LED floodlight support
By designing an aluminum alloy heat dissipation structure and diffuse reflection curved grooves to adapt to different chip specifications, the problem of poor adaptability of traditional brackets is solved, achieving efficient heat dissipation and uniform light scattering, thereby improving the lifespan and luminous efficiency of LED floodlights.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-08
- Publication Date
- 2026-03-27
AI Technical Summary
Traditional mounting brackets are difficult to adapt to the size differences of chips produced by different manufacturers, resulting in high production costs and difficulties, and making it impossible to easily install different models of chips.
An LED floodlight bracket was designed, which uses an aluminum alloy heat sink, heat sink plate and main emitter bowl, combined with multiple curved grooves to adapt to different chip specifications, and uses diffuse reflection material to achieve uniform light scattering and enhance heat dissipation.
The bracket has been improved in terms of versatility and applicability, achieving uniform heat dissipation of the chip and good floodlight effect, thus extending the lifespan and luminous efficiency of the LED floodlight.
Smart Images
Figure CN224054716U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to LED lamp support technical field, especially a kind of LED floodlight support. BACKGROUND
[0002] With the continuous development of lighting technology, LED floodlight is widely used in many fields such as commercial lighting, industrial lighting, landscape lighting and so on, due to its energy saving, environmental protection, long service life and other advantages. From the bustling city street lighting, to the light display of large commercial plaza, to the daily lighting of factory workshop, LED floodlight plays an important role.
[0003] In terms of chip installation, the size specifications of chips produced by different manufacturers differ greatly, and the traditional support is difficult to adapt to such diversity, resulting in the need to frequently adjust the production process or replace the support during production, greatly increasing the production cost and production difficulty, so there is a problem that different models of chips are not convenient to install. INVENTION CONTENTS
[0004] In view of the problems existing in the prior art, the utility model provides a LED floodlight support.
[0005] To achieve the above purpose, the utility model realizes the following technical scheme: a LED floodlight support, including anode connecting column, the bottom end of the anode connecting column is provided with a feeding plate, the upper surface of the feeding plate is provided with a cathode connecting column, the top end of the cathode connecting column is fixedly connected with a cathode wire holder, the top end of the cathode wire holder is provided with a heat sink, the inner side of the heat sink is provided with a main emission bowl, the inner side of the main emission bowl is sequentially provided with a first curved groove, a second curved groove, a third curved groove and a fourth curved groove, and the main emission bowl adopts rectangular shape, and the top end of the anode connecting column is provided with an anode wire holder.
[0006] For a preferred scheme of the LED floodlight support, the outer surface of the heat sink is fixedly connected with a heat sink plate, and the outer surface of the heat sink plate is fixedly connected with the outer surface of the main emission bowl.
[0007] By adopting the above technical scheme, the anode wire holder and the heat sink are used to facilitate heat dissipation of the main emission bowl, and then facilitate heat dissipation of the chip in the main emission bowl.
[0008] As a preferred scheme of the LED floodlight support, the heat sink, the heat sink plate and the main emission bowl are all made of aluminum alloy material, and the inner side of the main emission bowl is coated with a diffuse reflection material.
[0009] By adopting the above technical scheme, the heat generated by the chip is quickly dissipated to the surrounding environment through the aluminum alloy material, the temperature of the chip is effectively reduced, the light emitting efficiency and service life of the LED floodlight are improved, the light emitted by the chip is scattered multiple times through the material, and the light propagation direction is more uniform and dispersed.
[0010] As a preferred scheme of the LED floodlight support, the inner side surfaces of the first curved groove, the second curved groove, the third curved groove and the fourth curved groove are coated with a diffuse reflection material, and the outer side surfaces of the first curved groove, the second curved groove, the third curved groove and the fourth curved groove are attached to the inner side surface of the heat dissipation cover.
[0011] By adopting the above technical scheme, the heat dissipation cover facilitates heat dissipation of the chip installed in the first curved groove, the second curved groove, the third curved groove and the fourth curved groove, and the first curved groove, the second curved groove, the third curved groove and the fourth curved groove facilitate limiting of chips of different sizes.
[0012] As a preferred scheme of the LED floodlight support, a plurality of through holes are formed in the outer surface of the feeding plate.
[0013] By adopting the above technical scheme, the through holes facilitate machining of the anode connecting column and the anode lead frame.
[0014] As a preferred scheme of the LED floodlight support, distance plates are arranged at the middle sections of the anode connecting column and the cathode connecting column, and bridge plates are arranged at the outer sections of the anode connecting column and the cathode connecting column.
[0015] By adopting the above technical scheme, the distance plates facilitate positioning of the anode connecting column and the cathode connecting column, and the distance plates and the bridge plates facilitate increasing the overall strength.
[0016] The LED floodlight support has the following beneficial effects:
[0017] 1. The first curved groove, the second curved groove, the third curved groove and the fourth curved groove in the main emission bowl have different size designs, can adapt to chips of different sizes, in actual production and application, only need to select appropriate curved grooves according to the specific specifications of the chips for installation, do not need to design special supports for chips of different specifications, greatly improve the universality and applicability of the support, and the diffuse reflection material coated on the inner side surfaces of the main emission bowl and each curved groove can uniformly scatter the light emitted by the chip, and good floodlight effect is achieved.
[0018] 2. The heat dissipation system is constructed by the heat dissipation cover, the heat dissipation plate and the main emitting bowl made of aluminum alloy material, so that the heat generated by the chip can be quickly dissipated, the temperature of the chip is effectively reduced, and the light emitting efficiency and the service life of the LED flood lamp are improved. BRIEF DESCRIPTION OF DRAWINGS
[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed in the embodiment description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.
