Inverter brick based on single-tube double-sided heat dissipation module

Abstract

The utility model relates to an inversion brick based on a single-tube double-sided heat dissipation module. The inversion brick comprises a driving control panel and a power module. The driving control panel is positioned above the power module and is electrically connected with the power module; radiators are arranged on the upper surface and the lower surface of the power module; the driving control board is provided with an avoiding area, and the radiator located on the upper surface of the power module penetrates through the avoiding area. According to the utility model, under the condition of satisfying double-sided heat dissipation, no extra support is needed, the power density and the size can be further reduced, and the power density and the integration level of a system are improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to integrated circuit manufacturing technology field especially a kind of inverter brick based on single tube double-sided heat dissipation module. BACKGROUND

[0002] Traditional inverter brick is single-sided heat dissipation, there is high-power heat dissipation risk, cannot guarantee to work in high-voltage high-power harsh environment.In addition, double-sided heat dissipation module inverter brick needs to increase installation support to meet the requirement of double-sided heat dissipation.Volumetric density and integration are not high, cannot achieve integrated integration.Currently, drive board and drive control board are two boards, without achieving drive board and control integrated integration, integration is not high.

[0003] Therefore, it is desirable to provide an inverter brick based on single tube double-sided heat dissipation module, so as to solve the above technical problems. UTILITY MODEL CONTENT

[0004] The utility model discloses a kind of inverter bricks based on single tube double-sided heat dissipation module,

[0005] Including drive control board and power module;

[0006] The drive control board is located above the power module, and is electrically connected with the power module;

[0007] The upper surface and the lower surface of the power module are each provided with a radiator;

[0008] The drive control board is provided with a relief zone, and the radiator on the upper surface of the power module passes through the relief zone.

[0009] Specifically, a plurality of pins are provided on the upper surface of the power module, and the drive control board is electrically connected with the power module by the pins.

[0010] Further, the pin is pin needle.

[0011] Optionally, the drive control board is attached to the upper surface of the power module.

[0012] Optionally, the drive control board is spaced apart from the upper surface of the power module.

[0013] Optionally, the radiators provided on the upper surface and the lower surface of the power module are air-cooled radiators and / or water-cooled radiators.

[0014] Specifically,

[0015] The power module includes a lower insulating heat dissipation layer, at least one power single tube, an upper insulating heat dissipation layer and an insulating protective glue;

[0016] The power single tubes are attached to the lower insulating heat dissipation layer;

[0017] The upper surface of each power single tube is provided with a metal component, and the upper insulating heat dissipation layer is attached to the power single tube through the metal component;

[0018] The insulating protective glue covers all the power single tubes.

[0019] Optionally, the power module comprises a lower insulating heat dissipation layer, at least one power single tube, an upper insulating heat dissipation layer and insulating protective glue.

[0020] The power single tubes are attached to the lower insulating heat dissipation layer;

[0021] The upper surface of each power single tube is directly attached to the upper insulating heat dissipation layer;

[0022] The insulating protective glue covers all the power single tubes.

[0023] Preferably, the lower insulating heat dissipation layer and / or the upper insulating heat dissipation layer is a double-sided copper-clad ceramic plate.

[0024] Specifically, the power single tube comprises at least one chip, a metal conductive layer, a lead frame and a plastic package.

[0025] The chip is arranged on the lead frame, and both surfaces of the chip are provided with a metal conductive medium.

[0026] The S pole and the G pole on the chip are electrically connected to corresponding pins on the lead frame through the metal conductive medium.

[0027] The D pole on the chip is electrically connected to the metal conductive layer through the metal conductive medium.

[0028] The plastic package covers the chip, the metal conductive layer and the lead frame, and the surface of the metal conductive layer and the surface of the lead frame are exposed outside the plastic package.

[0029] Specifically, the power single tube comprises at least one chip, a lead frame and a plastic package.

[0030] The chip is arranged on the lead frame, and the front surface of the chip is provided with a metal conductive medium.

[0031] The S pole and the G pole on the front surface of the chip are electrically connected to corresponding pins on the lead frame through the metal conductive medium.

