Coupling packaging structure of optical detection chip

Abstract

The utility model relates to a coupling packaging structure of an optical detection chip. The coupling packaging structure comprises a lower cover plate, a middle layer and an upper cover plate which are sequentially arranged from bottom to top, the lower cover plate and the upper cover plate are provided with a plurality of oppositely-arranged fixing holes. Screws used for fixing the upper cover plate and the lower cover plate are arranged in the fixing holes. A flow guide channel is formed in one side, deviating from the lower cover plate, of the middle layer; a chip mounting groove is formed in one side, close to the lower cover plate, of the middle layer; the chip mounting groove is provided with an opening facing the direction of the lower cover plate; the chip mounting groove is communicated with the flow guide channel; a liquid flow inlet and a liquid flow outlet which are communicated with the flow guide channel are formed in the upper cover plate; the position, relative to the chip mounting groove, of the flow guide channel has the maximum size in the first direction. According to the utility model, processing errors are made up through the elasticity of the middle layer, and the flow channel after the chip is coupled is smooth, so that various accidental events (such as bubble generation, series flow, chip shaking and the like) caused by non-uniform pressure of the flow channel are reduced, and the detection reliability is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to optical detection chip technical field especially, relate to a kind of coupling package structure of optical detection chip. BACKGROUND

[0002] Optical detection chip usually uses transparent cover plate as optical window, incident light is projected to chip surface by the window. When the sample to be measured flows through the biochemical modification layer on the surface of chip, the target molecules in the sample will interact with the modification layer specifically, causing local refractive index or light absorption characteristics to change. This change will modulate the intensity, phase or wavelength of reflected light. After the reflected light signal is captured, the optical parameters are converted into concentration value and molecular interaction kinetics data by algorithm.

[0003] In the existing optical detection chip packaging method, the chip usually adopts the installation mode of front up, and has the following defects:

[0004] Poor chip mounting stability: the fragile biochemical modification layer is easily damaged by tweezers clamping chip front, and the chip and the lower cover plate cannot be completely attached, resulting in deviation of actual optical path between different chips, increasing the optical path adjustment workload.

[0005] Liquid flow disturbance problem: the bottom of flow channel after coupling packaging and chip surface are easy to have slope due to processing error, so bubbles and liquid flow are easy to produce, affecting detection precision.

[0006] Chip fixation is unreliable: chip is easy to shift or shake when sample flows, resulting in unstable detection signal.

[0007] Therefore, an optical detection chip coupling packaging scheme that can solve the above problems is needed. UTILITY MODEL CONTENT

[0008] In order to solve the above problems of the prior art, the utility model provides a coupling package structure of optical detection chip.

[0009] In order to achieve the above purpose, the main technical scheme adopted by the utility model includes:

[0010] The utility model provides a kind of coupling package structure of optical detection chip, including lower cover plate, intermediate layer, upper cover plate sequentially arranged from bottom to top;The lower cover plate, upper cover plate are equipped with a plurality of fixed holes being oppositely arranged;Screw for fixing upper cover plate and lower cover plate is equipped in the fixed hole;The side of the intermediate layer away from lower cover plate is equipped with flow guide channel;The side of the intermediate layer close to lower cover plate is equipped with chip mounting slot;The chip mounting slot has opening towards lower cover plate direction;The chip mounting slot is communicated with flow guide channel;The position of flow guide channel relative to chip mounting slot has maximum size in first direction;The flow guide direction of flow guide channel is parallel to second direction;The second direction is perpendicular to first direction.

[0011] In an embodiment of the utility model, the intermediate layer is equipped with through hole being oppositely arranged with fixed hole.

[0012] In an embodiment of the utility model, the liquid inlet and liquid outlet are all pre-buried with metal pipe for liquid flow.

[0013] In an embodiment of the utility model, the upper cover plate and lower cover plate are both transparent acrylic plate.

[0014] In an embodiment of the utility model, the intermediate layer is elastic layer.

[0015] In an embodiment of the utility model, the elastic layer is PDMS layer or silica gel layer or iron fluorine dragon layer.

