High-voltage device packaging structure

Abstract

The utility model discloses a high-voltage device packaging structure, which relates to the technical field of packaging, and comprises a packaging box, a device plate body is connected in the packaging box in a sliding manner, the packaging structure comprises a lock catch mechanism, the lock catch mechanism comprises a moving support fixedly connected to the outer surface of the packaging box, the moving support is provided with a limiting sliding groove, a moving block is connected to the limiting sliding groove in a sliding manner, and the moving block is connected with the device plate body in a sliding manner. The top end of the moving frame is fixedly connected with a bearing cylinder, and the inner wall of the bearing cylinder is slidably connected with an inclined block. According to the device, the device plate body can move and extrude towards the moving block, the main abutting and buckling plate extrudes the inclined block to retract into the bearing cylinder firstly, then the inclined block pops up to block the main abutting and buckling plate, the device plate body can be rapidly installed, the rotating table can be screwed, the inclined block is pulled to retract into the bearing cylinder, and the device plate body can be rapidly installed. And the device plate body is pushed out of the packaging box in cooperation with reset springback of the second spring to the device plate body, the device plate body is rapidly disassembled, and the device is beneficial to improving the mounting and disassembling efficiency of the device plate body.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field of packaging technology, concretely relates to a high voltage device packaging structure. BACKGROUND

[0002] Power semiconductor devices are semiconductor devices for power processing, which include power diodes, power switching devices and power integrated circuits. The device power and device power density will increase with the performance improvement of electronic devices, which makes electronic devices face serious challenges in heat dissipation while improving performance. Silicon carbide, as a new third-generation semiconductor material, has excellent physical and electrical properties. For silicon carbide high-temperature devices and integrated circuits, the working temperature is high, the stable working temperature range is large, and it has considerable advantages under high temperature conditions.

[0003] After searching, the patent authorization publication number is CN218333769U, and the patent discloses a packaging structure of a silicon carbide power semiconductor high-voltage device. The ceramic substrate, silicon carbide power device, metal positive electrode, metal negative electrode and external pin are fixed with a substrate and a packaging box at the top end of the ceramic substrate. The inner side of the packaging box is formed with a gap on the side of the substrate. The top end of the substrate is provided with a heat-conducting metal sheet, and the heat-conducting metal sheet is located at the bottom of the metal negative electrode. The top end of the packaging box is connected with a packaging cover through a packaging part. The bottom end of the ceramic substrate is adhered with a heat sink through an adhesive. Although the device can dissipate heat from the silicon carbide power device and dissipate it as soon as possible, the internal metal devices are in a lower working environment, the installation and disassembly of the device plate body are extremely cumbersome, and the installation and disassembly efficiency of the device plate body is reduced.

[0004] Therefore, in view of the above, the utility model provides a high-voltage device packaging structure to make up for and improve the shortcomings of the prior art. UTILITY MODEL CONTENTS

[0005] To solve the above technical problems, the utility model adopts the technical scheme of a high-voltage device packaging structure, which comprises a packaging box, a device plate body connected to the inside of the packaging box, and comprises:

[0006] The lock mechanism is arranged between the packaging box and the device plate body, and comprises a movable support fixedly connected to the outer surface of the packaging box, a limiting sliding groove formed in the movable support, a movable block slidably connected to the limiting sliding groove, a bearing cylinder fixedly connected to the top end of the movable support, and an inclined block slidably connected to the inner wall of the bearing cylinder.

[0007] The heat-conducting metal plate is fixedly connected to the inner bottom surface of the packaging box.

[0008] As a preferred, the inner wall of the limiting sliding groove is fixedly connected with a second spring, one end of the movable block abuts against the second spring, and the other end of the movable block abuts against the device plate body.

[0009] As preferred, the mobile block is fixedly connected with a main stop plate at one end close to the device plate body, and is fixedly connected with a secondary stop plate at one end away from the device plate body.

[0010] As preferred, the inclined block is fixedly connected with a mobile column at one end away from the supply moving frame, the outer surface of the bearing cylinder is rotationally connected with a rotating table, and the mobile column is in abutment with the rotating table.

[0011] As preferred, the inner wall of the bearing cylinder is fixedly connected with a first spring, and the first spring is located between the bearing cylinder and the inclined block, and the top end of the supply moving frame is fixedly connected with a blocking block.

[0012] As preferred, the top end of the packaging box is clamped with a cover plate, the bottom end of the heat-conducting metal plate is fixedly connected with a heat-dissipating column, and the bottom end of the packaging box is fixedly connected with a ventilation frame.

