Optical module
By using DC coupling between the digital signal processing chip and the optical chip, the problem of discontinuous driving signals in the optical module is solved, achieving signal continuity and stability, and improving the transmission efficiency of the optical module.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-31
- Publication Date
- 2026-03-27
AI Technical Summary
In the photoelectric signal conversion process, existing optical modules exhibit discontinuity in the driving signal at the coupling capacitor, which affects the continuity and stability of signal transmission.
A digital signal processing chip and an optical chip are used to achieve DC coupling. The common-mode voltage of the drive signal is ensured to be within a preset range through the connection of the first and second resistors, the first and second diodes, and the third power supply chip, avoiding direct connection through the coupling capacitor.
This effectively reduces the discontinuity of the driving signal at the coupling capacitor, ensuring signal continuity and stability, and improving the transmission efficiency and reliability of the optical module.
Smart Images

Figure CN224054264U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present disclosure relates to the field of optical fiber communication technology, and in particular to an optical module. BACKGROUND
[0002] With the development of new business and application modes such as cloud computing, mobile Internet, video, etc., the development and progress of optical communication technology becomes increasingly important. In optical communication technology, an optical module is a tool for converting optical signals and electrical signals, and is one of the key devices in optical communication equipment. With the development of optical communication technology, the transmission rate of the optical module is continuously improved. CONTENT OF THE UTILITY MODEL
[0003] The present disclosure provides an optical module, a digital signal processing chip and an optical chip are directly coupled.
[0004] In some embodiments, an optical module is provided, comprising:
[0005] a circuit board;
[0006] a light source, electrically connected to the circuit board, for emitting light without carrying data;
[0007] an optical chip, optically connected to the light source, for modulating the light without carrying data into an optical signal;
[0008] wherein the circuit board is provided with:
[0009] a digital signal processing chip, comprising:
[0010] a first output pin for outputting a first driving signal;
[0011] a second output pin for outputting a second driving signal;
[0012] a second power supply chip;
[0013] the optical chip comprises:
[0014] a first modulation electrode, a first end of which is connected to the first output pin to receive the first driving signal; the common-mode voltage of the first driving signal is not zero;
[0015] a second modulation electrode, a first end of which is connected to the second output pin to receive the second driving signal; the common-mode voltage of the second driving signal is not zero;
[0016] a first resistor, a first end of which is connected to a second end of the first modulation electrode;
[0017] a second resistor, a first end of which is connected to a second end of the second modulation electrode, and a second end of which is connected to a second end of the first resistor;
[0018] a first diode, one end of which is connected to the third end of the first modulation electrode, and the other end of which is connected to the second power supply chip;
[0019] a second diode, one end of which is connected to the third end of the second modulation electrode, and the other end of which is connected to the other end of the first diode, so that the other end of the second diode is connected to the second power supply chip;
[0020] a difference between a common-mode voltage of the first drive signal and a voltage at the second end of the first resistor is less than a first preset range, and a difference between a common-mode voltage of the second drive signal and a voltage at the second end of the second resistor is less than the first preset range.
[0021] The technical scheme has the following beneficial effects: the present disclosure provides an optical module, which comprises a circuit board, a light source and a light chip. The light source is electrically connected to the circuit board, and the light chip is electrically connected to the circuit board. The light source is used for emitting light without carrying data. The light chip is optically connected to the light source to receive the light without carrying data emitted by the light source. The light chip is used for modulating the light without carrying data into an optical signal. The circuit board is provided with a digital signal processing chip and a second power supply chip. The digital signal processing chip comprises a first output pin and a second output pin. The first output pin is used for outputting a first driving signal, and the second output pin is used for outputting a second driving signal. The light chip comprises a first modulation electrode, a second modulation electrode, a first resistor, a second resistor, a first diode and a second diode. A first end of the first modulation electrode is connected to the first output pin to receive the first driving signal. A second end of the first modulation electrode is connected to a first end of the first resistor. A third end of the first modulation electrode is connected to one end of the first diode, and the other end of the first diode is connected to the second power supply chip. A first end of the second modulation electrode is connected to the second output pin to receive the second driving signal. A second end of the second modulation electrode is connected to a first end of the second resistor. A third end of the second modulation electrode is connected to one end of the second diode, and the other end of the second diode is connected to the other end of the first diode to make the other end of the second diode connected to the second power supply chip. The second power supply chip is used for providing working voltage for the first diode and the second diode, so that the first diode and the second diode can work normally. The common-mode voltage of the first driving signal is not zero, and the common-mode voltage of the second driving signal is not zero, which indicates that the digital signal processing chip is not connected to the light chip through a coupling capacitor, but is directly connected, i.e. direct coupling, which can effectively reduce the discontinuity of the first driving signal and the second driving signal at the coupling capacitor. The difference between the common-mode voltage of the first driving signal and the voltage of the second end of the first resistor is less than a first preset range, which indicates that the common-mode voltage of the first driving signal is approximately equal to the voltage of the second end of the first resistor, so that the first driving signal is continuous. The difference between the common-mode voltage of the second driving signal and the voltage of the second end of the second resistor is less than a first preset range, which indicates that the common-mode voltage of the first driving signal is approximately equal to the voltage of the second end of the first resistor, so that the first driving signal is continuous.
[0022] In some embodiments, an optical module is provided, and the surface of the circuit board is further provided with:
[0023] a third power supply chip connected to the second end of the second resistor.
[0024] The technical scheme has the following beneficial effects: the surface of the circuit board is further provided with a third power supply chip, the third power supply chip is connected with the second end of the second resistor, so that the output voltage of the third power supply chip is the voltage of the second end of the second resistor, and then the difference between the output voltage of the third power supply chip and the common-mode voltage of the first drive signal is less than the first preset range. Since the second end of the second resistor is connected with the second end of the first resistor, and the third power supply chip is also connected with the second end of the first resistor, the output voltage of the third power supply chip is the voltage of the second end of the first resistor, and then the difference between the output voltage of the third power supply chip and the common-mode voltage of the second drive signal is less than the first preset range.
[0025] In some embodiments, a light module is provided, and the second end of the second resistor is suspended.
[0026] The technical scheme has the following beneficial effects: the second end of the second resistor is suspended, the second end of the second resistor is connected with the second end of the first resistor, and the second end of the first resistor is also suspended. The second end of the first resistor is suspended, and the voltage of the second end of the first resistor is equal to the common-mode voltage of the first drive signal, so that the difference between the voltage of the second end of the first resistor and the common-mode voltage of the first drive signal is within the first preset range. The second end of the second resistor is suspended, and the voltage of the second end of the second resistor is equal to the common-mode voltage of the second drive signal, so that the difference between the voltage of the second end of the second resistor and the common-mode voltage of the second drive signal is within the first preset range.
[0027] In some embodiments, a light module is provided, and the anode end of the first diode is connected with the third end of the first modulation electrode, and the cathode end of the first diode is connected with the second power supply chip.
[0028] The anode end of the second diode is connected with the third end of the second modulation electrode, and the cathode end of the second diode is connected with the second power supply chip.