[0016] In an embodiment of the utility model, the size of the chip mounting slot in first direction is always greater than the size of flow guide channel in first direction.

[0017] In an embodiment of the utility model, the upper top surface of chip mounting slot and the lower bottom surface of flow guide channel are flush.

[0018] In an embodiment of the utility model, the side wall of chip mounting slot is equipped with pressing strip towards inside of chip mounting slot.

[0019] In an embodiment of the utility model, the protruding length of pressing strip is 0.5-3mm.

[0020] The utility model discloses a beneficial effect is: the middle layer is close to the lower cover plate one side and is provided with the chip mounting slot that opens to the direction of lower cover plate, and the chip can be installed from below to the mounting slot, avoids the damage of forceps to the front biochemical modification layer of chip in traditional front upward installation mode, improves the stability and reliability of chip installation. Meanwhile, the chip is installed in the groove, can better adhere with the lower cover plate, reduces the deviation of actual light path between different chips, reduces the light path adjustment workload. The elasticity of the middle layer makes up for the processing error, makes the flow channel smooth after coupling chip, thereby reduces various sporadic events (such as bubble, string flow, chip shaking etc.

[0021] The chip mounting slot is greater than the flow guide channel in the first direction, which can protect the chip, optimize the liquid flow, facilitate the light path adjustment, and enhance the structural stability.

[0022] The top surface of the chip mounting slot is flush with the lower bottom surface of the flow guide channel, which can ensure the uniformity of the liquid flow, facilitate the contact between the chip and the liquid flow, simplify the packaging structure, facilitate the light path transmission, improve the consistency of the chip installation, and reduce the workload of adjusting the light path after switching different chips for testing.

[0023] The side wall of the chip mounting slot is provided with a pressing strip, which can fix the chip, enhance the sealing performance, adapt to different chip sizes, improve the structural stability, and facilitate the installation and removal of the chip. The pressing strip can effectively resist the liquid flow impact during the experiment, prevent the chip from shaking and displacing, thereby increasing the stability of the experiment and improving the testing accuracy. BRIEF DESCRIPTION OF DRAWINGS

[0024] To make the technical solutions of the embodiments of the utility model clearer, the following will briefly introduce the drawings needed in the embodiments. It should be understood that the following drawings only show some embodiments of the utility model, and should not be regarded as a limitation to the scope. Those skilled in the art can obtain other related drawings according to the drawings without creative labor.

[0025] Figure 1 It is the structure explosion map of the utility model;

[0026] Figure 2 It is the structure perspective view of the utility model;

[0027] Figure 3 It is another embodiment explosion map of the utility model;

[0028] Figure 4 It is another embodiment perspective view of the utility model;

[0029] Figure 5 It is the plan view of the utility model;

[0030] Figure 6 is Figure 5 A-A cross-sectional view in the middle of the figure;

[0031] Explanation of reference signs:

[0032] 10, lower cover plate; 11, fixing hole; 20, intermediate layer; 21, through hole; 22, flow guide channel; 23, chip mounting groove; 24, edge pressing strip; 30, upper cover plate; 31, liquid flow inlet; 32, liquid flow outlet. DETAILED DESCRIPTION

[0033] In order to make the purpose, technical scheme and advantages of the embodiments of the present application clearer, the technical scheme in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are some embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without making creative efforts fall within the scope of protection of the present application. Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the claimed present application, but only represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without making creative efforts fall within the scope of protection of the present application.

[0034] In the description of the present application, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "two ends", "one end", "the other end" and the like indicate the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first" and "second" are only for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0035] In the description of the present application, it should be noted that, unless otherwise explicitly specified and limited, the terms "mounting", "provided with", "connected" and the like should be understood broadly, for example, "connected" can be fixedly connected, or can be detachably connected, or integrally connected; can be mechanically connected, or can be electrically connected; can be directly connected, or can be indirectly connected through an intermediate medium; can be the communication inside two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0036] Embodiment:

[0037] As shown in Figure 1 the first direction is parallel to the X direction, the second direction is parallel to the Y direction, and the third direction is parallel to the Z direction and perpendicular to both the X direction and the Y direction. These definitions are for illustrative purposes only and do not limit the scope of the claims. The directions described above and shown in the drawings can differ, of course, based on implementation and use.