[0013] Compared with the prior art, the device has the advantages that:

[0014] The locking mechanism is provided, the device plate body can be extruded by moving towards the mobile block, the main stop plate is extruded to shrink into the bearing cylinder first, then the inclined block pops out to block the main stop plate, the device plate body installation is quickly completed, the inclined block is pulled to shrink into the bearing cylinder by rotating the rotating table, and the second spring is used to reset and rebound the device plate body, the device plate body is pushed out of the packaging box, the device plate body dismounting is quickly completed, and the device improves the mounting and dismounting efficiency of the device plate body.

[0015] The heat-conducting metal plate and the heat-dissipating column are used in cooperation, the heat on the device plate body can be transferred out of the packaging box by the heat-conducting metal plate and the heat-dissipating column, the air at the bottom of the packaging box is kept flowing by the ventilation frame, the heat emitted by the device plate body can be quickly dissipated, and the internal metal device is in a low working environment. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 It is a whole structure schematic view of a preferred embodiment of the utility model;

[0017] Figure 2 It is a whole structure side sectional schematic view of the utility model;

[0018] Figure 3 It is a packaging box and cover plate split structure schematic view of the utility model;

[0019] Figure 4 It is a supply moving frame local sectional structure schematic view of the utility model.

[0020] Reference numerals in the drawing are:

[0021] 1, packaging box; 2, device board body; 3, lock mechanism; 4, cover plate; 5, heat-conducting metal plate; 6, heat dissipation column; 7, ventilation frame;

[0022] 31, for moving frame; 32, limit sliding groove; 33, main stop plate; 34, vice stop plate; 35, inclined block; 36, moving column; 37, first spring; 38, rotating table; 39, blocking block; 310, moving block; 311, second spring; 312, bearing cylinder. DETAILED DESCRIPTION

[0023] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the utility model.

[0024] Embodiments of the utility model

[0025] Please refer to Figures 1-4 A high-voltage device packaging structure, as shown in the figure, comprising a packaging box 1, a device board body 2 is slidably connected inside the packaging box 1, comprising:

[0026] Lock mechanism 3, the lock mechanism 3 is arranged between the packaging box 1 and the device board body 2, the lock mechanism 3 comprises a fixedly connected supply frame 31 on the outer surface of the packaging box 1, the limit sliding groove 32 is formed on the supply frame 31, the moving block 310 is slidably connected on the limit sliding groove 32, the bearing cylinder 312 is fixedly connected at the top of the supply frame 31, and the inclined block 35 is slidably connected on the inner wall of the bearing cylinder 312;

[0027] Heat-conducting metal plate 5, the heat-conducting metal plate 5 is fixedly connected to the inner bottom surface of the packaging box 1;

[0028] The inner wall of the limit sliding groove 32 is fixedly connected with the second spring 311, one end of the moving block 310 abuts against the second spring 311, and the other end of the moving block 310 abuts against the device board body 2;

[0029] The end of the moving block 310 close to the device board body 2 is fixedly connected with the main stop plate 33, and the end of the moving block 310 away from the device board body 2 is fixedly connected with the vice stop plate 34;

[0030] The end of the inclined block 35 away from the supply frame 31 is fixedly connected with the moving column 36, the outer surface of the bearing cylinder 312 is rotatably connected with the rotating table 38, and the moving column 36 abuts against the rotating table 38;

[0031] The inner wall of the bearing cylinder 312 is fixedly connected with a first spring 37, and the first spring 37 is located between the bearing cylinder 312 and the inclined block 35, and the top end of the moving frame 31 is fixedly connected with a blocking block 39;

[0032] Supplementary explanation: The end face of the rotating table 38 away from the bearing cylinder 312 is arc-shaped, the moving column 36 slides on the bearing cylinder 312, and the moving column 36 is fixedly connected with a guide cylinder away from the bearing cylinder 312, and the guide cylinder abuts on the arc-shaped bearing cylinder 312;

[0033] The auxiliary stop plate 34 and the blocking block 39 are in the same horizontal plane;

[0034] The end of the inclined block 35 close to the main stop plate 33 is inclined;

[0035] The above scheme has the following advantages: through the setting of the locking mechanism 3, the device board body 2 can be moved to extrude the main stop plate 33 to first retract into the bearing cylinder 312, and then the inclined block 35 is extruded to block the main stop plate 33, so that the device board body 2 is quickly installed, and the rotating table 38 is rotated to pull the inclined block 35 to retract into the bearing cylinder 312, and the second spring 311 is used to reset and rebound the device board body 2, so that the device board body 2 is pushed out of the packaging box 1, and the device board body 2 is quickly disassembled, which is beneficial to improve the installation and disassembly efficiency of the device board body 2.

