Solid-state circuit breaker packaging module

Abstract

The utility model provides a solid-state circuit breaker packaging module, which comprises at least one substrate, at least one power semiconductor and at least one energy absorption pile which are arranged on the at least one substrate, and a shell used for packaging the at least one power semiconductor and the at least one energy absorption pile, the energy absorption stack comprises a plurality of energy absorption elements stacked on one another in the direction perpendicular to the substrate, and a conductive bonding layer is arranged between every two adjacent energy absorption elements of the energy absorption elements.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the field of circuit breaker, especially relates to a solid state circuit breaker packaging module. BACKGROUND

[0002] The statements in this section merely provide background information related to the utility model and can not constitute the prior art.

[0003] A circuit breaker is a switching device that can close (also called make), carry, and open (also called break) the current under normal circuit conditions and can close, carry, and open the current under abnormal circuit conditions within a specified time, such as short circuit, overload, or other emergency situations.

[0004] A solid state circuit breaker (SSCB) is one of the intelligent forms of circuit breakers, which can replace the traditional mechanical circuit breaker for circuit protection. The SSCB is a non-contact switching device, and its making and breaking are realized by controlling the carriers and channels of the carriers inside the semiconductor power device. The SSCB usually includes a power semiconductor and an energy absorber. When the current circuit is abnormal, for example, when the current circuit is short-circuited or overloaded, the breaking of the power semiconductor will cause a large amount of inductive energy to accumulate in the current circuit, therefore, the energy absorber is usually needed to absorb these inductive energies, and finally realizes the circuit protection function. SUMMARY

[0005] Therefore, the utility model aims at overcoming the defects of the prior art, and provides a solid state circuit breaker packaging module, which comprises:

[0006] at least one substrate,

[0007] at least one power semiconductor and at least one energy absorption stack arranged on the at least one substrate, and

[0008] an outer shell for packaging the at least one power semiconductor and the at least one energy absorption stack,

[0009] wherein the energy absorption stack comprises a plurality of energy absorption elements stacked with each other in a direction perpendicular to the substrate, and an electrically conductive adhesive layer is arranged between adjacent two energy absorption elements of the plurality of energy absorption elements.

[0010] According to the solid state circuit breaker packaging module of the utility model, preferably, the thickness of the at least one energy absorption stack is less than a preset threshold.

[0011] According to the solid state circuit breaker packaging module of the utility model, preferably, the preset threshold is 10mm.

[0012] According to the solid-state circuit breaker packaging module, preferably, the thermal structure part is a conductive material plate.

[0013] According to the solid-state circuit breaker packaging module, preferably, the material of the thermal structure part is a conductive material.

[0014] According to the solid-state circuit breaker packaging module, preferably, the thermal structure part is a conductive material plate.

[0015] According to the solid-state circuit breaker packaging module, preferably, the area of the thermal structure part is less than the area of the energy absorption element at the interface where the thermal structure part is adjacent to the energy absorption element.

[0016] According to the solid-state circuit breaker packaging module, preferably, the area of the thermal structure part is less than the area of the energy absorption element by 10%.

[0017] According to the solid-state circuit breaker packaging module, preferably, the thermal structure part is a conductive material plate.

[0018] According to the solid-state circuit breaker packaging module, preferably, the solid-state circuit breaker packaging module is a potting packaging module.

[0019] Compared with the prior art, the solid-state circuit breaker packaging module realizes heterogeneous packaging, at least packaging the power semiconductor and the energy absorption element in the same shell, obviously reduces the size of the solid-state circuit breaker, saves the cost of packaging and connecting components, shortens the internal power loop between the power semiconductor and the energy absorption element, and improves the voltage clamping performance of the solid-state circuit breaker. BRIEF DESCRIPTION OF DRAWINGS

[0020] The embodiments of the utility model will be further described below with reference to the drawings, in which:

[0021] Figure 1 It is a circuit schematic diagram of the solid-state circuit breaker packaging module according to an embodiment of the utility model;

[0022] Figure 2 It is a side sectional view of a solid-state circuit breaker packaging module according to an embodiment of the utility model;

