Pressure sensor

Abstract

The utility model discloses a pressure sensor comprising a housing, the housing is provided with a pressure pipeline connected with a to-be-tested device, the housing is internally provided with a pressure measuring chamber, and the pressure measuring chamber is connected with the to-be-tested device through the pressure pipeline; the pressure measuring mechanism comprises a ceramic plate arranged in the pressure measuring chamber and a chip for obtaining deformation data of the ceramic plate, the ceramic plate covers one end, located in the shell, of the pressure pipeline, the chip is arranged on one side, away from the pressure pipeline, of the ceramic plate, and a pressure sensor is arranged in the pressure measuring chamber; and an overload protection element for protecting the ceramic plate is arranged between the ceramic plate and the shell. According to the pressure sensor, the overload protection element is arranged between the ceramic plate and the shell, when the pressure of the to-be-tested equipment suddenly exceeds a design threshold value, the overload protection element can preferentially absorb and disperse pressure impact energy, and the ceramic plate is prevented from being broken or permanently deformed due to direct bearing of overload pressure.

Description

TECHNICAL FIELD

[0001] The utility model relates to sensor technical field, concretely relates to a pressure sensor. BACKGROUND

[0002] The pressure sensor is a kind of device that converts pressure signal into measurable electric signal output, is widely used in industrial automation, automobile electronics, medical equipment, aerospace etc.

[0003] In practical application, ceramic pressure sensor often faces the risk of overload or impact. Due to the brittle nature of ceramic material, when ceramic diaphragm is subjected to pressure exceeding its bearing capacity, it is easy to break or damage, leading to sensor failure. This not only increases the maintenance cost of equipment, but also may affect the normal operation of the whole system. SUMMARY

[0004] In order to solve the technical problems existing in the prior art, the application provides a pressure sensor.

[0005] In order to achieve the above purpose, the technical scheme adopted by the application is as follows: a pressure sensor, comprising: a shell, the shell has a pressure pipeline connected with a to-be-measured device, the shell has a pressure measuring chamber inside, the pressure measuring chamber is connected with the to-be-measured device through the pressure pipeline; a pressure measuring mechanism, the pressure measuring mechanism includes a ceramic plate arranged in the pressure measuring chamber and a chip for acquiring deformation data of the ceramic plate, the ceramic plate is covered on one end of the pressure pipeline located in the shell, the chip is arranged on the side of the ceramic plate away from the pressure pipeline, a push plate is arranged in the pressure measuring chamber; an overload protection element is arranged between the ceramic plate and the shell for protecting the ceramic plate.

[0006] In some embodiments of the utility model, the above-mentioned overload protection element includes a plurality of mutually parallel springs, and the two ends of any spring are connected with the shell and the ceramic plate respectively.

[0007] In some embodiments of the utility model, a push plate is arranged in the above-mentioned pressure measuring chamber, and one end of the spring away from the ceramic plate is connected with the push plate.

[0008] In some embodiments of the utility model, a maintenance opening is formed on the side of the above-mentioned pressure measuring chamber away from the pressure pipeline, and a maintenance cover plate is covered on the maintenance opening.

[0009] In some embodiments of the utility model, a circuit board is arranged in the above-mentioned shell, a display panel is arranged outside the shell, and the display panel is electrically connected with the circuit board.

[0010] In some embodiments of the utility model, a plurality of indicator lights are arranged on the above-mentioned shell, and any indicator light is electrically connected with the circuit board.

[0011] In some embodiments of the utility model, the ceramic plate and the shell are provided with sealing gaskets.

[0012] In some embodiments of the utility model, the outer side wall of the pressure pipeline is provided with external threads, and the pressure pipeline is sleeved with a tightening nut.

[0013] Advantages:

[0014] 1. By setting an overload protection element between the ceramic plate and the shell, when the pressure of the device to be measured suddenly exceeds the design threshold, the overload protection element can preferentially absorb and disperse the pressure impact energy, avoiding the ceramic plate from breaking or permanently deforming due to directly bearing the overload pressure. BRIEF DESCRIPTION OF DRAWINGS

[0015] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiment or prior art description. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0016] Figure 1 is a structural schematic view of the embodiment of the present application;

[0017] Figure 2 is a bottom view of the embodiment of the present application;

[0018] Figure 3 is Figure 2 the sectional view of A-A section.

