Ultrasonic proximity induction sensor capable of expanding view field

Abstract

The utility model relates to the technical field of sensors, and discloses an ultrasonic proximity sensor capable of expanding a field of view, which comprises an MEMS chip, the MEMS chip comprises a core plate, a chip Die is arranged on the core plate, a sound hole is arranged in the middle of the core plate, the sound hole is opposite to the chip Die, a field of view expanding plate is arranged at the top end of the core plate, and the field of view expanding plate is arranged on the core plate. The field-of-view expanding plate is provided with an expanded hole, the expanded hole is opposite to and communicated with the sound hole, and the aperture of the expanded hole is larger than that of the sound hole. According to the ultrasonic proximity sensor capable of expanding the view field, the problem that the view field of an ultrasonic sensor is small is solved, the detection range is wider under the large view field, and the detection rate is higher. The technical effect of enlarging the field of view of the sensor can be achieved by adjusting the reaming structure.

Description

Technical Field

[0001] This utility model relates to the field of sensor technology, and in particular to an ultrasonic proximity sensor that expands the field of view. Background Technology

[0002] Currently, ultrasonic sensors have a wide range of applications, including robot collision avoidance, proximity switches, automatic parking in automobiles, pipeline flow measurement, and liquid level detection. According to existing market research, the demand for ultrasonic sensors goes beyond just ranging capabilities; another crucial factor is the field of view (FOV). A larger FOV means a wider detection range. In proximity switches, current ultrasonic applications allow for ranging capabilities selected based on specific application requirements; however, their detection FOVs are generally 120° or even smaller, resulting in blind spots within the sensor's ranging range and necessitating the use of multiple sensors in conjunction. Utility Model Content

[0003] To address the technical problems existing in the background art, this utility model proposes an ultrasonic proximity sensor that expands the field of view.

[0004] This invention discloses an ultrasonic proximity sensor for expanding the field of view, comprising a MEMS chip. The MEMS chip includes a core board with a chip die on it. An acoustic aperture is located in the center of the core board, opposite to the chip die. A field-of-view expansion plate is mounted at the top of the core board, and an expansion aperture is formed on the field-of-view plate. This expansion aperture is opposite to and communicates with the acoustic aperture, and its diameter is larger than that of the acoustic aperture. The expansion aperture is cylindrical and coaxial with the acoustic aperture, thereby expanding the field of view.

[0005] Preferably, the diameter of the enlarged aperture is 1.5-4 times the diameter of the acoustic aperture.

[0006] Preferably, the depth of the enlarged hole is 1.1-3 times the depth of the acoustic hole.

[0007] Preferably, the aperture of the acoustic hole is larger than the outer diameter of the diaphragm inside the MEMS chip.

[0008] Preferably, there is an insulating layer between the field-expanding plate and the core plate.

[0009] Preferably, the MEMS chip comprises a frame layer and a bottom plate, the frame layer is mounted on the bottom plate, the core plate is mounted on the frame layer, the frame layer is provided with a receiving hole, the chip Die has a part extending to the receiving hole, the bottom plate is in conductive connection with the core plate, the aperture of the receiving hole is larger than the outer diameter of the chip Die, and the chip Die has a diaphragm as the existing chip Die; the diaphragm of the chip Die is located in the receiving hole.

[0010] Preferably, the aperture of the receiving hole is smaller than the aperture of the expanded hole.

[0011] Preferably, one side of the bottom plate away from the frame layer and the side of the bottom plate connected with the frame layer are both coated with a grounding layer.

[0012] Preferably, the outer wall of the core plate is provided with a clamping groove, and the side of the expanded field plate opposite to the core plate is provided with an extending clamping strip matched with the clamping groove.

[0013] Preferably, the extending clamping strip and the clamping groove are both provided with at least two groups, one group of the clamping grooves is matched with one group of the extending clamping strips, and at least two groups of the clamping grooves are distributed on two adjacent sides of the core plate.

[0014] In the utility model, the ultrasonic proximity sensing sensor with expanded field of view solves the problem of small field of view of ultrasonic sensor, and has wider detection range and higher detection rate under large field of view. The structure of the expanded hole can realize the detection of more than 120° large field of view by a single ultrasonic proximity sensing sensor with expanded field of view, and even can realize the detection of 180° large field of view. Two ultrasonic proximity sensing sensors with expanded field of view can realize 360° full-range non-dead-angle coverage.