[0023] Figure 3 It is a top view of a solid-state circuit breaker packaging module according to an embodiment of the utility model;

[0024] Figure 4 is a side sectional view of another solid state circuit breaker packaging module according to an embodiment of the present application;

[0025] Figure 5 is a side sectional view of an energy absorbing stack according to another embodiment of the present application;

[0026] Figure 6 is a circuit schematic of a solid state circuit breaker packaging module according to another embodiment of the present application;

[0027] Figure 7 is a side sectional view of a solid state circuit breaker packaging module according to another embodiment of the present application;

[0028] Figure 8 is a circuit schematic of a solid state circuit breaker packaging module according to another embodiment of the present application;

[0029] Figure 9 is a side sectional view of a solid state circuit breaker packaging module according to another embodiment of the present application;

[0030] Figure 10 is a side sectional view of another solid state circuit breaker packaging module according to an embodiment of the present application;

[0031] Figure 11 is a circuit schematic of a solid state circuit breaker packaging module according to another embodiment of the present application;

[0032] Figure 12 is a side sectional view of a solid state circuit breaker packaging module according to another embodiment of the present application;

[0033] Figure 13 is a side sectional view of another solid state circuit breaker packaging module according to an embodiment of the present application;

[0034] Figure 14 is a circuit schematic of a solid state circuit breaker packaging module according to another embodiment of the present application;

[0035] Figures 15-18 are side sectional views of four solid state circuit breaker packaging modules according to another embodiment of the present application, respectively;

[0036] Figure 19 is a circuit schematic of a solid state circuit breaker packaging module according to another embodiment of the present application; and

[0037] Figures 20-22 are side sectional views of three solid state circuit breaker packaging modules according to another embodiment of the present application, respectively. Detailed Implementation

[0038] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.

[0039] Currently, in the manufacturing of SSCB products, the power semiconductor and energy absorber are typically packaged separately in homogeneous packages before assembly and wiring. The inventors have found that such SSCB products cannot utilize three-dimensional space, have low space utilization, are large in size, have strong stray inductance, poor integration, low process consistency and reliability, high cost, and complex structure. Furthermore, since the power semiconductor in an SSCB product is a heat-generating element while the energy absorber generally does not generate heat, and considering the poor temperature characteristics and significant temperature drift of the energy absorber, existing technologies typically do not consider packaging the power semiconductor and energy absorber together to prevent the energy absorber from being affected by the heat dissipation of the power semiconductor.

[0040] One embodiment of this utility model provides a solid-state circuit breaker packaging module. See also... Figure 1 The circuit diagram shown is of a solid-state circuit breaker package module according to this embodiment. The solid-state circuit breaker package module includes power semiconductors and energy absorption components connected in parallel. Typically, the energy absorption component includes multiple energy absorbers (also referred to as "energy absorption elements" in this invention) connected in series. See also... Figure 2 and Figure 3 The side sectional view and top view of the solid-state circuit breaker packaging module of this embodiment shown include a back plate 1, a substrate 2 disposed on the back plate 1, a power semiconductor PM1 and an energy absorption stack EA1 disposed on the substrate 2, and a housing 3 for packaging the power semiconductor PM1 and the energy absorption stack EA1, wherein the energy absorption stack EA1 corresponds to Figure 1 The energy absorption component includes three energy absorbers Ea1, Ea2, and Ea3 stacked on top of each other in a direction perpendicular to the substrate 2. The energy absorbers Ea1, Ea2, and Ea3 are preferably bonded together in series and electrically connected by a conductive adhesive, such as solder or conductive adhesive. Furthermore, preferably, the substrate 2 is arranged on the backplate 1 by a conductive adhesive, and the power semiconductor PM1 and the energy absorption stack EA1 are also arranged on the substrate 2 by a conductive adhesive.

