Ultra-thin magnetic disk controller
By incorporating a metal heat sink, thermally conductive copper pipes, and a highly thermally conductive plastic housing into the ultra-thin disk controller, combined with miniature heat dissipation holes and a small fan, the heat dissipation problem of the ultra-thin disk controller is solved, achieving efficient heat dissipation and stable operation, and extending the device's lifespan.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-07
- Publication Date
- 2026-03-24
AI Technical Summary
Existing ultra-thin disk controllers suffer from poor heat dissipation due to their small size, resulting in ineffective heat dissipation and affecting stability and lifespan.
The heat dissipation system combines a metal heat sink with a thermally conductive copper pipe, along with a high thermal conductivity plastic shell and micro heat dissipation holes to increase the heat dissipation area and efficiency. A small cooling fan is used to assist in heat dissipation, and the shell is designed to be detachable for easy maintenance.
It effectively improves heat dissipation performance, ensures stable operation of key components in high-temperature environments, extends equipment life, and enhances equipment stability and reliability.
Smart Images

Figure CN224037684U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to disc control technical field more particularly to ultra -thin disc controller. BACKGROUND
[0002] As the key hub in the electronic equipment storage system, the disc controller plays a crucial role. It is responsible for accurately controlling the read and write operations of the disc, ensuring that data can be transmitted between the disc and the host system at high speed and stability, and is the core component of the entire storage system to ensure smooth operation. With the rapid development of science and technology, electronic devices such as notebook computers, tablet computers, and ultra-thin servers are constantly moving towards miniaturization and lightweight, which requires internal components to be as small as possible. Therefore, the ultra-thin disc controller has emerged as the times require.
[0003] However, the existing ultra-thin disc controller is severely compressed in terms of heat dissipation space due to the pursuit of extremely small size, resulting in poor heat dissipation performance. During the operation of the disc controller, a large amount of heat will be generated. If the heat cannot be dissipated in time, the key components such as chips are prone to performance degradation or even damage, which seriously affects the stability and service life of the disc controller, and further affects the normal operation of the entire electronic device.
[0004] Therefore, in view of the above problems, the existing structure and deficiencies are improved to provide an ultra-thin disc controller, with the purpose of achieving more practical value. INVENTION CONTENTS
[0005] In order to overcome the above-mentioned defects of the prior art, the present utility model provides an ultra-thin disc controller to solve the problems existing in the background art.
[0006] The utility model provides the following technical scheme: an ultra-thin disc controller, comprising:
[0007] The controller main body is tightly fixed with a metal heat sink at the bottom, and a plurality of heat dissipation fins are evenly and vertically distributed at the bottom end of the metal heat sink to increase the heat dissipation area.
[0008] The heat-conducting copper pipe is connected to the heat source on the controller main body at one end and penetrates the heat dissipation fins at the other end to ensure smooth heat conduction.
[0009] The shell is made of high-thermal-conductivity plastic material, and the outer surface of the shell is regularly arranged with micro heat dissipation holes to maintain the ultra-thin structure while ensuring the heat exchange efficiency with the outside air.
[0010] Further, the shell is integrally formed, which not only effectively ensures the stability of the overall structure, but also greatly improves the sealing performance to prevent external impurities from entering the internal precision components.
[0011] Further, the shell adopts a split structure, comprising a base and an upper cover, and the base and the upper cover are connected in a detachable manner, facilitating daily maintenance, quick repair and timely replacement of parts of the equipment.
[0012] Further, the bottom end of the shell is provided with a mounting groove, and a small cooling fan is arranged in the mounting groove to realize forced air cooling auxiliary cooling and enhance the cooling guarantee under high temperature working conditions.
[0013] Further, the aperture of the micro cooling hole is limited in the range of 0.1-0.25mm, which can not only guarantee sufficient air circulation to realize the cooling function, but also effectively prevent dust particles from invading in large quantities and maintain a clean internal environment.
[0014] Further, the metal heat sink is limited to an aluminum alloy material, and the thickness is strictly controlled within the range of 0.5-1mm, which not only meets the high-strength cooling demand, but also adapts to the space constraints of the ultra-thin design.