[0015] Additional aspects and advantages of the utility model will be partially given in the following description, partially will become obvious from the following description, or will be understood by the practice of the utility model. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 It is the structural schematic diagram of the utility model;

[0017] Figure 2 It is the sectional view of the utility model;

[0018] Figure 3 It is the sectional view of the core plate and the expanded field plate in some embodiments of the utility model;

[0019] Figure 4 It is the connection structure schematic diagram of the core plate and the expanded field plate in some embodiments of the utility model;

[0020] In the figure: 1, core plate; 10, acoustic hole; 11, clamping groove; 2, chip Die; 3, extended field of view plate; 30, expansion hole; 4, insulating layer; 5, extended clamping strip; 6, bottom plate; 7, frame layer; 70, containing hole. DETAILED DESCRIPTION

[0021] The embodiments of the present application are described in detail below, examples of which are shown in the drawings, wherein the same or similar symbols represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary and are only used to explain the present application, and cannot be understood as a limitation on the present application.

[0022] As Figures 1-3 shown in the figure, an ultrasonic proximity sensing sensor for expanding the field of view, an ultrasonic proximity sensing sensor for expanding the field of view, comprising a MEMS chip, the MEMS chip comprising a core plate 1, the core plate 1 being provided with a chip Die 2, the core plate 1 being a carrier of the chip Die 2, the core plate 1 being provided with an acoustic hole 10 at the middle position, the acoustic hole 10 being opposite to the chip Die 2, the core plate 1 being provided with an extended field of view plate 3 at the top end, the extended field of view plate 3 being provided with an expansion hole 30, the expansion hole 30 being opposite to and communicating with the acoustic hole 10, the aperture of the expansion hole 30 being larger than that of the acoustic hole 10, the expansion hole 30 being cylindrical and coaxial with the acoustic hole 10.

[0023] Like the prior art, the MEMS chip has a diaphragm, and the emission of ultrasonic waves is formed by the up and down vibration of the diaphragm to squeeze the air to form ultrasonic emission. The diaphragm area is a central symmetrical circular structure, and the ability to emit / receive signals at each angle has symmetry. And the top and bottom layers of the core plate 1 are covered with copper, and the top and bottom layers of the core plate 1 are connected through the full copper wall of the acoustic hole 10.

[0024] The diaphragm of the MEMS chip vibrates to cooperate with the acoustic hole 10 structure and the expansion hole 30 structure of the core plate 1, thereby improving the emission signal capability and the sensitivity of the received signal at a large angle, and expanding the measurement field of view through the expansion hole 30.

[0025] The function of the extended field of view plate 3 and the expansion hole 30 is mainly to suppress the residual vibration with the change of temperature, the extended field of view plate 3 is not electrically connected, and on the basis of not increasing the residual vibration, the temperature stability of the sensor can be obviously improved, that is, the change amplitude of the residual vibration of the sensor with temperature is minimum, and the measurement field of view of the sensor can be increased.

[0026] Preferably, the aperture of the expansion hole 30 is 1.5-4 times the aperture of the acoustic hole 10, and in this embodiment, the aperture of the expansion hole 30 is 1.5 times the aperture of the acoustic hole 10. It is found through experiments that when the aperture of the expansion hole 30 is 1.5-4 times the aperture of the acoustic hole 10, the effect of expanding the field of view is relatively good.

[0027] Preferably, the depth of the enlarged hole 30 is 1.1-3 times the depth of the acoustic hole 10. Experiments have shown that when the depth of the enlarged hole 30 is 1.1-3 times the depth of the acoustic hole 10, the effect of expanding the field of view is relatively good. In this embodiment, the depth of the enlarged hole 30 is 1.5 times the depth of the deep hole.

[0028] Preferably, the aperture of the acoustic aperture 10 is larger than the outer diameter of the diaphragm inside the MEMS chip. The acoustic aperture 10 is coaxial with the diaphragm, further increasing the field of view.

[0029] like Figure 3 In some preferred embodiments, an insulating layer 4 is provided between the field-expanding plate 3 and the core plate 1. The insulating layer 4 can be an adhesive layer, which further increases the temperature stability of the sensor while achieving the connection between the core plate 1 and the field-expanding plate 3.

[0030] Similar to existing technologies, the MEMS chip includes a frame layer 7 and a base plate 6. The frame layer 7 is mounted on the base plate 6, and the core plate 1 is mounted on the frame layer 7. The frame layer 7 has a receiving hole 70. The chip die 2 has a portion extending to the receiving hole 70. The base plate 6 is electrically connected to the core plate 1. Preferably, the diameter of the receiving hole 70 is smaller than the diameter of the enlarged hole 30.

[0031] Similar to existing technologies, the frame layer 7 mainly serves to connect the base plate 6 and the core plate 1. The bottom and top of the frame layer 7 have welding pads. The welding pad at the top of the frame layer 7 is connected to the base plate 6, and the welding pad at the top of the frame layer 7 is connected to the core plate 1. Similar to existing technologies, the outer ring welding pads of the frame layer 7 are a shielding layer.

[0032] It should be noted that in some embodiments, preferably, the side of the base plate 6 away from the frame layer 7 and the side of the base plate 6 connected to the frame layer 7 are coated with a grounding layer. This grounding layer can be copper coating. When the base plate 6 is connected to the external PCB board and after the grounding connection with the external PCB board is established, the grounding layer effectively wraps the entire signal layer, effectively shielding electromagnetic interference.