[0029] The output voltage of the second power supply chip is equal to the sum of the common-mode voltage of the first drive signal and the working voltage of the first diode, and is also equal to the sum of the common-mode voltage of the second drive signal and the working voltage of the second diode.
[0030] The technical scheme has the following beneficial effects: the positive electrode end of the first diode is connected with the third end of the first modulation electrode, the negative electrode end of the first diode is connected with the second power supply chip, the output voltage of the second power supply chip is equal to the sum of the common-mode voltage of the first drive signal and the working voltage of the first diode, so that the first diode can work normally. The positive electrode end of the second diode is connected with the third end of the second modulation electrode, the negative electrode end of the second diode is connected with the second power supply chip, the output voltage of the second power supply chip is equal to the sum of the common-mode voltage of the second drive signal and the working voltage of the second diode, so that the second diode can work normally.
[0031] In some embodiments, a light module is provided, the negative electrode end of the first diode is connected with the third end of the first modulation electrode, and the positive electrode end of the first diode is connected with the second power supply chip.
[0032] The negative electrode end of the second diode is connected with the third end of the second modulation electrode, and the positive electrode end of the second diode is connected with the second power supply chip.
[0033] The output voltage of the second power supply chip is equal to the difference between the common-mode voltage of the first drive signal and the working voltage of the first diode, and is also equal to the difference between the common-mode voltage of the second drive signal and the working voltage of the second diode.
[0034] The technical scheme has the following beneficial effects: the negative electrode end of the first diode is connected with the third end of the first modulation electrode, the positive electrode end of the first diode is connected with the second power supply chip, the output voltage of the second power supply chip is equal to the difference between the common-mode voltage of the first drive signal and the working voltage of the first diode, so that the first diode can work normally. The negative electrode end of the second diode is connected with the third end of the second modulation electrode, the positive electrode end of the second diode is connected with the second power supply chip, the output voltage of the second power supply chip is equal to the difference between the common-mode voltage of the second drive signal and the working voltage of the second diode, so that the second diode can work normally.
[0035] In some embodiments, a light module is provided, the third power supply chip is a power supply inputting current inwardly.
[0036] The technical scheme has the following beneficial effects: the third power supply chip is a power supply inputting current inwardly, so that the current on the first modulation electrode and the second modulation electrode can flow to the third power supply chip, effectively avoiding current leakage and interference.
[0037] In some embodiments, a light module is provided, the digital signal processing chip comprises:
[0038] The driving module is connected with the first output pin and the second output pin.
[0039] The technical scheme has the following beneficial effects: the digital signal processing chip is internally integrated with a driving module, the driving module outputs a first driving signal and a second driving signal, the driving module is connected with a first output pin and a second output pin of the digital signal processing chip, so that the first driving signal output by the driving module is output through the first output pin, and the second driving signal is output through the second output pin.
[0040] In some embodiments, a light module is provided, and the light chip further comprises:
[0041] an input waveguide;
[0042] a light splitter, an input end of which is connected with the input waveguide;
[0043] a first interference arm, an input end of which is connected with a first output end of the light splitter; the first modulation electrode is arranged on the first interference arm;
[0044] a second interference arm, an input end of which is connected with a second output end of the light splitter; the second modulation electrode is arranged on the second interference arm;
[0045] a light combiner, a first input end of which is connected with an output end of the first interference arm, and a second input end of which is connected with an output end of the second interference arm;
[0046] an output waveguide, an output end of which is connected with the light combiner.
[0047] The technical scheme has the following beneficial effects: the light chip further comprises an input waveguide, a light splitter, a first interference arm, a second interference arm, a light combiner and an output waveguide, an input end of the light splitter is connected with the input waveguide, so that the light splitter can receive light input by the input waveguide. A first output end of the light splitter is connected with the first interference arm, and a second output end of the light splitter is connected with the second interference arm, so that the light splitter divides the light into two beams, one of which enters the first interference arm and is transmitted in the first interference arm, and the other of which enters the second interference arm and is transmitted in the second interference arm. The first modulation electrode is arranged on the first interference arm, and the refractive index of the first interference arm is changed by a first driving signal of the first modulation electrode. The second modulation electrode is arranged on the second interference arm, and the refractive index of the second interference arm is changed by a second driving signal of the second modulation electrode. An output end of the first interference arm is connected with a first input end of the light combiner, and an output end of the second interference arm is connected with a second input end of the light combiner, so that the light on the first interference arm and the second interference arm is combined into one beam. An output end of the light combiner is connected with the output waveguide, so that the light output by the light combiner enters the output waveguide and is output in the output waveguide.
[0048] In some embodiments, a light module is provided, and the light chip further comprises:
[0049] a light phase shifter, arranged on the first interference arm.
[0050] The above technical solution has the following beneficial effects: the optical chip also includes an optical phase shifter, which is disposed on the first interference arm. The refractive index of the first interference arm is changed by the optical phase shifter. Attached Figure Description
[0051] To more clearly illustrate the technical solutions of the embodiments of this disclosure, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0052] Figure 1 This is a partial structural diagram of an optical communication system according to some embodiments;
[0053] Figure 2 This is a partial structural diagram of a host computer according to some embodiments;
[0054] Figure 3 This is a structural diagram of an optical module according to some embodiments;
[0055] Figure 4 An exploded view of an optical module according to some embodiments;
[0056] Figure 5 This is a structural diagram of an MZM modulator provided according to some embodiments;
[0057] Figure 6 This is an internal structural diagram of an optical module according to some embodiments;
[0058] Figure 7 This describes the internal structural principle of an optical module according to some embodiments. Figure 1 ;
[0059] Figure 8 This describes the internal structural principle of an optical module according to some embodiments. Figure 2 ;
[0060] Figure 9 This is an internal structure diagram of another optical module provided according to some embodiments;
[0061] Figure 10 This describes the internal structural principle of another optical module according to some embodiments. Figure 1 ;
[0062] Figure 11 This describes the internal structural principle of another optical module according to some embodiments. Figure 2 ;
[0063] Figure 12 This describes the internal structural principle of another optical module according to some embodiments. Figure 3 ;
[0064] Figure 13 This describes the internal structural principle of another optical module according to some embodiments. Figure 4 . Detailed Implementation
[0065] The embodiments of this disclosure will now be described clearly and in detail with reference to the accompanying drawings. However, the described embodiments are merely some, and not all, of the embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the embodiments provided in this disclosure are within the scope of protection of this disclosure.
[0066] Unless the context otherwise requires, throughout the specification and claims, the term "comprising" is interpreted as open and inclusive, meaning "including, but not limited to"; the terms "first" and "second" should not be construed as indicating or implying relative importance or indicating an upper limit on the number; the term "multiple" means two or more; the term "connection" should be interpreted broadly, for example, "connection" can be a fixed connection, a detachable connection, or an integral part, and can be a direct connection or an indirect connection through an intermediate medium; the use of the terms "suitable for configuration" or "configured as" implies open and inclusive language, which does not exclude devices suitable for configuration or configured to perform additional tasks or steps; descriptions such as "parallel," "perpendicular," "identical," "consistent," and "aligned" are not limited to absolute mathematical theoretical relationships, but also include acceptable error ranges arising in practice, and differences based on the same design concept but due to manufacturing reasons.
