.7, a voltage test equipment for integrated circuit board is disclosed, which comprises a voltage test machine main body and support legs horizontally arranged at the bottom of the voltage test machine main body. The top front end of the support leg is fixedly installed with a wire wrapping clamp. The wire is movably wound on the wire wrapping clamp. One end of the wire is connected with a plug movably inserted into the voltage test machine main body. The other end of the wire is connected with a test pen. The bottom of the wire wrapping clamp is horizontally fixedly installed with a bracket. The bracket is vertically arranged with a placing rack for supporting the test pen. The equipment movably winds the excess length of the wire on the wire wrapping clamp. The excess wire will not be dragged and moved on the operation table during use. The wire is conveniently stored after use, improving the safety and convenience of the test equipment use, and solving the problem of the excess part of the wire between the test pen and the voltage tester being pulled to other instruments or integrated circuit boards on the table of the operation station during use of the voltage test equipment for integrated circuit board. SUMMARY

[0005] The technical problem to be solved by the utility model lies in providing a voltage collection device for integrated circuit test.

[0006] In order to achieve the above object, the utility model adopts the following technical scheme:

[0007] A voltage collection device for integrated circuit test, including power conversion unit, MCU unit, digital analog conversion unit, analog digital conversion unit, voltage output unit and temperature box, wherein,

[0008] The power conversion unit supplies power for the MCU unit and the digital analog conversion unit respectively;

[0009] The MCU unit communicates with the digital analog conversion unit and the analog digital conversion unit through the SPI interface, controls voltage output and voltage collection;

[0010] The digital analog conversion unit receives the control signal from the MCU unit and controls the voltage output unit;The analog digital conversion unit collects the voltage of the measured chip and feeds back the data to the MCU unit;

[0011] The voltage output unit provides the required test voltage for the measured chip, and the measured chip is placed in the temperature box to test the performance under different temperatures.

[0012] Preferably, the voltage collection device further comprises a communication interface unit and an upper computer;

[0013] The upper computer communicates with the MCU unit through the communication interface unit to send test instructions and receive test data.

[0014] Preferably, the MCU unit and the communication interface unit communicate through the USART interface.

[0015] Preferably, the measured chip receives the required voltage for testing through the voltage output unit, and communicates with the communication interface unit through the RS485 interface to send voltage data.

[0016] Preferably, the digital signal of the MCU unit is received by the digital analog conversion unit, converted into an analog voltage signal and supplied to the measured chip through the voltage output unit;The analog digital conversion unit collects the voltage data of the measured chip, converts it into a digital signal and feeds it back to the MCU unit, realizing closed-loop control.

[0017] Preferably, the temperature box is connected with the MCU unit, and the temperature of the temperature box is controlled by the MCU unit to simulate different test environments.

[0018] Preferably, the power conversion unit includes 5V power conversion circuit and 3.3V power conversion circuit;The 5V power conversion circuit and the 3.3V power conversion circuit are realized by LDO voltage stabilizer.

[0019] Preferably, the 5V power conversion circuit supplies power for the digital-analog conversion unit, and the 3.3V power conversion circuit supplies power for the MCU unit.

[0020] Compared with the prior art, the utility model has the following technical characteristics:

[0021] 1. By integrating the MCU unit, the dependence on traditional test equipment such as power supply, multimeter, etc. is reduced, and the use of hardware resources is optimized.

[0022] 2. The host computer not only controls voltage testing, but also communicates with the temperature box to realize temperature control, thereby providing a wider environment simulation for chip testing.

[0023] 3. The cooperation of the digital-analog conversion unit and the analog-digital conversion unit forms a closed-loop control, ensuring the accurate output and collection of the test voltage and improving the accuracy of the test. BRIEF DESCRIPTION OF DRAWINGS

[0024] Figure 1 A structural block diagram of the voltage acquisition device provided by the embodiment of the utility model is shown in the figure.

[0025] Figure 2 A schematic diagram of the 6V power conversion circuit in the power conversion unit in the embodiment of the utility model is shown in the figure.

[0026] Figure 3 A schematic diagram of the 5V power conversion circuit in the power conversion unit in the embodiment of the utility model is shown in the figure.

[0027] Figure 4 A schematic diagram of the 3.3V power conversion circuit in the power conversion unit in the embodiment of the utility model is shown in the figure.

[0028] Figure 5 A schematic diagram of the MCU unit and its peripheral circuit in the embodiment of the utility model is shown in the figure.

[0029] Figure 6 A circuit schematic diagram of the communication interface unit in the embodiment of the utility model is shown in the figure.

