Optical module

Abstract

The utility model provides an optical module, a digital signal processing chip comprises a first output pin and a second output pin, a first end of a first modulation electrode is connected with the first output pin through a first capacitor, and a first end of a second modulation electrode is connected with the second output pin through a second capacitor, so that the common-mode voltage of a driving signal entering an optical chip is zero. And the digital signal processing chip and the optical chip realize alternating current coupling. The second end of the first modulation electrode is connected with the first end of the first resistor, and the third end is connected with one end of the first diode; the second end of the second modulation electrode is connected with the first end of the second resistor, and the third end is connected with one end of the second diode. The other end of the first diode is connected with the other end of the second diode. The second end of the first resistor is connected with the first power supply chip, and the other end of the first diode is also grounded; or, the second end of the first resistor is grounded, and the other end of the first diode is connected with the first power supply chip, so that the first diode can work.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the field of optical fiber communication technology, and in particular to an optical module. BACKGROUND

[0002] With the development of new business and application modes such as cloud computing, mobile Internet, video, etc., the development and progress of optical communication technology becomes increasingly important. In optical communication technology, an optical module is a tool for converting optical signals and electrical signals, and is one of the key devices in optical communication equipment. With the development of optical communication technology, the transmission rate of the optical module is continuously improved. CONTENT OF THE UTILITY MODEL

[0003] The present disclosure provides an optical module, a digital signal processing chip and an optical chip are implemented in an AC coupling manner.

[0004] In some embodiments, an optical module is provided, comprising:

[0005] a circuit board;

[0006] a light source, electrically connected to the circuit board, configured to emit light without carrying data;

[0007] an optical chip, optically connected to the light source, configured to modulate the light without carrying data into an optical signal;

[0008] wherein the circuit board is provided with:

[0009] a digital signal processing chip, comprising:

[0010] a first output pin, configured to output a first driving signal;

[0011] a second output pin, configured to output a second driving signal;

[0012] a first power supply chip;

[0013] a first capacitor, a first signal end of which is connected to the first output pin;

[0014] a second capacitor, a first signal end of which is connected to the second output pin;

[0015] the optical chip comprises:

[0016] a first modulation electrode, a first end of which is connected to a second signal end of the first capacitor to receive the first driving signal;

[0017] a second modulation electrode, a first end of which is connected to a second signal end of the second capacitor to receive the second driving signal;

[0018] a first resistor, a first end of which is connected to a second end of the first modulation electrode;

[0019] a second resistor, a first end of which is connected with a second end of the second modulation electrode, and a second end of which is connected with a second end of the first resistor;

[0020] a first diode, one end of which is connected with a third end of the first modulation electrode;

[0021] a second diode, one end of which is connected with a third end of the second modulation electrode, and the other end of which is connected with the other end of the first diode;

[0022] the second end of the second resistor is connected with the first power supply chip, and the other end of the second diode is grounded; or, the other end of the second diode is connected with the first power supply chip, and the second end of the second resistor is grounded.

[0023] The technical scheme has the following beneficial effects: the present disclosure provides a kind of optical module, including circuit board, light source and optical chip, light source is electrically connected with circuit board, optical chip is electrically connected with circuit board, light source is used to emit the light without carrying data, optical chip is optically connected with light source to receive the light without carrying data emitted by light source.Light chip is used to modulate the light without carrying data into optical signal.Circuit board is provided with digital signal processing chip and second power supply chip, digital signal processing chip includes first output pin and second output pin, first output pin is used to output first drive signal, and second output pin is used to output second drive signal.Circuit board is provided with first power supply chip, first capacitor and second capacitor, the first signal end of first capacitor is connected with first output pin, so that first capacitor can receive the first drive signal output by first output pin.The first signal end of second capacitor is connected with second output pin, so that second capacitor can receive the second drive signal output by second output pin.Optical chip includes first modulation electrode and second modulation electrode, the first end of first modulation electrode is connected with the second signal end of first capacitor, and the first end of second modulation electrode is connected with the second signal end of second capacitor, so that the common-mode voltage of first drive signal entering first modulation electrode and the common-mode voltage of second drive signal entering second modulation electrode are both zero, so that digital signal processing chip and optical chip realize AC coupling.Optical chip further includes first resistor, second resistor, first diode and second diode, the first end of first modulation electrode is connected with first output pin to receive first drive signal.The second end of first modulation electrode is connected with the first end of first resistor.The third end of first modulation electrode is connected with one end of first diode.The first end of second modulation electrode is connected with second output pin to receive second drive signal.The second end of second modulation electrode is connected with the first end of second resistor, and the second end of second resistor is connected with the second end of first resistor.The third end of second modulation electrode is connected with one end of second diode, and the other end of second diode is connected with the other end of first diode.The second end of second resistor is connected with first power supply chip, and the other end of second diode is grounded, so that first power supply chip can provide working voltage for second diode, and then second diode can work.Because the second end of second resistor is connected with the first end of first resistor, and the second end of second resistor is connected with first power supply chip, the second end of first resistor is connected with first power supply chip.The other end of second diode is connected with the other end of first diode, and the other end of second diode is grounded, and the other end of first diode is also grounded.The second end of first resistor is connected with first power supply chip, and the other end of first diode is also grounded, so that first power supply chip can provide working voltage for first diode, and then first diode can work.The second end of the second resistor is grounded, the second end of the second resistor is connected with the first end of the first resistor, and the second end of the first resistor is grounded. The other end of the second diode is connected with the other end of the first diode, the other end of the second diode is connected with the first power supply chip, and the other end of the first diode is connected with the first power supply chip. The second end of the first resistor is grounded, the other end of the first diode is connected with the first power supply chip, so that the first power supply chip can provide working voltage for the first diode, and the first diode can work.

[0024] In some embodiments, a light module is provided, the second end of the second resistor is grounded, the positive end of the first diode is connected with the third end of the first modulation electrode, and the negative end of the first diode is connected with the first power supply chip.

[0025] The positive end of the second diode is connected with the third end of the second modulation electrode, and the negative end of the second diode is connected with the first power supply chip.

[0026] The above technical solutions have the following beneficial effects: the second end of the second resistor is grounded, the positive end of the first diode is connected with the third end of the first modulation electrode, and the negative end of the first diode is connected with the first power supply chip, so that the first power supply chip can provide working voltage for the first diode, and the first diode can work. The second end of the second resistor is grounded, the second end of the second resistor is connected with the second end of the first resistor, and the second end of the first resistor is grounded. The second end of the first resistor is grounded, the positive end of the second diode is connected with the third end of the first modulation electrode, and the negative end of the second diode is connected with the first power supply chip, so that the first power supply chip can provide working voltage for the second diode, and the second diode can work.

