Improved photoresist spin-coating plate

Abstract

The utility model discloses an improved photoresist spin-coating glue disc, which belongs to the technical field of photoresist spin-coating glue discs and comprises a glue disc body, an annular groove is arranged on the glue disc body, the bottom surface of the annular groove comprises a first curved surface and a second curved surface, the first curved surface and the second curved surface are symmetrically arranged, and the first curved surface and the second curved surface are symmetrically arranged. An annular groove is formed in the base, the highest point and the lowest point in the annular groove are formed, and a glue outlet is formed in the annular groove and located at the lowest point of the annular groove; the inner cover plate is arranged on the glue disc body and is used for placing a wafer for spin coating; and the outer cover plate is mounted on the glue disc body so as to shield the waste glue. According to the improved photoresist spin-coating glue disc disclosed by the utility model, rapid discharge of waste glue is realized, and the flowability of the waste glue is effectively improved, so that the waste glue can be prevented from being accumulated in the spin-coating glue disc, the phenomena of solidification and blockage at the glue guide opening are further avoided, and the normal use of the spin-coating glue disc is ensured.

Description

TECHNICAL FIELD

[0001] The utility model belongs to photoresist spin coating glue disc technical field especially relates to an improved photoresist spin coating glue disc. BACKGROUND

[0002] Photoresist spin coating technology is the key process step in semiconductor manufacturing, microelectronic device and optical element processing, and spin coating glue disc is one of core components, and the existing spin coating glue disc bottom glue discharge groove is usually horizontally arranged, and this arrangement has the following problems:

[0003] 1. In the early stage of glue discharge, waste glue will first accumulate at the groove bottom, and will flow out from the glue guide hole only after reaching a certain thickness, resulting in poor flow efficiency of waste glue, and poor flow efficiency will cause waste glue to solidify at the pipe and glue guide hole position, causing blockage and affecting the normal use of the spin coating glue disc;

[0004] 2. In the later stage of cleaning the spin coating glue disc, the thick solidified glue needs longer time and more acetone for cleaning, causing waste of time and cost and increasing maintenance cost. INVENTION CONTENTS

[0005] The utility model overcomes the insufficient prior art, provides an improved photoresist spin coating glue disc to solve the problems in the prior art.

[0006] To achieve the above object, the utility model adopts the technical scheme of an improved photoresist spin coating glue disc, comprising

[0007] The glue disc body is provided with an annular groove, the bottom surface of the annular groove comprises a first curved surface and a second curved surface, the first curved surface and the second curved surface are symmetrically arranged and form the highest point and the lowest point in the annular groove, a glue outlet is arranged in the annular groove, and the glue outlet is located at the lowest point of the annular groove.

[0008] The inner cover plate is installed on the glue disc body to place the wafer for spin coating.

[0009] The outer cover plate is installed on the glue disc body to shield the waste glue.

[0010] In a preferred embodiment of the utility model, the inner circle protrusion and the outer circle protrusion are arranged on the glue disc body, the inner cover plate is installed on the inner circle protrusion, and the outer cover plate is installed on the outer circle protrusion.

[0011] In a preferred embodiment of the utility model, the inner cover plate is located in the outer cover plate, and the inner cover plate and the outer cover plate are coaxially arranged.

[0012] In a preferred embodiment of the utility model, the number of the highest points and the lowest points is two, and the straight line connected by the two highest points is perpendicular to the straight line connected by the two lowest points.

[0013] In a preferred embodiment of the utility model, the number of the glue outlet is two and is located at the position of the two lowest points to discharge the waste glue.

[0014] In a preferred embodiment of the utility model, the glue outlet is a circular through hole.

[0015] The utility model solves the defects in the background art and has the following beneficial effects:

[0016] 1. The improved photoresist spin coating glue disc can quickly discharge the waste glue, effectively improves the flowability of the waste glue, avoids the accumulation of the waste glue in the spin coating glue disc, avoids the solidification and blockage at the glue outlet position, and ensures the normal use of the spin coating glue disc.

[0017] 2. In the later maintenance of the spin coating glue disc, the small amount of waste glue can effectively reduce the maintenance cost. DRAWINGS

[0018] The utility model will be further described below in combination with the drawings and embodiments.

[0019] Figure 1 It is the overall structure schematic view of the preferred embodiment of the utility model.

[0020] Figure 2 It is the sectional view of the preferred embodiment of the utility model.

[0021] Figure 3 It is the structure schematic view of the glue disc body of the preferred embodiment of the utility model.

[0022] Figure 4 It is the top view of the preferred embodiment of the utility model. Figure 3

[0023] In the drawing: 10, glue disc body; 11, annular groove; 101, first curved surface; 102, second curved surface; 111, highest point; 112, lowest point; 12, glue outlet; 20, inner cover plate; 30, outer cover plate; 40, inner ring protrusion; 50, outer ring protrusion. DETAILED DESCRIPTION

[0024] ​The embodiments of the present application will be described herein below with reference made to figures. For the purpose of clearness, the details of the embodiments will be described herein below. However, it should be appreciated that the details of the embodiments should not be construed as limiting the present application. That is, in some embodiments of the present application, the details of the embodiments are not necessary. In addition, for the purpose of simplicity, some conventional structures and components will be shown in the figures in a simplified schematic manner.

