Semiconductor grabbing mechanism

Abstract

The utility model belongs to the technical field of semiconductor equipment, and particularly relates to a semiconductor grabbing mechanism. According to the semiconductor grabbing mechanism provided by the utility model, the mounting bottom plate, the rotating shaft, the supporting plate, the wafer clamping assembly, the poke rod assembly and the pushing block assembly are arranged, so that the pushing plate on the movable sleeve moves back and forth after the motor is started, and the poke rod assembly on the inclined plane is lifted up; according to the technical scheme, the rotating shaft is arranged to drive the wafer clamping assembly on the rotating shaft to be opened and closed so as to grab the wafer bearing basket, the open inclined plane is arranged to be high in flexibility, and meanwhile, the inclined plane is arranged to be different slope section surfaces, so that the grabbing effects of the wafer clamping assembly are different, impact or compression on the wafer bearing basket during clamping is reduced, and the grabbing efficiency of the wafer bearing basket is improved. And the stability and reliability of the grabbing process are ensured.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the technical field of semiconductor equipment, especially relates to a semiconductor grabbing mechanism. BACKGROUND

[0002] Wafer refers to the silicon wafer used for making silicon semiconductor circuit, and the main processing mode of wafer is piece processing and batch processing, that is, processing one piece or multiple pieces of wafer at the same time. In the field of semiconductors, different production processes need to be adopted in the process of wafer, therefore, in the whole processing process of wafer, the wafer needs to be frequently transferred between different devices, and when the wafer is handed over between different devices, a movable mechanical mechanism is needed to grab the basket for carrying the wafer so as to facilitate the transfer of the wafer.

[0003] On the other hand, the existing mechanical grabbing mechanism mainly includes a mounting plate, a clamping assembly for grabbing a wafer carrying basket, a rotating rod mounted on the mounting plate and provided with the clamping assembly, a clamping clamp driven to rotate by the rotating rod so as to clamp the carrying basket, and a motor for driving the clamping clamp to rotate.

[0004] For example, the Chinese utility model patent with the patent announcement number CN222483349U and the announcement date of 2025.02.14 discloses a wafer carrying mechanism, which includes a top plate, a clamping control motor, a horizontal transmission screw rod, a moving nut, a clamping guide control block, an auxiliary guide assembly, a right-angle piece, an auxiliary mounting bearing seat, a rotating rod, a wafer clamping assembly and an auxiliary connecting assembly.

[0005] The wafer carrying mechanism in the utility model patent has the following general structure and principle: the lifting control power motor drives the transmission assembly to transmit power, and then drives the lifting screw rod to rotate, the lifting screw rod rotates, and the lifting nut drives the lifting plate frame to move up and down, and then the wafer is lifted, the clamping control motor drives the horizontal transmission screw rod to rotate, and then drives the moving nut to move, the moving nut drives the clamping guide control block to move, with the clamping guide control block moving forward and backward, under the cooperation of the installation guide groove and the joint bearing, the auxiliary connecting long rod clamp and the rotating rod are driven to rotate, and then the rotating rod drives the wafer clamping arm to clamp the wafer.

[0006] However, the wafer carrying mechanism at least has the following deficiencies in actual use, in other words, the technical problem to be solved by the utility model.

[0007] The clamping joint bearing moves in the installation guide groove, the swing speed of the clamping joint bearing does not change, and the clamping arm does not slow down when it approaches the wafer basket, which is easy to hit the wafer basket and cause the wafer to vibrate and be damaged.

[0008] Therefore, in view of the above, there is an urgent need for a new semiconductor grabbing mechanism that reduces the damage to the wafer basket. Utility Model Content

[0009] This utility model provides a semiconductor gripping mechanism, which, through the arrangement of a mounting base plate, a rotating shaft, a support plate, a wafer clamping assembly, a toggle lever assembly, and a push block assembly, enables the push plate on the moving sleeve to move back and forth after the motor starts, thereby raising the toggle lever assembly on the inclined surface, driving the wafer clamping assembly on the rotating shaft to open and close, thereby gripping the wafer carrier basket. The open inclined surface setting offers high flexibility, and by setting the inclined surface to different slope segments, the gripping effect of the wafer clamping assembly varies, thereby reducing the impact or pressure on the wafer carrier basket during clamping and ensuring the stability and reliability of the gripping process.

