Wafer surface changing mechanism

Abstract

The utility model relates to the technical field of semiconductors, in particular to a wafer surface changing mechanism which comprises a first support, a second support, a first rotating unit used for driving the first support to rotate and a second rotating unit used for driving the second support to rotate, the first support is symmetrically provided with a plurality of first accommodating grooves used for placing first wafers, and the second support is symmetrically provided with a plurality of second accommodating grooves used for placing second wafers. The second support is symmetrically provided with a plurality of second accommodating grooves used for placing second wafers. When the surface of the first wafer on the first support needs to be changed, one side of the first wafer corresponds to one side of the second wafer, and the first rotating unit drives the first support to rotate, so that the other side of the first wafer corresponds to one side of the second wafer; the wafer cleaning device can effectively prevent the crystal faces of the wafers from being polluted, can clean the wafers in batches, and ensures the quality of wafer products.

Description

TECHNICAL FIELD

[0001] The utility model relates to a semiconductor technical field especially is a wafer surface changing mechanism. BACKGROUND

[0002] In the manufacturing process of the wafer, cleaning is a crucial step, which is the key to ensure the quality of wafer products. When the wafers are transported between various stations, in order to prevent the crystal surfaces of adjacent wafers from scratching each other, the wafers are generally arranged in one direction, that is, the crystal back of the previous wafer is adjacent to the crystal surface of the next wafer for forming a device structure. Because the crystal back is relatively smooth, it will not scratch the crystal surface of the next wafer during transportation.

[0003] In the slot cleaning process of the wafers arranged in this way, a cleaning device is usually used to clean a maximum of 25 wafers in batches. Since it is not convenient to change the surface of the wafers in batches, only single wafer cleaning can be performed, which affects the wafer cleaning efficiency and thus the quality of wafer products. SUMMARY

[0004] The utility model provides a wafer surface changing mechanism to effectively prevent the crystal surface of the wafer from being contaminated, realize batch cleaning of the wafer, and ensure the quality of wafer products.

[0005] To solve the above technical problems, the utility model adopts the following technical scheme:

[0006] The utility model provides a wafer surface changing mechanism, which comprises a first support, a second support, a first rotating unit for driving the first support to rotate, and a second rotating unit for driving the second support to rotate. The first support is symmetrically provided with a plurality of first accommodating grooves for placing first wafers. The second support is symmetrically provided with a plurality of second accommodating grooves for placing second wafers.

[0007] When it is necessary to change the surface of the first wafer on the first support, one side of the first wafer corresponds to one side of the second wafer. The first rotating unit drives the first support to rotate, so that the other side of the first wafer corresponds to one side of the second wafer.

[0008] The utility model further comprises a surface changing driving assembly, which is drivingly connected with the first rotating unit and / or the second rotating unit. The surface changing driving assembly is used to move the first support and the second support closer to or farther away from each other.

[0009] When the first wafer on the first support needs to be flipped and approached to the second support, the first accommodating groove and the second accommodating groove are filled with the first wafer and the second wafer respectively, one side of the first wafer corresponds to one side of the second wafer, the first rotating unit drives the first support to rotate, so that the other side of the first wafer corresponds to one side of the second wafer, the flipping driving assembly drives the first rotating unit and / or the second rotating unit to move, so that the first support and the second support are approached.

[0010] The two end faces of the first support are provided with at least two first butt joints, the two end faces of the second support are provided with at least two first butt columns, the first butt joints are matched with the first butt columns, and when the flipping driving assembly drives the first support and the second support to approach, the first butt joints are matched and inserted into the first butt columns.

[0011] The two end faces of the first support are provided with a second butt joint and a third butt column, the two end faces of the second support are provided with a third butt joint and a second butt column, the second butt joint and the second butt column are matched, the third butt joint and the third butt column are matched, and when the flipping driving assembly drives the first support and the second support to approach, the second butt joint is matched and inserted into the second butt column and the third butt joint is matched and inserted into the third butt column.