[0027] In some embodiments, a light module is provided,

[0028] The above technical solutions have the following beneficial effects: the second end of the second resistor is connected with the first power supply chip, the negative end of the first diode is connected with the third end of the first modulation electrode, and the positive end of the first diode is grounded, so that the first power supply chip can provide working voltage for the first diode, and the first diode can work. The second end of the second resistor is connected with the first power supply chip, the second end of the second resistor is connected with the second end of the first resistor, and the second end of the first resistor is connected with the first power supply chip. The second end of the first resistor is connected with the first power supply chip, the negative end of the second diode is connected with the third end of the first modulation electrode, and the positive end of the second diode is grounded, so that the first power supply chip can provide working voltage for the second diode, and the second diode can work.

[0029] In some embodiments, a light module is provided, the digital signal processing chip comprises:

[0030] The driving module is connected with the first output pin and the second output pin.

[0031] The technical scheme has the following beneficial effects: the driving module is integrated in the digital signal processing chip, the driving module outputs the first driving signal and the second driving signal, the driving module is connected with the first output pin and the second output pin of the digital signal processing chip, so that the first driving signal output by the driving module is output through the first output pin, and the second driving signal is output through the second output pin.

[0032] In some embodiments, a light module is provided, and the light chip further comprises:

[0033] An input waveguide;

[0034] A light splitter, an input end of which is connected with the input waveguide;

[0035] A first interference arm, an input end of which is connected with a first output end of the light splitter; the first modulation electrode is arranged on the first interference arm;

[0036] A second interference arm, an input end of which is connected with a second output end of the light splitter; the second modulation electrode is arranged on the second interference arm;

[0037] A light combiner, a first input end of which is connected with an output end of the first interference arm, and a second input end of which is connected with an output end of the second interference arm;

[0038] An output waveguide, an output end of which is connected with the light combiner.

[0039] The technical scheme has the following beneficial effects: the light chip further comprises the input waveguide, the light splitter, the first interference arm, the second interference arm, the light combiner and the output waveguide, the input end of the light splitter is connected with the input waveguide, so that the light splitter can receive the light input by the input waveguide. The first output end of the light splitter is connected with the first interference arm, and the second output end of the light splitter is connected with the second interference arm, so that the light splitter divides the light into two beams, one of which enters the first interference arm and is transmitted in the first interference arm, and the other of which enters the second interference arm and is transmitted in the second interference arm. The first modulation electrode is arranged on the first interference arm, and the first driving signal of the first modulation electrode changes the refractive index of the first interference arm. The second modulation electrode is arranged on the second interference arm, and the second driving signal of the second modulation electrode changes the refractive index of the second interference arm. The output end of the first interference arm is connected with the first input end of the light combiner, and the output end of the second interference arm is connected with the second input end of the light combiner, so that the light on the first interference arm and the second interference arm is combined into one beam. The output end of the light combiner is connected with the output waveguide, so that the light output by the light combiner enters the output waveguide and is output in the output waveguide.

[0040] In some embodiments, a light module is provided, the light chip further comprises:

[0041] a light phase shifter disposed on the first interference arm.

[0042] The above technical solution has the following beneficial effects: the light chip further comprises a light phase shifter, and the light phase shifter is disposed on the first interference arm. The refractive index of the first interference arm is changed by the light phase shifter.

[0043] In some embodiments, a light module is provided, the light phase shifter is a heater.

[0044] The above technical solution has the following beneficial effects: the light phase shifter is a heater. The power of the heater is adjusted by adjusting the current of the heater, and then the temperature of the first interference arm is adjusted, so that the refractive index of the first interference arm is adjusted. BRIEF DESCRIPTION OF DRAWINGS

[0045] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings needed to be used in the embodiments or prior art description will be briefly introduced as follows. Obviously, the drawings in the following description are only some embodiments of the present disclosure, and other drawings can be obtained by those skilled in the art without creative labor.

[0046] Figure 1 A partial structure diagram of a light communication system according to some embodiments is provided.

[0047] Figure 2 A partial structure diagram of a host computer according to some embodiments is provided.

[0048] Figure 3 A structure diagram of a light module according to some embodiments is provided.

[0049] Figure 4 An exploded view of a light module according to some embodiments is provided.

[0050] Figure 5 A structure diagram of a MZM modulator according to some embodiments is provided.

[0051] Figure 6 An internal structure diagram of a light module according to some embodiments is provided.

[0052] Figure 7 An internal structure principle of a light module according to some embodiments is provided. Figure 1

[0053] Figure 8 An internal structure principle of a light module according to some embodiments is provided. Figure 2 ​​

[0054] Figure 9 An internal structure diagram of another optical module according to some embodiments is provided;

[0055] Figure 10 An internal structure diagram of another optical module according to some embodiments is provided Figure 1 ;

[0056] Figure 11 An internal structure diagram of another optical module according to some embodiments is provided Figure 2 ;

[0057] Figure 12 An internal structure diagram of another optical module according to some embodiments is provided Figure 3 ;

[0058] Figure 13 An internal structure diagram of another optical module according to some embodiments is provided Figure 4 . DETAILED DESCRIPTION

[0059] Some embodiments of the present disclosure will be described in detail below with reference to the drawings. However, the described embodiments are only some embodiments of the present disclosure, not all embodiments. Based on the embodiments provided in the present disclosure, all other embodiments obtained by those of ordinary skill in the art belong to the scope of protection of the present disclosure.

[0060] Unless otherwise required by the context, throughout the specification and claims, the term "comprising" is to be interpreted as open, inclusive, meaning "including, but not limited to"; the terms "first", "second" are not to be interpreted as indicating or implying relative importance or indicating the upper limit of the number; the term "multiple" means two or more; the term "connected" should be broadly interpreted, for example, "connected" can be fixedly connected, or detachably connected, or integrated, can be directly connected, or indirectly connected through an intermediate medium; the use of the terms "adapted to" or "configured to" means open and inclusive language, which does not exclude devices adapted to or configured to perform additional tasks or steps; the terms "parallel", "vertical", "same", "consistent", "flush" and the like are not limited to absolute mathematical relationships, but also include acceptable error ranges generated in practice, and also include differences based on the same design concept but due to manufacturing reasons.

[0061] In optical communication technology, in order to establish information transmission between information processing devices, information needs to be loaded onto light, and the transmission of information is achieved by using the propagation of light. Here, the light loaded with information is an optical signal. The optical signal can reduce the loss of optical power when transmitted in the information transmission device, so as to achieve high-speed, long-distance and low-cost information transmission. The signal that can be recognized and processed by the information processing device is an electrical signal. The information processing device usually includes an optical network unit (ONU), a gateway, a router, a switch, a mobile phone, a computer, a server, a tablet computer, a television, etc., and the information transmission device usually includes an optical fiber and an optical waveguide, etc.