[0010] The technical solution adopted by this utility model to solve the above problems is: a semiconductor gripping mechanism, the structure of which includes a mounting base plate, two rotating shafts disposed above the mounting base plate, a support plate disposed on the mounting base plate and used to insert the rotating shafts, a wafer clamping assembly disposed on the rotating shafts, a toggle lever assembly disposed on the rotating shafts, and a push block assembly disposed on the mounting base plate and used to open and close the wafer clamping assembly by lifting the toggle lever assembly and driving the rotating shafts to rotate; the push block assembly includes a motor, a lead screw disposed at the output end of the motor, a movable sleeve disposed on the lead screw, two push plates disposed on both sides of the movable sleeve and used to lift the toggle lever assembly, and an inclined surface disposed on the push plate, the inclined surface having segments with different slopes.

[0011] A further preferred technical solution is that the inclined surface includes an acceleration tilting section disposed at the lowest end of the toggle lever assembly, and a deceleration section disposed adjacent to the acceleration tilting section and used to slow down the lifting speed of the toggle lever assembly.

[0012] A further preferred technical solution is that the inclined surface further includes an arc-shaped transition section disposed between the acceleration inclination section and the deceleration section.

[0013] A further preferred technical solution is that the slope of the acceleration tilt segment is greater than the slope of the deceleration segment.

[0014] A further preferred technical solution is that the actuating lever assembly includes a fixed block coupled to the rotating shaft, the fixed block rotating synchronously with the rotating shaft, and an actuating lever disposed on the fixed block and extending toward the inclined surface.

[0015] A further preferred technical solution is that the actuating lever assembly further includes a ball bearing disposed on the actuating lever and in contact with the inclined surface.

[0016] Further preferably, the technical scheme is characterized in that the rotating shaft is provided with a pressing rod away from the wafer clamping assembly, and the mounting base is provided with a support partition plate for avoiding over-closing of the wafer clamping assembly by limiting the pressing rod.

[0017] Further preferably, the technical scheme is characterized in that the rotating shaft is provided with a pressing rod away from the wafer clamping assembly, and the mounting base is provided with a support partition plate for avoiding over-closing of the wafer clamping assembly by limiting the pressing rod.

[0018] Further preferably, the technical scheme is characterized in that the rotating shaft is provided with a pressing rod away from the wafer clamping assembly, and the mounting base is provided with a support partition plate for avoiding over-closing of the wafer clamping assembly by limiting the pressing rod.

[0019] Further preferably, the technical scheme is characterized in that the rotating shaft is provided with a pressing rod away from the wafer clamping assembly, and the mounting base is provided with a support partition plate for avoiding over-closing of the wafer clamping assembly by limiting the pressing rod.

[0020] The utility model discloses the beneficial effect that: open tilt surface sets flexibility is strong, can set the different slope section surface according to the demand, can adapt to different size wafer carrier basket, realizes different clamping effect simultaneously, and the process of grabbing is more stable and reliable, and the impact or oppression of wafer carrier basket when clamping is reduced. BRIEF DESCRIPTION OF DRAWINGS

[0021] Figure 1 It is the perspective drawing of the utility model.

[0022] Figure 2 It is the position perspective drawing of the utility model push block assembly.

[0023] Figure 3 It is the side view position drawing of the utility model push block assembly.

[0024] Figure 4 It is the partial top view of the utility model in initial state.

[0025] Figure 5 It is the partial top view of the utility model in clamping state.

[0026] Figure 6 It is the front view schematic drawing of the utility model in initial state.

[0027] Figure 7 It is the front view schematic drawing of the utility model in clamping state.

[0028] In the drawing, the meaning of each mark is as follows:

[0029] Wafer carrier basket a;

[0030] The mounting base plate 1, the rotating shaft 2, the supporting plate 3, the wafer clamping assembly 4, the poking lever assembly 5, the pushing block assembly 6, the pressing rod 7, the supporting partition plate 8, the sleeve 9, the reset spring 10, the clamping sensor 11, the guide rail 12, and the sliding block 13.

[0031] The hook 41, the clamping jaw sleeve lever 42, the pipe joint 43, the fixing block 51, the poking lever 52, the ball 53, the motor 61, the screw rod 62, the moving sleeve 63, the pushing plate 64, the inclined surface 65, the accelerating inclined section 651, the decelerating section 652, and the arc-shaped transition section 653. DETAILED DESCRIPTION

[0032] The following description is merely exemplary of the present application and is not intended to limit the application's scope.