[0041] In the embodiment of the utility model, the number of energy absorbers contained in the energy absorption stack EA1 is not limited to three, but in order to guarantee that the height and weight of the solid state circuit breaker packaging module are not over standard, and guarantee the height difference between the energy absorption stack and the power semiconductor to facilitate subsequent circuit connection, preferably the thickness of the energy absorption stack is limited within the predetermined thickness. Preferably, the predetermined thickness is 10mm.

[0042] The solid state circuit breaker packaging module of the embodiment of the utility model can also be designed to be expandable. For example, in addition to the power semiconductor and the energy absorption stack, the wiring terminals TA and TB, the voltage sensing pins VS, the gate pins G and the temperature sensing pins TS are also arranged on the substrate 1 and electrically connected to the substrate 1, and are collectively packaged in the shell 3, as shown in Figure 2 and 3 .

[0043] In the embodiment of the utility model, preferably, the substrate is a patterned substrate, that is, a substrate with a conductive pattern layer. Preferably, the substrate is a double-sided copper-plated ceramic plate, wherein the copper layer of one side of the ceramic plate for arranging related components (including power semiconductors, energy absorbers, wiring terminals, etc.) is patterned to have a specific circuit layout to achieve a specific function, such as achieving a specific circuit connection. Preferably, the related components are mounted to the patterned substrate by welding or sintering. In particular, the copper layer of the region where the related components are arranged can serve as one of the wiring terminals of the related components. For example, in order to achieve the circuit connection shown in Figure 1 , as shown in Figure 3 , the power semiconductor PM1 and the energy absorption stack EA1 and the wiring terminal TB are arranged on the first copper layer region of the substrate 2, which serves as one of the wiring terminals of the power semiconductor PM1 and the energy absorption stack EA1; in addition, the second copper layer region where the wiring terminal TA is located is sequentially bonded (i.e. wire bonding, also known as "wire bonding") to the power semiconductor PM1 and the energy absorption stack EA1, thereby forming another wiring terminal of the power semiconductor PM1 and the energy absorption stack EA1. In this way, the power semiconductor PM1 and the energy absorption stack EA1 are connected in parallel between the wiring terminals TA and TB. In addition, the two voltage sensing pins VS are arranged on the first copper layer region and the second copper layer region, respectively, so as to be electrically connected to the wiring terminals TB and TA, respectively, for sensing the voltage across the solid state circuit breaker. The two gate pins G are arranged on separate copper layer regions for connecting an external driving power supply to drive the power semiconductor PM1. The two temperature sensing pins TS are arranged on another separate copper layer region for sensing the temperature of the solid state circuit breaker.

[0044] The utility model overcomes technical prejudice, arranges power semiconductor and energy absorption stack in same substrate and is packed in same shell, realizes heterogeneous integrated package, makes full use of the space of substrate, saves packing and connection cost, shortens internal power loop, improves efficiency, reduces the volume of solid state circuit breaker, reduces stray inductance, improves integration level, and improves the consistency and reliability of process. In addition, the utility model discloses the heterogeneous package of energy absorption stack and power semiconductor, because of the height difference between energy absorption stack and power semiconductor, when power semiconductor radiates heat, only the part of energy absorption stack (for example the part of energy absorption stack close to substrate) that is equivalent to the height of power semiconductor is easy to be heated, and other parts of energy absorption stack are less affected by power semiconductor heat dissipation, therefore, the whole energy absorption stack will not have larger temperature drift. In addition, the energy absorption stack structure also improves the energy absorption capacity.

[0045] According to another embodiment of the utility model, in order to improve the heat dissipation performance and strength of energy absorption stack EA1, copper plates are inserted between adjacent energy absorbers. Referring to the side cross-sectional view of the solid state circuit breaker package module of this embodiment shown in Figure 4 Figure 2 On the basis of the embodiment shown in, copper plates C1 are inserted between energy absorbers Ea1 and Ea2, and copper plates C2 are inserted between energy absorbers Ea2 and Ea3, and the copper plates are also connected to adjacent energy absorbers through conductive adhesive material. When the power semiconductor radiates heat, the heat absorbed by the energy absorption stack is more easily absorbed by the copper plates, so increasing the copper plates can improve the heat capacity of the energy absorption stack. In addition, the copper plates also improve the strength of the energy absorption stack, thereby reducing the risk of the energy absorption stack breaking when the temperature changes. The inventor has also found that the stacked metal does not significantly increase the stray inductance of the energy absorber, so it does not have an adverse effect.