[0012] The second butt joint and the third butt column at the two end faces of the first support are centrally symmetric about the rotation center of the first support, and the third butt joint and the second butt column at the two end faces of the second support are centrally symmetric about the rotation center of the second support.

[0013] The flipping driving assembly adopts a reverse synchronous double-sliding seat module, and two output ends of the flipping driving assembly are respectively drivingly connected with the first rotating unit and the second rotating unit.

[0014] When the first wafer on the first support needs to be flipped and approached to the second support, the first accommodating groove and the second accommodating groove are filled with the first wafer and the second wafer respectively, one side of the first wafer corresponds to one side of the second wafer, the first rotating unit drives the first support to rotate, so that the other side of the first wafer corresponds to one side of the second wafer, the flipping driving assembly drives the first support and the second support to move, so that the first support and the second support are approached.

[0015] The flipping driving assembly is drivingly connected with the first rotating unit or the second rotating unit, and the flipping driving assembly drives the first rotating unit or the second rotating unit to move, so that the first support and the second support are approached or moved away from each other.

[0016] When the first wafer on the first support needs to be flipped and approached to the second support, the first accommodating grooves and the second accommodating grooves are filled with the first wafers and the second wafers respectively, one side of the first wafers corresponds to one side of the second wafers, the first rotating unit drives the first support to rotate, so that the other side of the first wafers corresponds to one side of the second wafers, the flip driving assembly drives the first rotating unit or the second rotating unit to move, so that the first support and the second support are approached.

[0017] The first accommodating grooves are arc-shaped structures, and the centers of every two first accommodating grooves corresponding to the same first wafer coincide.

[0018] The second accommodating grooves are arc-shaped structures, and the centers of every two second accommodating grooves corresponding to the same second wafer coincide.

[0019] The distance between adjacent two first accommodating grooves is L1, the distance between adjacent two second accommodating grooves is L2, the minimum distance between the first accommodating grooves and the second accommodating grooves is L3 when the first support and the second support are approached, and L1, L2 and L3 satisfy L1=L2=L3.

[0020] The beneficial effects of the utility model are as follows:

[0021] The first wafers and the second wafers can be flipped smoothly, which is beneficial to the working condition of cleaning the second wafers or the second wafers alone, facilitates to meet the demand of batch cleaning wafers, prevents the wafer surface from being polluted, and guarantees the quality of wafer products. DRAWINGS

[0022] Figure 1 It is a structure front view of the wafer flipping mechanism in embodiment one.

[0023] Figure 2 It is a perspective view of the first support and the second support in embodiment one.

[0024] Figure 3 It is a perspective view of the first support in embodiment one.

[0025] Figure 4 It is a perspective view of the second support in embodiment one.

[0026] Figure 5 It is a structure schematic view when the first support and the second support are approached in embodiment one.

[0027] Figure 6 It is a perspective view of the first support and the second support in embodiment two.

[0028] Figure 7 It is a structure schematic view of the flip driving assembly, the first support and the second support in embodiment three.

[0029] Figure 8 Structure diagram of the embodiment four with the surface changing driving assembly, the first support and the second support.

[0030] 01, first wafer; 02, second wafer;

[0031] 1, first support; 101, first accommodating groove;

[0032] 11, first butt joint groove; 12, second butt joint groove; 13, third butt joint column;

[0033] 2, second support; 201, second accommodating groove;

[0034] 21, first butt joint column; 22, second butt joint column; 23, third butt joint groove;

[0035] 3, first rotating unit; 4, second rotating unit;

[0036] 5, surface changing driving assembly. DETAILED DESCRIPTION

[0037] For the convenience of the understanding of the person skilled in the art, the present application will be further described below in combination with the embodiments and the drawings. The specific embodiments of the present application will be described below. It should be noted that, in the specific description of these embodiments, the present specification cannot describe all the features of the actual embodiments in detail for the purpose of concise and brief description.