[0015] Further, the connecting part of the base and the upper cover is sealed with a sealing strip for secondary sealing treatment, which effectively resists external invasion in humid environment or in scenes with more dust.
[0016] Further, the surface of the heat dissipation fin is coated with a nano coating, which has super strong heat dissipation performance and hydrophobicity, on the one hand accelerating heat dissipation, on the other hand preventing water vapor from condensing on the fin surface to affect the heat dissipation efficiency, and ensuring stable operation in complex environment.
[0017] The technical effects and advantages of the utility model are as follows:
[0018] 1. The utility model discloses a controller main body and metal heat sink are closely connected, cooperate with the heat dissipation fin of reasonable distribution at the bottom, greatly promote the heat dissipation area, can quickly spread the heat generated to the surrounding of controller main body, effectively alleviate the heat dissipation problem caused by the volume ultra-thin, guarantee the operation environment temperature of key components, reduce the risk of overheating, second, the heat dissipation fin is connected with the heat source main chip and power amplifier of heat copper pipe accurate, rely on excellent heat conduction performance, open the efficient conduction channel for heat, ensure that heat is exported in time, avoid the damage to the performance of chip caused by heat accumulation, maintain the stable operation of key components such as chip, further, the shell selects high heat conduction plastic material and designs regular micro cooling hole, while maintaining the ultra-thin structure, guarantee the efficient heat exchange of internal and external air, further strengthen the heat dissipation, so that the whole magnetic disk controller can still realize good heat dissipation in the narrow space, improve stability and service life, and lay a solid foundation for the stable operation of the electronic equipment.
[0019] 2. The utility model discloses a shell adopts integrated process, and this high-precision manufacturing method makes the shell structure stable, can not only resist slight collision, vibration in daily use, protects internal precision assembly, and the sealing property obtains the great promotion, effectively blocks the dust, moisture and other impurities invasion, creates a clean, stable operating environment for the controller inside, reduces the failure rate caused by impurity erosion, prolongs the service life;
[0020] The shell can also be a split structure composed of a base and an upper cover, and can be detachably connected for easy maintenance. The operator can quickly detach the upper cover, accurately position and process the faulty parts, greatly saving maintenance time and cost. At the same time, the sealing rubber strip at the connecting part of the base and the upper cover is sealed again, which ensures the detachability and strengthens the sealing property, adapting to complex environments;
[0021] The small cooling fan at the bottom end of the shell automatically starts under high-temperature working conditions, cooperates with the cooling fins and the metal heat sink, significantly enhances the cooling capacity, rapidly reduces the internal temperature of the controller, ensures that the key components can maintain good performance even under high-load operation, guarantees the stable operation of the disk controller, and further improves the working efficiency and reliability of the entire electronic equipment;
[0022] In addition, the nano coating of the cooling fins has super cooling and hydrophobic properties, accelerates cooling while preventing water vapor condensation, so that the controller can also operate efficiently in a humid environment. BRIEF DESCRIPTION OF DRAWINGS
[0023] Figure 1 It is a first structure three-dimensional schematic view of the utility model.
[0024] Figure 2 It is a second structure three-dimensional schematic view of the utility model.
[0025] Figure 3 It is a structure three-dimensional split schematic view of the utility model.
[0026] Figure 4 It is a controller main body structure three-dimensional schematic view of the utility model.
[0027] Figure 5 It is another perspective structure three-dimensional schematic view of the utility model. Figure 4
[0028] In the figure: 100, controller main body; 110, metal heat sink; 111, cooling fin; 112, heat-conducting copper pipe; 113, shell; 114, micro cooling hole; 115, base; 116, upper cover; 117, mounting groove; 118, small cooling fan. DETAILED DESCRIPTION
[0029] The technical scheme in the utility model will be described clearly and completely in combination with the drawings of the utility model.
[0030] Embodiment one: the embodiment constructs a kind of ultra-thin disk controller, and its core component includes controller main body 100, metal heat sink 110, heat-conducting copper pipe 112 and shell 113.