[0067] In optical communication technology, to establish information transmission between information processing devices, information needs to be loaded onto light, and the propagation of light is used to transmit the information. Here, the light carrying the information is called an optical signal. When optical signals are transmitted in information transmission equipment, optical power loss can be reduced, thus enabling high-speed, long-distance, and low-cost information transmission. Information processing devices can recognize and process electrical signals. Information processing devices typically include optical network units (ONUs), gateways, routers, switches, mobile phones, computers, servers, tablets, televisions, etc., while information transmission equipment typically includes optical fibers and optical waveguides.
[0068] The optical module can realize mutual conversion between optical signals and electrical signals between the information processing device and the information transmission device. For example, at least one of the optical signal input end or the optical signal output pin of the optical module is connected with an optical fiber, and at least one of the electrical signal input end or the electrical signal output pin of the optical module is connected with an optical network terminal; a first optical signal from the optical fiber is transmitted to the optical module, the optical module converts the first optical signal into a first electrical signal, and transmits the first electrical signal to the optical network terminal; a second electrical signal from the optical network terminal is transmitted to the optical module, the optical module converts the second electrical signal into a second optical signal, and transmits the second optical signal to the optical fiber. Since information transmission can be performed between multiple information processing devices through electrical signals, at least one of the multiple information processing devices needs to be directly connected with the optical module, without the need for all the information processing devices to be directly connected with the optical module. Here, the information processing device directly connected with the optical module is referred to as a host computer of the optical module. In addition, the optical signal input end or the optical signal output pin of the optical module can be referred to as an optical port, and the electrical signal input end or the electrical signal output pin of the optical module can be referred to as an electrical port.
[0069] Figure 1 A partial structure diagram of an optical communication system according to some embodiments is provided. As shown in Figure 1 the optical communication system mainly includes a remote information processing device 1000, a local information processing device 2000, a host computer 100, an optical module 200, an optical fiber 101, and a network cable 103.
[0070] One end of the optical fiber 101 extends to the direction of the remote information processing device 1000, and the other end of the optical fiber 101 is connected with the optical module 200 through the optical port of the optical module 200. The optical signal can be totally reflected in the optical fiber 101, and the propagation of the optical signal in the totally reflected direction can almost maintain the original optical power. The optical signal is totally reflected multiple times in the optical fiber 101 to transmit the optical signal from the remote information processing device 1000 to the optical module 200, or to transmit the optical signal from the optical module 200 to the remote information processing device 1000, thereby realizing long-distance and low-power-loss information transmission.
[0071] The optical communication system can include one or more optical fibers 101, and the optical fiber 101 can be detachably connected with the optical module 200 or fixedly connected. The host computer 100 is configured to provide a data signal to the optical module 200, or receive a data signal from the optical module 200, or monitor or control the working state of the optical module 200.
[0072] The host computer 100 includes a housing substantially in the shape of a rectangular cuboid, and an optical module connecting hole 102 arranged on the housing. The optical module connecting hole 102 is configured to access the optical module 200, so as to establish one-way or two-way electrical signal connection between the host computer 100 and the optical module 200.
[0073] The host computer 100 further comprises an external electrical connection hole which can access an electrical signal network. For example, the external electrical connection hole comprises a Universal Serial Bus (USB) connection hole or a network cable connection hole 104 which is configured to access a network cable 103 to enable the host computer 100 to establish a one-way or two-way electrical signal connection with the network cable 103. One end of the network cable 103 is connected to the local information processing device 2000, and the other end of the network cable 103 is connected to the host computer 100 to establish an electrical signal connection between the local information processing device 2000 and the host computer 100 through the network cable 103. For example, a third electrical signal emitted by the local information processing device 2000 is transmitted to the host computer 100 through the network cable 103, and the host computer 100 generates a second electrical signal according to the third electrical signal, and the second electrical signal from the host computer 100 is transmitted to the optical module 200, the optical module 200 converts the second electrical signal into a second optical signal, and transmits the second optical signal to the optical fiber 101, and the second optical signal is transmitted in the optical fiber 101 to the remote information processing device 1000. For example, the first optical signal from the remote information processing device 1000 is transmitted through the optical fiber 101, the first optical signal from the optical fiber 101 is transmitted to the optical module 200, the optical module 200 converts the first optical signal into a first electrical signal, the optical module 200 transmits the first electrical signal to the host computer 100, the host computer 100 generates a fourth electrical signal according to the first electrical signal, and transmits the fourth electrical signal to the local information processing device 2000. It should be noted that the optical module is a tool for converting optical signals and electrical signals, and in the conversion process of the optical signals and the electrical signals, the information does not change, and the encoding and decoding mode of the information can change.
[0074] In addition to the optical network terminal, the host computer 100 further comprises an Optical Line Terminal (OLT), an Optical Network Terminal (ONT), or a data center server, etc.
[0075] Figure 2 A partial structural diagram of a host computer according to some embodiments. In order to clearly show the connection relationship between the optical module 200 and the host computer 100, Figure 2 Only the structure of the host computer 100 related to the optical module 200 is shown. As Figure 2As shown, the host computer 100 further comprises a PCB circuit board 105 arranged in the shell, a cage 106 arranged on the surface of the PCB circuit board 105, a heat sink 107 arranged on the cage 106, and an electrical connector arranged inside the cage 106. The electrical connector is configured to access the electrical port of the optical module 200; the heat sink 107 has a fin or other protruding structure to increase the heat dissipation area.
[0076] The optical module 200 is inserted into the cage 106 of the host computer 100, and the optical module 200 is fixed by the cage 106. The heat generated by the optical module 200 is conducted to the cage 106, and then diffused through the heat sink 107. After the optical module 200 is inserted into the cage 106, the electrical port of the optical module 200 is connected to the electrical connector inside the cage 106, thereby establishing a bidirectional electrical signal connection between the optical module 200 and the host computer 100. In addition, the optical port of the optical module 200 is connected to the optical fiber 101, thereby establishing a bidirectional optical signal connection between the optical module 200 and the optical fiber 101.
[0077] Figure 3 A structural diagram of an optical module according to some embodiments, Figure 4 An exploded view of an optical module according to some embodiments. As Figure 3 and Figure 4 As shown, the optical module 200 comprises a shell, a circuit board 300 arranged in the shell, and an optical transceiver component.
[0078] The shell comprises an upper shell 201 and a lower shell 202, and the upper shell 201 covers the lower shell 202 to form the above-mentioned shell with two openings 204 and 205. The outer contour of the shell generally presents a square body.
[0079] In some embodiments, the lower shell 202 comprises a bottom plate 2021 and two lower side plates 2022 arranged on both sides of the bottom plate 2021 and perpendicular to the bottom plate 2021; the upper shell 201 comprises a cover plate 2011, and the cover plate 2011 covers the two lower side plates 2022 of the lower shell 202 to form the above-mentioned shell.