[0025] In addition, the descriptions such as "first", "second" and the like in the present application are only for the purpose of description, and do not particularly mean the order or sequence, nor limit the present application. They are merely for the purpose of distinguishing components or operations described by the same technical terms, and should not be understood as indicating or implying the relative importance of the technical features indicated or the number of technical features. Therefore, the features limited by "first" and "second" can explicitly or implicitly include at least one of the features. In addition, the technical solutions of various embodiments can be combined with each other, but must be based on the realization of ordinary skilled in the art. When the combination of technical solutions contradicts each other or cannot be realized, it should be considered that the combination of technical solutions does not exist, nor within the protection scope required by the present application.

[0026] The improved photoresist spin coating disc disclosed in the embodiment can quickly discharge waste glue, effectively improve the flowability of waste glue, thereby avoiding the accumulation of waste glue in the spin coating disc, and avoiding the solidification and blockage phenomenon at the glue guide hole position, and ensuring the normal use of the spin coating disc.

[0027] In combination with Figures 1 to 4 As shown in the figure, the improved photoresist spin coating disc of the embodiment includes a disc body 10, an inner cover plate 20 and an outer cover plate 30. The disc body 10 can accumulate waste glue and quickly discharge the waste glue. The inner cover plate 20 and the outer cover plate 30 are both installed on the disc body 10. After the inner cover plate 20 is installed, the wafer can be placed on the inner cover plate 20 for spin coating operation. The outer cover plate 30 can shield the waste glue generated during spin coating to avoid the waste glue splashing during the spin coating process.

[0028] In the embodiment, the inner cover plate 20 is located in the outer cover plate 30, and the inner cover plate 20 and the outer cover plate 30 are coaxially arranged to facilitate the spin coating operation of the wafer.

[0029] Further, the disc body 10 of the embodiment is provided with an inner ring protrusion 40 and an outer ring protrusion 50. The inner cover plate 20 is installed on the inner ring protrusion 40, and the outer cover plate 30 is installed on the outer ring protrusion 50.

[0030] In combination with Figure 1 With Figure 3As shown, the glue disc body 10 is provided with an annular groove 11, the bottom surface of the annular groove 11 includes a first curved surface 101 and a second curved surface 102, the first curved surface 101 and the second curved surface 102 are symmetrically arranged, and form a highest point 111 and a lowest point 112 in the annular groove 11, and the annular groove 11 is provided with a glue outlet 12, the glue outlet 12 is located at the lowest point 112 position of the annular groove 11, during the spin coating process of the wafer, the photoresist is deposited from the side wall of the glue disc body 10 to the bottom of the glue disc body 10, due to the bottom surface of the annular groove 11 has the first curved surface 101 and the second curved surface 102, and forms the highest point 111 and the lowest point 112, and the glue outlet 12 is arranged at the lowest point 112 position, therefore, during the waste glue discharging process, the waste glue will flow from the highest point 111 to the lowest point 112, and the waste glue is discharged through the glue outlet 12, the existence of the first curved surface 101 and the second curved surface 102 can effectively improve the flowability of the waste glue, so that the waste glue quickly flows from the highest point 111 position to the lowest point 112 position, and then the waste glue is quickly discharged from the glue outlet 12.

[0031] In the embodiment, the number of the highest points 111 and the lowest points 112 is two, the straight line connected by the two highest points 111 is perpendicular to the straight line connected by the two lowest points 112, the number of the glue outlets 12 is two and is located at the two lowest points 112 positions, so as to discharge the waste glue, the two lowest points 112 are formed, and the two glue outlets 12 are arranged, so as to quickly guide the waste glue out and improve the waste glue guiding efficiency.

[0032] Specifically, the glue outlet 12 of the embodiment is a circular through hole, so as to quickly guide the waste glue out.

[0033] In actual use, the improved photoresist spin coating glue disc of the embodiment, the photoresist dropped during the spin coating process of the wafer forms waste glue, and is deposited from the side wall of the glue disc body 10 to the bottom of the glue disc body 10, the bottom surface of the glue disc body 10 has the first curved surface 101 and the second curved surface 102, and forms the highest point 111 and the lowest point 112, therefore, when the waste glue reaches the bottom of the glue disc body 10, it will flow from the highest point 111 to the lowest point 112 position, and the glue outlet 12 is arranged at the lowest point 112 position, therefore, the flowability of the waste glue is improved, the waste glue can be quickly guided out, the waste glue guiding efficiency is improved, and the normal use of the glue disc body 10 is ensured.