[0038] Embodiment one

[0039] Reference Figures 1 to 5 As shown in the figure, the utility model provides a wafer surface changing mechanism, including first support 1, second support 2, be used for driving first support 1 rotation's first rotating unit 3 and be used for driving second support 2 rotation's second rotating unit 4, first support 1 is provided with a plurality of first accommodating groove 101 for placing first wafer 01 symmetrically, second support 2 is provided with a plurality of second accommodating groove 201 for placing second wafer 02 symmetrically.

[0040] Reference Figure 1As shown, in actual application, when the first wafer 01 and the second wafer 02 are accurately placed on the first support 1 and the second support 2 respectively, the crystal surface of the first wafer 01 corresponds to the crystal surface of the second wafer 02. When the second wafer 02 is cleaned by using the cleaning agent, the first rotating unit 3 drives the first support 1 to rotate, so that the back of the first wafer 01 corresponds to the crystal surface of the second wafer 02. When the second wafer 02 is cleaned, the chemical liquid as the cleaning agent is prevented from flowing from the back of the second wafer 02 to the crystal surface of the first wafer 01, which effectively prevents the crystal surface of the first wafer 01 from being contaminated, and can realize batch cleaning of the second wafer 02, thereby ensuring the quality of the wafer product. Similarly, when the first wafer 01 needs to be cleaned, the second wafer 02 is changed to the other side, so that the back of the second wafer 02 corresponds to the crystal surface of the first wafer 01, which prevents the crystal surface of the second wafer 02 from being contaminated, and can realize batch cleaning of the first wafer 01, thereby ensuring the quality of the wafer product. In actual cleaning, the number of the first wafer 01 and the second wafer 02 is at most 25, which is convenient for meeting the demand of batch cleaning of the wafer. Since the first wafer 01 and the second wafer 02 can be changed to the other side smoothly, it is suitable for the working condition of cleaning the second wafer 02 or the second wafer 02 alone. Specifically, the first rotating unit 3 and the second rotating unit 4 are servo motors, direct current motors, alternating current asynchronous motors or alternating current synchronous motors, which are convenient for smoothly driving the first support 1 and the second support 2 to rotate, thereby meeting the demand of changing the first wafer 01 and the second wafer 02 to the other side.

[0041] Reference Figure 1 As shown, in the embodiment, the face-changing driving assembly 5 is drivingly connected with the first rotating unit 3 and / or the second rotating unit 4, and is used for moving the first support 1 and the second support 2 closer to or farther away from each other. In actual application, when the first wafer 01 on the first support 1 needs to be changed to the other side and the second support 2 is close to the first support 1, the first accommodating groove 101 and the second accommodating groove 201 are respectively filled with the first wafer 01 and the second wafer 02, one side of the first wafer 01 corresponds to one side of the second wafer 02, the first rotating unit 3 drives the first support 1 to rotate, so that the other side of the first wafer 01 corresponds to one side of the second wafer 02, and the face-changing driving assembly 5 drives the first rotating unit 3 and the second rotating unit 4 to move, so that the first support 1 and the second support 2 are close to each other, thereby smoothly changing the first wafer 01 to the other side.

[0042] Reference Figure 2As shown, in the embodiment, both end faces of the first support 1 are provided with at least two first butt grooves 11, both end faces of the second support 2 are provided with at least two first butt columns 21, the first butt grooves 11 are matched with the first butt columns 21, when the first support 1 and the second support 2 are brought together by the surface-changing driving assembly 5, the first butt grooves 11 are matched and inserted into the first butt columns 21, so as to facilitate quick positioning of the first support 1 and the second support 2; specifically, when the first support 1 or the second support 2 is rotated by 180°, the first butt grooves 11 can also be smoothly matched and inserted into the first butt columns 21, accurate positioning is realized through the corresponding relationship between the first butt columns 21 and the first butt grooves 11, and quick positioning of the first support 1 and the second support 2 is satisfied.