[0030] Figure 7 A communication circuit schematic diagram between the temperature box and the MCU chip in the embodiment of the utility model is shown in the figure.

[0031] Figure 8 A communication circuit schematic diagram between the measured chip and the MCU chip in the embodiment of the utility model is shown in the figure. DETAILED DESCRIPTION

[0032] The technical content of the utility model will be described in detail below in combination with the drawings and specific embodiments.

[0033] As Figure 1 The voltage acquisition device provided by the embodiment of the utility model, at least includes:

[0034] Power conversion unit: responsible for providing the required power supply for the whole voltage acquisition device. It has two outputs: 3.3V power supply for MCU unit, 5V power supply for digital analog conversion unit.

[0035] MCU unit: including MCU chip and its peripheral circuit. As the core control unit of the whole voltage acquisition device, MCU unit communicates with digital analog conversion unit and analog digital conversion unit through SPI interface, controls voltage output and voltage acquisition.

[0036] Digital analog conversion unit (DAC chip), converts digital signal into analog voltage signal. It receives the signal from MCU unit, and outputs corresponding voltage to voltage output unit.

[0037] Analog digital conversion unit (ADC chip), converts analog voltage signal into digital signal. It acquires the voltage of the measured chip, and feeds back the data to MCU unit.

[0038] Voltage output unit: the voltage output unit controlled by digital analog conversion unit, provides the required test voltage for the measured chip

[0039] Oven: for providing different temperature environment, to test the performance of the measured chip under different temperature. It is connected with MCU unit through RS485 interface.

[0040] Communication interface unit: responsible for the communication with host computer.

[0041] Host computer: the control center of the whole voltage acquisition device, communicates with MCU unit through communication interface unit, sends test instruction and receives test data.

[0042] Figure 1 The voltage acquisition device shown in the figure realizes the automatic voltage test of the measured chip through the control of MCU unit, including voltage output, voltage acquisition, temperature control and data communication. Among them, MCU unit communicates with digital analog conversion unit and analog digital conversion unit through SPI interface, controls the output and acquisition of voltage. Digital analog conversion unit receives the digital signal of MCU unit, converts it into analog voltage signal, and supplies the measured chip through voltage output unit. At the same time, analog digital conversion unit acquires the voltage data of the measured chip, converts it into digital signal and feeds back to MCU unit, realizes closed loop control.

[0043] The power conversion unit is the power source of the whole voltage acquisition device, which is responsible for converting the input power into 3.3V and 5V, respectively supplying the MCU unit and the digital-analog conversion unit, ensuring that the whole voltage acquisition device can obtain appropriate working voltage. The communication interface unit is responsible for communication with the host computer. The host computer as the control center of the whole voltage acquisition device sends test instructions to the MCU unit through these interfaces and receives test results, realizing the monitoring and management of the whole test process.

[0044] The chip under test is the test object of the voltage acquisition device, which receives the required voltage through the voltage output unit and communicates with the communication interface unit through the RS485 interface to send voltage data. The oven is connected with the MCU unit through the RS485 interface, allowing the MCU unit to control the temperature of the oven to simulate different test environments.

[0045] Figure 2 The 6V power conversion circuit in the power conversion unit is shown, where U1 is a step-down converter that converts the input 12V voltage to 6V. This circuit is the first stage of the entire power system, providing a stable 6V input for the subsequent voltage regulator. Diode D3 here plays a role in preventing reverse current to protect the circuit safety. C3 and C5 are input bypass capacitors that filter high-frequency noise. Resistors R4 and R5 together with C4 and C6 form a feedback and output stabilization network, ensuring the stability of the 6V output voltage, providing a stable working voltage for the subsequent U3 and U5 voltage regulators.

[0046] Figure 3 The 5V power conversion circuit in the power conversion unit is shown, where U3 is an LDO voltage regulator. This circuit also obtains energy from the 6V output voltage of the U1 voltage regulator. Resistor R9 controls the enable pin of U3, determining the working state of the circuit. C 15 and C16 are input bypass capacitors that reduce high-frequency interference of the input voltage. The connection of C 17 with the NR pin helps to reduce output noise. The feedback network composed of resistors R8, R 10, C 12 and C13 ensures the accuracy and stability of the 5V output, meeting the needs of the whole voltage acquisition device for 5V voltage.

[0047] Figure 4The 3.3V power conversion circuit in the power conversion unit is shown, where U5 is also an LDO regulator. The circuit receives a 6V output voltage from the step-down converter U1, and the EN pin connected through resistor R12 controls the opening and closing of U5. C25 and C26 act as input bypass capacitors, helping to filter out possible high-frequency noise. C27 is connected to the NR pin to further reduce output noise. The feedback network composed of resistors R13, R14, C22, and C24 ensures the stability of the 3.3V output voltage and optimizes the dynamic response of the power supply. D4 serves as a power status indicator light, which will light up when the circuit is working normally, showing "POWER OK".

[0048] Figure 5 The circuit schematic of the MCU unit is shown. As mentioned earlier, the MCU unit includes the MCU chip and its peripheral circuit. The peripheral circuit includes the reset circuit of the MCU chip, where the NRST pin is used for system reset, ensuring that the MCU chip can be correctly reset when starting or encountering abnormal conditions; the power-on buzzer prompt circuit controls the buzzer through the PB0 pin, used to issue an audible prompt when the system is powered on or under certain conditions; the crystal oscillator circuit is connected to the external crystal oscillator through the OSC_IN and OSC_OUT pins, providing an accurate clock signal for the MCU chip to ensure the synchronous operation of its internal logic circuit.

[0049] In Figure 5 In the MCU chip shown, the VDD_3 and VSS pins provide a 3.3V working voltage and ground; the VBAT pin is used to connect the backup battery; the ADC pins such as ADC 12_IN0, ADC 12_IN1, etc. are used for analog signal input and analog-to-digital conversion; the DAC pin such as DAC_OUT 1 is used for digital-to-analog conversion and outputs an analog signal. The communication interface pins include SPI1_SCK, SPI 1_MISO, SPI 1_MOSI of the SPI interface for SPI communication; I 2C 1_SCL, I 2C 1_SDA of the I 2C interface for I 2C communication; USART 1_TX, USART 1_RX of the USART interface for serial communication. General-purpose input / output pins (GPIO) such as PA0-WKUP, PB0, etc. can be configured as input or output mode, used for general digital signal processing.

[0050] In addition, Figure 5 The pins for connecting external devices such as ADC_VBAT, ADC_OPCP2, etc. are also included in the MCU chip, which are used to connect external sensors or devices. The design of the entire peripheral circuit aims to provide a stable and reliable working environment for the MCU chip, while ensuring its flexibility to interact with various external devices to achieve the functional requirements of the voltage acquisition device.

[0051] Figure 6 is a circuit diagram of the communication interface unit, in which the MCU chip U6 communicates with the communication chip U7 through the USART interface. In this circuit, the 53 pin (TX) and the 54 pin (RX) of U6 are connected to the 11 pin (R1 IN) and the 12 pin (T1 OUT) of U7 respectively, realizing the sending and receiving of data. Such connection allows the MCU chip to communicate with the host computer in series, transmitting control instructions and data. The communication interface unit also includes capacitors C33 and C38, which are used to stabilize the 3.3V power supply and reduce the impact of power supply noise on the communication chip. In addition, C34 and C31 act as decoupling capacitors to filter out high-frequency interference that may affect communication stability. The design of the entire communication interface unit aims to ensure accurate and reliable data transmission between the MCU chip and the host computer, providing effective remote control and data monitoring capabilities for the voltage acquisition device.

[0052] Figure 7 shows the communication circuit between the temperature box and the MCU chip U6. In this circuit, the MCU chip U6 is connected to the control chip U8 of the temperature box through its 50, 51, 52 pins. Specifically, the 50 pin (TX) of U6 is connected to the 1 pin (RX) of U8 for sending data to the temperature box; the 51 pin (RX) of U6 is connected to the 2 pin (TX) of U8 for receiving data from the temperature box. This connection allows the MCU chip to accurately control the temperature parameter settings of the temperature box, ensuring the accuracy of the test environment.

[0053] Figure 8 shows the communication circuit between the measured chip and the MCU chip U6. In this circuit, the MCU chip U6 is connected to the measured chip U9 through its 41, 42, 43 pins. The 41 pin (TX) of U6 is connected to the 1 pin (RX) of the measured chip U9 for sending instructions or data to the measured chip; the 42 pin (RX) of U6 is connected to the 2 pin (TX) of the measured chip U9 for receiving status information or other data from the measured chip. This connection enables the MCU chip to effectively exchange data with the measured chip, including sending test instructions and reading test results.