[0033] As shown in the accompanying drawings, Figures 1-7 A semiconductor grabbing mechanism, which comprises a mounting base plate 1, two rotating shafts 2 arranged above the mounting base plate 1, a supporting plate 3 arranged on the mounting base plate 1 and used for inserting the rotating shafts 2, a wafer clamping assembly 4 arranged on the rotating shafts 2, a poking lever assembly 5 arranged on the rotating shafts 2, and a pushing block assembly 6 arranged on the mounting base plate 1 and used for lifting the poking lever assembly 5 to drive the rotating shafts 2 to rotate so as to open and close the wafer clamping assembly 4. The pushing block assembly 6 comprises a motor 61, a screw rod 62 arranged at the output end of the motor 61, a moving sleeve 63 arranged on the screw rod 62, two pushing plates 64 arranged on both sides of the moving sleeve 63 and used for lifting the poking lever assembly 5, and an inclined surface 65 arranged on the pushing plates 64, wherein the inclined surface 65 has section surfaces with different slopes.

[0034] In the embodiment, the semiconductor grabbing mechanism is arranged at the upper end of a horizontal moving mechanism and a vertical lifting mechanism, so that the semiconductor grabbing mechanism can be moved to the upper side of the wafer carrying basket a to clamp and grab the wafer carrying basket a. Two rotating shafts 2 are arranged above the mounting base plate 1 and extend outward, and the extending ends are used for arranging the wafer clamping assembly 4 to clamp the wafer carrying basket a at the lower end of the wafer clamping assembly 4. The rotating shafts 2 are inserted into the supporting plate 3, and the supporting plate 3 can be arranged in multiple to improve the supporting effect of the rotating shafts 2.

[0035] Further, the toggle lever assembly 5 is arranged above the mounting base plate 1, and one end is arranged on the rotating shaft 2, and the other end extends to the push block assembly 6 and is in contact with the inclined surface 65. The toggle lever assembly 5 can be fixedly arranged on the rotating shaft 2, or can be connected with the rotating shaft 2 in a detachable manner. The toggle lever assembly 5 rotates synchronously with the rotating shaft 2. When the toggle lever assembly 5 is lifted or pressed, the rotating shaft 2 also rotates.

[0036] In the initial state, the toggle lever assembly 5 is arranged at the lower position of the inclined surface 65. The motor 61 is started, the moving sleeve 63 moves forward and backward on the lead screw 62, so that the push plate 64 gradually lifts the toggle lever assembly 5, the toggle lever assembly 5 is lifted upward to drive the rotating shaft 2 to rotate, and the two wafer clamping assemblies 4 arranged on the rotating shaft 2 are close to each other, thereby achieving the clamping effect.

[0037] In addition, in order to improve the movement stability of the push plate 64 and the supporting force of the toggle lever assembly 5, the guide rail 12 and the sliding block 13 can be arranged at the lower end of the push plate 64, so that the push plate 64 slides on the guide rail 12, and the pushing effect is better.

[0038] Finally, since the inclined surface 65 has segments with different slopes, when the rotating frequency of the motor 61 is consistent, the lifting speed of the toggle lever assembly 5 is different when passing through segments with different slopes, which causes the clamping speed of the wafer clamping assembly 4 to be different when the wafer clamping assembly 4 is close to each other. By setting the slopes of the segments of the inclined surface 65, different clamping effects can be achieved.

[0039] The inclined surface 65 includes an acceleration inclined segment 651 arranged at the lowest end position of the toggle lever assembly 5, and a deceleration segment 652 arranged adjacent to the acceleration inclined segment 651 and used for slowing down the lifting speed of the toggle lever assembly 5.

[0040] In the initial state, the inclined surface 65 is divided into the acceleration inclined segment 651 and the deceleration segment 652. The slope of the acceleration inclined segment 651 is greater than the slope of the deceleration segment 652, so that the lifting speed of the acceleration inclined segment 651 is faster than the lifting speed of the deceleration segment 652. The clamping state of the wafer clamping assembly 4 is fast first and then slow, so that when the wafer clamping assembly 4 is close to the wafer carrier basket a, the clamping speed is slowed down to reduce the impact loss of the wafer clamping assembly 4 on the wafer carrier basket a. The segment length and slope of the acceleration inclined segment 651 and the deceleration segment 652 can be adjusted and set according to requirements.