[0043] Reference Figure 1 As shown, in the embodiment, the surface-changing driving assembly 5 adopts a reverse synchronous double-sliding seat module, and two output ends of the surface-changing driving assembly 5 are respectively drivingly connected with the first support 1 and the second support 2; in actual application, when it is needed to bring the first wafer 01 of the first support 1 into surface-changing contact with the second support 2, the first accommodating groove 101 and the second accommodating groove 201 are respectively filled with the first wafer 01 and the second wafer 02, one side of the first wafer 01 corresponds to one side of the second wafer 02, the first rotating unit 3 drives the first support 1 to rotate, so that the other side of the first wafer 01 corresponds to one side of the second wafer 02, the surface-changing driving assembly 5 drives the first support 1 and the second support 2 to move, so that the first support 1 and the second support 2 are brought together, the first wafer 01 is brought into surface-changing contact with the second wafer 02, and the use condition of needing to change the surface of the first wafer 01 is satisfied; similarly, when it is needed to change the surface of the second wafer 02, the second wafer 02 is changed in surface by the second rotating unit 4, so that the other side of the second wafer 02 corresponds to one side of the first wafer 01, the surface-changing driving assembly 5 drives the first rotating unit 3 and the second rotating unit 4 to move, so that the first support 1 and the second support 2 are brought together, the second wafer 02 is brought into surface-changing contact with the first wafer 01, and the use condition of needing to change the surface of the second wafer 02 is satisfied.

[0044] Reference Figure 3 As shown, in the embodiment, the first accommodating groove 101 is in an arc structure, and the centers of every two first accommodating grooves 101 adapted to the same first wafer 01 coincide, so as to facilitate improvement of the insertion stability of the first wafer 01.

[0045] Reference Figure 4 As shown, in the embodiment, the second accommodating groove 201 is in an arc structure, and the centers of every two second accommodating grooves 201 adapted to the same second wafer 02 coincide, so as to facilitate improvement of the insertion stability of the second wafer 02.

[0046] Reference Figure 5As shown, in the embodiment, the distance between two adjacent first accommodating grooves 101 is L1, the distance between two adjacent second accommodating grooves 201 is L2, and the minimum distance between the first accommodating groove 101 and the second accommodating groove 201 when the first support 1 and the second support 2 are close to each other is L3, L1, L2 and L3 satisfy L1=L2=L3; the first wafer 01 and the second wafer 02 are both called target wafers, so that when the first support 1 and the second support 2 are close to each other, the interval between every two adjacent target wafers can be ensured to be the same, which facilitates stable batch transfer of the target wafers, is beneficial to quick positioning and grabbing of the target wafers by the mechanical hand, and improves wafer transfer efficiency.

[0047] Embodiment two

[0048] The embodiment has the same structure and working principle as those of the embodiment one, and the difference lies in that:

[0049] Reference Figure 6 As shown, in the embodiment, the two end faces of the first support 1 are both provided with a second butt joint groove 12 and a third butt joint column 13, the two end faces of the second support 2 are both provided with a third butt joint groove 23 and a second butt joint column 22, the second butt joint groove 12 and the second butt joint column 22 are matched, the third butt joint groove 23 and the third butt joint column 13 are matched, and when the face changing driving assembly 5 drives the first support 1 and the second support 2 to close to each other, the second butt joint groove 12 is matched and inserted into the second butt joint column 22 and the third butt joint groove 23 is matched and inserted into the third butt joint column 13, thereby facilitating accurate positioning of the first support 1 and the second support 2.

[0050] The second butt joint groove 12 and the third butt joint column 13 at the two end faces of the first support 1 are centrally symmetrical about the rotation center of the first support 1, the third butt joint groove 23 and the second butt joint column 22 at the two end faces of the second support 2 are centrally symmetrical about the rotation center of the second support 2, when the first support 1 or the second support 2 is rotated by 180°, the second butt joint groove 12 is smoothly matched and inserted into the second butt joint column 22, and the third butt joint groove 23 is smoothly matched and inserted into the third butt joint column 13, thereby satisfying quick positioning of the first support 1 and the second support 2.

[0051] Embodiment three

[0052] The embodiment has the same structure and working principle as those of the embodiment one, and the difference lies in that:

[0053] Reference Figure 7 As shown, in the embodiment, the face changing driving assembly 5 is drivingly connected with the first rotation unit 3, the face changing driving assembly 5 drives the first rotation unit 3 to move, so that the first support 1 and the second support 2 are close to or away from each other.