[0019] In the figure: 1 - shell; 2 - pressure pipeline; 3 - pressure measuring chamber; 4 - ceramic plate; 5 - chip; 6 - spring; 7 - push plate; 8 - maintenance cover plate; 9 - display panel; 10 - circuit board; 11 - indicator light; 12 - sealing gasket; 13 - external thread; 14 - tightening nut. DETAILED DESCRIPTION

[0020] In order to make the purpose, technical scheme and advantages of the embodiments of the present application more clear, the technical scheme in the embodiments of the present application will be described clearly and completely below in combination with the drawings in the embodiments of the present application. Obviously, the described embodiments are some embodiments of the present application, not all embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.

[0021] Therefore, the following detailed description of the embodiments of the application provided in the accompanying drawings is not intended to limit the scope of the application claimed, but merely represents selected embodiments of the application. All other embodiments obtained by persons of ordinary skill in the art based on the embodiments of the application without creative effort fall within the scope of the application.

[0022] It should be noted that similar reference numbers and letters in the following drawings represent similar items, and therefore, once an item is defined in one drawing, it need not be further defined and explained in subsequent drawings.

[0023] In the description of the application, it should be noted that if the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship when the product of the application is usually placed, and are only for the convenience of describing the application and simplifying the description, and therefore cannot be understood as indicating or implying that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the application. In addition, if the terms "first", "second" and the like appear in the description of the application, they are only used to distinguish the description and cannot be understood as indicating or implying relative importance.

[0024] In addition, if the terms "horizontal", "vertical" and the like appear in the description of the application, they do not mean that the component must be absolutely horizontal or vertical, but can be slightly inclined. For example, "horizontal" only means that its direction is relatively more horizontal than "vertical", and does not mean that the structure must be completely horizontal, but can be slightly inclined.

[0025] In the description of the application, it should also be noted that unless otherwise explicitly specified and limited, if the terms "arrangement", "installation", "connection", "connection" appear, they should be understood in a broad sense, for example, they can be fixedly connected, or can be detachably connected, or integrally connected; can be mechanically connected, or can be electrically connected; can be directly connected, or can be indirectly connected through an intermediate medium; can be the communication inside two elements. For those of ordinary skill in the art, the specific meaning of the above terms in the application can be understood according to the specific circumstances.

[0026] Embodiments

[0027] Please refer to Figures 1-3The embodiment provides a pressure sensor, which comprises a shell 1, a pressure pipeline 2 connected with a device to be measured on the shell 1, a pressure measuring chamber 3 in the shell 1, and the pressure measuring chamber 3 is connected with the device to be measured through the pressure pipeline 2; a pressure measuring mechanism, which comprises a ceramic plate 4 arranged in the pressure measuring chamber 3 and a chip 5 for acquiring deformation data of the ceramic plate 4, the ceramic plate 4 is arranged on one end of the pressure pipeline 2 in the shell 1, and the chip 5 is arranged on the side of the ceramic plate 4 away from the pressure pipeline 2; an overload protection element arranged between the ceramic plate 4 and the shell 1 for protecting the ceramic plate 4.

[0028] In the embodiment, the shell 1 is the main structure of the sensor, provides the sealed pressure measuring chamber 3, and integrates the pressure pipeline 2. One end of the pressure pipeline 2 is connected with the device to be measured, and the other end extends into the pressure measuring chamber 3, so that the pressure of the medium to be measured can be conducted to the inside of the pressure measuring chamber 3 through the pipeline. The pressure pipeline 2 is designed in an integrated manner with the shell 1, reduces external connecting components, reduces the risk of leakage, reduces the volume of the sensor, and adapts to a compact installation space. The direct communication design ensures that the pressure signal is quickly and non-attenuatedly transmitted to the pressure measuring chamber 3, and the response speed of the sensor is improved.

[0029] In the embodiment, the pressure measuring chamber 3 is a closed space, and is communicated with the device to be measured through the pressure pipeline 2. When the pressure of the medium to be measured changes, the pressure in the chamber changes, and a pressure acting on the ceramic plate 4 is formed.