[0032] The plastic package covers the chip and the lead frame, and the back surface of the chip and the surface of the lead frame are exposed outside the plastic package.

[0033] Optionally, all the power single tubes are mounted in a normal direction and / or in an inverted direction on the lower insulating heat dissipation layer.

[0034] The single-tube double-sided heat dissipation module-based inverter brick has the following advantages compared with the prior art:

[0035] (1) Without increasing additional supports, the power density and volume can be further reduced to improve the system power density and integration, and the volume is reduced by 1 / 2 compared with the traditional double-sided heat dissipation module under the condition of meeting the double-sided heat dissipation;

[0036] (2) Simple installation, low overall loop stray inductance, and small driving board interference. The stray inductance is reduced by more than 50%;

[0037] (3) Combined with the single-tube double-sided heat dissipation module, the overall inverter brick has no binding line, the process is simple, and the overall reliability is high;

[0038] (4) The driving board and the control board are integrated into a driving control board, the integration degree is high, and the anti-interference is small. BRIEF DESCRIPTION OF DRAWINGS

[0039] Figure 1 It is a structure schematic view of the single-tube double-sided heat dissipation module-based inverter brick of embodiment 1;

[0040] Figure 2 It is an internal structure schematic view of the power module after removing the heat sink in embodiment 1;

[0041] Figure 3 It is a structure schematic of the power single tube in embodiment 1 Figure 1 ;

[0042] Figure 4 It is a structure schematic of the power single tube in embodiment 1 Figure 2 ;

[0043] Figure 5 It is a structure schematic of the power single tube in embodiment 1 Figure 3 ;

[0044] Figure 6 It is a structure schematic of the power single tube in embodiment 1 Figure 4 ;

[0045] Figure 7 It is a stray inductance simulation result view of the single-tube double-sided heat dissipation module-based inverter brick in embodiment 1;

[0046] Figure 8 It is a common-mode current EMI simulation schematic view of the single-tube double-sided heat dissipation module-based inverter brick in embodiment 1;

[0047] Figure 9 It is a common-mode EMI simulation result view of the single-tube double-sided heat dissipation module-based inverter brick in embodiment 1;

[0048] Figure 10 This is a schematic diagram of an inverter brick based on a single-tube double-sided heat dissipation module in Example 2. Detailed Implementation

[0049] The specific embodiments of this utility model patent will be further described in detail below with reference to the accompanying drawings.

[0050] Example 1

[0051] In this embodiment, as Figure 1 As shown, an inverter brick based on a single-tube double-sided heat dissipation module includes a drive control board 1 and a power module 2; the drive control board 1 is located above the power module 2 and is electrically connected to the power module 2; the upper and lower surfaces of the power module 2 are provided with heat sinks (4, 3); the drive control board 1 is provided with a clearance area 5 for the heat sink 4 on the upper surface of the power module 2 to pass through.

[0052] In this embodiment, the upper surface of the power module 2 is provided with a plurality of pins 6, and the drive control board 1 is electrically connected to the power module 2 through the pins 6. Specifically, the pins 6 are pins.

[0053] In this embodiment, a gap is left between the upper surfaces of the drive control board 1 and the power module 2, that is, the drive control board and the power module are suspended.

[0054] In this embodiment, the heat sinks 4 provided on the upper and lower surfaces of the power module 2 are air-cooled heat sinks. Alternatively, water-cooled heat sinks or other types of heat sinks can be selected according to actual needs.

[0055] In this embodiment, as Figure 2 As shown, the power module 2 includes a lower insulating heat dissipation layer 7, a single power tube 8, an upper insulating heat dissipation layer 9, and insulating protective adhesive 10;

[0056] The power tube 8 is mounted on the lower insulating heat dissipation layer 7;

[0057] The upper surface of the power tube 8 is provided with a metal component 11, and the upper insulating heat dissipation layer 7 is attached to the power tube 8 through the metal component 11.

[0058] The insulating protective adhesive 10 covers all power tubes 8.