[0054] In actual application, when the first wafer 01 on the first support 1 needs to be exchanged with the second support 2, the first accommodating groove 101 and the second accommodating groove 201 are respectively filled with the first wafer 01 and the second wafer 02, one side of the first wafer 01 corresponds to one side of the second wafer 02, the first rotating unit 3 drives the first support 1 to rotate, so that the other side of the first wafer 01 corresponds to one side of the second wafer 02, the exchange driving assembly 5 drives the first rotating unit 3 to move, so that the first support 1 and the second support 2 are close to each other, the exchange driving assembly 5 is drivingly connected with the first rotating unit 3 to smoothly realize the mutual approaching or moving away of the first support 1 and the second support 2, and the structural versatility is improved.

[0055] Embodiment four

[0056] The embodiment is different from the structure and working principle of the embodiment one in that:

[0057] Referring to Figure 8 In the embodiment, the exchange driving assembly 5 is drivingly connected with the second rotating unit 4, the exchange driving assembly 5 drives the second rotating unit 4 to move, so that the first support 1 and the second support 2 are close to or move away from each other.

[0058] In actual application, when the first wafer 01 on the first support 1 needs to be exchanged with the second support 2, the first accommodating groove 101 and the second accommodating groove 201 are respectively filled with the first wafer 01 and the second wafer 02, one side of the first wafer 01 corresponds to one side of the second wafer 02, the first rotating unit 3 drives the first support 1 to rotate, so that the other side of the first wafer 01 corresponds to one side of the second wafer 02; alternatively, when the second wafer 02 on the second support 2 needs to be exchanged with the first support 1, the first accommodating groove 101 and the second accommodating groove 201 are respectively filled with the first wafer 01 and the second wafer 02, one side of the first wafer 01 corresponds to one side of the second wafer 02, the second rotating unit 4 drives the second support 2 to rotate, so that the other side of the second wafer 02 corresponds to one side of the first wafer 01, the exchange driving assembly 5 drives the second rotating unit 4 to move, so that the first support 1 and the second support 2 are close to each other, the exchange driving assembly 5 is drivingly connected with the second rotating unit 4 to smoothly realize the mutual approaching or moving away of the first support 1 and the second support 2, and the structural versatility is improved.

[0059] The above is only the preferred embodiment of the present application, and does not limit the present application in any form. Although the present application is disclosed as above in the preferred embodiment, it is not intended to limit the present application. Any skilled person in the art can make some changes or modifications to the disclosed technical content without departing from the technical solution of the present application, and any equivalent embodiment with equivalent changes is equivalent to the above embodiment. Any simple modification, equivalent change and modification of the above embodiment according to the present application technical solution are within the scope of the present application technical solution.

Claims

1. A wafer switching mechanism, characterized in that, It includes a first support (1), a second support (2), a first rotating unit (3) for driving the first support (1) to rotate, and a second rotating unit (4) for driving the second support (2) to rotate. The first support (1) is symmetrically provided with a plurality of first receiving slots (101) for placing the first wafer (01), and the second support (2) is symmetrically provided with a plurality of second receiving slots (201) for placing the second wafer (02). When it is necessary to change the face of the first wafer (01) on the first support (1), one side of the first wafer (01) corresponds to one side of the second wafer (02), and the first rotating unit (3) drives the first support (1) to rotate so that the other side of the first wafer (01) corresponds to one side of the second wafer (02).

2. The wafer switching mechanism according to claim 1, characterized in that, It also includes a face-changing drive assembly (5), which is drivenly connected to the first rotating unit (3) and / or the second rotating unit (4), and the face-changing drive assembly (5) is used to make the first support (1) and the second support (2) move closer to or further away from each other; When it is necessary to move the first wafer (01) on the first support (1) closer to the second support (2), the first receiving groove (101) and the second receiving groove (201) are filled with the first wafer (01) and the second wafer (02) respectively. One side of the first wafer (01) corresponds to one side of the second wafer (02). The first rotating unit (3) drives the first support (1) to rotate so that the other side of the first wafer (01) corresponds to one side of the second wafer (02). The face-changing drive assembly (5) drives the first rotating unit (3) and / or the second rotating unit (4) to move so that the first support (1) and the second support (2) move closer together.