[0031] Firstly, controller main body 100 is the core operation and control unit of the whole controller, and is fixed closely with metal heat sink 110 at bottom by special bonding process, to ensure that high-efficiency heat transfer can be realized between the two.Metal heat sink 110 adopts carefully designed structure, and multiple heat dissipation fins 111 are evenly and vertically distributed at the bottom end of the metal heat sink, which are reasonably spaced from each other to maximize the heat dissipation area, so that heat can be quickly dissipated from the metal heat sink 110 to the surrounding environment, effectively reducing the temperature of the controller main body 100.
[0032] Secondly, heat-conducting copper pipe 112 plays a key role in the heat dissipation system, and one end of the heat-conducting copper pipe is accurately connected to the main chip or power amplifier on the controller main body 100, which are key parts of heat sources prone to high heat. During operation, the main chip needs to continuously perform complex data operation and instruction processing, resulting in large power consumption and thus a large amount of heat. When the power amplifier amplifies the signal, heat is also generated due to energy conversion. The heat-conducting copper pipe 112 quickly conducts the heat generated by the heat sources to the other end by virtue of the excellent heat conduction performance of the copper pipe inside. The other end of the heat-conducting copper pipe 112 is seamlessly connected to the heat dissipation fins 111, forming a smooth and unobstructed heat conduction channel to ensure that heat can be smoothly transferred from the heat source to the heat dissipation fins and then dissipated to the outside.
[0033] Furthermore, the shell 113 is made of plastic material with high thermal conductivity, which has good heat conduction characteristics while ensuring a certain structural strength, and can assist in dissipating heat from the inside. The outer surface of the shell 113 is regularly arranged with micro heat dissipation holes 114, and the diameter, spacing and arrangement of these heat dissipation holes are precisely calculated to maintain the ultra-thin structure of the entire controller while effectively ensuring the efficient exchange rate of heat and outside air, so as to ensure that the internal heat can be discharged in time.
[0034] Embodiment two:
[0035] Based on embodiment one, embodiment two makes further optimization and improvement.
[0036] In one aspect, the shell 113 is manufactured using an advanced one-piece molding process. During the molding process, the shell 113 is effectively ensured to be stable in structure and able to withstand a certain degree of external force impact and vibration, and the sealing performance is greatly improved, effectively preventing the intrusion of external dust, moisture and other impurities into the internal precision components, thereby providing a relatively clean and stable operating environment for the internal electronic components.
[0037] On the other hand, considering the convenience of later maintenance and repair of the device, the shell 113 can also be designed as a split innovative structure, specifically composed of a base 115 and an upper cover 116. The two are combined together through a convenient detachable connection method, such as a buckle connection or screw fixation, etc. When it is necessary to perform routine maintenance, quick repair and timely replacement of parts, the operator can easily detach the upper cover 116 and conveniently access the internal controller main body 100, heat dissipation components and other key components, thereby greatly improving the work efficiency.
[0038] Meanwhile, a mounting groove 117 is cleverly provided at the bottom end of the shell 113, and a small heat dissipation fan 118 is precisely fitted inside the mounting groove 117. The small heat dissipation fan 118 is driven by a low-noise, high-speed brushless DC motor, and the noise generated during operation is controlled below the industry standard, while having energy-saving characteristics. Under high temperature working conditions, when the internal temperature of the controller reaches a certain threshold, the small heat dissipation fan 118 can be automatically started to realize forced air cooling auxiliary heat dissipation function, which cooperates with the heat dissipation fins 111 and the metal heat dissipation plate 110 to provide strong heat dissipation protection for the device, ensuring stable operation of the controller in high temperature environment.
[0039] In addition, the pore size of the micro heat dissipation hole 114 is strictly limited and precisely controlled within a specific range of 0.1-0.25 mm. Such a fine design not only ensures smooth air flow for efficient heat dissipation, but also effectively blocks the invasion of dust particles, thereby maintaining a clean internal operating environment and reducing problems such as poor heat dissipation or electronic component short circuit caused by dust accumulation.