[0046] According to an embodiment of the utility model, the size of the copper plate between the two adjacent energy absorbers is not limited, but in order to facilitate the process, optimize the edge electric field distribution of the energy absorber, and enhance the voltage clamping capability of the power semiconductor chip while the energy absorber absorbs energy, preferably, the lateral size (i.e. the size parallel to the substrate direction) of the copper plate is smaller than the lateral size of the energy absorber. More preferably, the lateral size of the copper plate is 10% smaller than the lateral size of the energy absorber, i.e. the lateral size of the copper plate is 90% of the lateral size of the energy absorber.

[0047] In an embodiment of the utility model, the shape of the copper between the two adjacent energy absorbers is not limited to a plate shape, as long as the copper is clamped between the two energy absorbers to improve the heat capacity and strength. Therefore, in the utility model, the component between the two adjacent energy absorbers for improving the heat capacity and strength is referred to as a "thermal structure part". As Figure 5 ​The side cross-sectional view of an energy absorption stack according to another embodiment of the present invention shown depicts a copper thermal structure comprising a plate-shaped portion and trapezoidal portions on both sides of the plate-shaped portion. Overall, the lateral dimensions on both sides are smaller, while the lateral dimension in the middle is larger. In this embodiment, at the interface where the energy absorber and the copper thermal structure are adjacent, the area of ​​the energy absorber is larger than the area of ​​the copper thermal structure. This optimizes the edge electric field distribution of the energy absorber and enhances its voltage clamping capability for the power semiconductor chip while absorbing energy. The larger dimension in the middle of the copper thermal structure further increases the heat capacity, improving the absorption capacity of the energy absorption stack. In another embodiment, the lateral dimension of the middle portion of the thermal structure is smaller than the lateral dimensions on both sides, thus saving material while optimizing the edge electric field distribution and enhancing the voltage clamping capability.

[0048] According to embodiments of this utility model, the thermal structure between the two energy absorbers is not limited to copper, but can also be made of other conductive materials such as aluminum, silver, or alloys.

[0049] The preceding embodiments included a power semiconductor and an energy absorption stack. According to other embodiments of the present invention, multiple power semiconductors and multiple energy absorption stacks can be arranged on the same substrate and packaged in the same housing, achieving various different circuit connections.

[0050] Another embodiment of this utility model provides a solid-state circuit breaker packaging module, see [link to relevant documentation]. Figure 6 The circuit diagram of the solid-state circuit breaker package module shown in this embodiment includes two power semiconductors PM1-PM2 and two energy absorption stacks EA1-EA2 connected in parallel between terminals TA and TB.

[0051] See Figure 7 The side cross-sectional view of the solid-state circuit breaker package module of this embodiment shows that one pin of each of the two power semiconductors PM1-PM2 and the two energy absorber stacks EA1-EA2 is disposed on a continuous copper layer area on the substrate surface, which is bonded to the terminal TB. The other pins of the two power semiconductors PM1-PM2 and the two energy absorber stacks EA1-EA2 are bonded to each other and to the terminal TA. Thus, the two power semiconductors PM1-PM2 and the two energy absorber stacks EA1-EA2 are connected in parallel between the terminals TA and TB. In this embodiment, the two power semiconductors and two energy absorber stacks are packaged within the same housing (not shown), and one end of the terminals TA and TB extends to the outside of the housing. In this embodiment, the components on the substrate (including the power semiconductors and energy absorber stacks) are connected in parallel; therefore, the operation of one component does not affect the operation of other components, making replacement convenient.

