Integrated circuit chip defect detection device

Abstract

The utility model provides an integrated circuit chip defect detection device, and belongs to the technical field of chip quality detection. The integrated circuit chip defect detection device comprises a comprehensive assembly, a detection assembly and a wafer, the comprehensive assembly serves as an overall frame and is used for adsorbing, adjusting and fixing the wafer and monitoring temperature changes of all positions of the wafer, and a partition plate is fixedly connected into the comprehensive assembly; the detection assembly is installed outside the partition plate and located on the upper side of the center of the comprehensive assembly, and the detection assembly is used for conducting optical reflection detection on the surface of the wafer and marking the defect position through the change of reflected light. The device has the advantages that the device can be fixed in real time through negative pressure adsorption during optical detection, temperature rise changes caused by optical detection are monitored in real time, overall shaking of the wafer is reduced, infrared light irradiates the surface of the wafer to conduct reflection receiving detection, and therefore the surface shape changes of the wafer are tested.

Description

TECHNICAL FIELD

[0001] The utility model relates to chip quality detection technical field, concretely relates to integrated circuit chip defect detection device. BACKGROUND

[0002] With the continuous progress of semiconductor technology, the complexity and integration of integrated circuit chips are continuously improved, and small defects can cause chip performance degradation or even failure. Therefore, integrated circuit chip defect detection has become an indispensable part of the production process.

[0003] The traditional detection method includes artificial visual inspection, electron microscope inspection, etc., wherein the artificial visual inspection is inefficient and is easily affected by human factors, and is time-consuming and labor-consuming, and the electron microscope inspection has high initial investment cost for small and medium-sized enterprises, and the initial production is difficult to bear, and the cracks, cavities and other defects in the chip need to be detected again by other equipment, which is difficult to meet the existing demand. Therefore, the present application provides an integrated circuit chip defect detection device. UTILITARIAN CONTENT

[0004] To solve the above technical problem, the utility model provides an integrated circuit chip defect detection device which can stably rotate and adjust the round crystal after filling through the reduction gear set, and fix it immediately through negative pressure adsorption during optical detection, and monitor the temperature change caused by optical detection in real time, reduce the overall shaking of the round crystal, and test the integrated circuit chip defect detection device by reflecting and receiving the detection of the infrared light irradiated on the surface of the round crystal to test the shape change of the surface of the round crystal.

[0005] The technical scheme of the utility model is as follows:

[0006] An integrated circuit chip defect detection device, comprising a comprehensive component, a detection component and a round crystal, the comprehensive component is used as a whole frame to adsorb, adjust and fix the round crystal while monitoring the temperature change of each part of the round crystal, a partition plate is fixedly connected inside the comprehensive component, the detection component is installed outside the partition plate and at the upper side of the center of the comprehensive component, the detection component is used for optical reflection detection of the surface of the round crystal, and the defect is marked by the change of reflected light.

[0007] Further, the comprehensive component comprises an adjusting ring table, an adjusting motor, a reduction gear set, a bearing platform and a gas pump, the adjusting ring table, the adjusting motor, the reduction gear set and the bearing platform are on the same vertical line, and the bottom center of the partition plate is provided with a guide pipe.

[0008] Further, the adjusting motor is located outside the comprehensive assembly below the partition plate, the speed reducer set is detachably connected to the end of the driving shaft of the adjusting motor, the load platform is detachably connected outside the driving shaft of the speed reducer set, and the air pump is fixedly connected outside the comprehensive assembly below the partition plate of the comprehensive assembly.

[0009] Further, the adjusting ring table is internally fixedly connected with a partition ring, the partition ring is arranged in a radial manner and separates the inside of the adjusting ring table into a plurality of annular spaces, gas conveying pipes are fixedly connected between the partition rings, the gas conveying pipes connect the adjusting ring table and the air pump with each other, and the gas conveying pipes are provided with openings according to the partition of the partition ring in the inside of the adjusting ring table.

[0010] Further, the edge of the load platform is fixedly connected with a limiting arc plate, the edge of the limiting arc plate is outwardly expanded, hollow suction cups are fixedly connected outside the load platform, and temperature sensors are fixedly connected between the hollow suction cups.

[0011] Further, the center of the hollow suction cup is provided with a slot and is connected with the partition ring space in contact with the bottom of the load platform.

[0012] Further, the detection assembly comprises a fixed base, a hollow arc plate, a locking base, a pulley and a contact arc plate, the locking base is provided in two groups and is symmetrically arranged inside the hollow arc plate, the locking base is provided with the pulley outside and is clamped with the hollow arc plate, and the locking base is fixedly connected with the contact arc plate on the side away from the pulley.

[0013] Further, the contact arc plate is provided with an infrared emitter outside the left side of the hollow arc plate, the contact arc plate is provided with a receiving plate outside the right side of the hollow arc plate, the fixed base is symmetrically arranged on both sides of the partition plate, and the hollow arc plate is fixedly connected outside the fixed base at both ends.