[0080] In some embodiments, the lower shell 202 comprises a bottom plate 2021 and two lower side plates 2022 arranged on both sides of the bottom plate 2021 and perpendicular to the bottom plate 2021; the upper shell 201 comprises a cover plate 2011 and two upper side plates arranged on both sides of the cover plate 2011 and perpendicular to the cover plate 2011, and the two upper side plates and the two lower side plates 2022 are combined to realize that the upper shell 201 covers the lower shell 202.
[0081] The direction of the line connecting the two openings 204 and 205 can be consistent with or inconsistent with the length direction of the optical module 200. For example, opening 204 is located at the end of the optical module 200. Figure 3 The opening 205 is also located at the end of the optical module 200 (right end). Figure 3 (Left end). Alternatively, opening 204 is located at the end of optical module 200, while opening 205 is located on the side of optical module 200. Opening 204 is an electrical port, from which the gold fingers of circuit board 300 extend and insert into the electrical connector of host computer 100; opening 205 is an optical port, configured to connect to external optical fiber 101 so that optical fiber 101 can connect to the optical transceiver component in optical module 200.
[0082] The assembly method using an upper housing 201 and a lower housing 202 facilitates the installation of the circuit board 300 and optical transceiver components into the aforementioned housings, which provide encapsulation and protection for these devices. Furthermore, the assembly of the circuit board 300 and optical transceiver components facilitates the deployment of positioning components, heat dissipation components, and electromagnetic shielding components, thus promoting automated production.
[0083] In some embodiments, the upper housing 201 and the lower housing 202 are made of metal materials, which facilitates electromagnetic shielding and heat dissipation.
[0084] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside its housing. The unlocking component 600 is configured to establish a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.
[0085] For example, the unlocking component 600 is located on the outside of the two lower side plates 2022 of the lower housing 202, and includes a locking component that matches the cage 106 of the host computer 100. When the optical module 200 is inserted into the cage 106, the locking component of the unlocking component 600 fixes the optical module 200 in the cage 106; when the unlocking component 600 is pulled, the locking component of the unlocking component 600 moves accordingly, thereby changing the connection relationship between the locking component and the host computer, so as to release the fixation between the optical module 200 and the host computer, thereby allowing the optical module 200 to be pulled out of the cage 106.
[0086] Circuit board 300 includes circuit traces, electronic components, and chips. The circuit traces connect the electronic components and chips according to the circuit design to achieve functions such as power supply, electrical signal transmission, and grounding. Electronic components may include, for example, capacitors, resistors, transistors, and metal-oxide-semiconductor field-effect transistors (MOSFETs). Chips may include, for example, microcontroller units (MCUs), laser driver chips, transimpedance amplifiers (TIAs), limiting amplifiers (LIAs), clock and data recovery chips (CDRs), power management chips, and digital signal processing (DSP) chips.
[0087] Circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also perform a load-bearing function. For example, the rigid circuit board can stably support the aforementioned electronic components and chips. The rigid circuit board can also be inserted into the electrical connector in the cage 106 of the host computer 100.
[0088] The circuit board 300 also includes gold fingers formed on its end surfaces, each gold finger consisting of a plurality of independent pins. The circuit board 300 is inserted into a cage 106 and is electrically connected to an electrical connector within the cage 106 by the gold fingers. The gold fingers may be located only on one side of the surface of the circuit board 300 (e.g., ...). Figure 4 The upper surface shown can also be positioned on the upper and lower surfaces of the circuit board 300 to provide a greater number of pins, thus adapting to applications with high pin count requirements. The gold fingers are configured to establish an electrical connection with the host computer to achieve power supply, grounding, two-wire synchronous serial (Inter-Integrated Circuit, I2C) signal transmission, and data signal transmission. Of course, flexible circuit boards are also used in some optical modules. Flexible circuit boards are generally used in conjunction with rigid circuit boards as a supplement to rigid circuit boards.
[0089] In some embodiments, the optical transceiver component may include a light source 910. The light source 910 can be a distributed feedback light source, differing in that it incorporates a Bragg grating and is a side-emitting semiconductor light source. Currently, distributed feedback light sources primarily use semiconductor materials as the dielectric, including gallium antimonyide, gallium arsenide, indium phosphide, and zinc sulfide. The most significant characteristics of distributed feedback light sources are their excellent monochromaticity, with linewidths typically below 1 MHz, and very high side-mode rejection ratios, currently reaching over 40-50 dB.
[0090] The light source 910 can be used to output light without carrying data. Specifically, the bottom surface of the light source 910 can be arranged on the substrate, and the light source 910 can output light through the side surface, and the output light enters the optical chip 920. The optical chip 920 uses silicon as the main base material, and silicon is not an ideal light-emitting material, so the optical chip 920 cannot integrate the light source 910, and an external light source 910 is needed to provide light. The light provided by the light source 910 to the optical chip 920 is light with a single wavelength and stable power, and does not carry data. The light is modulated by the optical chip 920 to load data into the light.
[0091] The optical chip 920 can be a silicon optical chip or a lithium niobate chip.
[0092] The optical chip 920 can be arranged on the circuit board 300 and electrically connected to the circuit board 300. Specifically, the optical chip 920 can be connected to the circuit board 300 by wire bonding. Therefore, the optical chip 920 is generally arranged on the surface of the circuit board 300.
[0093] The optical chip 920 and the light source 910 can be optically connected through an optical fiber ribbon. The optical chip 920 can receive light from the light source 910 through the optical fiber ribbon, and then modulate the light, specifically, load signals onto the light. The optical chip 920 and the optical fiber socket are optically connected through the optical fiber ribbon. The optical fiber socket is optically connected to the external optical fiber of the optical module. The light modulated by the optical chip 920 is transmitted to the optical fiber socket through the optical fiber ribbon, and then transmitted to the external optical fiber through the optical fiber socket. The light transmitted from the external optical fiber is transmitted to the optical fiber ribbon through the optical fiber socket, and then transmitted to the optical chip 920 through the optical fiber ribbon. Thus, the optical chip 920 can output or receive light carrying data to or from the external optical fiber of the optical module.
[0094] In some embodiments, the optical chip 920 can include an MZM modulator (Mach-Zehnder modulator). The MZM modulator can modulate the light without carrying data into an optical signal, so that the optical chip 920 can modulate the light without carrying data emitted by the light source 910 into an optical signal.
[0095] In some embodiments, the surface of the circuit board 300 can be provided with a DSP chip 310. The DSP chip 310 can be connected to the optical chip 920, so that the optical chip 920 and the DSP chip 310 can exchange information, and the DSP chip 310 can provide a driving signal to the optical chip 920. The driving signal can include an alternating current signal and a direct current signal, and the direct current signal can be a common-mode voltage.
[0096] In some embodiments, the driving chip is not integrated in the DSP chip 310, and the driving chip can be arranged on the circuit board 300 or on the optical chip 920. One end of the driving chip can be connected with the DSP chip 310, and the other end of the driving chip can be connected with the optical chip 920, so that the DSP chip 310 can be connected with the optical chip 920.