[0062] The optical module can realize the mutual conversion between the optical signal and the electrical signal between the information processing device and the information transmission device. For example, at least one of the optical signal input end or the optical signal output pin of the optical module is connected with an optical fiber, and at least one of the electrical signal input end or the electrical signal output pin of the optical module is connected with an optical network unit; a first optical signal from the optical fiber is transmitted to the optical module, the optical module converts the first optical signal into a first electrical signal, and transmits the first electrical signal to the optical network unit; a second electrical signal from the optical network unit is transmitted to the optical module, the optical module converts the second electrical signal into a second optical signal, and transmits the second optical signal to the optical fiber. Since multiple information processing devices can transmit information through electrical signals, at least one of the multiple information processing devices needs to be directly connected with the optical module, without the need for all the information processing devices to be directly connected with the optical module. Here, the information processing device directly connected with the optical module is referred to as the host computer of the optical module. In addition, the optical signal input end or the optical signal output pin of the optical module can be referred to as an optical port, and the electrical signal input end or the electrical signal output pin of the optical module can be referred to as an electrical port.

[0063] Figure 1 A partial structure diagram of an optical communication system according to some embodiments is provided. As shown in Figure 1 the optical communication system mainly includes a remote information processing device 1000, a local information processing device 2000, a host computer 100, an optical module 200, an optical fiber 101 and a network cable 103.

[0064] One end of the optical fiber 101 extends to the direction of the remote information processing device 1000, and the other end of the optical fiber 101 is connected with the optical module 200 through the optical port of the optical module 200. The optical signal can be totally reflected in the optical fiber 101, and the propagation of the optical signal in the totally reflected direction can almost maintain the original optical power. The optical signal occurs multiple times of total reflection in the optical fiber 101, so as to transmit the optical signal from the remote information processing device 1000 to the optical module 200, or transmit the optical signal from the optical module 200 to the remote information processing device 1000, thereby realizing long-distance and low-power loss information transmission.

[0065] The optical communication system can include one or more optical fibers 101, and the optical fiber 101 is detachably connected with the optical module 200, or fixedly connected. The host computer 100 is configured to provide a data signal to the optical module 200, or receive a data signal from the optical module 200, or monitor or control the working state of the optical module 200.

[0066] The host computer 100 includes a housing in the shape of a cuboid, and an optical module connecting hole 102 arranged on the housing. The optical module connecting hole 102 is configured to access the optical module 200, so that the host computer 100 and the optical module 200 establish a one-way or two-way electrical signal connection.

[0067] The host computer 100 also includes an external electrical connection hole, which can access an electrical signal network. For example, the external electrical connection hole includes a universal serial bus (USB) connection hole or a network cable connection hole 104, which is configured to access a network cable 103, so that the host computer 100 and the network cable 103 establish a one-way or two-way electrical signal connection. One end of the network cable 103 is connected to a local information processing device 2000, and the other end of the network cable 103 is connected to the host computer 100, so as to establish an electrical signal connection between the local information processing device 2000 and the host computer 100 through the network cable 103. For example, a third electrical signal emitted by the local information processing device 2000 is transmitted to the host computer 100 through the network cable 103, and the host computer 100 generates a second electrical signal according to the third electrical signal. The second electrical signal from the host computer 100 is transmitted to the optical module 200, and the optical module 200 converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber 101. The second optical signal is transmitted to a remote information processing device 1000 in the optical fiber 101. For example, a first optical signal from the remote information processing device 1000 propagates through the optical fiber 101, the first optical signal from the optical fiber 101 is transmitted to the optical module 200, the optical module 200 converts the first optical signal into a first electrical signal, and the optical module 200 transmits the first electrical signal to the host computer 100. The host computer 100 generates a fourth electrical signal according to the first electrical signal, and transmits the fourth electrical signal to the local information processing device 2000. It should be noted that the optical module is a tool for converting optical signals and electrical signals, and the information does not change in the conversion process of the optical signals and the electrical signals, and the encoding and decoding mode of the information can change.

[0068] In addition to including an optical network terminal, the host computer 100 also includes an optical line terminal (OLT), an optical network terminal (ONT), or a data center server, etc.

[0069] Figure 2 A partial structural diagram of a host computer according to some embodiments is shown. In order to clearly show the connection relationship between the optical module 200 and the host computer 100, Figure 2 Only the structure of the host computer 100 related to the optical module 200 is shown. As Figure 2 shown, the host computer 100 further includes a PCB circuit board 105 arranged in the shell, a cage 106 arranged on the surface of the PCB circuit board 105, a heat sink 107 arranged on the cage 106, and an electrical connector arranged inside the cage 106. The electrical connector is configured to access the electrical port of the optical module 200; the heat sink 107 has a protruding structure such as fins to increase the heat dissipation area.

[0070] The optical module 200 is inserted into the cage 106 of the host computer 100, and the optical module 200 is fixed by the cage 106. The heat generated by the optical module 200 is conducted to the cage 106, and then diffused through the heat sink 107. After the optical module 200 is inserted into the cage 106, the electrical port of the optical module 200 is connected with the electrical connector inside the cage 106, so that the optical module 200 and the host computer 100 establish a bidirectional electrical signal connection. In addition, the optical port of the optical module 200 is connected with the optical fiber 101, so that the optical module 200 and the optical fiber 101 establish a bidirectional optical signal connection.

[0071] Figure 3 A structural diagram of an optical module according to some embodiments is shown, Figure 4 A exploded view of an optical module according to some embodiments is shown. As Figure 3 and Figure 4 shown, the optical module 200 includes a shell, a circuit board 300 arranged in the shell, and an optical transceiver component.

[0072] The shell includes an upper shell 201 and a lower shell 202, the upper shell 201 covers the lower shell 202 to form the above-mentioned shell with two openings 204 and 205; the outer contour of the shell generally presents a square body.

[0073] In some embodiments, the lower shell 202 includes a bottom plate 2021 and two lower side plates 2022 located on both sides of the bottom plate 2021 and arranged perpendicularly to the bottom plate 2021; the upper shell 201 includes a cover plate 2011, which covers the two lower side plates 2022 of the lower shell 202 to form the above-mentioned shell.

[0074] In some embodiments, the lower shell 202 comprises a bottom plate 2021 and two lower side plates 2022 arranged perpendicularly to the bottom plate 2021 on both sides of the bottom plate 2021; the upper shell 201 comprises a cover plate 2011 and two upper side plates arranged perpendicularly to the cover plate 2011 on both sides of the cover plate 2011, and the two upper side plates and the two lower side plates 2022 are combined to realize the covering of the upper shell 201 on the lower shell 202.