[0040] Furthermore, the metal heat dissipation plate 110 is explicitly limited to use high-quality aluminum alloy material, and its thickness is strictly controlled within a narrow range of 0.5-1 mm through a precise process. The aluminum alloy material itself has excellent heat conduction performance and can quickly conduct heat away, and the strictly controlled thickness not only fully meets the high-strength heat dissipation requirement, but also perfectly adapts to the strict space constraints brought by the ultra-thin design, so that the entire controller realizes ultra-thin design while ensuring heat dissipation performance.
[0041] In addition, in order to further enhance the sealing performance of the split structure of the shell, the connecting part of the base 115 and the upper cover 116 is subjected to secondary sealing treatment by using a sealing rubber strip. On the basis of being detachable, the sealing rubber strip effectively fills the small gap of the connecting part, further enhances the sealing performance of the whole shell, effectively resists external invasion in a humid environment or a scene with more dust, and ensures the reliability and stability of the internal electronic components.
[0042] Finally, the surface of the heat dissipation fin 111 is coated with a nano coating. The nano coating has super heat dissipation performance and hydrophobicity, which can accelerate the dissipation of heat from the surface of the heat dissipation fin to the air, improve the heat dissipation efficiency, and on the other hand, the hydrophobicity can effectively prevent water vapor from condensing on the surface of the fin, avoid affecting the heat dissipation efficiency due to water vapor accumulation, and ensure that the controller can still operate stably in a complex environment, such as a high humidity environment.
[0043] Through the above two embodiments, the structural characteristics, heat dissipation principle and optimization scheme under different design requirements of the ultra-thin disc controller are comprehensively displayed, so that it can meet the diversified application scenarios and performance requirements.
[0044] Finally, it should be pointed out that: first, in the description of the present application, it should be pointed out that, unless otherwise specified and limited, the terms "mounting", "connection", "connection" should be understood broadly, which can be mechanical connection or electrical connection, or the communication between two elements, or direct connection, "up", "down", "left", "right" and the like are only used to indicate the relative positional relationship, when the absolute position of the described object changes, the relative positional relationship may change;
[0045] Secondly: the utility model discloses the embodiment of the drawings, only relate to the structure involved in the embodiment of the present disclosure, other structures can refer to the usual design, in the case where there is no conflict, the same embodiment and different embodiments of the utility model can be combined with each other;
[0046] Finally: the above is only the preferred embodiment of the utility model, and is not used to limit the utility model, and any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the utility model should be included in the protection scope of the utility model.
Claims
1. An ultra-thin disk controller, characterized by: Include: The controller body (100), the metal heat dissipation plate (110) is fixed at the bottom of the controller body (100), the bottom end of the metal heat dissipation plate (110) is uniformly and vertically distributed with multiple heat dissipation fins (111); The heat-conducting copper pipe (112) is connected to the heat source on the controller body (100) at one end, and the other end penetrates the heat dissipation fin (111); The shell (113) is made of high heat-conducting plastic material, and the outer surface of the shell (113) is regularly arranged with micro heat dissipation holes (114).
2. The ultra-thin disk controller of claim 1, wherein: The shell (113) is integrally formed.
3. The ultra-thin disk controller of claim 1, wherein: The shell (113) adopts a split structure, including a base (115) and an upper cover (116), the base (115) and the upper cover (116) are connected in a detachable manner. The bottom end of the shell (113) is provided with a mounting groove (117), and a small heat dissipation fan (118) is arranged in the mounting groove (117).
4. The ultra-thin disk controller of claim 2, wherein: The aperture of the micro heat dissipation hole (114) is limited to the range of 0.1-0.25mm.
5. The ultra-thin disk controller of claim 2 or 3, wherein: The metal heat dissipation plate (110) is limited to be made of aluminum alloy material, and the thickness is strictly controlled within the range of 0.5-1mm.
6. The ultra-thin disk controller of claim 1, wherein: The connecting part of the base (115) and the upper cover (116) is sealed with a sealing strip for secondary sealing treatment.
7. The ultra-thin disk controller of claim 3, wherein: The surface of the heat dissipation fin (111) is coated with a nano coating.
8. The ultra-thin disk controller of claim 1, wherein: