SMT (Surface Mount Technology) adhesive curing equipment

Abstract

The utility model relates to the technical field of SMT (Surface Mount Technology) processing, and discloses SMT adhesive curing equipment, which comprises a processing box and further comprises a support frame fixedly connected in the processing box, and a plurality of heating pipes fixedly connected at the bottom of the support frame. According to the device, dust prevention treatment can be effectively carried out on the interior of the processing box through the arranged dust prevention assembly, so that the influence of dust and other impurities on curing of patch glue can be avoided, the position of the movable plate can be effectively adjusted through the arranged adjusting assembly, and therefore the device can effectively carry out curing treatment on the patch glue; according to the surface mount adhesive curing device, the position of the movable plate can be effectively fixed through the arranged fixing assembly, and high-temperature gas in the external environment can be effectively cooled through the arranged cooling assembly, so that the curing efficiency and effect of the surface mount adhesive can be further improved, and the overall practicability of the device is effectively improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to SMT patch processing technical field, concretely relates to a kind of SMT patch glue curing equipment. BACKGROUND

[0002] SMT patch is a kind of surface mount device without pin or short pin surface assembly component is installed on the surface of printed circuit board (PCB), is welded and assembled by reflow soldering or immersion soldering method, SMT patch needs to silk screen tin paste first, then glue to the fixed position of circuit board, then surface mount device is attached to circuit board, then curing is carried out, at this time, a kind of SMT patch glue curing equipment needs to be used.

[0003] The curing equipment in prior art mostly does not have effective dustproof structure, so that dust and other impurities in external environment adhere to the outside of patch during cooling process, to cause impact on normal use effect of patch, and the curing equipment in prior art also does not have effective cooling structure, when the gas temperature in external environment is higher, if the gas in external environment is directly sucked into the inside of processing box to carry out temperature reduction treatment to patch glue, then patch glue curing efficiency is low and curing effect is poor, etc., reduce the practicability of device as a whole.

[0004] Comparing the Chinese patent with publication number CN221829174U, the utility model discloses a kind of SMT patch glue curing equipment, including curing box, its front side is hinged with door, support plate is horizontally slid in the bottom of curing box, a plurality of heating bands are horizontally arranged in the curing box, exhaust fan is fixedly arranged at the top of curing box, cover plate is hinged with the exhaust fan at the top of curing box, respectively set up air inlet in the left and right side walls of curing box corresponding exhaust fan, respectively slid wind baffle with the air inlet corresponding at the left and right side walls outside curing box, the air inlet is set with the matching air passage in the wind baffle, two wind baffles are fixedly provided with adjusting assembly, temperature sensor is further provided in the top of curing box, controller is provided with the temperature sensor outside curing box, exhaust fan and air inlet are shielded by cover plate and wind baffle, the efficiency of heating melting is improved, heat is discharged by exhaust fan, and air inlet is used for heat dissipation, with low cost and high practicability.

[0005] The above scheme can effectively cure the patch glue, but the above scheme still cannot effectively intercept the dust and other impurities in the external environment, and the above scheme still cannot reduce the temperature of the gas with higher temperature in the external environment, and the problems in the above background are not solved.

[0006] Therefore, the skilled in the art provides a kind of SMT patch glue curing equipment to solve the problems in the above background. Utility model content

[0007] The utility model discloses a SMT paster glue curing equipment, including processing box, still including:

[0008] Support frame, fixedly connected in the inside of processing box, the bottom of support frame is fixedly connected with a plurality of heating pipes,

[0009] Mounting frame is fixedly connected respectively in the inner wall both sides of processing box, and the placing plate is equipped between two mounting frames,

[0010] Exhaust cylinder, symmetry is arranged in the upper surface of processing box, and the inside of two exhaust cylinders is fixedly installed with exhaust fan, and the outside of two exhaust cylinders is all set with sealing cover, and the both sides of the outer wall of processing box are all equal interval and are set with air inlet hole,

[0011] Moving plate is arranged respectively in the both sides of the outer wall of processing box, and the inside of two moving plates is all equal interval and is set with vent, and the outside of two moving plates is all fixedly connected with positioning frame,

[0012] Dustproof assembly is arranged in the inside of positioning frame,

[0013] Adjusting assembly, symmetry is arranged in the outside of moving plate,

[0014] Fixing assembly, symmetry is arranged in the outside of moving plate,

[0015] Cooling assembly, set up in the outside of moving plate.

[0016] As the further improvement of the technical scheme, the dustproof assembly includes a dustproof mesh cover arranged in the positioning frame, the positioning frame is symmetrically provided with a fixing block outside, the fixing block is provided with a fixing rod inside, one end of the fixing rod is fixedly connected with a pull ring, the fixing rod is fixedly connected with a contact plate outside, the fixing rod is sleeved with a reset spring outside, the reset spring is in contact between the contact plate and the fixing block, the contact surfaces of the fixing block and the positioning frame are both provided with a guide groove for the movement of the fixing rod, and the dustproof mesh cover is provided with a guide groove inside for the movement of the fixing rod.

[0017] As the further improvement of the technical scheme, the adjusting assembly includes guide blocks symmetrically arranged outside the moving plate, the outer walls of the processing box are fixedly connected with a plurality of support blocks, guide rods are fixedly connected between every two support blocks, the guide blocks are provided with guide grooves inside for the movement of the guide rods, the guide rods are sleeved with contact springs outside, the contact springs are in contact between the guide blocks and the support blocks, and the bottom of the moving plate is fixedly connected with a handle.

[0018] As a further improvement of the technical solution, the outer part of the plurality of guide rods is sleeved with an accordion protective cover, and the two ends of the plurality of accordion protective covers are fixedly connected with the opposite sides of the guide blocks and the support blocks.

[0019] As a further improvement of the technical solution, the fixing assembly comprises a connecting block symmetrically arranged on the outer part of the moving plate, a telescopic rod fixedly connected in the inner part of the connecting block, an arc-shaped clamping block fixedly connected at the telescopic end of the telescopic rod, a compression spring sleeved on the outer part of the telescopic rod, the compression spring abutting between the arc-shaped clamping block and the connecting block, a guide groove for the arc-shaped clamping block to move formed in the outer part of the connecting block, and a plurality of plug-in plates symmetrically arranged on the two sides of the outer wall of the processing box, and two guide grooves for the arc-shaped clamping block to move are formed in the inner part of each plug-in plate.

[0020] As a further improvement of the technical solution, the cooling assembly comprises a cooling box fixedly connected on the outer part of the moving plate, a serpentine cooling pipe fixedly connected on the outer part of the moving plate, and a micro circulating pump fixedly connected on the outer part of the moving plate, the liquid inlet end of the micro circulating pump is in communication with one end of the serpentine cooling pipe, the liquid outlet end of the micro circulating pump is in communication with the inner part of the cooling box through a pipeline, the other end of the serpentine cooling pipe is in communication with the inner part of the cooling box, and the inner bottom end of the cooling box is provided with refrigerating plates at equal intervals.

[0021] Compared with the prior art, the utility model has the advantages of:

[0022] In the SMT patch glue curing equipment, when the patch glue needs to be cured, the patch is placed on the placing plate, the heating pipe starts to run, the patch glue can be effectively heated and melted, when the patch glue needs to be cured, the sealing cover is opened, the moving plate is adjusted in height by the adjusting assembly, when the ventilation hole in the moving plate is in communication with the air inlet hole on the two sides of the outer wall of the processing box, the gas in the external environment enters the inside of the processing box to cool the patch glue, the exhaust fan can effectively exhaust the high-temperature gas in the processing box, the circulation speed of the gas in the processing box is improved, the patch glue can be effectively cured, when the gas temperature in the external environment is high, the cooling assembly starts to run, the temperature of the gas in the external environment is effectively reduced, the cooling and curing efficiency and effect of the patch glue are improved, the dust and impurities in the external environment are intercepted by the dustproof assembly, the patch glue is not affected by the dust and impurities, the position of the moving plate is fixed by the fixing assembly, and the practicability of the device is further improved. BRIEF DESCRIPTION OF DRAWINGS

[0023] Figure 1 This is a schematic diagram of the overall three-dimensional structure of this utility model;

[0024] Figure 2 This is a three-dimensional structural diagram of the dustproof mesh cover after disassembly in this utility model;

[0025] Figure 3 This is a bottom-view three-dimensional structural diagram of the present invention;

[0026] Figure 4 for Figure 2 Enlarged structural diagram of region A in the middle;

[0027] Figure 5 for Figure 2 A magnified structural diagram of region B in the middle;

[0028] Figure 6 for Figure 3 A magnified structural diagram of region C in the middle.