[0033] like Figure 4 In some preferred embodiments, the outer wall of the core plate 1 has a slot 11, and the side of the field-expanding plate 3 opposite to the core plate 1 has an extension strip 5. The extension strip 5 matches the slot 11, which facilitates the fixing of the relative position of the core plate 1 and the field-expanding plate 3, and ensures that the sound hole 10 and the expansion hole 30 are coaxial.

[0034] Preferably, the extension clamping strip 5 and the clamping groove 11 are each provided with at least two groups, one group of the clamping groove 11 matches one group of the extension clamping strip 5, and at least two groups of the clamping groove 11 are distributed on two adjacent sides of the core plate 1, that is, at least one group of the clamping groove 11 is on any one of the two sides, the rectangular plate structure of the core plate 1, and the extension groove is arranged on the two sides of the core plate 1, which further facilitates the matching of the extension clamping strip 5 and the clamping groove 11, and facilitates the installation of the field expansion plate 3 while limiting the relative position of the field expansion plate 3 and the core plate 1.

[0035] It should be understood that the terms "upper", "lower", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.

[0036] In the present application, unless otherwise specified and limited, the terms "mounting", "connection", "connection", "fixing" and the like should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected or in communication with each other; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise specified. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0037] In the present application, unless otherwise specified and limited, the first feature is "on" or "under" the second feature. The first and second features can be in direct contact, or the first and second features can be in indirect contact through an intermediate medium. Moreover, the first feature "above", "above" and "above" of the second feature can be directly above or obliquely above the first feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature "below", "below" and "below" of the second feature can be directly below or obliquely below the first feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.

[0038] The above is only a preferred specific embodiment of the present application, but the protection scope of the present application is not limited to this. Any skilled person in the art can make equivalent replacement or change according to the technical scheme and the inventive concept of the present application within the technical range disclosed by the present application, which should be covered within the protection scope of the present application.

Claims

1. An ultrasonic proximity inductive sensor with an extended field of view, characterized in that, The MEMS chip comprises a core plate (1) provided with a chip Die (2), a sound hole (10) is opened in the middle of the core plate (1), the sound hole (10) is opposite to the chip Die (2), an expanded field of view plate (3) is installed at the top end of the core plate (1), an expansion hole (30) is opened in the expanded field of view plate (3), the expansion hole (30) is opposite to and communicates with the sound hole (10), and the aperture of the expansion hole (30) is larger than that of the sound hole (10).

2. The ultrasonic proximity inductive sensor with extended field of view according to claim 1, characterized in that, The aperture of the expansion hole (30) is 1.5-4 times of the aperture of the sound hole (10).

3. The ultrasonic proximity inductive sensor with extended field of view of claim 1, wherein, The depth of the expansion hole (30) is 1.1-3 times of the depth of the sound hole (10).

4. The ultrasonic proximity inductive sensor with extended field of view of claim 1, wherein, The aperture of the sound hole (10) is larger than the outer diameter of the diaphragm in the MEMS chip.

5. The ultrasonic proximity inductive sensor with extended field of view of claim 1, wherein, There is an insulating layer (4) between the expanded field of view plate (3) and the core plate (1).

6. The ultrasonic proximity inductive sensor with extended field of view of claim 1, wherein, The MEMS chip comprises a frame layer (7) and a bottom plate (6), the frame layer (7) is installed on the bottom plate (6), the core plate (1) is installed on the frame layer (7), a receiving hole (70) is opened in the frame layer (7), the chip Die (2) has a part extending into the receiving hole (70), and the bottom plate (6) is in conductive connection with the core plate (1).

7. The ultrasonic proximity inductive sensor with extended field of view according to claim 6, characterized in that, The far side of the bottom plate (6) from the frame layer (7) and the side of the bottom plate (6) connected with the frame layer (7) are coated with a grounding layer.

8. The ultrasonic proximity inductive sensor with extended field of view of claim 6, wherein, The aperture of the receiving hole (70) is smaller than that of the expansion hole (30).

9. The ultrasonic proximity inductive sensor with extended field of view of claim 1, wherein, The outer wall of the core plate (1) is provided with a clamping groove (11), the side of the expanded field of view plate (3) opposite to the core plate (1) is provided with an extending clamping strip (5), and the extending clamping strip (5) is matched with the clamping groove (11).

10. The ultrasonic proximity inductive sensor with extended field of view according to claim 9, characterized in that, The extending clamping strip (5) and the clamping groove (11) are each provided with at least two groups, one group of the clamping groove (11) is matched with one group of the extending clamping strip (5), and at least two groups of the clamping groove (11) are distributed on two adjacent sides of the core plate (1).

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