Electronic device

Abstract

The utility model discloses an electronic device, which comprises a signal transceiver, a screen cover plate and a mainboard, and is characterized in that the signal transceiver is arranged between the screen cover plate and the mainboard; the electronic equipment further comprises a supporting piece, and the supporting piece is located in the circumferential direction of the signal transceiver and located between the screen cover plate and the mainboard. A gap is formed between the signal transceiver and the supporting piece; the mainboard comprises a plurality of layers of substrates and copper-clad layers, wherein the substrates and the copper-clad layers are alternately stacked to form the mainboard; the number of the copper-clad layers of the mainboard in at least part of the first area is smaller than that of the copper-clad layers of the other areas, the first area is a mainboard area corresponding to a gap between the signal transceiver and the supporting piece, and the area with the number of the copper-clad layers smaller than that of the other areas is a target area.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of communication, and particularly relates to an electronic device. BACKGROUND

[0002] At present, electronic devices such as mobile phones are usually configured with a signal transceiver system, such as an infrared sensor, a time-of-flight (TOF) sensor and the like. These devices are usually arranged below the cover plate or below the display layer of the screen of the electronic device. However, the stacking environment of the electronic device is complex, and bottom noise is inevitably generated. Excessive bottom noise can cause the signal-to-noise ratio to decrease or even saturate, so the bottom noise needs to be inhibited to some extent to ensure the good performance of the device.

[0003] In the prior art, as the stacking mode of the devices in the electronic device tends to be more and more miniaturized, a partitioning foam is usually added between the sensor transceiver modules to minimize the reflection from the top of the sensor to the screen. In order to obtain a better signal-to-noise ratio, a special-shaped foam needs to be designed, but the processing error of the foam is large, which causes poor consistency of the bottom noise distribution and poor overall suppression effect. CONTENT OF THE UTILITY MODEL

[0004] The purpose of the embodiments of the application is to provide an electronic device, which can solve the problem of poor consistency of the bottom noise distribution and poor overall suppression effect in the prior art.

[0005] In a first aspect, the embodiments of the application provide an electronic device, which comprises a signal transceiver, a screen cover plate and a mainboard, wherein the signal transceiver is arranged between the screen cover plate and the mainboard.

[0006] The electronic device further comprises a support, wherein the support is located circumferentially around the signal transceiver, and the support is located between the screen cover plate and the mainboard.

[0007] The signal transceiver and the support have a gap therebetween.

[0008] The mainboard comprises a multilayer substrate and a copper clad layer, wherein the substrate and the copper clad layer are alternately stacked to form the mainboard.

[0009] The number of copper clad layers of the mainboard in at least part of a first region is less than that in other regions, the first region is a mainboard region corresponding to the gap, and the region with a number of copper clad layers less than that in other regions is a target region.

[0010] In the embodiments of the present application, by digging out part or all of the copper layer in the area of the main board which is at least partially opposite to the gap between the signal transceiver and the support, a certain clearance area is formed, which can reduce the reflectivity of this part of the area, thereby reducing the secondary reflection intensity of the signal reflected through the screen cover in this part of the area, and further playing a role in suppressing the bottom noise, effectively improving the bottom noise suppression effect.

[0011] Additional aspects and advantages of the present application will be in part apparent and in part pointed out hereinafter. BRIEF DESCRIPTION OF DRAWINGS

[0012] The above and / or additional aspects and advantages of the present application will become apparent and be readily appreciated from the following description, including the accompanying drawings, wherein:

[0013] Figure 1 is a side view of an electronic device according to an embodiment of the present application in the direction of the long side of the signal transceiver;

[0014] Figure 2 is a side view of an electronic device according to an embodiment of the present application in the direction of the short side of the signal transceiver;

[0015] Figure 3 is a top view of an electronic device according to an embodiment of the present application;

[0016] Figure 4 is a schematic diagram of a transceiver-in-one infrared sensor structure according to an embodiment of the present application;

[0017] Figure 5 is a schematic diagram of the verification comparison of the bottom noise suppression effect of the embodiments of the present application and the prior art. DETAILED DESCRIPTION

[0018] Embodiments of the present application will be described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference signs represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be understood as limiting the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor are within the scope of protection of the present application.