[0029] The meanings of the labels in the diagram are as follows:

[0030] 1. Processing box; 2. Support frame; 3. Heating tube; 4. Exhaust duct; 5. Sealing cover; 6. Mounting frame; 7. Placement plate; 8. Dustproof mesh cover; 9. Moving plate; 10. Positioning frame; 11. Exhaust fan; 12. Serpentine cooling tube; 13. Miniature circulating pump; 14. Cooling box; 15. Fixing block; 16. Fixing rod; 17. Contact plate; 18. Return spring; 19. Cooling plate; 20. Support block; 21. Guide rod; 22. Guide block; 23. Contact spring; 24. Bellows protective cover; 25. Insert plate; 26. Connecting block; 27. Telescopic rod; 28. Arc-shaped locking block; 29. ​​Compression spring. Detailed Implementation

[0031] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0032] Please see Figure 1 - Figure 6 As shown, this embodiment provides an SMT adhesive curing device, including a processing box 1, and further comprising:

[0033] The support frame 2 is fixedly connected inside the processing box 1, and multiple heating tubes 3 are fixedly connected to the bottom of the support frame 2;

[0034] The installation frame 6 is fixedly connected to the inner wall of the processing box 1, and the placing plate 7 is arranged between the two installation frames 6.

[0035] The exhaust cylinder 4 is symmetrically arranged on the upper surface of the processing box 1, the exhaust fan 11 is fixedly installed in the exhaust cylinder 4, the sealing cover 5 is sleeved on the outside of the exhaust cylinder 4, and the air inlet holes are arranged on the outer wall of the processing box 1.

[0036] The moving plate 9 is arranged on the outer wall of the processing box 1, the ventilation holes are arranged in the moving plate 9, and the positioning frame 10 is fixedly connected to the outside of the moving plate 9.

[0037] The dustproof assembly is arranged in the positioning frame 10.

[0038] The adjusting assembly is symmetrically arranged on the outside of the moving plate 9.

[0039] The fixing assembly is symmetrically arranged on the outside of the moving plate 9.

[0040] The cooling assembly is arranged on the outside of the moving plate 9.

[0041] The working principle is as follows: when the patch glue needs to be cured, the patch is placed on the placing plate 7, the heating pipe 3 starts to run, the heating pipe 3 can effectively heat and melt the patch glue, when the patch glue needs to be cured, the sealing cover 5 is opened, the exhaust fan 11 starts to run, the height position of the moving plate 9 is adjusted through the adjusting assembly, when the ventilation holes in the moving plate 9 are connected with the air inlet holes on the outer wall of the processing box 1, the gas in the external environment enters the inside of the processing box 1 to cool the patch glue, at the same time, the exhaust fan 11 can effectively exhaust the high-temperature gas in the processing box 1, so as to improve the circulation speed of the gas in the processing box 1, and the patch glue can be effectively cured, when the gas temperature in the external environment is high, the cooling assembly starts to run, the cooling assembly can effectively reduce the temperature of the gas in the external environment, so as to effectively improve the cooling and curing efficiency and effect of the patch glue, through the arrangement of the dustproof assembly, the dust and impurities in the external environment can be effectively intercepted, so as to avoid the influence of the dust and impurities on the patch glue, through the arrangement of the fixing assembly, the position of the moving plate 9 can be effectively fixed, and the practicability of the device is further improved.