[0030] In the embodiment, the ceramic plate 4 directly bears the pressure in the pressure measuring chamber 3. Under the action of the pressure, the ceramic plate 4 is elastically deformed slightly, and the deformation amount of the ceramic plate 4 is proportional to the pressure. The chip 5 converts the deformation of the ceramic plate 4 into resistance change through a Wheatstone bridge, and then outputs an electric signal in a linear relationship with the pressure through signal amplification, filtering and other processes.

[0031] In the embodiment, the overload protection element is arranged between the ceramic plate 4 and the shell 1. When the pressure exceeds the design threshold, the overload protection element absorbs the excess pressure energy through elastic deformation, and slows down the deformation rate of the ceramic plate 4. At this time, the rigid structure of the overload protection element limits the maximum displacement of the ceramic plate 4, and prevents the ceramic plate 4 from being broken due to excessive bending.

[0032] It should be noted that the support stiffness of the overload protection element to the ceramic plate 4 in the normal pressure range is accurately calculated, so that the overload protection element does not interfere with the slight deformation of the ceramic plate 4 in the pressure measuring process, and the collection accuracy of the chip 5 to the deformation data is not affected.

[0033] Please refer to Figures 1-3 In some embodiments of the embodiment, the overload protection element comprises a plurality of springs 6 parallel to each other, and the two ends of any spring 6 are connected with the shell 1 and the ceramic plate 4 respectively.

[0034] In the present embodiment, when the medium pressure to be measured is conducted to the pressure measuring chamber 3 through the pressure pipeline 2, the ceramic plate 4 as a sensitive element bears the pressure and elastically deforms.

[0035] It should be noted that, in the normal pressure range, the spring group 6 is in the initial stage of elastic deformation, and the rigidity thereof is small enough to be negligible, so that the deformation resistance of the ceramic plate 4 can be ignored, and the ceramic plate 4 can freely respond to the pressure change, and the chip 5 normally collects the deformation data and converts the same into an electrical signal output.

[0036] When the pressure exceeds the preset threshold, the deformation amount of the ceramic plate 4 increases, and the spring group 6 is further compressed. The rigidity of the spring group 6 linearly increases with the compression amount, and an elastic restoring force opposite to the deformation direction is generated, which forms a dynamic balance with the excess pressure, thereby limiting the maximum deformation amount of the ceramic plate 4. The spring group 6 stores the excess pressure energy through the elastic potential energy, thereby avoiding the direct action of the pressure on the ceramic plate 4 to cause the rupture thereof.

[0037] When the overload pressure disappears, the spring group 6 releases the stored elastic potential energy, and pushes the ceramic plate 4 to return to the initial position, so that the sensor returns to the normal measurement state.

[0038] If the spring group 6 is plastically deformed due to extreme overload, the residual rigidity thereof can still serve as a mechanical limiting structure to prevent the ceramic plate 4 from being damaged again in subsequent working conditions.

[0039] Please refer to Figures 1-3 In some embodiments of the present embodiment, a push plate 7 is arranged in the above-mentioned pressure measuring chamber 3, and the end of the spring 6 away from the ceramic plate 4 is connected with the push plate 7.

[0040] In the present embodiment, the push plate 7 is used for erecting and mounting the spring 6, and facilitates the parallel action of the plurality of springs 6 on the ceramic plate 4.

[0041] Please refer to Figures 1-3 In some embodiments of the present embodiment, a maintenance opening (not labeled in the figure) is formed on the side of the above-mentioned pressure measuring chamber 3 away from the pressure pipeline 2, and a maintenance cover plate 8 is arranged on the maintenance opening.

[0042] In the present embodiment, when the ceramic plate 4, the chip 5 or the overload protection element is damaged due to aging or overload, the faulty components can be quickly replaced through the maintenance opening without the need to disassemble the sensor as a whole, thereby shortening the maintenance time. When the performance is reduced due to medium pollution, the maintenance opening provides a cleaning channel, and the residual substances can be manually cleaned or the integrity of the internal structure can be verified.

[0043] Please refer to Figure 1 In some embodiments of the present embodiment, a circuit board 10 is arranged in the above-mentioned housing 1, and a display panel 9 is arranged outside the housing 1, and the display panel 9 is electrically connected with the circuit board 10.