[0014] The utility model has the advantages of the following beneficial effects:

[0015] 1. By setting the comprehensive assembly, the device can stably rotate and adjust the circular crystal filled through the speed reducer set, and is instantly fixed through negative pressure adsorption when optical detection is carried out, the overall shaking of the circular crystal is reduced, and the stability of the device is greatly improved.

[0016] 2. By setting the detection assembly, the device can test the shape change of the surface of the circular crystal through reflection and reception detection of infrared light irradiation on the surface of the circular crystal, and the accuracy of the detection result is ensured through detection at various angles. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 is the overall appearance schematic view of the utility model.

[0018] Figure 2 is another perspective view of the utility model Figure 1 ;

[0019] Figure 3 is a schematic diagram of the internal structure of the utility model;

[0020] Figure 4 is an overall structure explosion view of the detection assembly of the utility model.

[0021] Wherein: 1, comprehensive assembly; 101, partition plate; 102, adjusting ring table; 103, partition ring; 104, guide pipe; 105, adjusting motor; 106, speed reducer gear set; 107, bearing platform; 108, limit arc plate; 109, hollow suction cup; 110, temperature sensor; 111, gas pipe; 112, air pump; 2, detection assembly; 201, fixed base; 202, hollow groove arc plate; 203, locking base; 204, pulley; 205, contact arc plate; 206, infrared emitter; 207, receiving plate; 3, round crystal. DETAILED DESCRIPTION

[0022] The technical solutions in the embodiments of the utility model will be described clearly and completely below, obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the utility model.

[0023] Embodiment 1

[0024] Please see Figures 1 to 4 , the utility model provides a kind of integrated circuit chip defect detection device, including comprehensive assembly 1, detection assembly 2 and round crystal 3, comprehensive assembly 1 is used as overall framework to the round crystal 3 is adsorbed and adjusted fixed while monitoring the temperature change of each place of round crystal 3, and the inside fixed connection of comprehensive assembly 1 has partition plate 101, detection assembly 2 is installed outside partition plate 101 and is in the center upper side position of comprehensive assembly 1, and detection assembly 2 is used to carry out optical reflection detection to the surface of round crystal 3, and the defect place is marked by the change of reflected light, and comprehensive assembly 1 includes adjusting ring table 102, adjusting motor 105, speed reducer gear set 106, bearing platform 107 and air pump 112, adjusting ring table 102, adjusting motor 105, speed reducer gear set 106 and bearing platform 107 are in the same vertical line;

[0025] The bottom center of the partition plate 101 is provided with a guide pipe 104, the adjusting motor 105 is located outside the comprehensive assembly 1 on the lower side of the partition plate 101, the speed reducer set 106 is detachably connected to the end of the drive shaft of the adjusting motor 105, the bearing platform 107 is detachably connected to the outside of the drive shaft of the speed reducer set 106, the air pump 112 is fixedly connected to the outside of the comprehensive assembly 1 on the lower side of the partition plate 101, the adjusting ring table 102 is fixedly connected with the partition ring 103 inside, the partition ring 103 is arranged in a radial manner and separates the inside of the adjusting ring table 102 into a plurality of annular spaces, the partition ring 103 is fixedly connected with the gas conveying pipe 111, the gas conveying pipe 111 connects the adjusting ring table 102 and the air pump 112, and the gas conveying pipe 111 is provided with an opening in the part inside the adjusting ring table 102 according to the partition of the partition ring 103.

[0026] Specifically, when detecting, the circular crystal 3 is placed outside the bearing platform 107 and stably supported by limiting the lower part of the limiting arc plate 108. The bottom of the circular crystal 3 is in contact with the hollow suction cup 109 and is fixed by low adsorption force. Then, the irradiation angle of the locking base 203 is adjusted, the infrared emitter 206 is turned on for optical detection, the infrared light irradiated on the surface of the circular crystal 3 is reflected outside the receiving plate 207 and records the change of the track. At this time, the adjusting motor 105 is turned on to drive the bearing platform 107 to rotate as a whole through the speed reducer set 106, so that the infrared emitter 206 uniformly irradiates on the surface of the circular crystal 3, and the change of the process of the circular crystal 3 being heated by the irradiation of the infrared light is recorded in real time by the temperature sensor 110. The surface shape change of the circular crystal 3 is recorded by the circulating rotation of the bearing platform 107.

[0027] Example 2

[0028] See Figures 1 to 4 In the embodiment 1, the edge of the bearing platform 107 is fixedly connected with the limiting arc plate 108, the edge of the limiting arc plate 108 is expanded outward, the outside of the bearing platform 107 is fixedly connected with the hollow suction cup 109, the hollow suction cup 109 is fixedly connected with the temperature sensor 110, the center of the hollow suction cup 109 is provided with a slot and connected with the partition space of the partition ring 103 in contact with the bottom of the bearing platform 107, the detection assembly 2 includes the fixed base 201, the hollow arc plate 202, the locking base 203, the pulley 204 and the contact arc plate 205, the number of the locking base 203 is two and symmetrically distributed inside the hollow arc plate 202, the pulley 204 is arranged outside the locking base 203 and clamped with the hollow arc plate 202;

[0029] The locking base 203 is fixedly connected with a contact arc plate 205 on the side far from the pulley 204, the contact arc plate 205 is externally provided with an infrared emitter 206 on the left side of the hollow slot arc plate 202, the contact arc plate 205 is externally provided with a receiving plate 207 on the right side of the hollow slot arc plate 202, and the fixed base 201 is symmetrically arranged on both sides of the partition plate 101, and the two ends of the hollow slot arc plate 202 are fixedly connected to the outside of the fixed base 201.