[0097] In some embodiments, the driving chip is integrated in the DSP chip 310. For example, the DSP chip 310 includes a driving module, which can output the first driving signal and the second driving signal, so that the DSP chip 310 can output the first driving signal and the second driving signal.
[0098] Figure 5 A structural diagram of an MZM modulator according to some embodiments is shown. As shown in FIG. 9, in some embodiments, the MZM modulator can include an input waveguide 925. The input waveguide 925 can be optically connected with the light source 910, so that the MZM modulator can receive the light emitted by the light source 910 without carrying data. Figure 5
[0099] In some embodiments, the MZM modulator can include a beam splitter 923. One end of the beam splitter 923 can be connected with the input waveguide 925 to receive the light input by the input waveguide 925 without carrying data. The beam splitter 923 can divide the light without carrying data into two equal parts.
[0100] In some embodiments, the MZM modulator can include an interference arm 922. The interference arm 922 can include a first interference arm 9221. The input end of the first interference arm 9221 can be connected with the first output end of the beam splitter 923, so that the light transmitted by the beam splitter 923 is transmitted to the first interference arm 9221.
[0101] The interference arm 922 can include a second interference arm 9222. The input end of the second interference arm 9222 can be connected with the second output end of the beam splitter 923, so that the light transmitted by the beam splitter 923 is transmitted to the second interference arm 9222.
[0102] In some embodiments, the MZM modulator can include a beam combiner 924. The first input end of the beam combiner 924 can be connected with the first interference arm 9221. The second input end of the beam combiner 924 can be connected with the second interference arm 9222. The beam combiner 924 can combine the light transmitted by the first interference arm 9221 to the beam combiner 924 and the light transmitted by the second interference arm 9222 to the beam combiner 924.
[0103] In some embodiments, the MZM modulator can include an output waveguide 926. An input end of the output waveguide 926 can be connected with an output end of the combiner 924 to receive the optical signal and output. An output end of the output waveguide 926 can be connected with a fiber ribbon so that the optical signal can be emitted through the fiber ribbon.
[0104] In some embodiments, the MZM modulator can include a modulation electrode 921. The modulation electrode 921 can include a first modulation electrode 9211. The first modulation electrode 9211 can be disposed on the first interference arm 9221. The first modulation electrode 9211 can receive the first driving signal output by the DSP chip 310 and dynamically change the refractive index of the first interference arm 9221 through the electro-optic effect under the action of the first driving signal to change the phase of the light input into the first interference arm 9221, so as to realize optical modulation.
[0105] The modulation electrode 921 can include a second modulation electrode 9212. The second modulation electrode 9212 can be disposed on the second interference arm 9222. The second modulation electrode 9212 can receive the second driving signal output by the DSP chip 310 and dynamically change the refractive index of the second interference arm 9222 through the electro-optic effect under the action of the second driving signal to change the phase of the light input into the second interference arm 9222, so as to realize optical modulation.
[0106] In some embodiments, the MZM modulator can include an optical phase shifter 927. The optical phase shifter 927 can be disposed on the interference arm 922. The optical phase shifter 927 can compensate for the initial phase error and optimize the working point of the MZM modulator by changing the refractive index of the interference arm 922.
[0107] The first modulation electrode 9211, the second modulation electrode 9212, and the optical phase shifter 927 work together to ensure that the MZM modulator works stably under high bandwidth and low distortion conditions.
[0108] In some embodiments, the optical phase shifter 927 can be disposed on the first interference arm 9221 to adjust the refractive index of the first interference arm 9221.
[0109] In some embodiments, the optical phase shifter 927 can be disposed on the second interference arm 9222 to adjust the refractive index of the second interference arm 9222.
[0110] In some embodiments, the optical phase shifter 927 can be disposed on the first interference arm 9221 and the second interference arm 9222 to adjust the refractive index of the first interference arm 9221 and the second interference arm 9222.
[0111] In some embodiments, the optical phase shifter 927 can be a heater. The power of the heater is adjusted by adjusting the current of the heater, and in turn the temperature of the interference arm 922 is adjusted, so that the refractive index of the interference arm 922 is adjusted.
[0112] In some embodiments, the optical phase shifter 927 can be an electrode. The power of the electrode is adjusted by adjusting the voltage of the electrode, and in turn the concentration of carriers in the interference arm 922 is adjusted, so that the refractive index of the interference arm 922 is adjusted.
[0113] In some embodiments, the driving chip is arranged outside the DSP chip 310, and two capacitors can be arranged between the driving chip and the DSP chip 310. One end of the capacitor can be connected with the DSP chip 310, and the other end of the capacitor can be connected with the driving chip. The capacitor has the characteristic of "blocking direct current and passing alternating current", so that the common-mode voltage of the driving signal output by the DSP chip 310 can be reduced to zero after passing through the capacitor and the driving chip, that is, only an alternating current signal.
[0114] The following introduces that the driving chip is integrated in the DSP chip 310, and the connection relationship between the DSP chip 310 and the optical chip 920.
[0115] Figure 6 An internal structure diagram of an optical module according to some embodiments is provided. As shown in Figure 6 In some embodiments, a first capacitor 320 is arranged between the optical chip 920 and the DSP chip 310. The ground end of the first capacitor 320 is grounded, the first signal end of the first capacitor 320 can be connected with the optical chip 920, and the second signal end of the first capacitor 320 can be connected with the DSP chip 310, so that the optical chip 920 and the DSP chip 310 are connected. The first capacitor 320 has the characteristic of "blocking direct current (direct current signal) and passing alternating current (alternating current signal)", so as to block the direct current signal of the driving signal output by the DSP chip 310, so that the driving signal output by the DSP chip 310 is only an alternating current signal after passing through the first capacitor 320.
[0116] In some embodiments, a second capacitor 330 is arranged between the optical chip 920 and the DSP chip 310. The ground end of the second capacitor 330 is grounded, the first signal end of the second capacitor 330 can be connected with the optical chip 920, and the second signal end of the second capacitor 330 can be connected with the DSP chip 310, so that the optical chip 920 and the DSP chip 310 are connected. The second capacitor 330 has the characteristic of "blocking direct current (direct current signal) and passing alternating current (alternating current signal)", so as to block the direct current signal of the driving signal output by the DSP chip 310, so that the driving signal output by the DSP chip 310 is only an alternating current signal after passing through the second capacitor 330.
[0117] Figure 7 An internal structure principle of an optical module according to some embodiments is provided. Figure 1 .Figure 8 This describes the internal structural principle of an optical module according to some embodiments. Figure 2 .like Figure 7 and Figure 8 As shown, in some embodiments, the first output pin 311 of the DSP chip 310 can be connected to the first signal terminal of the first capacitor 320, and the second terminal of the first capacitor 320 can be connected to the first signal terminal of the first modulation electrode 9211 of the optical chip 920, so that the driving signal output by the first output pin 311 of the DSP chip 310 is only an AC signal after passing through the first capacitor 320.