[0038] As shown in Figures 1-6 A coupling packaging structure of an optical detection chip includes, from bottom to top, a lower cover plate 10, an intermediate layer 20, and an upper cover plate 30. The lower cover plate 10 and the upper cover plate 30 are provided with a plurality of oppositely arranged fixing holes 11. Screws for fixing the upper cover plate 30 and the lower cover plate 10 are arranged in the fixing holes 11. This design can provide reliable mechanical connection and ensure the close combination between the upper cover plate 30 and the lower cover plate 10, thereby guaranteeing the stability of the entire packaging structure, reducing structural deformation or loosening caused by external force, and being conducive to improving the stability of the optical path and reducing the workload of optical path adjustment. When the upper and lower cover plates 10 are fixedly connected, the flatness of the intermediate layer 20 can be effectively guaranteed, and the levelness of chip installation can be improved.

[0039] The side of the intermediate layer 20 away from the lower cover plate 10 is provided with a flow guide channel 22, which provides a flow path for the sample to be tested. The flow guide channel 22 is in communication with the liquid inlet 31 and the liquid outlet 32 of the upper cover plate 30, which can make the sample flow along the designed path, ensure that the sample flows uniformly through the surface of the chip, and be conducive to improving the accuracy and repeatability of the detection.

[0040] The side of the intermediate layer 20 close to the lower cover plate 10 is provided with a chip mounting groove 23. The chip mounting groove 23 has an opening facing the direction of the lower cover plate 10, and the chip can be installed from bottom to top into the mounting groove, avoiding the damage of the traditional front-up installation method to the front biochemical modification layer of the chip, and improving the stability and reliability of chip installation. At the same time, the chip is installed in the groove, which can better adhere to the lower cover plate 10, reduce the actual optical path deviation when different chips are installed, and reduce the workload of optical path adjustment.

[0041] The chip mounting groove 23 is in communication with the flow guide channel 22. The upper cover plate 30 is provided with a liquid inlet 31 and a liquid outlet 32 in communication with the flow guide channel 22. The position of the flow guide channel 22 relative to the chip mounting groove 23 has the maximum size in the first direction. The flow guide direction of the flow guide channel 22 is parallel to the second direction. The second direction is perpendicular to the first direction. This design can make the liquid flow uniformly distributed on the surface of the chip, reduce the liquid flow disturbance caused by unreasonable flow channel design, and reduce the possibility of bubble generation and liquid flow, thereby improving the detection precision. At the same time, reasonable flow channel design can also help to reduce the impact force of the sample flow on the chip, reduce the risk of chip displacement or shaking, and make the detection signal more stable.

[0042] In an embodiment, the intermediate layer 20 is provided with through holes 21 opposite to the fixing holes 11, which are aligned with the fixing holes 11 of the upper and lower cover plates 10, so that the screws can pass through the fixing holes 11 of the upper cover plate 30, the through holes 21 of the intermediate layer 20 and the fixing holes 11 of the lower cover plate 10 in sequence, tightly connecting the three-layer structure together. This design facilitates the assembly process of the packaging structure, ensures the accurate relative position between the layers, and is beneficial to ensure the stability and reliability of the entire packaging structure. The arrangement of the through holes 21 enables the intermediate layer 20 to better adapt to the fixing mode of the upper and lower cover plates 10, achieving the fixed connection of the multi-layer structure without increasing the additional space occupation, which helps to maintain the compactness of the entire optical detection chip coupling packaging structure. When using screws for fixing, the through holes 21 can make the fixing pressure more evenly distributed on the intermediate layer 20, avoiding deformation or damage of the intermediate layer 20 due to excessive local pressure. This helps to protect the structural integrity of the intermediate layer 20, further improving the flatness of the intermediate layer 20, the stability of the liquid flow, and the flatness of the flow guide channel 22, chip mounting groove 23 and other structures on the intermediate layer 20, avoiding bending caused by uneven stress, thereby improving the performance and service life of the entire packaging structure.