[0054] In one embodiment of the present application, the MCU chip U6 communicates efficiently with the DAC chip U10 and the ADC chip U38 through the SPI (Serial Peripheral Interface) communication protocol. SPI is a high-speed synchronous communication protocol that allows full-duplex data transmission between the MCU chip and peripheral devices. In communication with the DAC chip U10, the MCU chip U6 sends digital signals through the SPI interface to control U10 to convert these signals into corresponding analog voltage outputs for testing the measured chip. Similarly, U6 communicates with the ADC chip U38 through the SPI interface, sends control signals to start voltage collection, and receives the converted digital signals from U38, which represent the voltage state of the measured chip. Through this closed-loop control mechanism, the MCU chip U6 can accurately control the voltage output during testing and monitor the voltage response of the measured chip in real time, ensuring the accuracy and reliability of the test. This design not only improves testing efficiency, but also enhances the consistency of test results, which is crucial for the performance of the voltage collection device.

[0055] The utility model discloses a work of the coordination of host computer and each function unit realizes the automation test to integrated chip voltage performance. In the testing process, the user sets different test voltage types through host computer, these settings are communicated to digital analog conversion unit through MCU unit, and corresponding analog voltage is generated by digital analog conversion unit, and is supplied to the measured chip. Meanwhile, the analog-digital conversion unit is responsible for collecting the voltage response of the measured chip and feeding back the data to the MCU unit. The MCU unit communicates with the digital analog conversion unit / analog-digital conversion unit through the SPI interface, ensuring the accurate control of the testing process. In addition, the MCU unit can also control the oven to test the chip performance under different temperature conditions.

[0056] Compared with the prior art, the utility model has the following technical features:

[0057] 1. By integrating the MCU unit, the dependence on traditional test equipment such as power supply, multimeter, etc. is reduced, and the use of hardware resources is optimized.

[0058] 2. The host computer not only controls voltage testing, but also communicates with the oven to realize temperature control, providing a wider environment simulation for chip testing.

[0059] 3. The cooperation of the digital analog conversion unit and the analog-digital conversion unit forms a closed-loop control, ensuring the accurate output and collection of the test voltage and improving the accuracy of the test.

[0060] The voltage acquisition device for integrated circuit testing provided by the utility model is described in detail above. For the general technical personnel in the art, any obvious change made to it without departing from the essential content of the utility model will constitute an infringement of the utility model patent right and will bear the corresponding legal responsibility.

Claims

1. A voltage acquisition device for integrated circuit testing, characterized in that... It includes a power conversion unit, an MCU unit, a digital-to-analog converter unit, an analog-to-digital converter unit, a voltage output unit, and a temperature chamber; among which, The power conversion unit supplies power to the MCU unit and the digital-to-analog converter unit respectively; The MCU unit communicates with the digital-to-analog converter and the analog-to-digital converter via the SPI interface to control voltage output and voltage acquisition. The digital-to-analog converter receives control signals from the MCU unit and controls the voltage output unit; the analog-to-digital converter acquires the voltage of the chip under test and feeds the data back to the MCU unit. The voltage output unit provides the required test voltage to the chip under test, which is placed in the temperature chamber to test its performance at different temperatures.

2. The voltage acquisition device as described in claim 1, characterized in that... It also includes a communication interface unit and a host computer; The host computer communicates with the MCU unit through the communication interface unit to send test commands and receive test data.

3. The voltage acquisition device as described in claim 2, characterized in that: The MCU unit and the communication interface unit communicate via the USART interface.

4. The voltage acquisition device as described in claim 2, characterized in that: The chip under test receives the voltage required for the test through the voltage output unit and communicates with the communication interface unit through the RS485 interface to send voltage data.

5. The voltage acquisition device as described in claim 1, characterized in that: The digital-to-analog converter receives the digital signal from the MCU unit, converts it into an analog voltage signal, and supplies it to the chip under test through the voltage output unit; the analog-to-digital converter collects the voltage data of the chip under test, converts it into a digital signal, and feeds it back to the MCU unit to realize closed-loop control.

6. The voltage acquisition device as described in claim 1, characterized in that: The temperature chamber is connected to the MCU unit, and the MCU unit controls the temperature of the temperature chamber to simulate different test environments.

7. The voltage acquisition device as described in claim 1, characterized in that: The power conversion unit includes a 5V power conversion circuit and a 3.3V power conversion circuit; both the 5V power conversion circuit and the 3.3V power conversion circuit are implemented by LDO regulators.

8. The voltage acquisition device as described in claim 7, characterized in that: The 5V power conversion circuit supplies power to the digital-to-analog converter unit, and the 3.3V power conversion circuit supplies power to the MCU unit.

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