[0075] The direction of the line connecting the two openings 204 and 205 can be consistent with the length direction of the optical module 200, or can be inconsistent with the length direction of the optical module 200. For example, the opening 204 is located at the end of the optical module 200 (the right end of the optical module 200), and the opening 205 is also located at the end of the optical module 200 (the left end of the optical module 200). Alternatively, the opening 204 is located at the end of the optical module 200, and the opening 205 is located at the side of the optical module 200. The opening 204 is an electrical port, and the gold fingers of the circuit board 300 extend from the electrical port and are inserted into the electrical connector of the host computer 100; the opening 205 is an optical port configured to access the external optical fiber 101, so that the optical fiber 101 is connected to the optical transceiver component in the optical module 200. Figure 3 Figure 3

[0076] The combination of the upper shell 201 and the lower shell 202 facilitates the installation of the circuit board 300 and the optical transceiver component into the above-mentioned shells, and the above-mentioned devices can be packaged and protected by the upper shell 201 and the lower shell 202. In addition, when the circuit board 300 and the optical transceiver component are assembled, the positioning components, heat dissipation components and electromagnetic shielding components of these devices can be deployed, which is conducive to the automatic implementation of production.

[0077] In some embodiments, the upper shell 201 and the lower shell 202 are made of metal material, which is conducive to electromagnetic shielding and heat dissipation.

[0078] In some embodiments, the optical module 200 further comprises an unlocking component 600 located outside the shell of the optical module 200. The unlocking component 600 is configured to realize the fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0079] For example, the unlocking component 600 is located outside the two lower side plates 2022 of the lower shell 202, and comprises a clamping component matched with the cage 106 of the host computer 100. When the optical module 200 is inserted into the cage 106, the clamping component of the unlocking component 600 fixes the optical module 200 in the cage 106; when the unlocking component 600 is pulled, the clamping component of the unlocking component 600 moves, thereby changing the connection relationship between the clamping component and the host computer, to release the fixation between the optical module 200 and the host computer, so that the optical module 200 can be pulled out of the cage 106.

[0080] ​​Circuit board 300 includes circuit traces, electronic components, and chips. The circuit traces connect the electronic components and chips according to the circuit design to achieve functions such as power supply, electrical signal transmission, and grounding. Electronic components may include, for example, capacitors, resistors, transistors, and metal-oxide-semiconductor field-effect transistors (MOSFETs). Chips may include, for example, microcontroller units (MCUs), laser driver chips, transimpedance amplifiers (TIAs), limiting amplifiers (LIAs), clock and data recovery chips (CDRs), power management chips, and digital signal processing (DSP) chips.

[0081] Circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also perform a load-bearing function. For example, the rigid circuit board can stably support the aforementioned electronic components and chips. The rigid circuit board can also be inserted into the electrical connector in the cage 106 of the host computer 100.

[0082] The circuit board 300 also includes gold fingers formed on its end surfaces, each gold finger consisting of a plurality of independent pins. The circuit board 300 is inserted into a cage 106 and is electrically connected to an electrical connector within the cage 106 by the gold fingers. The gold fingers may be located only on one side of the surface of the circuit board 300 (e.g., ...). Figure 4 The upper surface shown can also be positioned on the upper and lower surfaces of the circuit board 300 to provide a greater number of pins, thus adapting to applications with high pin count requirements. The gold fingers are configured to establish an electrical connection with the host computer to achieve power supply, grounding, two-wire synchronous serial (Inter-Integrated Circuit, I2C) signal transmission, and data signal transmission. Of course, flexible circuit boards are also used in some optical modules. Flexible circuit boards are generally used in conjunction with rigid circuit boards as a supplement to rigid circuit boards.

[0083] In some embodiments, the optical transceiver component may include a light source 910. The light source 910 can be a distributed feedback light source, differing in that it incorporates a Bragg grating and is a side-emitting semiconductor light source. Currently, distributed feedback light sources primarily use semiconductor materials as the dielectric, including gallium antimonyide, gallium arsenide, indium phosphide, and zinc sulfide. The most significant characteristics of distributed feedback light sources are their excellent monochromaticity, with linewidths typically below 1 MHz, and very high side-mode rejection ratios, currently reaching over 40-50 dB.

[0084] The light source 910 can be used to output light without carrying data. Specifically, the bottom surface of the light source 910 can be arranged on the substrate, and the light source 910 can output light through the side surface, and the output light enters the optical chip 920. The optical chip 920 uses silicon as the main base material, and silicon is not an ideal light-emitting material, so the optical chip 920 cannot integrate the light source 910, and an external light source 910 is needed to provide light. The light provided by the light source 910 to the optical chip 920 is light with a single wavelength and stable power, and does not carry data. The light is modulated by the optical chip 920 to load data into the light.

[0085] The optical chip 920 can be a silicon optical chip or a lithium niobate chip.

[0086] The optical chip 920 can be arranged on the circuit board 300 and electrically connected to the circuit board 300. Specifically, the optical chip 920 can be connected to the circuit board 300 by wire bonding. Therefore, the optical chip 920 is generally arranged on the surface of the circuit board 300.

[0087] The optical chip 920 and the light source 910 can be optically connected through an optical fiber ribbon. The optical chip 920 can receive light from the light source 910 through the optical fiber ribbon, and then modulate the light, specifically, load signals onto the light. The optical chip 920 and the optical fiber socket are optically connected through the optical fiber ribbon. The optical fiber socket is optically connected to the external optical fiber of the optical module. The light modulated by the optical chip 920 is transmitted to the optical fiber socket through the optical fiber ribbon, and then transmitted to the external optical fiber through the optical fiber socket. The light transmitted from the external optical fiber is transmitted to the optical fiber ribbon through the optical fiber socket, and then transmitted to the optical chip 920 through the optical fiber ribbon. Thus, the optical chip 920 can output or receive light carrying data to or from the external optical fiber of the optical module.

[0088] In some embodiments, the optical chip 920 can include an MZM modulator (Mach-Zehnder modulator). The MZM modulator can modulate the light without carrying data into an optical signal, so that the optical chip 920 can modulate the light without carrying data emitted by the light source 910 into an optical signal.

[0089] In some embodiments, the surface of the circuit board 300 can be provided with a DSP chip 310. The DSP chip 310 can be connected to the optical chip 920, so that the optical chip 920 and the DSP chip 310 can exchange information, and the DSP chip 310 can provide a driving signal to the optical chip 920. The driving signal can include an alternating current signal and a direct current signal, and the direct current signal can be a common-mode voltage.

[0090] In some embodiments, the driving chip is not integrated in the DSP chip 310, and the driving chip can be arranged on the circuit board 300 or on the optical chip 920. One end of the driving chip can be connected with the DSP chip 310, and the other end of the driving chip can be connected with the optical chip 920, so that the DSP chip 310 can be connected with the optical chip 920.

[0091] In some embodiments, the driving chip is integrated in the DSP chip 310. For example, the DSP chip 310 includes a driving module, which can output the first driving signal and the second driving signal, so that the DSP chip 310 can output the first driving signal and the second driving signal.

[0092] Figure 5 A structural diagram of an MZM modulator according to some embodiments is shown. As shown in the figure, in some embodiments, the MZM modulator can include an input waveguide 925. The input waveguide 925 can be optically connected with the light source 910, so that the MZM modulator can receive the light emitted by the light source 910 without carrying data. Figure 5

[0093] In some embodiments, the MZM modulator can include a beam splitter 923. One end of the beam splitter 923 can be connected with the input waveguide 925 to receive the light input by the input waveguide 925 without carrying data. The beam splitter 923 can divide the light without carrying data into two equal parts.