[0041] The inclined surface 65 further comprises an arc-shaped transition section 653 arranged between the accelerating inclined section 651 and the decelerating section 652.

[0042] In the embodiment, the accelerating inclined section 651 and the decelerating section 652 have different slopes, resulting in a relatively obvious turning at the junction. When the toggle lever assembly 5 passes the turning, the friction force of the toggle lever assembly 5 is relatively large, causing the wafer clamping assembly 4 to shake obviously when clamping. In order to keep the wafer clamping assembly 4 smooth, the arc-shaped transition section 653 is arranged in the area, forming a relatively smooth connection.

[0043] The slope of the accelerating inclined section 651 is greater than the slope of the decelerating section 652.

[0044] In the embodiment, the slope of the accelerating inclined section 651 is greater than the slope of the decelerating section 652, so that the wafer clamping assembly 4 achieves a clamping effect of fast first and slow later. For example, when the wafer clamping assembly 4 needs to clamp an 8-inch wafer, the inclination angle of the inclined surface 65 is preferably 0°-12°, the inclination angle of the accelerating inclined section 651 is 8°-12°, and the inclination angle of the decelerating section 652 is 0°-8°. When the wafer clamping assembly 4 needs to clamp a 12-inch wafer, the inclination angle of the inclined surface 65 is preferably 0°-20°, the inclination angle of the accelerating inclined section 651 is 15°-20°, and the inclination angle of the decelerating section 652 is 0°-18°. When the inclination angle of the decelerating section 652 gradually approaches 0°, the wafer clamping assembly 4 is in a clamping state and does not appear to be unstable, and the clamping effect of the wafer clamping assembly 4 is best.

[0045] The toggle lever assembly 5 comprises a fixed block 51 coupled to the rotating shaft 2, and the fixed block 51 rotates synchronously with the rotating shaft 2. The toggle lever assembly 5 further comprises a toggle lever 52 arranged on the fixed block 51 and extending towards the inclined surface 65.

[0046] In the embodiment, the fixed block 51 is arranged on the rotating shaft 2, and the push plate 64 moves forward and backward to drive the toggle lever 52 on the inclined surface 65 to swing up and down, thereby driving the rotating shaft 2 to rotate to achieve the opening and closing of the wafer clamping assembly 4.

[0047] The toggle lever assembly 5 further comprises a ball 53 arranged on the toggle lever 52 and in contact with the inclined surface 65.

[0048] In the embodiment, the ball 53 is arranged on the knob 52 and close to the inclined surface 65. The ball 53 can rotate relative to the knob 52. When the inclined surface 65 lifts the ball 53, the ball 53 can rotate, thereby reducing the resistance when the pushing plate 64 moves, reducing the difficulty of lifting the knob 52, and reducing the friction loss in the pushing process.

[0049] The supporting partition 8 is arranged on the mounting base plate 1 and limits the pressing rod 7 to avoid the wafer clamping assembly 4 from being closed excessively.

[0050] In the embodiment, the pressing rod 7 is arranged on the rotating shaft 2 and extends close to the supporting partition 8. In the initial state, the pressing rod 7 is away from the supporting partition 8. When the wafer clamping assembly 4 clamps the wafer carrier basket a, the pressing rod 7 approaches and contacts the supporting partition 8, thereby avoiding the wafer clamping assembly 4 from being closed excessively and pressing the wafer carrier basket a, and achieving a certain protection effect.

[0051] The sleeve 9 is arranged on the supporting partition 8, and the reset spring 10 is arranged in the sleeve 9 and supports the pressing rod 7.

[0052] In the embodiment, the reset spring 10 is arranged in the sleeve 9. When the wafer clamping assembly 4 clamps the wafer carrier basket a, the pressing rod 7 presses the reset spring 10 in the sleeve 9. When the wafer clamping assembly 4 needs to be opened, the knob assembly 5 needs to be returned to the lower end of the inclined surface 65. The rebound force of the reset spring 10 can increase the reset speed of the knob assembly 5.

[0053] The wafer clamping assembly 4 includes a hook 41 coupled to the rotating shaft 2, a jaw sleeve rod 42 arranged at the lower end of the hook 41 and used for suspending the wafer carrier basket a, and a pipe joint 43 arranged on the hook 41 and used for connecting the jaw sleeve rod 42.