[0042] In order to effectively prevent dust in the inside of the processing box 1, the dustproof assembly comprises a dustproof screen cover 8 arranged in the inside of the positioning frame 10, the outside of the positioning frame 10 is symmetrically provided with a fixing block 15, the inside of the fixing block 15 is provided with a fixing rod 16, one end of the fixing rod 16 is fixedly connected with a pull ring, the outside of the fixing rod 16 is fixedly connected with an abutting plate 17, the outside of the fixing rod 16 is sleeved with a reset spring 18, the reset spring 18 abuts between the abutting plate 17 and the fixing block 15, the contact surfaces of the fixing block 15 and the positioning frame 10 are both provided with a guide groove for the movement of the fixing rod 16, the inside of the dustproof screen cover 8 is provided with a guide groove for the movement of the fixing rod 16, when it is needed to prevent dust in the inside of the processing box 1, the pull ring is only pulled, at this time, the pull ring drives the fixing rod 16 to move synchronously, the fixing rod 16 drives the abutting plate 17 to move synchronously, in the process of the movement of the abutting plate 17, the reset spring 18 is extruded, at this time, the dustproof screen cover 8 is inserted into the inside of the positioning frame 10, and then the pull ring is released, at this time, the reset spring 18 is reset, drives the abutting plate 17 and the fixing rod 16 to move synchronously, when the fixing rod 16 is inserted into the guide groove in the inside of the dustproof screen cover 8, the dustproof screen cover 8 and the positioning frame 10 can be fixed, at this time, the inside of the processing box 1 can be prevented from dust by the dustproof screen cover 8.

[0043] In view of the need to adjust the height position of the moving plate 9 when curing the patch glue, the adjusting assembly includes guide blocks 22 symmetrically arranged outside the moving plate 9, a plurality of support blocks 20 are fixedly connected to the outer wall of the processing box 1 on both sides, a guide rod 21 is fixedly connected between every two support blocks 20, a plurality of guide blocks 22 are internally provided with guide grooves for the movement of the guide rods 21, a plurality of abutting springs 23 are externally sleeved on the guide rods 21, and the abutting springs 23 are abutted between the guide blocks 22 and the support blocks 20. The bottom of the moving plate 9 is fixedly connected with a handle. When the patch glue needs to be cured, the handle is simply pulled down, and the moving plate 9 is moved synchronously. The moving plate 9 moves and drives the fixing assembly to move synchronously. When the ventilation hole in the moving plate 9 is communicated with the air inlet hole on both sides of the outer wall of the processing box 1, the position of the moving plate 9 is fixed by the fixing assembly. At this time, the gas in the external environment can enter the inside of the processing box 1, so that the patch glue can be effectively cured. During the movement of the moving plate 9, the guide blocks 22 move synchronously outside the guide rods 21. At this time, the abutting springs 23 are extruded. When the patch glue does not need to be cured, the position of the moving plate 9 is fixed by the fixing assembly. At this time, the abutting springs 23 are reset, the guide blocks 22 are moved synchronously, the guide blocks 22 drive the moving plate 9 and the fixing assembly to move synchronously. When the moving plate 9 moves to the uppermost position, the position of the moving plate 9 is fixed by the fixing assembly. At this time, the processing box 1 can be sealed.

[0044] In order to effectively prolong the service life of the abutting spring 23, the external part of the guide rod 21 is sleeved with an organ protective cover 24, and the two ends of the organ protective cover 24 are fixedly connected with the opposite side of the guide block 22 and the support block 20. Through the arrangement of the organ protective cover 24, the abutting spring 23 can be effectively protected from dust and water, thereby effectively prolonging the service life of the abutting spring 23.