[0052] A further embodiment of the utility model provides a solid state circuit breaker packaging module, see Figure 8 The circuit schematic diagram of the solid state circuit breaker packaging module of this embodiment shown in the figure, it includes power semiconductor PM1 and two energy absorption stacks EA1-EA2, energy absorption stack EA1 and EA2 are in series, then again with power semiconductor PM1 parallel. Thus, power semiconductor PM1 passes through two series connection energy absorption stacks and releases energy, improves energy absorption efficiency, in addition, can reduce the thickness of single energy absorption stack, thereby reduce the height of solid state circuit breaker.

[0053] See Figure 9 The side sectional view of a solid state circuit breaker packaging module of this embodiment shown in the figure, it includes the first substrate and the second substrate arranged on the back plate, the first energy absorption stack EA1 and the power semiconductor PM1 are arranged on the first substrate, and the second energy absorption stack EA2 is arranged on the second substrate. One pin of the first energy absorption stack EA1 and the power semiconductor PM1 is arranged on the first substrate, and the terminal TA is bonded to the first substrate. Another pin of the first energy absorption stack EA1 is bonded to one pin of the second energy absorption stack EA2, and another pin of the second energy absorption stack EA2 is arranged on the second substrate, and another pin of the power semiconductor PM1 and the terminal TB are both bonded to the second substrate. Thus, two energy absorption stacks EA1 and EA2 are in series with each other and then parallel with the power semiconductor PM1, and the parallel circuit is connected between the terminals TA and TB. The power semiconductor and two energy absorption stacks of this embodiment are packaged in the same shell (not shown in the figure), and one end of the terminals TA and TB extends to the outside of the shell. Alternatively, in this embodiment, only one substrate is arranged on the back plate, and the conductive layer on the substrate has at least two isolated regions, the first region arranges the first energy absorption stack EA1 and the power semiconductor PM1, and the second region arranges the second energy absorption stack EA2. Figure 9 In the embodiment shown in the figure, the first energy absorption stack EA1 includes four energy absorbers stacked with each other, and the second energy absorption stack EA2 includes three energy absorbers stacked with each other. One power semiconductor and two energy absorption stacks of this embodiment are packaged in the same shell (not shown in the figure), and one end of the terminals TA and TB extends to the outside of the shell.

[0054] See Figure 10 The side sectional view of another solid state circuit breaker packaging module of this embodiment shown in the figure, which is Figure 10The difference between the embodiments is only the way of bonding between the individual components. Specifically, one pin of the first energy absorption stack EA1 and the power semiconductor PM1 is electrically connected and bonded to the terminal TA via the conductive layer on which it is arranged, another pin of the first energy absorption stack EA1 is bonded to the second substrate, one pin of the second energy absorption stack EA2 is arranged on the second substrate, another pin of the power semiconductor PM1 is bonded to another pin of the second energy absorption stack EA2 and to the terminal TB. Thereby, the two energy absorption stacks are connected in series with each other and in parallel with the power semiconductor, the parallel circuit being connected between the terminals TA and TB. One power semiconductor and two energy absorption stacks of this embodiment are encapsulated in the same housing (not shown in the figures), and one end of the terminals TA and TB extends to the outside of the housing.

[0055] A further embodiment of the utility model provides a solid state circuit breaker packaging module, refer to Figure 11 The circuit schematic diagram of the solid state circuit breaker packaging module of this embodiment shown in the figure, it includes two power semiconductors PM1-PM2 and an energy absorption stack EA1, power semiconductor PM1 and PM2 are connected in series, then again with energy absorption stack EA1 parallel, thereby, two power semiconductors PM1-PM2 share an energy absorption stack for energy release, save the cost.