[0118] In some embodiments, the second output pin 312 of the DSP chip 310 can be connected to the first end of the second capacitor 330, and the second end of the second capacitor 330 can be connected to the first end of the second modulation electrode 9212 of the optical chip 920, so that the drive signal output by the second output pin 312 of the DSP chip 310 is only an AC signal after passing through the second capacitor 330.
[0119] The driver module of the DSP chip 310 can be connected to the first output pin 311 so that the first drive signal output by the driver module is output through the first output pin 311. The driver module of the DSP chip 310 can be connected to the second output pin 312 so that the second drive signal output by the driver module is output through the second output pin 312.
[0120] The first output pin 311 of the DSP chip 310 can be connected to the first signal terminal of the first capacitor 320, the second terminal of the first capacitor 320 can be connected to the first signal terminal of the first modulation electrode 9211 of the optical chip 920, the second output pin 312 of the DSP chip 310 can be connected to the first terminal of the second capacitor 330, and the second terminal of the second capacitor 330 can be connected to the first terminal of the second modulation electrode 9212 of the optical chip 920, so that the DSP chip 310 and the optical chip 920 achieve AC coupling.
[0121] In some embodiments, the optical chip 920 may include a resistor 928. Resistor 928 may include a first resistor 9281. A first terminal of the first resistor 9281 may be connected to a second terminal of the first modulation electrode 9211, and a second terminal of the first resistor 928 may be grounded or connected to the first power supply chip 340. The voltage at the other terminal of the first resistor 928 is VMOD.
[0122] Resistor 928 may include a second resistor 9282. The first end of the second resistor 9282 may be connected to the second end of the second modulation electrode 9212, and the second end of the second resistor 9282 may be connected to the second end of the first resistor 9282, so that the voltage at the second end of the second resistor 9282 is also VMOD.
[0123] In some embodiments, the optical chip 920 may include a diode 929. The diode 929 may include a first diode 9291. One end of the first diode 9291 may be connected to the third end of the first modulation electrode 9211, and the other end of the first diode 9291 may be grounded or connected to the first power supply chip 340. The voltage at the other end of the first diode 9291 is VB.
[0124] The first diode 9291 can be an equivalent circuit of multiple first sub-diodes. The first sub-diode can be a first PN junction integrated within an MZM modulator. The first PN junction changes the refractive index of the first interference arm 9221 through carrier dispersion.
[0125] Diode 929 may include a second diode 9292. One end of the second diode 9292 may be connected to the third end of the second modulation electrode 9212, and the other end of the second diode 9292 may be connected to the other end of the first diode 9291, so that one end of the second diode 9292 can be grounded or connected to the first power supply chip 340. The voltage at the other end of the second diode 9292 is VB.
[0126] The second diode 9292 can be an equivalent circuit of multiple second sub-diodes. The second sub-diode can be a second PN junction integrated within an MZM modulator. The second PN junction changes the refractive index of the second interference arm 9222 through carrier dispersion.
[0127] In some embodiments, the first power chip 340 can provide operating voltage to the first diode 9291 and the second diode 9292 so that the first diode 9291 and the second diode 9292 can operate normally. For example, the voltage output by the first power chip 340 is Vpn, where Vpn is the voltage difference between the positive and negative terminals of the first diode 9291 and the second diode 9292.
[0128] The larger the VPN, the higher the bandwidth; the smaller the VPN, the lower the bandwidth. Therefore, the bandwidth can be adjusted based on the VPN.
[0129] like Figure 7 As shown, in some embodiments, the positive terminal of the first diode 9291 is connected to the third terminal of the first modulation electrode 9211, the negative terminal of the first diode 9291 is connected to the first power chip 340, and the other end of the first resistor 9281 is grounded; the positive terminal of the second diode 9292 is connected to the third terminal of the second modulation electrode 9212, the negative terminal of the second diode 9292 is connected to the negative terminal of the first diode 9291, and the other end of the second resistor 9282 is grounded.
[0130] Part of the current signal flows from the first power chip 340 to the ground through the first diode 9291, the first modulation electrode 9211 and the first resistor 9281, and part of the current signal flows from the first power chip 340 to the ground through the second diode 9292, the second modulation electrode 9212 and the second resistor 9282.
[0131] According to the direction of the current signal, VB-VMOD=Vpn, and VMOD=0 (grounded), it can be known that VB=Vpn.
[0132] As shown in FIG. 9, in some embodiments, the negative terminal of the first diode 9291 is connected with the third terminal of the first modulation electrode 9211, the positive terminal of the first diode 9291 is grounded, and the other terminal of the first resistor 9281 is connected with the first power chip 340; the negative terminal of the second diode 9292 is connected with the third terminal of the second modulation electrode 9212, the positive terminal of the second diode 9292 is grounded, and the other terminal of the second resistor 9282 is connected with the first power chip 340. Figure 8 Part of the current signal flows from the first power chip 340 to the ground through the first resistor 9281, the first modulation electrode 9211 and the first diode 9291, and part of the current signal flows from the first power chip 340 to the ground through the second resistor 9282, the second modulation electrode 9212 and the second diode 9292.
[0133] According to the direction of the current signal, VMOD-Vpn=VB, and VB=0 (grounded), it can be known that VMOD=Vpn.
[0134] However, due to the existence of the first capacitor 320 and the second capacitor 330, the driving signal will generate a discontinuous point at the first capacitor 320 and the second capacitor 330. In order to solve this problem, in some embodiments, the DSP chip 310 is not connected with the optical chip 920 through the first capacitor 320 and the second capacitor 330, but is directly connected, i.e., DC (direct current) coupling, the difference between the common-mode voltage of the first driving signal on the first modulation electrode 9211 and the voltage of the second terminal of the first resistor 9281 is within a first preset range, and the difference between the common-mode voltage of the second driving signal on the second modulation electrode 9212 and the voltage of the second terminal of the second resistor 9282 is within the first preset range. For example, the first preset range is-50mV~50mV.
[0135]
[0136] The DSP chip 310 is directly connected with the optical chip 920, which can effectively reduce the discontinuity of the driving signal at the first capacitor 320 and the second capacitor 330, thereby improving the stability and accuracy of signal transmission. The difference between the common-mode voltage of the first driving signal on the first modulation electrode 9211 and the voltage at the second end of the first resistor 9281 is within the first preset range, which indicates that the common-mode voltage of the first driving signal on the first modulation electrode 9211 is approximately equal to the voltage at the second end of the first resistor 9281, so that the first driving signal is continuous. The difference between the common-mode voltage on the second modulation electrode 9212 and the voltage at the second end of the second resistor 9282 is within the first preset range, which indicates that the common-mode voltage at the first end of the second modulation electrode 9212 is approximately equal to the voltage at the second end of the second resistor 9282, so that the second driving signal is continuous. In addition, this connection mode can also simplify the circuit structure and reduce the circuit complexity, which is conducive to the miniaturization and integration design of the optical module.