[0030] By being arranged as above, when the depth of the wafer 3 is detected, after the position is adjusted to the defect position according to the embodiment 1, the air pump 112 is opened to perform air extraction, the space separated by the partition ring 103 forms a negative pressure space through the air pump 112 via the air pipe 111, and the hollow suction cup 109 connected with the adjusting ring table 102 tightly adsorbs the wafer 3 in the negative pressure state, so as to complete the fixation, at this time, the opening of the pulley 204 adjusts the irradiation angle and position of the infrared emitter 206, and the suspected defect position is repeatedly detected, so as to ensure the accuracy of the detection result.

[0031] The above only describes the preferred embodiments of the present application and is not used to limit the present application, and any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. An integrated circuit chip defect detection apparatus comprising a synthesis assembly (1), a detection assembly (2) and a bulge (3), characterized in that, The comprehensive assembly (1) is used as a whole frame for adsorbing, adjusting and fixing the round crystal (3) and monitoring the temperature changes of the round crystal (3), the internal fixed connection of the comprehensive assembly (1) is provided with a partition plate (101), the detection assembly (2) is installed outside the partition plate (101) and at the central upper side of the comprehensive assembly (1), the detection assembly (2) is used for optical reflection detection of the surface of the round crystal (3), and the defect position is marked through the reflection light change.

2. The integrated circuit chip defect detection apparatus of claim 1, wherein The comprehensive assembly (1) comprises an adjusting ring table (102), an adjusting motor (105), a speed reduction gear set (106), a bearing platform (107) and a gas pump (112), the adjusting ring table (102), the adjusting motor (105), the speed reduction gear set (106) and the bearing platform (107) are in the same vertical line, and the bottom center of the partition plate (101) is provided with a guide pipe (104).

3. The integrated circuit chip defect detection apparatus of claim 2, wherein The adjusting motor (105) is located outside the comprehensive assembly (1) on the lower side of the partition plate (101), the speed reduction gear set (106) is detachably connected to the end of the transmission shaft of the adjusting motor (105), the bearing platform (107) is detachably connected to the outside of the transmission shaft of the speed reduction gear set (106), and the gas pump (112) is fixedly connected to the outside of the comprehensive assembly (1) on the lower side of the partition plate (101).

4. The integrated circuit chip defect detection apparatus of claim 2, wherein The adjusting ring table (102) is fixedly connected with a partition ring (103) inside, the partition ring (103) is arranged in a radial shape and divides the inside of the adjusting ring table (102) into a plurality of annular spaces, the partition rings (103) are fixedly connected with a gas conveying pipe (111) therebetween, the gas conveying pipe (111) connects the adjusting ring table (102) and the gas pump (112) with each other, and the gas conveying pipe (111) is provided with openings in the internal part of the adjusting ring table (102) according to the partition of the partition ring (103).

5. The integrated circuit chip defect detection apparatus of claim 2, wherein The edge of the bearing platform (107) is fixedly connected with a limiting arc plate (108), the edge of the limiting arc plate (108) is expanded outward, the outside of the bearing platform (107) is fixedly connected with a hollow suction cup (109), and the hollow suction cups (109) are fixedly connected with a temperature sensor (110) therebetween.

6. The integrated circuit chip defect detection apparatus of claim 5, wherein The center of the hollow suction cup (109) is provided with a slot and is connected with the partition ring (103) partition space in contact with the bottom of the bearing platform (107).

7. The integrated circuit chip defect detection apparatus of claim 1, wherein The detection assembly (2) comprises a fixed base (201), an empty slot arc plate (202), a locking base (203), a pulley (204) and a contact arc plate (205), the locking base (203) is provided in two groups and symmetrically distributed inside the empty slot arc plate (202), the locking base (203) is provided with the pulley (204) outside and clamped with the empty slot arc plate (202), and the locking base (203) is fixedly connected with the contact arc plate (205) on the side away from the pulley (204).

8. The integrated circuit chip defect detection apparatus of claim 7, wherein The contact arc plate (205) is located on the left side of the empty slot arc plate (202) and externally provided with an infrared emitter (206), and the contact arc plate (205) is located on the right side of the empty slot arc plate (202) and externally provided with a receiving plate (207), the fixed base (201) is symmetrically arranged on both sides of the partition plate (101), and the empty slot arc plate (202) is fixedly connected at both ends to the outside of the fixed base (201).

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