[0043] In an embodiment, metal pipes for liquid flow are pre-embedded in the liquid inlet 31 and the liquid outlet 32; the metal pipes have high strength and hardness and can withstand certain pressure without being easily deformed. Pre-embedding metal pipes at the liquid inlet 31 and outlet can avoid damage to the interface due to long-term liquid flow impact or external pressure, improving the durability and stability of the entire packaging structure. The inner wall of the metal pipe is relatively smooth, which is conducive to the smooth flow of liquid into and out of the flow guide channel 22. Compared with other materials, the surface roughness of the metal pipe is low, and the resistance of the liquid flowing therein is small, which can better ensure the stability of the liquid flow rate and flow, reduce the turbulence and fluctuation of the liquid flow, and thus improve the accuracy and repeatability of the detection. The metal pipe can be conveniently connected with the external liquid conveying pipeline, such as by welding, threaded connection or using a sealed joint. The metal material interface is easier to achieve good sealing effect, preventing liquid leakage, ensuring the sealing of the entire detection system, and avoiding damage to the equipment due to liquid leakage. Some metal materials have good corrosion resistance and can resist the corrosion of chemical substances that may exist in the detection sample. This helps to prolong the service life of the packaging structure, ensure the integrity and function of the liquid flow channel, and is especially suitable for detecting some liquid samples with corrosive properties. In an embodiment, the metal pipe is a steel needle pipe;

[0044] In an embodiment, the upper cover plate 30 and the lower cover plate 10 are both transparent acrylic plates. The transparent acrylic plates have high light transmittance, which enables the incident light to efficiently pass through the cover plates and project onto the chip surface, and also ensures that the reflected light can smoothly pass through the cover plates and be captured by the detection equipment, reducing the attenuation and scattering of light during transmission, thereby improving the sensitivity and accuracy of optical detection. The transparent nature allows the operator to directly observe the chip surface and the internal liquid flow, such as observing the flow state of the sample on the chip surface, whether bubbles are generated, the adhesion between the chip and each layer, etc. This helps to timely discover problems in the packaging process and to judge and handle abnormal situations during detection. Acrylic plates are easy to cut, drill, polish, and other processing operations, which can easily produce upper cover plates 30 and lower cover plates 10 with different shapes, sizes, and structures according to design requirements, meeting the needs of various optical detection chip packaging. For example, the fixing holes 11, mounting grooves, and other structures can be accurately processed according to the size and shape of the chip, ensuring the precision and quality of packaging.

[0045] In an embodiment, the intermediate layer 20 is an elastic layer; the elastic layer is a PDMS layer or a silicone layer or a Teflon layer. The elastic material can tightly adhere to the contact surface between the chip and each layer under the extrusion of the upper and lower cover plates 10, effectively filling the small gaps caused by insufficient processing precision or component size differences, thereby preventing liquid leakage and ensuring the sealing of the packaging structure, which is very important for ensuring the normal flow of the sample during detection and preventing cross-contamination. The elastic layer can buffer the impact of external vibration and impact on the chip, reducing the risk of chip displacement, shaking, or even damage caused by vibration or impact, helping to protect the chip and its surface biochemical modification layer, and improving the stability of the detection signal and the accuracy of the detection result. At the same time, it can also reduce the change of the optical path caused by mechanical stress, ensuring the stability of the optical path. During detection, the chip may be deformed slightly due to factors such as temperature change and liquid pressure. The elastic layer can adapt to the deformation of the chip by its own elastic deformation to maintain good contact with the chip, and will not affect the performance of the packaging structure due to the slight deformation of the chip, which is beneficial to improve the adaptability and reliability of the packaging structure. PDMS (polydimethylsiloxane), silicone, and Teflon materials generally have good chemical compatibility and are not easily reacted with detection samples or other chemicals, which can avoid problems such as material aging and performance degradation caused by chemical reactions, ensuring the stability and service life of the packaging structure in different chemical environments. The PDMS layer, silicone layer, or Teflon layer has good optical transparency and stability in a certain wavelength range, and will not significantly absorb, scatter, or interfere with the incident light and reflected light during optical detection, which helps to ensure the accuracy and reliability of optical detection.