[0137] Figure 9 An internal structure diagram of another optical module according to some embodiments is provided. As shown in Figure 9 , in some embodiments, the optical chip 920 is directly connected with the DSP chip 310.
[0138] Figure 10 An internal structure diagram of another optical module according to some embodiments is provided. As shown in Figure 1 . Figure 11 An internal structure diagram of another optical module according to some embodiments is provided. As shown in Figure 2 . As shown in Figure 10 and Figure 11 , in some embodiments, the first output pin 311 of the DSP chip 310 can be connected with the first end of the first modulation electrode 9211 of the optical chip 920, so that the common-mode voltage VCM of the first driving signal output by the first output pin 311 of the DSP chip 310 is not zero after the first driving signal reaches the first modulation electrode 9211, that is, the first driving signal includes an alternating current signal and a direct current signal.
[0139] The second output pin 312 of the DSP chip 310 can be connected with the first end of the second modulation electrode 9212 of the optical chip 920, so that the common-mode voltage VCM of the electrical signal output by the second output pin 312 of the DSP chip 310 is not zero after the electrical signal reaches the second modulation electrode 9212, that is, the second driving signal includes an alternating current signal and a direct current signal.
[0140] In some embodiments, the optical chip 920 can include a resistor 928. The resistor 928 can include a first resistor 9281. The first end of the first resistor 9281 can be connected with the second end of the first modulation electrode 9211. The voltage at the other end of the first resistor 928 is VMOD.
[0141] The resistor 928 can include a second resistor 9282. A first end of the second resistor 9282 can be connected with the second end of the second modulation electrode 9212, and a second end of the second resistor 9282 can be connected with the second end of the first resistor 9282, so that the voltage of the second end of the second resistor 9282 is also VMOD.
[0142] In some embodiments, the optical chip 920 can include a diode 929. The diode 929 can include a first diode 9291. One end of the first diode 9291 can be connected with the third end of the first modulation electrode 9211, and the other end of the first diode 9291 can be connected with the second power supply chip 350. The voltage of the other end of the first diode 9291 is VB.
[0143] The first diode 9291 can be an equivalent circuit of a plurality of first sub-diodes. The first sub-diode can be a first PN junction integrated within the MZM modulator. The first PN junction changes the refractive index of the first interference arm 9221 through the carrier dispersion effect.
[0144] The diode 929 can include a second diode 9292. One end of the second diode 9292 can be connected with the third end of the second modulation electrode 9212, and the other end of the second diode 9292 can be connected with the other end of the first diode 9291, so that the one end of the second diode 9292 can be connected with the second power supply chip 350. The voltage of the other end of the other end of the second diode 9292 is VB.
[0145] The second diode 9292 can be an equivalent circuit of a plurality of second sub-diodes. The second sub-diode can be a second PN junction integrated within the MZM modulator. The second PN junction changes the refractive index of the second interference arm 9222 through the carrier dispersion effect.
[0146] In some embodiments, the second power supply chip 350 can provide operating voltages for the first diode 9291 and the second diode 9292, so that the first diode 9291 and the second diode 9292 can work normally.
[0147] One end of the first diode 9291 can be connected with the third end of the first modulation electrode 9211, and the other end of the first diode 9291 can be connected with the second power supply chip 350. One end of the second diode 9292 can be connected with the third end of the second modulation electrode 9212, and the other end of the second diode 9292 can be connected with the other end of the first diode 9291.
[0148] In some embodiments, the second end of the second resistor 9282 can be connected to the third power chip 360, and the difference between the input voltage of the third power chip 360 and the common-mode voltage of the second drive signal on the second modulation electrode 9212 is less than a first preset range.
[0149] Since the second end of the second resistor 9282 is connected to the second end of the first resistor 9281, the second end of the second resistor 9282 can be connected to the third power chip 360, and the second end of the first resistor 9281 can be connected to the third power chip 360. The second end of the first resistor 9281 can be connected to the third power chip 360, and the difference between the input voltage of the third power chip 360 and the common-mode voltage of the first drive signal on the first modulation electrode 9211 is less than a first preset range.
[0150] The voltage difference between the input voltage VMOD of the third power chip 360 and the common-mode voltage VCM is less than a first preset range, so that the difference between the common-mode voltage on the first modulation electrode 9211 and the voltage at the second end of the first resistor 9281 is within the first preset range. The difference between the input voltage of the third power chip 360 and the common-mode voltage of the second drive signal on the second modulation electrode 9212 is less than a first preset range, so that the difference between the common-mode voltage on the second modulation electrode 9212 and the voltage at the second end of the second resistor 9282 is within the first preset range.
[0151] In some embodiments, the third power chip 360 can be a SINK type power supply, which is a power supply that inputs current inwardly, and its core function is to absorb, consume or manage current in external circuits. The third power chip 360 is a power supply that inputs current inwardly, so that the current on the first modulation electrode 9211 and the second modulation electrode 9212 can flow to the third power chip 360, effectively avoiding current leakage and interference.
[0152] In some embodiments, the input voltage VMOD of the third power chip 360 is less than the common-mode voltage VCM of the first drive signal, which can reduce loss.
[0153] In some embodiments, the second end of the second resistor 9282 can be suspended. In a circuit, when one end of a resistor is suspended, it is equivalent to the circuit in which the resistor is located being disconnected, so no current flows through the resistor, and the voltage at the suspended end depends on whether the other end is connected to a voltage source or other node. The second end of the second resistor 9282 is suspended, and the voltage at the second end of the second resistor 9282 is equal to the common-mode voltage of the second drive signal, i.e., the voltage at the second end of the second resistor 9282 is within the first preset range of the common-mode voltage of the second drive signal.
[0154] Since the second end of the second resistor 9282 is connected with the second end of the first resistor 9281, the second end of the second resistor 9282 is suspended, and then the second end of the first resistor 9281 is suspended. The voltage of the second end of the first resistor 9281 is equal to the common-mode voltage of the first driving signal, that is, the voltage of the second end of the first resistor 9281 and the common-mode voltage of the first driving signal are in the first preset range.
[0155] As shown in Figure 10 and Figure 11 The second end of the first resistor 9281 and the second end of the second resistor 9282 are connected with the third power supply chip 360.
[0156] As shown in Figure 10 In some embodiments, the anode end of the first diode 9291 is connected with the third end of the first modulation electrode 9211, the cathode end of the first diode 9291 is connected with the second power supply chip 350, and the other end of the first resistor 9281 is connected with the third power supply chip 360; the anode end of the second diode 9292 is connected with the third end of the second modulation electrode 9212, and the cathode end of the second diode 9292 is connected with the cathode end of the first diode 9291.
[0157] As shown in Figure 11 The cathode end of the first diode 9291 is connected with the third end of the first modulation electrode 9211, the anode end of the first diode 9291 is grounded, and the other end of the first resistor 9281 is connected with the second power supply chip 350; the cathode end of the second diode 9292 is connected with the third end of the second modulation electrode 9212, and the anode end of the second diode 9292 is grounded.