[0056] Refer to Figure 12 The side sectional view of a solid state circuit breaker packaging module of this embodiment shown in the figure, it includes the first substrate and the second substrate arranged on the back plate, the first substrate is arranged with energy absorption stack EA1 and first power semiconductor PM1, and the second substrate is arranged with second power semiconductor PM2. Energy absorption stack EA1 and one pin of first power semiconductor PM1 are electrically connected to each other and bonded to the terminal TA via the conductive layer on which they are arranged, another pin of first power semiconductor PM1 is bonded to the second substrate and thus bonded to one pin of second power semiconductor PM2, another pin of energy absorption stack EA1 and another pin of second power semiconductor PM2 are bonded to each other and to the terminal TB. In this way, first power semiconductor PM1 and second power semiconductor PM2 are connected in series with each other and in parallel with energy absorption stack EA1, the parallel circuit being connected between the terminals TA and TB. Alternatively, in this embodiment, only one substrate is arranged on the back plate, and the conductive layer on the substrate includes at least two regions isolated from each other, the first region is arranged with energy absorption stack EA1 and first power semiconductor PM1, and the second region is arranged with second power semiconductor PM2. Two power semiconductors and an energy absorption stack of this embodiment are encapsulated in the same housing (not shown in the figures), and one end of the terminals TA and TB extends to the outside of the housing.

[0057] Refer to Figure 13A side sectional view of another solid state circuit breaker packaging module of the embodiment shown, which comprises a first substrate and a second substrate arranged on a back plate, with Figure 12 In this embodiment, only an energy absorber EA1 is arranged on the first substrate, while two power semiconductors PM1 and PM2 are arranged on the second substrate. As can be clearly seen from the figure, the energy absorber EA1 is electrically connected between the terminal ends TA and TB, while the power semiconductors PM1 and PM2 are electrically connected in series between the terminal ends TA and TB. The two power semiconductors and one energy absorber of this embodiment are packaged in the same housing (not shown in the figure), and one end of the terminal ends TA and TB extends to the outside of the housing.

[0058] Another embodiment of the utility model provides a solid state circuit breaker packaging module, refer to Figure 14 A circuit schematic diagram of the solid state circuit breaker packaging module of the embodiment shown, which comprises two power semiconductors PM1-PM2 and two energy absorbers EA1-EA2. The first power semiconductor PM1 and the first energy absorber EA1 are in parallel, the second power semiconductor PM2 and the second energy absorber EA2 are in parallel, then, the two parallel circuits are connected in series between the terminal ends TA and TB. In this embodiment, each power semiconductor is provided with a corresponding energy absorber, and therefore the requirement for material performance is lower.

[0059] Refer to Figures 15-18 A side sectional view of four solid state circuit breaker packaging modules of the embodiment shown, which respectively comprises two substrates arranged on a back plate, one power semiconductor and one energy absorber are arranged on each substrate, the power semiconductor and the energy absorber on each substrate are connected in parallel through different bonding modes, then the two substrates are connected in parallel through different bonding modes, and Figure 14 The circuit connection shown. Those skilled in the art can clearly or specifically bond from the figure, and here is not repeated. As can be seen from the figure, in this embodiment, the two substrates are arranged in mirror symmetry, so that one template is used to prepare two parts during preparation, and then the two parts are arranged in mirror symmetry, and the solid state circuit breaker packaging module of the embodiment can be realized during packaging, saving process and cost. The two power semiconductors and the two energy absorbers of this embodiment are packaged in the same housing (not shown in the figure), and one end of the terminal ends TA and TB extends to the outside of the housing.

[0060] Another embodiment of the utility model provides a solid state circuit breaker packaging module, refer to Figure 19The circuit diagram of the solid-state circuit breaker packaging module of this embodiment is shown, which comprises two power semiconductors PM1-PM2 in series with each other and two energy absorption stacks EA1-EA2 in series with each other. The two series branches are connected in parallel between the connection terminals TA and TB. In this embodiment, the power semiconductors and the energy absorption stacks are each in series, which improves the switching capability and the energy absorption capacity.

[0061] Referring to Figures 20-22 The side sectional views of three solid-state circuit breaker packaging modules of this embodiment are shown, which respectively comprise two substrates arranged on a back plate. Figure 20 One power semiconductor and one energy absorber are respectively arranged on each substrate of Figure 21 and 22 The two substrates of and each arrange a power semiconductor and an energy absorber. By different bonding manners, the two power semiconductors are connected in series between the connection terminals TA and TB and the two energy absorbers are connected in series between the connection terminals TA and TB, which realizes Figure 19 the circuit connection shown. The skilled in the art can clearly or specifically know the bonding relationship from the figure, which will not be described here. The two power semiconductors and the two energy absorption stacks of this embodiment are packaged in the same housing (not shown in the figure), and one end of the connection terminals TA and TB extends to the outside of the housing.