3. The wafer switching mechanism according to claim 2, characterized in that, The first support (1) has at least two first docking grooves (11) on both ends, and the second support (2) has at least two first docking posts (21) on both ends. The first docking grooves (11) cooperate with the first docking posts (21). When the face-changing drive assembly (5) drives the first support (1) and the second support (2) to move closer, the first docking grooves (11) cooperate to insert into the first docking posts (21).

4. The wafer switching mechanism according to claim 2, characterized in that, The first support (1) is provided with a second docking groove (12) and a third docking post (13) on both ends. The second support (2) is provided with a third docking groove (23) and a second docking post (22) on both ends. The second docking groove (12) and the second docking post (22) cooperate. The third docking groove (23) and the third docking post (13) cooperate. When the face-changing drive assembly (5) drives the first support (1) and the second support (2) to move closer, the second docking groove (12) cooperates to insert into the second docking post (22) and the third docking groove (23) cooperates to insert into the third docking post (13). The second docking groove (12) and the third docking post (13) at both ends of the first support (1) are centrally symmetrical about the rotation center of the first support (1), and the third docking groove (23) and the second docking post (22) at both ends of the second support (2) are centrally symmetrical about the rotation center of the second support (2).

5. The wafer switching mechanism according to claim 2, characterized in that, The face-changing drive assembly (5) adopts a reverse synchronous double slide block module, and the two output ends of the face-changing drive assembly (5) are respectively driven and connected to the first rotation unit (3) and the second rotation unit (4). When it is necessary to switch the first wafer (01) of the first support (1) to the second support (2), the first receiving groove (101) and the second receiving groove (201) are filled with the first wafer (01) and the second wafer (02) respectively. One side of the first wafer (01) corresponds to one side of the second wafer (02). The first rotating unit (3) drives the first support (1) to rotate so that the other side of the first wafer (01) corresponds to one side of the second wafer (02). The switching drive assembly (5) drives the first rotating unit (3) and the second rotating unit (4) to move so that the first support (1) and the second support (2) can move together.

6. The wafer switching mechanism according to claim 2, characterized in that, The face-changing drive assembly (5) is driven to connect with the first rotating unit (3) or the second rotating unit (4). The face-changing drive assembly (5) drives the first rotating unit (3) or the second rotating unit (4) to move, so that the first support (1) and the second support (2) move closer to or further away from each other. When it is necessary to move the first wafer (01) on the first support (1) closer to the second support (2), the first receiving groove (101) and the second receiving groove (201) are filled with the first wafer (01) and the second wafer (02) respectively. One side of the first wafer (01) corresponds to one side of the second wafer (02). The first rotating unit (3) drives the first support (1) to rotate so that the other side of the first wafer (01) corresponds to one side of the second wafer (02). The face-changing drive assembly (5) drives the first rotating unit (3) or the second rotating unit (4) to move so that the first support (1) and the second support (2) are brought closer together.

7. The wafer switching mechanism according to claim 1, characterized in that, The first receiving groove (101) has an arc-shaped structure, and the centers of the two first receiving grooves (101) that are adapted to the same first wafer (01) coincide.

8. The wafer switching mechanism according to claim 1, characterized in that, The second receiving groove (201) has an arc-shaped structure, and the centers of every two second receiving grooves (201) that are adapted to the same second wafer (02) coincide.

9. The wafer switching mechanism according to claim 2, characterized in that, The distance between two adjacent first receiving slots (101) is L1, and the distance between two adjacent second receiving slots (201) is L2; ​​when the first support (1) and the second support (2) are close together, the minimum distance between the first receiving slot (101) and the second receiving slot (201) is L3. L1, L2 and L3 satisfy L1 = L2 = L3.

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