[0158] As shown in Figure 10 Part of the current signal flows from the first output pin 311 of the DSP chip 310 to the third power supply chip 360 through the first modulation electrode 9211 and the first resistor 9281 in turn, part of the current signal flows from the second output pin 312 of the DSP chip 310 to the third power supply chip 360 through the second modulation electrode 9212 and the second resistor 9282 in turn, part of the current signal flows from the second power supply chip 350 through the first diode 9291 and the first modulation electrode 9211 in turn, and part of the current signal flows from the second power supply chip 350 through the second diode 9292 and the second modulation electrode 9212 in turn.
[0159] According to the direction of the current signal, VB-Vpn=VCM is obtained, and it is known that VB=Vpn+VCM, that is, the voltage that the second power supply chip 350 can output is Vpn+VCM.
[0160] As shown in Figure 11As shown, a portion of the current signal flows from the first output pin 311 of the DSP chip 310 through the first modulation electrode 9211 and the first resistor 9281 to the third power chip 360. A portion of the current signal flows from the second output pin 312 of the DSP chip 310 through the second modulation electrode 9212 and the second resistor 9282 to the third power chip 360. A portion of the current signal flows from the first modulation electrode 9211 through the first diode 9291 and the second power chip 350. A portion of the current signal flows from the second modulation electrode 9212 through the second diode 9292 and the second power chip 350.
[0161] Based on the current signal direction, VCM-Vpn = VB. Therefore, VB = VCM-Vpn, meaning the voltage that the second power supply chip 350 can output is VCM-Vpn.
[0162] Figure 12 This describes the internal structural principle of another optical module according to some embodiments. Figure 3 . Figure 13 This describes the internal structural principle of another optical module according to some embodiments. Figure 4 .like Figure 12 and Figure 13 As shown, the second terminal of the first resistor 9281 and the second terminal of the second resistor 9282 are both left floating.
[0163] like Figure 12 As shown, in some embodiments, the positive terminal of the first diode 9291 is connected to the third terminal of the first modulation electrode 9211, and the negative terminal of the first diode 9291 is connected to the second power chip 350; the positive terminal of the second diode 9292 is connected to the third terminal of the second modulation electrode 9212, and the negative terminal of the second diode 9292 is connected to the negative terminal of the first diode 9291.
[0164] like Figure 13 As shown, in some embodiments, the negative terminal of the first diode 9291 is connected to the third terminal of the first modulation electrode 9211, and the positive terminal of the first diode 9291 is grounded; the negative terminal of the second diode 9292 is connected to the third terminal of the second modulation electrode 9212, and the positive terminal of the second diode 9292 is grounded.
[0165] like Figure 12 As shown, in a circuit, when one end of a resistor is left floating, it is equivalent to an open circuit in the circuit containing the resistor, meaning no current flows through the resistor. Figure 12As shown in FIG. 9, the second end of the first resistor 9281 and the second end of the second resistor 9282 are both suspended, no current flows through the first resistor 9281 and the second resistor 9282, and part of the current signal flows through the first modulation electrode 9211, the first diode 9291 and the second power supply chip 350 in sequence, and part of the current signal flows through the second modulation electrode 9212, the second diode 9292 and the second power supply chip 350 in sequence.
[0166] According to the current signal, VB-Vpn=VCM is obtained, and it is known that VB=Vpn+VCM, that is, the voltage that the second power supply chip 350 can output is Vpn+VCM.
[0167] As shown in FIG. 9, the second end of the first resistor 9281 and the second end of the second resistor 9282 are both suspended, no current flows through the first resistor 9281 and the second resistor 9282, and part of the current signal flows through the first modulation electrode 9211, the first diode 9291 and the second power supply chip 350 in sequence, and part of the current signal flows through the second modulation electrode 9212, the second diode 9292 and the second power supply chip 350 in sequence. Figure 13 Figure 13 As shown in FIG. 9, the second end of the first resistor 9281 and the second end of the second resistor 9282 are both suspended, no current flows through the first resistor 9281 and the second resistor 9282, and part of the current signal flows through the first modulation electrode 9211, the first diode 9291 and the second power supply chip 350 in sequence, and part of the current signal flows through the second modulation electrode 9212, the second diode 9292 and the second power supply chip 350 in sequence.
[0168] According to the current signal, VCM-Vpn=VB is obtained, and it is known that VB=VCM-Vpn, that is, the voltage that the second power supply chip 350 can output is VCM-Vpn.
[0169] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present disclosure, but not to limit them; although the present disclosure has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement for part of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present disclosure.
Claims
1. An optical module characterized by comprising: The application relates to a light source circuit board. The application relates to a light source circuit board. The application relates to a light source circuit board. The application relates to a light source circuit board. The application relates to a light source circuit board. The application relates to a light source circuit board. The application relates to a light source circuit board. The application relates to a light source circuit board. The application relates to a light source circuit board. The application relates to a light source circuit board. The application relates to a light source circuit board. The application relates to a light source circuit board. The application relates to a light source circuit board. The application relates to a light source circuit board. The application relates to a light source circuit board. The application relates to a light source circuit board. The application relates to a light source circuit board. The application relates to a light source circuit board.
2. The optical module according to claim 1, characterized by The application relates to a light source circuit board. The application relates to a light source circuit board.
3. The optical module according to claim 1, characterized by The application relates to a light source circuit board.
4. The optical module according to claim 1, characterized by The application relates to a light source circuit board. The application relates to a light source circuit board. The application relates to a light source circuit board.
5. The optical module according to claim 1, characterized by The application relates to a light source circuit board. The application relates to a light source circuit board. The application relates to a light source circuit board.
6. The optical module of claim 2, wherein, The application relates to a light source circuit board.
7. The optical module of claim 1, wherein, The application relates to a light source circuit board. The application relates to a light source circuit board.
8. The optical module of claim 1, wherein, The application relates to a light source circuit board. The application relates to a light source circuit board. The application relates to a light source circuit board. The application relates to a light source circuit board. The application relates to a light source circuit board. The application relates to a light source circuit board. The application relates to a light source circuit board. The application relates to a light source circuit board. The application relates to a light source circuit board. The application relates to a light source circuit board. The application relates to a light source circuit board. The application relates to a light source circuit board. The application relates to a light source circuit board. The application relates to a light source circuit board. The application relates to a light source circuit board. The application relates to a light source circuit board. 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The application relates to a light source circuit board. The application relates to a light source circuit board. The application relates to a light source circuit board. The application relates to a light source circuit board. The application relates to a light source circuit board. The application relates to a light source circuit A first interference arm, an input end of which is connected with a first output end of the beam splitter; the first modulation electrode is arranged on the first interference arm; A second interference arm, an input end of which is connected with a second output end of the beam splitter; the second modulation electrode is arranged on the second interference arm; A beam combiner, a first input end of which is connected with an output end of the first interference arm, and a second input end of which is connected with an output end of the second interference arm; An output waveguide, which is connected with an output end of the beam combiner.
9. The optical module according to claim 8, characterized by The optical chip further comprises: An optical phase shifter, which is arranged on the first interference arm.