[0062] For the foregoing embodiment comprising two substrates, one substrate can be alternatively used, and the conductive layer on the substrate comprises at least two regions isolated from each other.

[0063] According to other embodiments of the present application, the number of power semiconductors and energy absorption stacks contained in the solid-state circuit breaker packaging module is not limited, and the number of energy absorbers contained in each energy absorption stack is also not limited, as long as the energy absorption stacks and the power semiconductors are packaged in the same housing to achieve the purpose of the present application.

[0064] In the embodiment of the utility model, power semiconductor can be one or more of MOSFET, IGBT and other semiconductor switching elements known in the art, and energy absorber can be one or more of MOV, TVS, absorbing capacitor and other energy absorbers known in the art. In addition, the types of power semiconductor and energy absorber enclosed in the same shell can be the same or different. Preferably, in the embodiment of the utility model, the energy absorption stack includes one or more of MOV, TVS and absorbing capacitor. Considering that different energy absorption elements have different characteristics, when the same energy absorption stack includes multiple different energy absorbers, the multiple energy absorbers are arranged in order of absorbing capacitor, TVS and MOV away from the substrate. Specifically, considering the response speed of the energy absorber, in order from fast to slow, absorbing capacitor, TVS and MOV, the response speed determines the voltage clamping effect, the faster the response speed, the better the voltage clamping effect, and the closer the distance, the better the voltage clamping effect, therefore, in order to achieve the highest voltage clamping performance, the absorbing capacitor is arranged close to the substrate and thus closest to the power semiconductor, followed by the TVS, and the MOV is farthest from the substrate and thus farthest from the power semiconductor. Considering the absorption capacity of the energy absorber, in order from strong to weak, MOV, TVS and absorbing capacitor. In the embodiment of the utility model, arranging multiple energy absorbers in order of absorbing capacitor, TVS and MOV away from the substrate can achieve rapid voltage clamping of the lower and closer energy absorber, and then the upper and farther energy absorption element starts to respond to the energy absorption, which can prevent the power semiconductor from shutting off overvoltage and absorb short-circuit energy. Those skilled in the art can understand that in the case of including only two kinds of energy absorbers in the same energy absorption stack, they are also arranged in a similar manner, that is, the energy absorber with faster response speed is arranged closer to the substrate.

[0065] In addition, in the embodiment of the utility model, those skilled in the art can make different substrate patterns and bonding according to needs, so as to realize different circuit connection relationships.

[0066] In the embodiment of the utility model, preferably, the wire bonding adopts copper tape.

[0067] In the embodiment of the utility model, preferably, the solid-state circuit breaker packaging module is a potting packaging module. The potting packaging process can improve the insulation performance of each component in the module. The potting material is an insulating material, preferably epoxy resin or silicone. More preferably, the shell is an epoxy resin potting shell.

[0068] According to other embodiments of the utility model, the conductive pattern layer of the substrate is formed of silver, gold, nickel, conductive polymer, graphene, alloy material, liquid metal, conductive ink, etc.

[0069] The solid-state circuit breaker packaging module at least packages the power semiconductor and the energy absorption element in the same shell, obviously reduces the size of the solid-state circuit breaker, saves the cost of packaging and connecting components, shortens the internal power loop between the power semiconductor and the energy absorption element, and improves the voltage clamping performance of the solid-state circuit breaker. In addition, the technical personnel can design the rated current and tripping capacity of the solid-state circuit breaker in an extended manner, and the number of components is flexible.