[0045] In order to effectively fix the position of the moving plate 9, the fixing assembly comprises connecting blocks 26 symmetrically arranged outside the moving plate 9, the inside of the connecting block 26 is fixedly connected with an extension rod 27, the telescopic end of the extension rod 27 is fixedly connected with an arc-shaped clamping block 28, the outside of the extension rod 27 is sleeved with a compression spring 29, the compression spring 29 abuts between the arc-shaped clamping block 28 and the connecting block 26, the outside of the connecting block 26 is provided with a guide groove for the arc-shaped clamping block 28 to move, the outer wall of the processing box 1 is symmetrically provided with a plug plate 25 on both sides, the inside of the plug plate 25 is provided with two guide grooves for the arc-shaped clamping block 28 to move, when it is necessary to cure the patch glue, the handle only needs to be pulled down, at this time the handle will drive the moving plate 9 to move synchronously, the moving plate 9 drives the connecting block 26 to move synchronously, the connecting block 26 drives the arc-shaped clamping block 28 to move synchronously, in the process of moving of the arc-shaped clamping block 28, the arc-shaped clamping block 28 will be extruded, at this time the arc-shaped clamping block 28 will extrude the extension rod 27 and the compression spring 29 synchronously, when the arc-shaped clamping block 28 moves to the guide groove below the plug plate 25, the compression spring 29 resets to drive the arc-shaped clamping block 28 to move synchronously, when the arc-shaped clamping block 28 is inserted into the guide groove below the plug plate 25, the position of the moving plate 9 can be fixed, when it is not necessary to cure the patch glue, the arc-shaped clamping block 28 only needs to be pressed, at this time the arc-shaped clamping block 28 will extrude the extension rod 27 and the compression spring 29 synchronously, when the arc-shaped clamping block 28 is separated from the guide groove below the plug plate 25, the abutting spring 23 resets to drive the guide block 22 and the moving plate 9 to move synchronously, the moving plate 9 drives the connecting block 26 to move synchronously, the connecting block 26 drives the arc-shaped clamping block 28 to move upwards synchronously, when the arc-shaped clamping block 28 moves to the guide groove above the plug plate 25, the compression spring 29 resets to drive the arc-shaped clamping block 28 to move synchronously, when the arc-shaped clamping block 28 is inserted into the guide groove above the plug plate 25, the position of the moving plate 9 can be fixed again.

[0046] In addition, in order to effectively cool the gas temperature in the external environment, the cooling assembly comprises a cooling box 14 fixedly connected to the outside of the moving plate 9, a serpentine cooling pipe 12 fixedly connected to the outside of the moving plate 9, and a micro circulating pump 13 fixedly connected to the outside of the moving plate 9. The inlet end of the micro circulating pump 13 is in communication with one end of the serpentine cooling pipe 12, the outlet end of the micro circulating pump 13 is in communication with the inside of the cooling box 14 through a pipeline, the other end of the serpentine cooling pipe 12 is in communication with the inside of the cooling box 14, and the inside of the cooling box 14 is provided with refrigeration plates 19 at equal intervals. When the gas temperature in the external environment is high, the micro circulating pump 13 starts to operate, at which time the micro circulating pump 13 can draw the refrigerant in the cooling box 14 into the inside of the serpentine cooling pipe 12. When hot air passes through the serpentine cooling pipe 12, the serpentine cooling pipe 12 can effectively absorb heat from the hot air, thereby effectively reducing the temperature of the hot air, and further effectively improving the curing efficiency and effect of the patch adhesive. The refrigerant in the serpentine cooling pipe 12 can be circulated into the inside of the cooling box 14, so that the circulation is repeated, thereby effectively cooling the gas with high temperature in the external environment, and effectively improving the practicability of the device as a whole. Through the arrangement of the refrigeration plates 19, the refrigerant can be effectively cooled, thereby further improving the cooling effect.

[0047] The basic principle, main features and advantages of the present application are shown and described above. It should be understood by those skilled in the art that the present application is not limited by the above embodiments, and the above embodiments and descriptions in the specification are only preferred examples of the present application and do not limit the present application. Without departing from the spirit and scope of the present application, various changes and improvements can be made to the present application, and these changes and improvements all fall within the scope of the claimed present application. The scope of protection of the present application is defined by the appended claims and their equivalents.