[0094] In some embodiments, the MZM modulator can include an interference arm 922. The interference arm 922 can include a first interference arm 9221. The input end of the first interference arm 9221 can be connected with the first output end of the beam splitter 923, so that the light transmitted by the beam splitter 923 is transmitted to the first interference arm 9221.

[0095] The interference arm 922 can include a second interference arm 9222. The input end of the second interference arm 9222 can be connected with the second output end of the beam splitter 923, so that the light transmitted by the beam splitter 923 is transmitted to the second interference arm 9222.

[0096] In some embodiments, the MZM modulator can include a beam combiner 924. The first input end of the beam combiner 924 can be connected with the first interference arm 9221. The second input end of the beam combiner 924 can be connected with the second interference arm 9222. The beam combiner 924 can combine the light transmitted by the first interference arm 9221 to the beam combiner 924 and the light transmitted by the second interference arm 9222 to the beam combiner 924.

[0097] ​In some embodiments, the MZM modulator can include an output waveguide 926. An input end of the output waveguide 926 can be connected with an output end of the combiner 924 to receive the optical signal and output. An output end of the output waveguide 926 can be connected with a fiber ribbon so that the optical signal can be emitted through the fiber ribbon.

[0098] In some embodiments, the MZM modulator can include a modulation electrode 921. The modulation electrode 921 can include a first modulation electrode 9211. The first modulation electrode 9211 can be disposed on the first interference arm 9221. The first modulation electrode 9211 can receive the first driving signal output by the DSP chip 310 and dynamically change the refractive index of the first interference arm 9221 through the electro-optic effect under the action of the first driving signal to change the phase of the light input into the first interference arm 9221, so as to realize optical modulation.

[0099] The modulation electrode 921 can include a second modulation electrode 9212. The second modulation electrode 9212 can be disposed on the second interference arm 9222. The second modulation electrode 9212 can receive the second driving signal output by the DSP chip 310 and dynamically change the refractive index of the second interference arm 9222 through the electro-optic effect under the action of the second driving signal to change the phase of the light input into the second interference arm 9222, so as to realize optical modulation.

[0100] In some embodiments, the MZM modulator can include an optical phase shifter 927. The optical phase shifter 927 can be disposed on the interference arm 922. The optical phase shifter 927 can compensate for the initial phase error and optimize the working point of the MZM modulator by changing the refractive index of the interference arm 922.

[0101] The first modulation electrode 9211, the second modulation electrode 9212, and the optical phase shifter 927 work together to ensure that the MZM modulator works stably under high bandwidth and low distortion conditions.

[0102] In some embodiments, the optical phase shifter 927 can be disposed on the first interference arm 9221 to adjust the refractive index of the first interference arm 9221.

[0103] In some embodiments, the optical phase shifter 927 can be disposed on the second interference arm 9222 to adjust the refractive index of the second interference arm 9222.

[0104] In some embodiments, the optical phase shifter 927 can be disposed on the first interference arm 9221 and the second interference arm 9222 to adjust the refractive index of the first interference arm 9221 and the second interference arm 9222.

[0105] In some embodiments, the optical phase shifter 927 can be a heater. The power of the heater is adjusted by adjusting the current of the heater, and in turn the temperature of the interference arm 922 is adjusted, so that the refractive index of the interference arm 922 is adjusted.

[0106] In some embodiments, the optical phase shifter 927 can be an electrode. The power of the electrode is adjusted by adjusting the voltage of the electrode, and in turn the concentration of carriers in the interference arm 922 is adjusted, so that the refractive index of the interference arm 922 is adjusted.

[0107] In some embodiments, the driving chip is arranged outside the DSP chip 310, and two capacitors can be arranged between the driving chip and the DSP chip 310. One end of the capacitor can be connected with the DSP chip 310, and the other end of the capacitor can be connected with the driving chip. The capacitor has the characteristic of "blocking direct current and passing alternating current", so that the common-mode voltage of the driving signal output by the DSP chip 310 can be reduced to zero after passing through the capacitor and the driving chip, that is, only an alternating current signal.

[0108] The following introduces that the driving chip is integrated in the DSP chip 310, and the connection relationship between the DSP chip 310 and the optical chip 920.

[0109] Figure 6 An internal structure diagram of an optical module according to some embodiments is provided. As shown in Figure 6 In some embodiments, a first capacitor 320 is arranged between the optical chip 920 and the DSP chip 310. The ground end of the first capacitor 320 is grounded, the first signal end of the first capacitor 320 can be connected with the optical chip 920, and the second signal end of the first capacitor 320 can be connected with the DSP chip 310, so that the optical chip 920 and the DSP chip 310 are connected. The first capacitor 320 has the characteristic of "blocking direct current (direct current signal) and passing alternating current (alternating current signal)", so as to block the direct current signal of the driving signal output by the DSP chip 310, so that the driving signal output by the DSP chip 310 is only an alternating current signal after passing through the first capacitor 320.

[0110] In some embodiments, a second capacitor 330 is arranged between the optical chip 920 and the DSP chip 310. The ground end of the second capacitor 330 is grounded, the first signal end of the second capacitor 330 can be connected with the optical chip 920, and the second signal end of the second capacitor 330 can be connected with the DSP chip 310, so that the optical chip 920 and the DSP chip 310 are connected. The second capacitor 330 has the characteristic of "blocking direct current (direct current signal) and passing alternating current (alternating current signal)", so as to block the direct current signal of the driving signal output by the DSP chip 310, so that the driving signal output by the DSP chip 310 is only an alternating current signal after passing through the second capacitor 330.

[0111] Figure 7 An internal structure principle of an optical module according to some embodiments is provided. Figure 1 .Figure 8 Internal structure principle of an optical module according to some embodiments Figure 2 As shown in FIG. 9, in some embodiments, the first output pin 311 of the DSP chip 310 can be connected with the first signal end of the first capacitor 320, and the second end of the first capacitor 320 can be connected with the first signal end of the first modulation electrode 9211 of the optical chip 920, so that the driving signal outputted by the first output pin 311 of the DSP chip 310 is only an alternating current signal after passing through the first capacitor 320. Figure 7 Figure 8 As shown in FIG. 9, in some embodiments, the second output pin 312 of the DSP chip 310 can be connected with the first end of the second capacitor 330, and the second end of the second capacitor 330 can be connected with the first end of the second modulation electrode 9212 of the optical chip 920, so that the driving signal outputted by the second output pin 312 of the DSP chip 310 is only an alternating current signal after passing through the second capacitor 330.

[0112] The driving module of the DSP chip 310 can be connected with the first output pin 311, so that the first driving signal outputted by the driving module is outputted through the first output pin 311. The driving module of the DSP chip 310 can be connected with the second output pin 312, so that the second driving signal outputted by the driving module is outputted through the second output pin 312.