[0070] The embodiment of the utility model discloses a kind of preparation method of solid-state circuit breaker packaging module, including energy absorption pile preparation step, solid-state circuit breaker module preparation step, electrical connection step and packaging step, specifically including:

[0071] Multiple energy absorbers are stacked with each other and connected by conductive adhesive material to form an energy absorption pile, preferably multiple energy absorbers and multiple copper plates are stacked with each other and connected by conductive adhesive material to form an energy absorption pile;

[0072] At least one power semiconductor and at least one energy absorption pile are arranged on a substrate;

[0073] Electrical connection is made between at least one power semiconductor, at least one energy absorption pile and the substrate to achieve the desired circuit connection relationship; and

[0074] At least one power semiconductor, at least one energy absorption pile and the substrate are packaged in the same shell to form a solid-state circuit breaker packaging module, preferably at least one power semiconductor, at least one energy absorption pile and the substrate are potting packaged. Specifically, after the substrate and related components in the module are installed, an insulating shell is installed, and then a potting material is filled into the module, which can be a silicone, epoxy resin or other insulating material. The filling height is preferably just enough to immerse the components and electrical connection lines (conductive parts), and the purpose of filling is to insulate, because the electrostatic, creepage and other safety distance of the components and electrical connection lines in the air is not enough, and the insulating material can meet the safety requirements, which can be regarded as the last step of packaging. In order to reduce the amount of potting material to ensure that the packaging module is not too heavy, the height inside the packaging module is designed, i.e. the thickness of the energy absorption pile is limited within a predetermined thickness. If the component is particularly high, the potting material will be particularly large, making the module too heavy.

[0075] According to the embodiment of the utility model, if the potting material is a flowable material such as silicone, an insulating shell is necessary to contain and protect the potting material. That is, potting packaging is performed after the insulating shell is installed. If the potting material is a curable material such as epoxy resin, the insulating shell can be omitted, and the curable material used for potting can also be used as the insulating shell.

[0076] According to another embodiment of the present application, the method for preparing the solid-state circuit breaker packaging module further comprises the step of arranging the substrate on the back plate.

[0077] The embodiment can be used for preparing the solid-state circuit breaker packaging module of any of the preceding embodiments of the present application, which will not be described here again.

[0078] Although the present application has been described by preferred embodiments, the present application is not limited to the embodiments described herein, and includes various changes and variations made without departing from the scope of the present application.

Claims

1. A solid state circuit breaker packaging module, characterized by, Comprising: at least one substrate, at least one power semiconductor and at least one energy absorption stack arranged on the at least one substrate, and an enclosure for encapsulating the at least one power semiconductor and the at least one energy absorption stack, wherein the energy absorption stack comprises a plurality of energy absorption elements stacked on top of each other in a direction perpendicular to the substrate, and wherein between two adjacent energy absorption elements of the plurality of energy absorption elements an electrically conductive adhesive layer is arranged.

2. The solid state circuit breaker packaging module according to claim 1, characterized in that, The thickness of the at least one energy absorption stack is less than a predetermined threshold value.

3. The solid state circuit breaker packaging module according to claim 2, characterized in that, The predetermined threshold value is 10 mm.

4. The solid state circuit breaker packaging module of claim 1, wherein, Between two adjacent energy absorption elements of the plurality of energy absorption elements a thermal structure is arranged, which is connected to the adjacent energy absorption elements by an electrically conductive adhesive material.

5. The solid state circuit breaker packaging module according to claim 4, characterized in that, The material of the thermal structure is an electrically conductive material.

6. The solid state circuit breaker packaging module according to claim 5, characterized in that, The thermal structure is a plate of electrically conductive material.

7. The solid state circuit breaker packaging module according to claim 4, characterized in that, At the interface where the thermal structure is adjacent to the energy absorption element, the area of the thermal structure is less than the area of the energy absorption element.

8. The solid state circuit breaker packaging module according to claim 7, characterized in that, The area of the thermal structure is 10% less than the area of the energy absorption element.

9. The solid state circuit breaker packaging module of claim 1, wherein, Further comprising a back plate, on which the at least one substrate is arranged, and wherein the back plate and the enclosure jointly encapsulate the at least one power semiconductor and the at least one energy absorption stack.

10. The solid state circuit breaker packaging module of claim 1, wherein, The solid state circuit breaker packaging module is a potting packaging module.

Images