[0054] In the embodiment, the hook 41 is arranged on the rotating shaft 2. The jaw sleeve rod 42 is used for clamping and taking the wafer carrier basket a. The jaw sleeve rod 42 is connected and fixed with the hook 41 through the pipe joint 43. The jaw sleeve rod 42 can be replaced according to the size of the wafer carrier basket a. The outer layer of the jaw sleeve rod 42 is provided with a PFA hose, which prevents the jaw sleeve rod 42 from being directly contacted with liquid and increases the gripping friction of the jaw sleeve rod 42.

[0055] The hook 41 is provided with a clamping inductor 11.

[0056] In the embodiment, the hook 41 is provided with the clamping sensor 11, which is a commercially available sensor, such as a gravity sensor or an infrared sensor, and is used to detect whether the clamping jaw sleeve rod 42 is successfully clamped, and is linked with the motor to improve the working efficiency.

[0057] The embodiments of the utility model are described in detail above in combination with the drawings, but the utility model is not limited to the above-mentioned embodiments, and various modifications can be made within the knowledge range possessed by the ordinary skilled in the art without departing from the purpose of the utility model. These are all non-creative modifications, and are protected by the patent law as long as they are within the scope of the claims of the utility model.

Claims

1. A semiconductor gripping mechanism, characterized in that: The structure includes a mounting base plate (1), two rotating shafts (2) disposed above the mounting base plate (1), a support plate (3) disposed on the mounting base plate (1) and used to insert the rotating shafts (2), a wafer clamping assembly (4) disposed on the rotating shafts (2), a toggle rod assembly (5) disposed on the rotating shafts (2), and a push block assembly (6) disposed on the mounting base plate (1) and used to open and close the wafer clamping assembly (4) by lifting the toggle rod assembly (5) and driving the rotating shafts (2); the push block assembly (6) includes a motor (61), a lead screw (62) disposed at the output end of the motor (61), a movable sleeve (63) disposed on the lead screw (62), two push plates (64) disposed on both sides of the movable sleeve (63) and used to lift the toggle rod assembly (5), and an inclined surface (65) disposed on the push plate (64), the inclined surface (65) having segments with different slopes.

2. The semiconductor gripping mechanism according to claim 1, characterized in that: The inclined surface (65) includes an acceleration tilt section (651) disposed at the lowest end of the toggle lever assembly (5), and a deceleration section (652) disposed adjacent to the acceleration tilt section (651) and used to slow down the lifting speed of the toggle lever assembly (5).

3. A semiconductor gripping mechanism according to claim 2, characterized in that: The inclined surface (65) also includes an arc-shaped transition section (653) disposed between the acceleration inclined section (651) and the deceleration section (652).

4. A semiconductor gripping mechanism according to claim 2, characterized in that: The slope of the acceleration tilt segment (651) is greater than the slope of the deceleration segment (652).

5. A semiconductor gripping mechanism according to claim 1, characterized in that: The toggle lever assembly (5) includes a fixed block (51) coupled to the rotating shaft (2), the fixed block (51) rotating synchronously with the rotating shaft (2), and a toggle lever (52) disposed on the fixed block (51) and extending toward the inclined surface (65).

6. A semiconductor gripping mechanism according to claim 5, characterized in that: The toggle lever assembly (5) further includes a ball (53) disposed on the toggle lever (52) and in contact with the inclined surface (65).

7. A semiconductor gripping mechanism according to claim 1, characterized in that: It also includes a pressure bar (7) disposed on the rotating shaft (2) and away from the end of the wafer clamping assembly (4), and a support partition (8) disposed on the mounting base plate (1) and used to prevent the wafer clamping assembly (4) from being over-closed by limiting the pressure bar (7).

8. A semiconductor gripping mechanism according to claim 7, characterized in that: It also includes a sleeve (9) disposed on the support partition (8) and a return spring (10) disposed in the sleeve (9) and used to support the pressure rod (7).

9. A semiconductor gripping mechanism according to claim 1, characterized in that: The wafer clamping assembly (4) includes a hook (41) coupled to the rotating shaft (2), a gripper sleeve (42) disposed at the lower end of the hook (41) and used to suspend the wafer carrier basket (a), and a pipe joint (43) disposed on the hook (41) and used to connect the gripper sleeve (42).

10. A semiconductor gripping mechanism according to claim 9, characterized in that: The hook (41) is equipped with a clamping sensor (11).

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