Claims

1. An SMT patch glue curing apparatus comprising a processing box (1), characterized in that, Also includes: Support frame (2) is fixedly connected in the inside of the processing box (1), the bottom of the support frame (2) is fixedly connected with a plurality of heating pipes (3); The mounting frame (6) is fixedly connected on both sides of the inner wall of the processing box (1) respectively, and the placing plate (7) is arranged between the two mounting frames (6); The exhaust cylinder (4) is symmetrically arranged on the upper surface of the processing box (1), the inside of the two exhaust cylinders (4) is fixedly installed with an exhaust fan (11), the outside of the two exhaust cylinders (4) is sleeved with a sealing cover (5), and the outer wall of the processing box (1) is provided with an air inlet hole at equal intervals on both sides; The moving plate (9) is arranged on both sides of the outer wall of the processing box (1) respectively, the inside of the two moving plates (9) is provided with a ventilation hole at equal intervals, and the outside of the two moving plates (9) is fixedly connected with a positioning frame (10); The dustproof assembly is arranged in the inside of the positioning frame (10); The adjusting assembly is symmetrically arranged on the outside of the moving plate (9); The fixing assembly is symmetrically arranged on the outside of the moving plate (9); The cooling assembly is arranged on the outside of the moving plate (9).

2. The SMT patch glue curing apparatus according to claim 1, characterized in that: The dustproof assembly includes a dustproof mesh cover (8) arranged in the inside of the positioning frame (10), the outside of the positioning frame (10) is symmetrically provided with a fixed block (15), the inside of the fixed block (15) is provided with a fixed rod (16), one end of the fixed rod (16) is fixedly connected with a pull ring, the outside of the fixed rod (16) is fixedly connected with a resisting plate (17), the outside of the fixed rod (16) is sleeved with a reset spring (18), the reset spring (18) is abutted between the resisting plate (17) and the fixed block (15), the contact surfaces of the fixed block (15) and the positioning frame (10) are provided with guide grooves for the movement of the fixed rod (16), and the inside of the dustproof mesh cover (8) is provided with a guide groove for the movement of the fixed rod (16).

3. The SMT patch glue curing apparatus according to claim 1, characterized in that: The adjusting assembly includes guide blocks (22) symmetrically arranged on the outside of the moving plate (9), the outer walls of the processing box (1) are fixedly connected with a plurality of support blocks (20), guide rods (21) are fixedly connected between every two support blocks (20), the inside of the plurality of guide blocks (22) is provided with guide grooves for the movement of the guide rods (21), the outside of the plurality of guide rods (21) is sleeved with resisting springs (23), the plurality of resisting springs (23) are abutted between the guide blocks (22) and the support blocks (20), and the bottom of the moving plate (9) is fixedly connected with a handle.

4. The SMT patch glue curing apparatus according to claim 3, characterized in that: The outside of the plurality of guide rods (21) is sleeved with an organ protective cover (24), and the two ends of the plurality of organ protective covers (24) are fixedly connected with the opposite sides of the guide blocks (22) and the support blocks (20) respectively.

5. The SMT patch glue curing apparatus according to claim 1, characterized in that: The fixed assembly includes connecting blocks (26) symmetrically arranged outside the moving plate (9), the inside of the connecting block (26) is fixedly connected with a telescopic rod (27), the telescopic end of the telescopic rod (27) is fixedly connected with an arc-shaped clamping block (28), the outside of the telescopic rod (27) is sleeved with a compression spring (29), the compression spring (29) abuts between the arc-shaped clamping block (28) and the connecting block (26), the outside of the connecting block (26) is provided with a guide groove for the arc-shaped clamping block (28) to move, and the outer wall of the processing box (1) is symmetrically provided with plug-in plates (25) on both sides, the inside of the plug-in plates (25) is provided with two guide grooves for the arc-shaped clamping block (28) to move.

6. The SMT patch glue curing apparatus according to claim 1, characterized in that: The cooling assembly includes a cooling box (14) fixedly connected outside the moving plate (9), a serpentine cooling pipe (12) fixedly connected outside the moving plate (9), and a micro circulating pump (13) fixedly connected outside the moving plate (9), the liquid inlet end of the micro circulating pump (13) is communicated with one end of the serpentine cooling pipe (12), the liquid outlet end of the micro circulating pump (13) is communicated with the inside of the cooling box (14) through a pipeline, the other end of the serpentine cooling pipe (12) is communicated with the inside of the cooling box (14), and the inside of the cooling box (14) is provided with refrigerating plates (19) at equal intervals.

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