[0036] Please refer to Figures 1-3 As shown in the figure, the top end of the packaging box 1 is clamped with a cover plate 4, the bottom end of the heat-conducting metal plate 5 is fixedly connected with a heat dissipation column 6, and the bottom end of the packaging box 1 is fixedly connected with a ventilation frame 7;

[0037] The above scheme has the following advantages: through the cooperation of the heat-conducting metal plate 5 and the heat dissipation column 6, the heat on the device board body 2 can be transferred out of the packaging box 1 by the heat-conducting metal plate 5 and the heat dissipation column 6, and the air flow at the bottom of the packaging box 1 can be maintained by the ventilation frame 7, so that the heat emitted by the device board body 2 can be dissipated as soon as possible, and the internal metal devices are in a lower working environment.

[0038] The working principle and use process of the utility model:

[0039] In order to facilitate the description and understanding of the working process, the installation state and the disassembly state are mainly described:

[0040] In the mounted state, the staff holds the device plate body 2 to move and press, the inner wall of the limiting sliding groove 32 is fixedly connected with the second spring 311, one end of the moving block 310 abuts against the second spring 311, the other end of the moving block 310 abuts against the device plate body 2, the top end of the moving frame 31 is fixedly connected with the bearing cylinder 312, the inner wall of the bearing cylinder 312 is slidably connected with the inclined block 35, the end of the inclined block 35 close to the main stop plate 33 is inclined, the moving block 310 carries the main stop plate 33 to press the inclined block 35, the inclined block 35 presses the first spring 37 to shrink, and after the inclined block 35 passes, the inclined block 35 is reset and moved by rebound, the main stop plate 33 is blocked, and the device plate body 2 is installed into the packaging box 1;

[0041] In the disassembled state, the staff rotates the rotating table 38, the moving column 36 abutting against the arc-shaped end face is moved, the inclined block 35 is pulled into the bearing cylinder 312, the second spring 311 is reset and moved by rebound, the moving block 310 is reset and moved until the vice stop plate 34 abuts against the blocking block 39, the device plate body 2 is pushed out of the packaging box 1, and the device plate body 2 is disassembled.

[0042] It should be noted that, in the present document, relational terms such as first and second and the like can be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises", "comprising", or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can include other elements not expressly listed or inherent to such process, method, article, or apparatus.

[0043] Although the embodiments of the present application have been shown and described, it should be understood by those ordinary skilled in the art that various changes, modifications, replacements and variations can be made to the embodiments without departing from the principles and spirits of the present application, and the scope of the present application is defined by the appended claims and their equivalents.

Claims

1. A high voltage device packaging structure, comprising a packaging box (1), a device board body (2) is slidably connected inside the packaging box (1), characterized in that, Include: Lock catch mechanism (3), the lock catch mechanism (3) is arranged between the packaging box (1) and the device plate body (2), the lock catch mechanism (3) includes the moving bracket (31) fixedly connected to the outer surface of the packaging box (1), the moving bracket (31) is provided with a limiting sliding groove (32), the limiting sliding groove (32) is slidably connected with a moving block (310), the moving bracket (31) top end is fixedly connected with a bearing cylinder (312), the bearing cylinder (312) inner wall is slidably connected with an inclined block (35); Thermal conductive metal plate (5), the thermal conductive metal plate (5) is fixedly connected to the inner bottom surface of the packaging box (1).

2. The high voltage device package structure of claim 1, wherein, The inner wall of the limiting sliding groove (32) is fixedly connected with a second spring (311), one end of the moving block (310) is in abutment with the second spring (311), and the other end of the moving block (310) is in abutment with the device plate body (2).

3. The high voltage device package structure of claim 1, wherein, The end of the moving block (310) close to the device plate body (2) is fixedly connected with a main abutting plate (33), and the end of the moving block (310) away from the device plate body (2) is fixedly connected with a secondary abutting plate (34).

4. The high voltage device package structure of claim 1, wherein, The end of the inclined block (35) away from the moving bracket (31) is fixedly connected with a moving column (36), the outer surface of the bearing cylinder (312) is rotatably connected with a rotating table (38), and the moving column (36) is in abutment with the rotating table (38).

5. The high voltage device package structure of claim 4, wherein, The inner wall of the bearing cylinder (312) is fixedly connected with a first spring (37), and the first spring (37) is located between the bearing cylinder (312) and the inclined block (35), and the top end of the moving bracket (31) is fixedly connected with a blocking block (39).

6. The high voltage device package structure of claim 1, wherein, The top end of the packaging box (1) is clamped with a cover plate (4), the bottom end of the thermal conductive metal plate (5) is fixedly connected with a heat dissipation column (6), and the bottom end of the packaging box (1) is fixedly connected with a ventilation frame (7).

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