[0113] The first output pin 311 of the DSP chip 310 can be connected with the first signal end of the first capacitor 320, and the second end of the first capacitor 320 can be connected with the first signal end of the first modulation electrode 9211 of the optical chip 920, and the second output pin 312 of the DSP chip 310 can be connected with the first end of the second capacitor 330, and the second end of the second capacitor 330 can be connected with the first end of the second modulation electrode 9212 of the optical chip 920, so that the DSP chip 310 and the optical chip 920 are AC coupled.

[0114] In some embodiments, the optical chip 920 can include a resistor 928. The resistor 928 can include a first resistor 9281. The first end of the first resistor 9281 can be connected with the second end of the first modulation electrode 9211, and the second end of the first resistor 928 can be grounded or connected with the first power supply chip 340. The voltage of the other end of the first resistor 928 is VMOD.

[0115] The resistor 928 can include a second resistor 9282. The first end of the second resistor 9282 can be connected with the second end of the second modulation electrode 9212, and the second end of the second resistor 9282 can be connected with the second end of the first resistor 9282, so that the voltage of the second end of the second resistor 9282 is also VMOD.

[0116] The resistor 928 can include a second resistor 9282. The first end of the second resistor 9282 can be connected with the second end of the second modulation electrode 9212, and the second end of the second resistor 9282 can be connected with the second end of the first resistor 9282, so that the voltage of the second end of the second resistor 9282 is also VMOD. ​

[0117] In some embodiments, the optical chip 920 may include a diode 929. The diode 929 may include a first diode 9291. One end of the first diode 9291 may be connected to the third end of the first modulation electrode 9211, and the other end of the first diode 9291 may be grounded or connected to the first power supply chip 340. The voltage at the other end of the first diode 9291 is VB.

[0118] The first diode 9291 can be an equivalent circuit of multiple first sub-diodes. The first sub-diode can be a first PN junction integrated within an MZM modulator. The first PN junction changes the refractive index of the first interference arm 9221 through carrier dispersion.

[0119] Diode 929 may include a second diode 9292. One end of the second diode 9292 may be connected to the third end of the second modulation electrode 9212, and the other end of the second diode 9292 may be connected to the other end of the first diode 9291, so that one end of the second diode 9292 can be grounded or connected to the first power supply chip 340. The voltage at the other end of the second diode 9292 is VB.

[0120] The second diode 9292 can be an equivalent circuit of multiple second sub-diodes. The second sub-diode can be a second PN junction integrated within an MZM modulator. The second PN junction changes the refractive index of the second interference arm 9222 through carrier dispersion.

[0121] In some embodiments, the first power chip 340 can provide operating voltage to the first diode 9291 and the second diode 9292 so that the first diode 9291 and the second diode 9292 can operate normally. For example, the voltage output by the first power chip 340 is Vpn, where Vpn is the voltage difference between the positive and negative terminals of the first diode 9291 and the second diode 9292.

[0122] The larger the VPN, the higher the bandwidth; the smaller the VPN, the lower the bandwidth. Therefore, the bandwidth can be adjusted based on the VPN.

[0123] like Figure 7 As shown, in some embodiments, the positive terminal of the first diode 9291 is connected to the third terminal of the first modulation electrode 9211, the negative terminal of the first diode 9291 is connected to the first power chip 340, and the other end of the first resistor 9281 is grounded; the positive terminal of the second diode 9292 is connected to the third terminal of the second modulation electrode 9212, the negative terminal of the second diode 9292 is connected to the negative terminal of the first diode 9291, and the other end of the second resistor 9282 is grounded.

[0124] Part of the current signal flows from the first power chip 340 to ground via the first diode 9291, the first modulation electrode 9211 and the first resistor 9281 in sequence, and part of the current signal flows from the first power chip 340 to ground via the second diode 9292, the second modulation electrode 9212 and the second resistor 9282 in sequence.

[0125] Based on the direction of the current signal, VB - VMOD = Vpn, and VMOD = 0 (grounded), we can conclude that VB = Vpn.

[0126] like Figure 8 As shown, in some embodiments, the negative terminal of the first diode 9291 is connected to the third terminal of the first modulation electrode 9211, the positive terminal of the first diode 9291 is grounded, and the other end of the first resistor 9281 is connected to the first power chip 340; the negative terminal of the second diode 9292 is connected to the third terminal of the second modulation electrode 9212, the positive terminal of the second diode 9292 is grounded, and the other end of the second resistor 9282 is connected to the first power chip 340.

[0127] Part of the current signal flows from the first power chip 340 to ground via the first resistor 9281, the first modulation electrode 9211 and the first diode 9291 in sequence, and part of the current signal flows from the first power chip 340 to ground via the second resistor 9282, the second modulation electrode 9212 and the second diode 9292 in sequence.

[0128] Based on the direction of the current signal, VMOD-Vpn=VB, and VB=0 (grounded), we can conclude that VMOD=Vpn.

[0129] However, due to the presence of the first capacitor 320 and the second capacitor 330, discontinuities will occur in the driving signal at the first capacitor 320 and the second capacitor 330. To solve this problem, in some embodiments, the DSP chip 310 and the optical chip 920 are not connected through the first capacitor 320 and the second capacitor 330, but are directly connected, i.e., DC coupling. The difference between the common-mode voltage of the first driving signal on the first modulation electrode 9211 and the voltage at the second terminal of the first resistor 9281 is within a first preset range, and the difference between the common-mode voltage of the second driving signal on the second modulation electrode 9212 and the voltage at the second terminal of the second resistor 9282 is within the first preset range. For example, the first preset range is -50mV to 50mV.

[0130] The direct connection between the DSP chip 310 and the optical chip 920 effectively reduces the discontinuity of the driving signal at the first capacitor 320 and the second capacitor 330, thereby improving the stability and accuracy of signal transmission. The difference between the common-mode voltage of the first driving signal on the first modulation electrode 9211 and the voltage at the second terminal of the first resistor 9281 is within a first preset range, indicating that the common-mode voltage of the first driving signal on the first modulation electrode 9211 and the voltage at the second terminal of the first resistor 9281 are approximately equal, ensuring the continuity of the first driving signal. Similarly, the difference between the common-mode voltage on the second modulation electrode 9212 and the voltage at the second terminal of the second resistor 9282 is within a first preset range, indicating that the common-mode voltage at the first terminal of the second modulation electrode 9212 and the voltage at the second terminal of the second resistor 9282 are approximately equal, ensuring the continuity of the second driving signal. Furthermore, this connection method simplifies the circuit structure, reduces circuit complexity, and facilitates the miniaturization and integration of the optical module.

[0131] Figure 9 This is an internal structural diagram of another optical module provided according to some embodiments. For example... Figure 9 As shown, in some embodiments, the optical chip 920 is directly connected to the DSP chip 310.