[0019] The terms "first", "second", etc. in the description and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the terms used in this way can be interchanged under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than that illustrated or described herein, and the objects distinguished by "first", "second", etc. are generally a class, not limited to the number of objects, for example, the first object can be one or more. In the description of the present application, unless otherwise specified, "a plurality of" means two or more. In addition, "and / or" in the specification and claims means at least one of the connected objects, and " / " generally means that the front and rear associated objects are in an "or" relationship.

[0020] In the description of the present application, it should be understood that the terms "up", "down", "front", "back", "left", "right", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0021] In the description of the present application, it should be noted that unless otherwise specified and limited, the terms "mounting", "connection", "connection" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication inside two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0022] The embodiments of the present application aim at the defects of the background art, and optimize the optical path without changing the stacking structure, without adding any auxiliary materials and process requirements, and by changing the hardware design to optimize the optical problem. The electronic device provided by the embodiments of the present application will be described in detail in combination with the specific embodiments and application scenarios thereof, with reference to the accompanying drawings.

[0023] Please refer to Figure 1 and Figure 2 , Figure 1 and Figure 2 The electronic device provided by the embodiments of the present application is a side view structural schematic diagram in two different directions. As shown in Figure 1 and Figure 2 , the electronic device comprises:

[0024] The signal transceiver 101, the screen cover plate 102 and the mainboard 103, the signal transceiver 101 is arranged between the screen cover plate 102 and the mainboard 103;

[0025] The electronic device further comprises a support 104, which is located circumferentially around the signal transceiver 101 and between the screen cover plate 102 and the main board 103.

[0026] A gap 200 is formed between the signal transceiver 101 and the support 104.

[0027] The main board 103 comprises a multilayer substrate 1031 and a copper clad layer 1032, which are alternately stacked to form the main board 103.

[0028] The number of copper clad layers of the main board 103 in at least part of a first area 300 is less than that in other areas, the first area 300 is an area of the main board corresponding to the gap 200, the area with less number of copper clad layers than other areas is a target area, and the other areas are areas of the main board 103 except the first area 300.

[0029] In the embodiments of the present application, in order to better suppress the bottom noise and ensure the quality of signal transmission, a bottom noise suppression scheme is proposed by optimizing the signal optical path without changing the stacking structure and adding any auxiliary materials. Only the copper clad layer of the main board area in the signal reflection path is partially or completely removed, and a good effect of suppressing the bottom noise can be achieved.

[0030] As shown in Figure 1 and Figure 2 , the signal transceiver 101 is arranged below the screen cover plate 102, and the main board 103 is located below the signal transceiver 101, that is, the main board 103, the signal transceiver 101 and the screen cover plate 102 are designed in a stacking structure, wherein the signal transceiver 101 is a device with signal transmission function, which can be a sensor device for measuring certain indicators through signal transmission, the screen cover plate 102 can also be called a screen glass cover plate, and the main board 103 is a printed circuit board (PCB) structure formed by stacking a plurality of substrates 1031.

[0031] The support 104 is arranged circumferentially around the signal transceiver 101 and between the screen cover plate 102 and the main board 103, which plays a role of structural support, and specifically, the support 104 can be arranged around the signal transceiver 101, and the support 104 is also arranged between the screen cover plate 102 and the main board 103, as shown in Figure 1 and Figure 2 , a gap 200 is formed between the signal transceiver 101 and the support 104.

[0032] The signal emitted from the signal transceiver 101 is reflected by the screen cover plate 102, falls into the first area 300 on the main plate 103 opposite the gap 200, and if the reflectivity of this part of the area on the main plate 103 is high, then it will cause the signal to be reflected by the main plate 103 twice to generate bottom noise, especially the area on the main plate 103 located on both sides of the long side of the signal transceiver 101, the secondary reflection has a greater impact on the bottom noise. Based on this principle, the embodiment of the present application reduces the reflectivity of at least part of the first area 300 on the main plate 103 from the perspective of reducing the reflectivity of at least part of the first area 300 on the main plate 103, and proposes an improved design scheme of removing at least part of the copper layer of the main plate 103 in the first area 300, so that the number of copper layers of this part of the main plate 103 is less than that of other areas. Due to the reduction in the number of copper layers, the reflectivity of this part of the main plate 103 can be greatly reduced, and the secondary reflection intensity of the signal reflected by the screen cover plate 102 on this part of the main plate 103 will also be greatly reduced, thereby playing a role in suppressing bottom noise.