[0034] While the present application has been described with reference to various embodiments, it will be understood that many modifications and variations of the present application are possible, as they will occur to those skilled in the art in the scope of the application. That is, the methods, systems, or devices discussed above are examples. It is contemplated that various configurations can be made without parting from the scope of the application. For example, the method can be performed in a different order or the various stages can be combined or omitted. Also, features described with respect to certain configurations can be combined in a variety of other configurations. Different aspects and elements of configurations can be combined in similar ways. Also, a person of ordinary skill in the art will recognize various elements from the description can be implemented in hardware, software, firmware, middleware, code, or any combination thereof. Moreover, some of what has been described above can be performed remotely by a remote computing device. When implemented in software, the functions can be stored on or transmitted over as one or more instructions or code on a computer-readable medium. Computer-readable media include both computer storage media and communication media including any medium that facilitates transfer of a computer program from one place to another. A storage media can be any available media that can be accessed by a computer. By way of example, and not limitation, such computer-readable media can comprise RAM, ROM, EEPROM, CD-ROM or other optical disk storage, magnetic disk storage or other magnetic storage devices, or any other medium that can be used to carry or store desired program code in the form of instructions or data structures and that can be accessed by a computer. Also, any connection is properly termed a computer-readable medium. For example, if the software is transmitted from a website, server, or other remote source using a coaxial cable, fiber optic cable, or twisted pair, then the coaxial cable, fiber optic cable, or twisted pair are included in the definition of medium. Disk and disc, as used herein, include compact disc (CD), laser disc, optical disc, digital versatile disc (DVD), and Blu-Ray® disc where disks usually reproduce data magnetically, while discs reproduce data optically with lasers. Combinations of the above should also be included within the scope of computer-readable media.

[0035] In the description specific details have been set forth in order to provide a thorough understanding of the exemplary configurations including implementations. However, configurations can be practiced without some of the specific details, for example, well-known circuits, processes algorithms, structures, and techniques have not been described in detail because such details are already well known. The description is only provided to illustrate example configurations and is not limitative of the scope, applicability, or configurations of claims. Rather, the above description of configurations will provide those skilled in the art with an enabling description that can be used in conjunction with the appended claims to im plement and use the described technologies. Various changes to the function and arrangements of elements can be made without departing from the spirit or scope of the disclosure.

[0036] Moreover, although each of the operations can be described as a sequential process, many of the operations can occur in parallel, or concurrently. In addition, the order of the operations can be rearranged. A process might have other steps not discussed herein. Further, examples of the methods can be implemented by hardware, software, firmware, middleware, code, hardware description languages, or any combination thereof. When implemented in software, the program code, or code segments, for performing the necessary tasks can be stored in a non-transitory computer-readable medium such as a storage medium. A storage medium can be any available medium that can be accessed by a computer. By way of example, and not limitation, such computer-readable media can comprise RAM, ROM, EEPROM, CD-ROM or other optical disk storage, magnetic disk storage or other magnetic storage devices, or any other medium that can be used to carry or store desired program code in the form of instructions or data structures and that can be accessed by a computer.

[0037] In view of the above, it will be seen that the details set forth in the above description of the application are regarded as illustrative rather than restrictive, and that application is intended to be as broad as it can reasonably be made to be. In reading the claims, it is to be understood that whenever the application, including all of the claims herein, is used, all equivalents thereof are intended to be included.

Claims

1. An improved photoresist spin-on-coating puck, characterized by, Comprising A glue disc body (10) is provided with an annular groove (11), the bottom surface of the annular groove (11) comprises a first curved surface (101) and a second curved surface (102), the first curved surface (101) and the second curved surface (102) are symmetrically arranged and form the highest point (111) and the lowest point (112) in the annular groove (11), the annular groove (11) is provided with a glue outlet (12), and the glue outlet (12) is located at the lowest point (112) of the annular groove (11); An inner cover plate (20) is installed on the glue disc body (10) to place a wafer for spin coating; An outer cover plate (30) is installed on the glue disc body (10) to shield waste glue.

2. The improved photoresist spin-on-coating disc according to claim 1, wherein, The glue disc body (10) is provided with an inner ring protrusion (40) and an outer ring protrusion (50), the inner cover plate (20) is installed on the inner ring protrusion (40), and the outer cover plate (30) is installed on the outer ring protrusion (50).

3. The improved photoresist spin-on-coating disc according to claim 2, wherein, The inner cover plate (20) is located in the outer cover plate (30), and the inner cover plate (20) and the outer cover plate (30) are coaxially arranged.

4. The improved photoresist spin-on-coating disc of claim 1, wherein, The number of the highest point (111) and the lowest point (112) is two, and the straight line connected by the two highest points (111) and the straight line connected by the two lowest points (112) are perpendicular to each other.

5. The improved photoresist spin-on-coating disc according to claim 4, wherein, The number of the glue outlet (12) is two and is located at the position of the two lowest points (112) to discharge waste glue.

6. The improved photoresist spin-on-coating disc according to claim 1, wherein, The glue outlet (12) is a circular through hole.

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