[0132] Figure 10 This describes the internal structural principle of another optical module according to some embodiments. Figure 1 . Figure 11 This describes the internal structural principle of another optical module according to some embodiments. Figure 2 .like Figure 10 and Figure 11 As shown, in some embodiments, the first output pin 311 of the DSP chip 310 can be connected to the first end of the first modulation electrode 9211 of the optical chip 920, so that the common-mode voltage VCM of the first drive signal output through the first output pin 311 of the DSP chip 310 is not zero after it reaches the first modulation electrode 9211, that is, the first drive signal includes AC signal and DC signal.

[0133] The second output pin 312 of the DSP chip 310 can be connected to the first end of the second modulation electrode 9212 of the optical chip 920 so that the common mode voltage VCM of the electrical signal output by the second output pin 312 of the DSP chip 310 is not zero after it reaches the second modulation electrode 9212, that is, the driving signal includes AC signal and DC signal.

[0134] In some embodiments, the optical chip 920 may include a resistor 928. Resistor 928 may include a first resistor 9281. A first terminal of the first resistor 9281 may be connected to a second terminal of the first modulation electrode 9211. The voltage at the other terminal of the first resistor 928 is VMOD.

[0135] The resistor 928 can include a second resistor 9282. A first end of the second resistor 9282 can be connected with the second end of the second modulation electrode 9212, and a second end of the second resistor 9282 can be connected with the second end of the first resistor 9282, so that the voltage of the second end of the second resistor 9282 is also VMOD.

[0136] In some embodiments, the optical chip 920 can include a diode 929. The diode 929 can include a first diode 9291. One end of the first diode 9291 can be connected with the third end of the first modulation electrode 9211, and the other end of the first diode 9291 can be connected with the second power supply chip 350. The voltage of the other end of the first diode 9291 is VB.

[0137] The first diode 9291 can be an equivalent circuit of a plurality of first sub-diodes. The first sub-diode can be a first PN junction integrated within the MZM modulator. The first PN junction changes the refractive index of the first interference arm 9221 through the carrier dispersion effect.

[0138] The diode 929 can include a second diode 9292. One end of the second diode 9292 can be connected with the third end of the second modulation electrode 9212, and the other end of the second diode 9292 can be connected with the other end of the first diode 9291, so that the one end of the second diode 9292 can be connected with the second power supply chip 350. The voltage of the other end of the other end of the second diode 9292 is VB.

[0139] The second diode 9292 can be an equivalent circuit of a plurality of second sub-diodes. The second sub-diode can be a second PN junction integrated within the MZM modulator. The second PN junction changes the refractive index of the second interference arm 9222 through the carrier dispersion effect.

[0140] In some embodiments, the second power supply chip 350 can provide operating voltages for the first diode 9291 and the second diode 9292, so that the first diode 9291 and the second diode 9292 can work normally.

[0141] One end of the first diode 9291 can be connected with the third end of the first modulation electrode 9211, and the other end of the first diode 9291 can be connected with the second power supply chip 350. One end of the second diode 9292 can be connected with the third end of the second modulation electrode 9212, and the other end of the second diode 9292 can be connected with the other end of the first diode 9291.

[0142] In some embodiments, the second end of the second resistor 9282 can be connected to the third power chip 360, and the difference between the input voltage of the third power chip 360 and the common-mode voltage of the second drive signal on the second modulation electrode 9212 is less than a first preset range.

[0143] Since the second end of the second resistor 9282 is connected to the second end of the first resistor 9281, the second end of the second resistor 9282 can be connected to the third power chip 360, and the second end of the first resistor 9281 can be connected to the third power chip 360. The second end of the first resistor 9281 can be connected to the third power chip 360, and the difference between the input voltage of the third power chip 360 and the common-mode voltage of the first drive signal on the first modulation electrode 9211 is less than a first preset range.

[0144] The voltage difference between the input voltage VMOD of the third power chip 360 and the common-mode voltage VCM is less than a first preset range, so that the difference between the common-mode voltage on the first modulation electrode 9211 and the voltage at the second end of the first resistor 9281 is within the first preset range. The difference between the input voltage of the third power chip 360 and the common-mode voltage of the second drive signal on the second modulation electrode 9212 is less than a first preset range, so that the difference between the common-mode voltage on the second modulation electrode 9212 and the voltage at the second end of the second resistor 9282 is within the first preset range.

[0145] In some embodiments, the third power chip 360 can be a SINK type power supply, which is a power supply that inputs current inwardly, and its core function is to absorb, consume or manage current in external circuits. The third power chip 360 is a power supply that inputs current inwardly, so that the current on the first modulation electrode 9211 and the second modulation electrode 9212 can flow to the third power chip 360, effectively avoiding current leakage and interference.

[0146] In some embodiments, the input voltage VMOD of the third power chip 360 is less than the common-mode voltage VCM of the first drive signal, which can reduce loss.

[0147] In some embodiments, the second end of the second resistor 9282 can be suspended. In a circuit, when one end of a resistor is suspended, it is equivalent to the circuit in which the resistor is located being disconnected, so no current flows through the resistor, and the voltage at the suspended end depends on whether the other end is connected to a voltage source or other node. The second end of the second resistor 9282 is suspended, and the voltage at the second end of the second resistor 9282 is equal to the common-mode voltage of the second drive signal, i.e., the voltage at the second end of the second resistor 9282 is within the first preset range of the common-mode voltage of the second drive signal.

[0148] Since the second end of the second resistor 9282 is connected with the second end of the first resistor 9281, the second end of the second resistor 9282 is suspended, and then the second end of the first resistor 9281 is suspended. The second end of the first resistor 9281 is suspended, and the voltage of the second end of the first resistor 9281 is equal to the common-mode voltage of the first driving signal, that is, the voltage of the second end of the first resistor 9281 is within the first preset range with the common-mode voltage of the first driving signal.

[0149] As shown in Figure 10 and Figure 11 The second end of the first resistor 9281 and the second end of the second resistor 9282 are connected with the third power supply chip 360.

[0150] As shown in Figure 10 In some embodiments, the anode end of the first diode 9291 is connected with the third end of the first modulation electrode 9211, the cathode end of the first diode 9291 is connected with the second power supply chip 350, and the other end of the first resistor 9281 is connected with the third power supply chip 360; the anode end of the second diode 9292 is connected with the third end of the second modulation electrode 9212, and the cathode end of the second diode 9292 is connected with the cathode end of the first diode 9291.

[0151] As shown in Figure 11 The cathode end of the first diode 9291 is connected with the third end of the first modulation electrode 9211, the anode end of the first diode 9291 is grounded, and the other end of the first resistor 9281 is connected with the second power supply chip 350; the cathode end of the second diode 9292 is connected with the third end of the second modulation electrode 9212, and the anode end of the second diode 9292 is grounded.