[0033] Specifically, the area on the main plate 103 opposite the gap 200 is called the first area 300, that is, the first area 300 is the projection area of the gap 200 on the main plate 103. The main plate 103 includes a plurality of substrates 1031 and copper layers 1032, which are alternately stacked by the substrate 1031 and the copper layer 1032. In the embodiment of the present application, the main plate 103 does not have a copper layer 1032 between each area of the substrate 1031, but the copper layer 1032 in the area of the main plate 103 opposite the gap 200 is at least partially removed, so that the number of copper layers of the main plate 103 in at least part of the first area 300 is less than that of other areas of the main plate 103, to reduce the reflectivity of at least part of the first area 300.

[0034] The area of the main plate 103 that has not been removed from the copper layer is alternately stacked by a plurality of substrates 1031 and copper layers 10322, and each two substrates 1031 are separated by a copper layer 1032, such as Figure 1 and Figure 2The multilayer board structure of the region of the main board 103 which is not designed for clearance is shown in the figure, and the substrate 1031 is covered with a copper layer 1032, wherein the uppermost layer and the lowermost layer of the main board 103 are solder resist ink layers 1033, and the solder resist ink layers 1033 are also covered with a copper layer 1032, and the substrate 1031 is generally a substrate made of FR4 (a code of a kind of fire-resistant material), and the number of layers of the main board 103 can be any layer and any order. In the embodiment of the present application, at least part of the copper layer or all of the copper layer of the main board 103 in the first region 300 is removed, for example, at least part of the copper layer in the region of the main board 103 which is opposite to any side or multiple sides of the signal transceiver 101 can be removed to reduce the reflectivity of at least part of the first region 300, and all of the copper layer in the first region 300 can also be removed to reduce the reflectivity of the entire first region 300, so as to obtain a better noise suppression effect.

[0035] According to some embodiments of the present application, the first side of the signal transceiver 101 and the support 104 have a first gap 201, and the second side of the signal transceiver 101 and the support 104 have a second gap 202, and the first side and the second side are two opposite sides of the signal transceiver 101 in the length direction.

[0036] The target region includes a first sub-region 301 and / or a second sub-region 302, the first sub-region 301 is a region of the main board 103 corresponding to the first gap 201, and the second sub-region 302 is a region of the main board 103 corresponding to the second gap 202.

[0037] In some embodiments, considering that the region of the main board 103 which is opposite to the gap between the short side of the signal transceiver 101 and the support 104 has less influence on the noise, and the region of the main board 103 which is opposite to the gap between the long side of the signal transceiver 101 and the support 104 has greater influence on the noise, the present application mainly considers the clearance design of the region of the main board 103 which is opposite to the gap between the long side of the signal transceiver 101 and the support 104, that is, removing at least part of the copper layer in the region of the main board 103.

[0038] Specifically, referring to Figure 3 , the first side of the signal transceiver 101 and the support 104 have a first gap 201, and the second side of the signal transceiver 101 and the support 104 have a second gap 202, and the first side and the second side are two opposite long sides of the signal transceiver 101.

[0039] The region of the main board 103 which is opposite to the first gap 201 is referred to as the first sub-region 301, and the region of the main board 103 which is opposite to the second gap 202 is referred to as the second sub-region 302, for example Figure 1As shown, the first sub-region 301 is a projection region of the first gap 201 on the main board 103, and the second sub-region 302 is a projection region of the second gap 202 on the main board 103. In this embodiment, the target region includes the first sub-region 301 and / or the second sub-region 302. The main board 103 in the first sub-region 301 and the second sub-region 302 is arranged by a multi-layer substrate stack. In a normally designed circuit board, a copper layer is arranged between each two layers of substrates. In this embodiment, part or all of the copper layers of the first sub-region 301 of the main board 103 can be removed to reduce the reflectivity of the first sub-region 301. Similarly, part or all of the copper layers of the second sub-region 302 of the main board 103 can be removed to reduce the reflectivity of the second sub-region 302. In addition, part or all of the copper layers of the first sub-region 301 and the second sub-region 302 can be removed to reduce the reflectivity of the first sub-region 301 and the second sub-region 302, thereby obtaining a better noise suppression effect.