[0046] In an embodiment, the size of the chip mounting groove 23 in the first direction is always greater than the size of the flow guide channel 22 in the first direction, and the chip mounting groove 23 is larger in size, which can make the contact area of the chip with the middle layer 20 larger, and the chip is more stable when fixed, which can reduce the possibility of displacement or shaking of the chip during sample flow, and help to improve the stability of the entire packaging structure and ensure the stability and repeatability of the detection signal.

[0047] In an embodiment, the upper top surface of the chip mounting groove 23 is flush with the lower bottom surface of the flow guide channel 22, which can make the liquid flow through the flow guide channel 22 to the chip surface with a more uniform flow rate and pressure distribution on the chip. Because the liquid flow channel and the chip surface are in the same plane, the liquid flow impact or uneven flow rate caused by the height difference is avoided, and the liquid flow disturbance and bubble generation are avoided, which is beneficial to improve the consistency of the biochemical reaction on the chip surface, thereby improving the accuracy and repeatability of the detection result. When optical detection is performed, the flush structure is helpful to maintain the stability and accuracy of the optical path. The chip surface and the bottom surface of the flow guide channel 22 are in the same plane, which reduces the problems of refraction, scattering and other problems caused by uneven structure of the optical path, which is beneficial to the transmission and detection of the optical signal on the chip surface, and improves the sensitivity and resolution of the optical detection.

[0048] As shown in the embodiment of Figures 1-2 , the flow guide channel 22 has a large channel in the middle and small channels on both sides of the large channel, and the large channel corresponds to the chip mounting groove 23. The size of the large channel in the X direction is obviously larger than the size of the small channel in the X direction. Due to the change in size, according to Bernoulli's principle, the flow rate of the liquid flowing to the large channel will be further reduced, so that it can pass through the chip surface more gently, and reduce the generation of bubbles and other problems.

[0049] As shown in the embodiment of Figures 3-4 , the flow guide channel 22 is spindle-shaped, and the middle part also forms a large channel, and the large channel corresponds to the chip mounting groove 23. The size of the large channel in the X direction is obviously larger than the size of the flow guide channel 22 at other positions in the X direction. Due to the change in size, according to Bernoulli's principle, the flow rate of the liquid flowing to the large channel will be further reduced, so that it can pass through the chip surface more gently, and reduce the generation of bubbles and other problems.

[0050] As shown in the embodiment of Figures 5-6 , in an embodiment, the side wall of the chip mounting groove 23 is provided with a pressing strip 24 towards the inside of the chip mounting groove 23; the extension length of the pressing strip 24 is 0.5-3mm; the pressing strip 24 can have various cross-sectional shapes, which can be triangular, rectangular, zigzag, trapezoidal, wavy and other common geometric structures; and the pressing strip 24 is provided with at least one. Figure 6An example of the cross section of the edge bead 24 being triangular is shown in the middle;

[0051] The edge bead 24 can tightly press the chip from the side into the chip mounting groove 23, preventing the chip from being displaced due to external forces (such as the impact force of liquid flow, vibration, etc.) during packaging or use, ensuring that the chip is always in the correct position, thereby ensuring the accuracy and repeatability of detection. When the chip is mounted in the mounting groove, the edge bead 24 can tightly fit the surface of the chip, filling the small gap between the chip and the mounting groove, effectively preventing liquid from leaking from the gap between the chip and the mounting groove, improving the sealing of the packaging structure, and avoiding interference with the detection results or damage to the equipment caused by sample leakage. By setting edge beads 24 with different extension lengths and different cross-sectional shapes, the fixing and sealing effect on the chip can be flexibly adjusted to adapt to chips of different sizes and shapes. The edge bead 24 increases the friction and connection strength between the chip and the mounting groove, making the chip and the packaging structure form a more stable whole. When subjected to external stress, it can better disperse stress and reduce the risk of damage to the chip and the packaging structure, improving the stability and durability of the entire packaging structure.