[0059] Alternatively, the upper surface of the power tube 8 can be directly attached to the upper insulating heat dissipation layer 9 (i.e., without setting the metal component 11).

[0060] The bottom of the heat sink 4 above the power module 2 is attached to the upper insulating heat dissipation layer 7 and can be embedded in the insulating protective glue 10 to achieve fixed connection; and the heat sink 3 below the power module 2 can be fixedly connected with the power module 2 through a fastener and attached to the lower insulating heat dissipation layer 7.

[0061] In the embodiment, the lower insulating heat dissipation layer 7 and the upper insulating heat dissipation layer 9 are double-sided copper-clad ceramic plates, and the upper and lower double-sided copper-clad ceramic plates form a stack, and the structure is in the shape of an I-shaped structure, which has high overall rigidity and high reliability. The upper and lower copper layers of the double-sided copper-clad ceramic plates carry current to form a power loop, and the inductances cancel each other out, so that the stray inductance is low.

[0062] Specifically, in the embodiment, as shown in Figure 3 , the power single tube 8 includes a chip 12, a metal conductive layer 13, a lead frame 14 and a plastic package 15;

[0063] The chip 12 is arranged on the lead frame 14, and both sides of the chip 12 are provided with metal conductive media 16;

[0064] The S pole and the G pole on the chip 12 are electrically connected to the corresponding pins on the lead frame 14 through the metal conductive media 16;

[0065] The D pole on the chip 12 is electrically connected to the metal conductive layer 13 through the metal conductive media 16;

[0066] The plastic package 15 covers the chip 12, the metal conductive layer 13 and the lead frame 14, and the surfaces of the metal conductive layer 13 and the lead frame 14 are exposed outside the plastic package 15. In addition, the number of chips 12 in a single power single tube 8 can also be two or more, as shown in Figure 4 .

[0067] In the embodiment, the power single tube 8 is flip-chip embedded on the lower insulating heat dissipation layer 7; in addition, the power single tube 8 can also be surface mounted on the lower insulating heat dissipation layer 7, which can be set according to actual needs.

[0068] As shown in Figure 5 , the structure of the power single tube can also be as follows:

[0069] The power single tube 8 includes a chip 12, a lead frame 14 and a plastic package 15;

[0070] The chip 12 is arranged on the lead frame 14, and the front surface of the chip 12 is provided with metal conductive media 16;

[0071] The S pole and the G pole on the front surface of the chip 12 are electrically connected to the corresponding pins on the lead frame 14 through the metal conductive media 16;

[0072] The molding compound 15 encapsulates the chip 12 and the lead frame 14, with the back side of the chip 12 and the surface of the lead frame 14 exposed outside the molding compound 15. The number of chips 12 in a single power transistor 8 can also be two or more, such as... Figure 6 As shown.

[0073] This embodiment provides an inverter brick based on a single-tube double-sided heat dissipation module. While meeting the double-sided heat dissipation requirements, it eliminates the need for additional supports, and further reduces power density and volume, improving system power density and integration. It is half the size of traditional double-sided heat dissipation modules. Furthermore, the driver board and control board are integrated into a single drive and control board, resulting in high integration and low interference resistance.

[0074] like Figure 7 As shown, stray inductance simulation testing was performed on an inverter brick based on a single-tube double-sided heat dissipation module in Example 1: Port excitations (lumped ports, wave ports, etc.) were defined by setting appropriate boundary conditions (open boundaries, radiating boundaries, etc.) using simulation software, while considering the frequency range, and the parasitic parameters of the entire inverter brick were extracted. This product, by optimizing the spacing between the drive control board and the module, achieves a stray inductance of less than 4nH, far superior to similar double-sided heat dissipation power module systems.

[0075] like Figure 8 and Figure 9 As shown, common-mode EMI simulation testing was performed on an inverter brick based on a single-tube double-sided heat dissipation module in Example 1. The common-mode path and noise sources, primarily common-mode current noise, were established using simulation software. Typical common-mode excitation was applied, considering worst-case switching characteristics. The noise level was received via a LISN, and the simulation results were compared with standard limits such as CISPR. The simulation results show that the overall noise level of this product is lower than the CISPR limit, significantly better than that of traditional inverters.