[0040] In this way, by designing the clearance between the main board 103 and the support 104 to be opposite to the long side of the signal transceiver 101, a more significant noise suppression effect can be obtained.

[0041] According to some embodiments of the present application, the surface of the substrate 1031 on the side close to the signal transceiver 101 of the target region is not provided with a copper layer.

[0042] In this embodiment, the main board region in which at least part of the copper layer is removed can be referred to as a target region. The substrate 1031 on the side close to the signal transceiver 101 of the above target region is the uppermost layer of the substrate 103 in the target region of the main board 103, which can also be referred to as the first layer of substrate. The signal reflected by the screen cover plate 102 first reaches the uppermost layer of the copper layer 1032 of the main board 103, which is the first layer of copper layer. The first layer of copper layer is the copper layer on the upper surface of the first layer of substrate. The first layer of copper layer has the greatest adverse effect on the secondary reflected signal. Therefore, in some embodiments, at least the first layer of copper layer of the main board 103 closest to the screen cover plate 102 in the target region can be removed to reduce the reflectivity and reflectivity of the upper layer of the main board 103, thereby ensuring a better noise suppression effect.

[0043] According to yet some other embodiments of the present application, the main board 103 is not provided with a copper layer between the substrates 1031 in the target region from the surface close to the signal transceiver 101 to the direction away from the signal transceiver 101.

[0044] The signal reflected by the screen cover 102 will sequentially reach the copper plating layer 1032 between each substrate 1031 of the motherboard 103. That is, the secondary reflection signal of the copper plating layer closer to the upper surface of the motherboard 103 will have a greater adverse effect. Therefore, in some embodiments, several copper plating layers of the motherboard 103 closest to the screen cover 102 in the target area can be removed. In other words, several copper plating layers of the motherboard 103 in the target area can be removed from top to bottom to reduce the reflectivity and reflection intensity of the upper layer of the motherboard 103 and ensure better noise suppression effect.

[0045] According to some other embodiments of this application, no copper cladding layer is provided between any two substrates 1031 in the target region.

[0046] In some embodiments, in order to obtain a better noise floor suppression effect, all copper layers of the motherboard 103 in the target area can be removed, so that the motherboard 103 in the target area has no copper layer, forming a clear area 120, thereby significantly reducing the reflectivity of the motherboard 103 in the target area. In this way, the intensity of secondary reflection of the signal reflected by the screen cover 102 in the target area of ​​the motherboard 103 will also be greatly reduced, thereby significantly improving the noise floor suppression effect.

[0047] According to some embodiments of this application, the surface layer of the motherboard 103 near the signal transceiver 101 is a solder resist ink layer 1033, and the solder resist ink layer 1033 in the target area is recessed into the substrate 1031.

[0048] like Figure 1 and Figure 2 As shown, in some embodiments, after removing the copper layer on the surface of the motherboard 103 in the target area, the solder resist ink layer 1033 in the target area can be designed to have a structure that is recessed towards the substrate 1031, that is, the solder resist ink layer 1033 in the target area directly covers the substrate 1031 that is adjacent to it, which can ensure that the motherboard manufacturing process is easy to implement.

[0049] It should be noted that in some embodiments, the bottom layer of the motherboard 103, i.e. the lowest copper layer, in the target area can also be removed. In this case, the bottom solder resist ink layer 1033 of the motherboard 103 away from the signal transceiver 101 also presents a structure that is recessed into the substrate 1031.

[0050] According to some embodiments of this application, foam 105 is filled between the screen cover 102 and the support member 104, and no foam is filled between the screen cover 102 and the signal transmitting end of the signal transceiver 101, nor is foam filled between the screen cover 102 and the signal receiving end of the signal transceiver 101.