[0152] As shown in Figure 10 Part of the current signal flows from the first output pin 311 of the DSP chip 310 to the third power supply chip 360 through the first modulation electrode 9211 and the first resistor 9281 in turn, part of the current signal flows from the second output pin 312 of the DSP chip 310 to the third power supply chip 360 through the second modulation electrode 9212 and the second resistor 9282 in turn, part of the current signal flows from the second power supply chip 350 through the first diode 9291 and the first modulation electrode 9211 in turn, and part of the current signal flows from the second power supply chip 350 through the second diode 9292 and the second modulation electrode 9212 in turn.

[0153] According to the direction of the current signal, VB-Vpn=VCM is obtained, and it is known that VB=Vpn+VCM, that is, the voltage that the second power supply chip 350 can output is Vpn+VCM.

[0154] As shown in Figure 11As shown, part of the current signal flows from the first output pin 311 of the DSP chip 310 to the third power supply chip 360 through the first modulation electrode 9211 and the first resistor 9281 in sequence, part of the current signal flows from the second output pin 312 of the DSP chip 310 to the third power supply chip 360 through the second modulation electrode 9212 and the second resistor 9282 in sequence, part of the current signal flows from the first modulation electrode 9211 to the second power supply chip 350 through the first diode 9291 in sequence, and part of the current signal flows from the second modulation electrode 9212 to the second power supply chip 350 through the second diode 9292 in sequence.

[0155] According to the direction of the current signal, VCM-Vpn=VB can be obtained, and it can be known that VB=VCM-Vpn, that is, the voltage that the second power supply chip 350 can output is VCM-Vpn.

[0156] Figure 12 Another internal structure principle of an optical module according to some embodiments Figure 3 . Another internal structure principle of an optical module according to some embodiments Figure 13 . Another internal structure principle of an optical module according to some embodiments Figure 4 . As shown in Figure 12 and Figure 13 , the second end of the first resistor 9281 and the second end of the second resistor 9282 are both suspended.

[0157] As shown in Figure 12 , in some embodiments, the anode end of the first diode 9291 is connected with the third end of the first modulation electrode 9211, and the cathode end of the first diode 9291 is connected with the second power supply chip 350; the anode end of the second diode 9292 is connected with the third end of the second modulation electrode 9212, and the cathode end of the second diode 9292 is connected with the cathode end of the first diode 9291.

[0158] As shown in Figure 13 , in some embodiments, the cathode end of the first diode 9291 is connected with the third end of the first modulation electrode 9211, and the anode end of the first diode 9291 is grounded; the cathode end of the second diode 9292 is connected with the third end of the second modulation electrode 9212, and the anode end of the second diode 9292 is grounded.

[0159] As shown in Figure 12 , in the circuit, when one end of the resistor is suspended, it is equivalent to that the circuit in which the resistor is located is disconnected, and no current flows through the resistor. As shown in Figure 12As shown, the second terminals of the first resistor 9281 and the second resistor 9282 are both floating, and no current flows through the first resistor 9281 and the second resistor 9282. Therefore, part of the current signal flows from the second power chip 350 through the first diode 9291 and the first modulation electrode 9211 in sequence, and part of the current signal flows from the second power chip 350 through the second diode 9292 and the second modulation electrode 9212 in sequence.

[0160] Based on the current signal direction, we can obtain VB - Vpn = VCM, and thus VB = Vpn + VCM. That is, the voltage that the second power supply chip 350 can output is Vpn + VCM.

[0161] like Figure 13 As shown, in a circuit, when one end of a resistor is left floating, it is equivalent to an open circuit in the circuit containing the resistor, meaning no current flows through the resistor. Figure 13 As shown, the second terminals of the first resistor 9281 and the second terminals of the second resistor 9282 are both floating, and no current flows through the first resistor 9281 and the second resistor 9282. Part of the current signal flows from the first modulation electrode 9211 through the first diode 9291 and the second power chip 350 in sequence, and part of the current signal flows from the second modulation electrode 9212 through the second diode 9292 and the second power chip 350 in sequence.

[0162] Based on the direction of the current signal, VCM-Vpn = VB. Therefore, VB = VCM-Vpn, which means that the voltage that the second power supply chip 350 can output is VCM-Vpn.

[0163] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this disclosure, and are not intended to limit them. Although this disclosure has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this disclosure.

Claims

1. An optical module characterized by comprising: include: Circuit board; A light source, electrically connected to the circuit board, is used to emit light that does not carry data. An optical chip, connected to the light source, is used to modulate light that does not carry data into an optical signal; The circuit board is provided with: Digital signal processing chips, including: The first output pin is used to output the first drive signal; The second output pin is used to output the second drive signal; First power chip; The first capacitor has its first signal terminal connected to the first output pin. The second capacitor has its first signal terminal connected to the second output pin. The optical chip includes: The first modulation electrode has its first end connected to the second signal end of the first capacitor to receive the first driving signal; The second modulation electrode has its first end connected to the second signal end of the second capacitor to receive the second driving signal; The first resistor has its first end connected to the second end of the first modulation electrode. The second resistor has its first end connected to the second end of the second modulation electrode and its second end connected to the second end of the first resistor. The first diode has one end connected to the third end of the first modulation electrode; The second diode has one end connected to the third end of the second modulation electrode and the other end connected to the other end of the first diode; The second end of the second resistor is connected to the first power chip, and the other end of the second diode is grounded; or, the other end of the second diode is connected to the first power chip, and the second end of the second resistor is grounded.

2. The optical module according to claim 1, characterized by The second end of the second resistor is grounded, the positive terminal of the first diode is connected to the third end of the first modulation electrode, and the negative terminal of the first diode is connected to the first power chip. The positive terminal of the second diode is connected to the third terminal of the second modulation electrode, and the negative terminal of the second diode is connected to the first power chip.

3. The optical module according to claim 1, characterized by The second end of the second resistor is connected to the first power chip, the negative terminal of the first diode is connected to the third end of the first modulation electrode, and the positive terminal of the first diode is grounded. The negative terminal of the second diode is connected to the third terminal of the second modulation electrode, and the positive terminal of the second diode is connected to the positive terminal of the first diode.

4. The optical module according to claim 1, characterized by The digital signal processing chip includes: The driver module is connected to the first output pin and the second output pin.

5. The optical module according to claim 1, characterized by The optical chip also includes: Input waveguide; The input end of the beam splitter is connected to the input waveguide. The first interference arm has its input end connected to the first output end of the beam splitter; the first modulation electrode is disposed on the first interference arm. The second interference arm has its input end connected to the second output end of the beam splitter; the second modulation electrode is disposed on the second interference arm. A beam combiner, with its first input end connected to the output end of the first interferometer arm and its second input end connected to the output end of the second interferometer arm; The output waveguide is connected to the output end of the optical combiner.

6. The optical module according to claim 5, characterized by The optical chip also includes: An optical phase shifter is mounted on the first interference arm.

7. The optical module according to claim 6, characterized by The optical phase shifter is a heater.

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