[0044] In the embodiment, the circuit board 10 is used for integrating signal conditioning circuit, amplifying, denoising and linearizing the weak electric signal output by the pressure measuring mechanism, and converting it into a standard electric signal. It contains modules for realizing pressure data calculation, calibration, storage and communication protocol conversion. It also provides power management function to convert external power into stable voltage required by modules such as chip 5 and display panel 9. The display panel 9 is used to display the data processed by the circuit board 10, which is convenient for users to query in real time.

[0045] Please refer to Figure 1 In some embodiments of the embodiment, a plurality of indicator lights 11 are arranged on the shell 1, and any indicator light 11 is electrically connected to the circuit board 10.

[0046] In the embodiment, the microcontroller on the circuit board 10 generates corresponding control signals according to the running state of the sensor, and then drives the indicator light 11 correspondingly. The flashing mode of the same indicator light 11 corresponds to a specific state, which will not be described here.

[0047] Please refer to Figure 3 In some embodiments of the embodiment, a sealing gasket 12 is arranged between the ceramic plate 4 and the shell 1, and the ceramic plate 4 abuts against the sealing gasket 12.

[0048] In the embodiment, the ceramic plate 4 is used as a pressure sensitive element, and its surface directly contacts the medium to be measured to convert pressure into an electric signal. The sealing gasket 12 is located between the ceramic plate 4 and the shell 1, forming a flexible buffer layer to isolate the medium from the internal circuit of the shell 1 and prevent leakage or corrosion of the medium.

[0049] In addition, the sealing gasket 12 is elastic, and the overload protection element deforms when overloaded but maintains sealing to avoid medium leakage.

[0050] Please refer to Figures 1-3 In some embodiments of the embodiment, an external thread 13 is formed on the outer side wall of the pressure pipeline 2, and a tightening nut 14 is arranged on the pressure pipeline 2.

[0051] In the embodiment, the external thread 13 is formed on the outer side wall of the pressure pipeline 2, and the tightening nut 14 is rotated to move axially along the thread, achieving fastening connection with the installation interface. The tolerance fit between the internal thread of the tightening nut 14 and the external thread 13 of the pipeline ensures that the connection is not loose, and at the same time provides initial sealing pre-tightening force.

[0052] The above descriptions are only the preferred embodiments of the present application, and are not intended to limit the present application. The present application can have various modifications and changes for those skilled in the art. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A pressure sensor, characterized by, The utility model relates to a pressure test device, including: A shell (1) has a pressure pipeline (2) connected with a device to be tested on the shell (1), and a pressure chamber (3) is arranged in the shell (1), and the pressure chamber (3) is connected with the device to be tested through the pressure pipeline (2); A pressure measuring mechanism is arranged in the pressure chamber (3) and includes a ceramic plate (4) and a chip (5) for obtaining deformation data of the ceramic plate (4), the ceramic plate (4) is arranged at one end of the pressure pipeline (2) in the shell (1), and the chip (5) is arranged on the side of the ceramic plate (4) away from the pressure pipeline (2); An overload protection element is arranged between the ceramic plate (4) and the shell (1) to protect the ceramic plate (4).

2. A pressure sensor according to claim 1, wherein The overload protection element includes a plurality of parallel springs (6), and the two ends of any spring (6) are connected with the shell (1) and the ceramic plate (4) respectively.

3. A pressure sensor according to claim 2, wherein A push plate (7) is arranged in the pressure chamber (3), and one end of the spring (6) away from the ceramic plate (4) is connected with the push plate (7).

4. The pressure sensor of claim 1, wherein, A maintenance opening is arranged on the side of the pressure chamber (3) away from the pressure pipeline (2), and a maintenance cover plate (8) is arranged on the maintenance opening.

5. The pressure sensor of claim 1, wherein, A circuit board (10) is arranged in the shell (1), a display panel (9) is arranged outside the shell (1), the display panel (9) is electrically connected with the circuit board (10).

6. A pressure sensor according to claim 5, wherein A plurality of indicator lights (11) are arranged on the shell (1), and any indicator light (11) is electrically connected with the circuit board (10).

7. The pressure sensor of claim 1, wherein, A sealing washer (12) is arranged between the ceramic plate (4) and the shell (1), and the ceramic plate (4) abuts against the sealing washer (12).

8. The pressure sensor of claim 1, wherein, An external thread (13) is arranged on the outer wall of the pressure pipeline (2), and a tightening nut (14) is arranged on the pressure pipeline (2).

Images