[0051] In some embodiments, only the foam 105 in contact with the lower surface of the screen cover plate 102 can be arranged between the screen cover plate 102 and the support 104, and the signal transmitting end and the signal receiving end of the signal transceiver 101 are designed without obstruction, as shown in Figure 1 The screen cover plate 102 and the support 104 are filled with the foam 105, but the area 110 of the screen cover plate 102 opposite the signal transceiver 101 is not provided with the foam, so as to ensure that the transmitting signal of the signal transceiver 101 can pass through the screen cover plate 102, and the incident signal can also pass through the screen cover plate 102 to reach the receiving end of the signal transceiver 101. Taking the infrared sensor as an example, the transmitting light of the infrared sensor can pass through the screen cover plate 102 and return to the receiving end of the infrared sensor again after being reflected by an object.

[0052] According to some embodiments of the present application, the signal transmitting module 1012 and the signal receiving module 1013 of the signal transceiver 101 are provided with the partition 108.

[0053] As shown in Figure 2 The signal transmitting module 1012 and the signal receiving module 1013 of the signal transceiver 101 can be provided with the partition 108 such as the partition foam, so as to partition the mutual interference between the signal transmission and the signal reception of the signal transceiver 101 and further suppress the noise interference.

[0054] It should be noted that, as shown in Figure 2 The position opposite the partition 108 below the screen cover plate 102 can also be filled with the foam 105 or other materials.

[0055] According to some embodiments of the present application, the main board 103 and the signal transceiver 101 are further provided with the circuit board 106, the circuit board 106 is fixed on the main board 103, and the circuit board 106 is fixedly connected with the signal transceiver 101.

[0056] That is, in some embodiments, the signal transceiver 101 can be arranged on the circuit board 106, and the circuit board 106 is equivalent to a pad board for raising the signal transceiver 101, which is suitable for the miniaturized stacking scheme.

[0057] Specifically, the circuit board 106 and the main board 103 are two separate PCB boards, the circuit board 106 is fixed on the main board 103, such as being welded on the main board 103, for raising the signal transceiver 101, and the height thereof can be customized according to the overall stacking structure, and the circuit board 106 is fixedly connected with the signal transceiver 101, such as being welded together through the soldering pad.

[0058] According to a further embodiment of the present application, the circuit board 106 is adapted to the length and width dimensions of the signal transceiver 101.

[0059] As shown in Figure 1 and Figure 2 , the circuit board 106 is adapted to the length and width dimensions of the signal transceiver 101, and the two are welded together through the solder pad to form an integrated structure, which can be combined together as a miniaturized transceiver solution.

[0060] According to some embodiments of the present application, the multi-layer substrate 1031 of the third area of the main board 103 is electrically connected through the via 107.

[0061] As shown in Figure 1 , the area of the main board 103 without copper layer is formed by the alternating stacking of the multi-layer substrate 1031 and the copper layer 1032, and the different layers of the substrate 1031 can be electrically connected through the via 107 according to actual needs.

[0062] According to some embodiments of the present application, the signal transceiver 101 is an infrared sensor, a time-of-flight (TOF) sensor, or an ultrasonic sensor.

[0063] That is, the embodiments of the present application can be applied to any electronic device containing a transceiver system design, for example, can be applied to an electronic device provided with an infrared sensor, a TOF sensor, an ultrasonic sensor, etc. under the screen, and can well suppress the bottom noise generated by the secondary reflection of infrared signals, ultrasonic signals, etc. on the main board. The application field of the embodiments of the present application can involve head-mounted terminals, robots, etc.

[0064] According to some embodiments of the present application, the signal transmitting module 1012 and the signal receiving module 1013 of the signal transceiver 101 are integrated.

[0065] That is, the embodiments of the present application are applicable to the signal transceiver 101 with the integrated setting of the transceiver module. Taking an infrared sensor as an example, as shown in Figure 4 , the infrared sensor includes a sensor body 1011, a signal transmitting module 1012 and a signal receiving module 1013 located on the sensor body 1011, that is, the signal transmitting module 1012 and the signal receiving module 1013 are integrated on the sensor body 1011, so that the size of the infrared sensor is miniaturized, and is applicable to electronic devices adopting a miniaturized stacking scheme.

[0066] The embodiments of the present application also verify the bottom noise suppression effect, Figure 5 showing the experimental comparison results of the original main board bottom noise and the clearance design (i.e. removing the copper layer of the target area of the main board) of the main board bottom noise. It can be seen that the bottom noise after the clearance design is significantly reduced.