[0076] Example 2

[0077] In this embodiment, the drive control board 1 is mounted on the upper surface of the power module 2, and other features are the same as in embodiment 1.

[0078] The preferred embodiments of this utility model have been described in detail above, but this utility model is not limited to the embodiments described. Those skilled in the art can make various equivalent modifications or substitutions without departing from the spirit of this utility model, and these equivalent modifications or substitutions are all included within the scope defined by the claims of this application.

Claims

1. An inverter brick based on a single tube double-sided heat dissipation module, characterized in that, The drive control board and the power module are included; The drive control board is located above the power module and is electrically connected with the power module; The upper surface and the lower surface of the power module are provided with radiators; The drive control board is provided with an avoiding area, and the radiator on the upper surface of the power module passes through the avoiding area.

2. The single-pipe double-sided heat dissipation module-based inverter brick according to claim 1, characterized in that, The upper surface of the power module is provided with pins, and the drive control board is electrically connected with the power module through the pins.

3. The single pipe double-sided heat dissipation module based inverter brick according to claim 2, characterized in that, The pins are pin needles.

4. The single pipe double-sided heat dissipation module-based inverter brick according to any one of claims 1-3, characterized in that, The drive control board is attached to the upper surface of the power module.

5. The single pipe double-sided heat dissipation module based inverter brick according to any one of claims 1-3, characterized in that, The drive control board is spaced from the upper surface of the power module.

6. The single pipe double-sided heat dissipation module based inverter brick according to claim 1, characterized in that, The radiators provided on the upper surface and the lower surface of the power module are air-cooled radiators and / or water-cooled radiators.

7. The single-pipe double-sided radiator module-based inverter brick according to claim 1, characterized in that, The power module includes a lower insulating radiator layer, at least one power single pipe, an upper insulating radiator layer and an insulating protective glue; The power single pipe is attached to the lower insulating radiator layer; The upper surface of the power single pipe is provided with a metal component, and the upper insulating radiator layer is attached to the power single pipe through the metal component; The insulating protective glue covers all the power single pipes.

8. The single pipe double-sided heat dissipation module based inverter brick according to claim 1, characterized in that, The power module includes a lower insulating radiator layer, at least one power single pipe, an upper insulating radiator layer and an insulating protective glue; The power single pipe is attached to the lower insulating radiator layer; The upper surface of the power single pipe is directly attached to the upper insulating radiator layer; The insulating protective glue covers all the power single pipes.

9. The single-pipe double-sided radiator module-based inverter brick according to claim 7 or 8, characterized in that, The lower insulating radiator layer and / or the upper insulating radiator layer is a double-sided copper-clad ceramic plate.

10. The single-pipe double-sided heat dissipation module-based inverter brick according to claim 7 or 8, characterized in that, The power single pipe includes at least one chip, a metal conductive layer, a lead frame and a plastic package; The chip is arranged on the lead frame, and both surfaces of the chip are provided with metal conductive media; The S pole and the G pole on the chip are electrically connected with corresponding pins on the lead frame through the metal conductive media; The D pole on the chip is electrically connected with the metal conductive layer through the metal conductive media; The plastic package covers the chip, the metal conductive layer and the lead frame, and the surface of the metal conductive layer and the surface of the lead frame are exposed outside the plastic package.

11. A single pipe double-sided heat dissipating module based inverter brick according to claim 7 or 8, characterized in that, The power single pipe includes at least one chip, a lead frame and a plastic package; The chip is arranged on the lead frame, and the front surface of the chip is provided with metal conductive media; The S pole and the G pole on the front surface of the chip are electrically connected with corresponding pins on the lead frame through the metal conductive media; The plastic package covers the chip and the lead frame, and the back surface of the chip and the surface of the lead frame are exposed outside the plastic package.

12. A single pipe double-sided heat dissipating module based inverter brick according to claim 7 or 8, characterized in that, All the power single pipes are mounted and / or inverted on the lower insulating radiator layer.

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