[0052] Embodiment

[0053] 1. Assembly steps:

[0054] Place the middle layer 20 on the upper cover plate 30.

[0055] Place the chip face down into the back card slot, and press the back with tweezers to make it fit the upper cover plate 30.

[0056] Install the lower cover plate 10 and flip it over, fasten it with screws from the upper cover plate 30, and compress the edge bead 24 to fix the chip.

[0057] 2. Material selection:

[0058] The upper and lower cover plates are made of transparent acrylic with a thickness of 1-5 mm; the middle layer 20 is made of PDMS, Teflon or silicone (thickness 0.3-2 mm).

[0059] 3. Detection process:

[0060] The sample to be tested is injected into the flow channel through the pre-embedded steel needle tube, and the flow rate is controlled at 10-1000 μL / min.

[0061] Light is projected onto the chip surface through the transparent cover plate, and the reflected light signal is analyzed by algorithm to determine the concentration of the sample to be tested and the dynamics of intermolecular interaction.

[0062] The above merely describes the embodiments of the present application, and does not limit the patent scope of the present application, and any equivalent transformation or direct or indirect application in the related technical field based on the content of the present application specification and drawings is also included in the patent protection scope of the present application.

Claims

1. A coupling package structure of an optical detection chip, characterized in that: The application relates to a chip mounting device, which comprises, from bottom to top, a lower cover plate (10), an intermediate layer (20) and an upper cover plate (30); the lower cover plate (10) and the upper cover plate (30) are provided with a plurality of oppositely arranged fixing holes (11); the fixing holes (11) are provided with screws for fixing the upper cover plate (30) and the lower cover plate (10); the side of the intermediate layer (20) away from the lower cover plate (10) is provided with a flow guide channel (22); the side of the intermediate layer (20) close to the lower cover plate (10) is provided with a chip mounting groove (23); the chip mounting groove (23) has an opening towards the lower cover plate (10); the chip mounting groove (23) is communicated with the flow guide channel (22); the upper cover plate (30) is provided with a liquid inlet (31) and a liquid outlet (32) communicated with the flow guide channel (22); the position of the flow guide channel (22) relative to the chip mounting groove (23) has the maximum size in the first direction; the flow guide direction of the flow guide channel (22) is parallel to the second direction; and the second direction is perpendicular to the first direction.

2. The coupling package structure of an optical detection chip according to claim 1, wherein: The intermediate layer (20) is provided with through holes (21) oppositely arranged with the fixing holes (11).

3. The coupling package structure of an optical detection chip according to claim 1, wherein: The liquid inlet (31) and the liquid outlet (32) are both pre-buried with metal pipes for liquid flow.

4. The coupling package structure of an optical detection chip according to claim 1, wherein: The upper cover plate (30) and the lower cover plate (10) are both transparent acrylic plates.

5. The coupling package structure of an optical detection chip according to claim 1, wherein: The intermediate layer (20) is an elastic layer.

6. The coupling package structure of an optical detection chip according to claim 5, wherein: The elastic layer is a PDMS layer, a silica gel layer or a Teflon layer.

7. The coupling package structure of an optical detection chip according to claim 1, wherein: The size of the chip mounting groove (23) in the first direction is always greater than the size of the flow guide channel (22) in the first direction.

8. The coupling package structure of an optical detection chip according to claim 1, wherein: The upper top surface of the chip mounting groove (23) is flush with the lower bottom surface of the flow guide channel (22).

9. The coupling package structure of an optical detection chip according to claim 1, wherein: The side wall of the chip mounting groove (23) is provided with a pressing edge strip (24) towards the inside of the chip mounting groove (23).

10. The coupling package structure of an optical detection chip according to claim 9, wherein: The extension length of the pressing edge strip (24) is 0.5-3 mm.

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