[0067] In summary, the embodiments of the present application can obtain good bottom noise suppression effect without changing the stacking form, increasing cost and process requirements, and only by removing the copper layer under the gap projection area on the mainboard.

[0068] According to the electronic device of the embodiments of the present application, the electronic device comprises a signal transceiver, a screen cover plate and a mainboard, the signal transceiver is arranged between the screen cover plate and the mainboard; the electronic device further comprises a support, the support is located circumferentially around the signal transceiver, and the support is located between the screen cover plate and the mainboard; the signal transceiver and the support have a gap therebetween; the mainboard comprises a multilayer substrate and a copper layer, the substrate and the copper layer are alternately stacked to form the mainboard; the number of the copper layers of the mainboard in at least a part of a first area is less than that of other areas, the first area is a mainboard area corresponding to the gap, and the area with the number of the copper layers less than that of other areas is a target area. In this way, by removing part or all of the copper layers of the area on the mainboard which directly faces the gap between the signal transceiver and the support, a certain clearance area is formed, the reflectivity of this area is reduced, the secondary reflection intensity of the signal reflected by the screen cover plate in this area is reduced, and the bottom noise is suppressed, thereby effectively improving the bottom noise suppression effect.

[0069] Other configurations of the electronic device according to the embodiments of the present application, such as communication modules, processors and the like, and operations are known to those skilled in the art, and will not be described in detail here.

[0070] In the description of the present specification, the description of the terms "one embodiment", "some embodiments", "exemplary embodiment", "example", "specific example" or "some examples" means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the present specification, the exemplary description of the above terms does not necessarily mean the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0071] Although the embodiments of the present application have been shown and described, those skilled in the art can understand that various changes, modifications, replacements and variations can be made to the embodiments without departing from the principles and purposes of the present application, and the scope of the present application is defined by the claims and their equivalents.

Claims

1. An electronic device, comprising: The electronic device comprises a signal transceiver, a screen cover plate and a main plate, wherein the signal transceiver is arranged between the screen cover plate and the main plate. The electronic device further comprises a support, which is located circumferentially around the signal transceiver and between the screen cover plate and the main plate. The signal transceiver and the support have a gap therebetween. The main plate comprises a multilayer substrate and a copper layer, which are alternately stacked to form the main plate. The number of copper layers of the main plate in at least a first region is less than that in other regions, the first region is a region of the main plate corresponding to the gap, and the region with less number of copper layers than other regions is a target region.

2. The electronic device of claim 1, wherein, The signal transceiver has a first gap between a first side edge and the support and a second gap between a second side edge and the support, the first and second side edges being two opposite side edges of the signal transceiver in the length direction. The target region comprises a first sub-region and / or a second sub-region, the first sub-region being a region of the main plate corresponding to the first gap, and the second sub-region being a region of the main plate corresponding to the second gap.

3. The electronic device of claim 1, wherein, The surface of the substrate close to one side of the target region of the signal transceiver is not provided with a copper layer.

4. The electronic device of claim 3, wherein, Any two layers of the substrate in the target region are not provided with a copper layer.

5. The electronic device of claim 3, wherein, The main plate is not provided with a copper layer between the multilayer substrate from the surface close to the signal transceiver to the direction away from the signal transceiver in the target region.

6. The electronic device of claim 3, wherein, The surface layer of the main plate close to the signal transceiver is a solder resist ink layer, and the solder resist ink layer of the target region is recessed towards the substrate.

7. The electronic device of any of claims 1-6, wherein, The screen cover plate and the support are filled with foam, and the screen cover plate and the signal transmitting end of the signal transceiver are not filled with foam, and the screen cover plate and the signal receiving end of the signal transceiver are not filled with foam.

8. The electronic device of any of claims 1-6, wherein, The main plate and the signal transceiver are further provided with a circuit board, which is fixed on the main plate and fixedly connected with the signal transceiver.

9. The electronic device of any of claims 1-6, wherein, The multilayer substrate of a third region of the main plate is electrically connected through a via, and the third region is other regions of the main plate except the target region.

10. The electronic device of any of claims 1-6, wherein, The signal transmitting module and the signal receiving module of the signal transceiver are provided with a partition member.

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