[0020] Figure 1 is the overall structure schematic diagram of the present application;
[0021] Figure 2 is the front cross-sectional structure schematic diagram of the present application;
[0022] Figure 3 is Figure 2 the enlarged structure schematic diagram of A in the figure;
[0023] Figure 4 is the side cross-sectional structure schematic diagram of the present application.
[0024] In the figure, 1, anode connecting column; 2, anode wire frame; 3, cathode wire frame; 4, main emitting bowl; 5, heat dissipation cover; 6, distance plate; 7, bridging plate; 8, cathode connecting column; 9, feeding plate; 10, through hole; 11, first curved groove; 12, second curved groove; 13, third curved groove; 14, fourth curved groove; 15, heat dissipation plate. DETAILED DESCRIPTION
[0025] The technical solutions in the embodiments of the present application will be described clearly and completely in combination with the drawings in the embodiments of the present application. Embodiment 1
[0026] Referring to Figure 1 , Figure 2 , Figure 3 and Figure 4For the first embodiment of the utility model, the embodiment provides a LED flood lamp support, including anode contact column 1, the bottom of anode contact column 1 is provided with feeding plate 9, the upper surface of feeding plate 9 is provided with cathode contact column 8, the top of cathode contact column 8 is fixedly connected with cathode wire holder 3, the top of cathode wire holder 3 is provided with heat dissipation cover 5, the inner side of heat dissipation cover 5 is provided with main emission bowl 4, the inner side of main emission bowl 4 is sequentially provided with first curved groove 11, second curved groove 12, third curved groove 13 and fourth curved groove 14, and main emission bowl 4 adopts rectangular shape, the top of anode contact column 1 is provided with anode wire holder 2.
[0027] Specifically, the outer surface of heat dissipation cover 5 is fixedly connected with heat dissipation plate 15, the outer surface of heat dissipation plate 15 is fixedly connected with the outer surface of main emission bowl 4, heat dissipation cover 5, heat dissipation plate 15 and main emission bowl 4 all adopt aluminum alloy material, and the inner side of main emission bowl 4 is coated with diffuse reflection material.
[0028] Further, the first curved groove 11, the second curved groove 12, the third curved groove 13 and the fourth curved groove 14 in the main emission bowl 4 have different size designs, which can adapt to chips of different sizes. In actual production and application, only the appropriate curved groove is selected according to the specific specifications of the chip for installation, without the need to design special supports for chips of different specifications, greatly improving the universality and applicability of the support. Moreover, the diffuse reflection material coated on the inner side of the main emission bowl 4 and each curved groove can uniformly scatter the light emitted by the chip, achieving good floodlight effect. Embodiment 2
[0029] Referring to Figure 1 , Figure 2 , Figure 3 and Figure 4 , for the second embodiment of the utility model, the inner side of the first curved groove 11, the second curved groove 12, the third curved groove 13 and the fourth curved groove 14 is coated with diffuse reflection material, and the outer side of the first curved groove 11, the second curved groove 12, the third curved groove 13 and the fourth curved groove 14 is attached to the inner side of the heat dissipation cover 5.
[0030] Specifically, the outer surface of feeding plate 9 is provided with multiple groups of through holes 10, the middle segment position of anode contact column 1 and cathode contact column 8 is provided with distance plate 6, and the outer segment of anode contact column 1 and cathode contact column 8 is provided with bridging plate 7.
[0031] Further, the heat dissipation cover 5, the heat dissipation plate 15 and the main emission bowl 4 of the entire support adopt aluminum alloy material, constructing a high-efficiency heat dissipation system, which can quickly dissipate the heat generated by the chip, effectively reducing the temperature of the chip, thereby improving the luminous efficiency and service life of the LED flood lamp.
[0032] Working principle: the heat sink 5 at the top end of the cathode lead frame 3 not only provides protection for the internal main emitting bowl 4, but more importantly, the outer surface of the heat sink 5 is connected with the heat sink plate 15 which is closely connected with the main emitting bowl 4, forming a high-efficiency heat dissipation system. When the chip works in the main emitting bowl 4 and generates heat, since the heat sink 5, the heat sink plate 15 and the main emitting bowl 4 all adopt aluminum alloy which has high thermal conductivity, the heat can be quickly transferred from the chip to the main emitting bowl 4, then conducted to the heat sink 5 through the heat sink plate 15, and finally dissipated to the surrounding environment, thereby effectively reducing the temperature of the chip, ensuring the stable operation of the chip at a suitable temperature, improving the luminous efficiency and service life of the LED floodlight. The main emitting bowl 4 adopts a rectangular shape, and the first curved groove 11, the second curved groove 12, the third curved groove 13 and the fourth curved groove 14 are sequentially arranged inside the main emitting bowl 4 and have multiple functions. On the one hand, the inner side of these curved grooves is coated with a diffuse reflection material. When the chip emits light, the light will be scattered multiple times when it hits the diffuse reflection material, making the light propagation direction more uniform and dispersed, thereby achieving good floodlight effect. On the other hand, different curved grooves have different size specifications, which can limit the size of the chip and facilitate the installation of different specifications of chips. At the same time, the outer side of these curved grooves is in contact with the inner side of the heat sink 5, further enhancing the heat dissipation effect and ensuring that each chip can be effectively cooled. The distance plate 6 is arranged at the middle segment position of the anode connecting column 1 and the cathode connecting column 8, which can accurately determine the relative position between the anode connecting column 1 and the cathode connecting column 8, ensuring the accuracy of the entire structure. The bridge plate 7 is arranged at the outer segment of the anode connecting column 1 and the cathode connecting column 8, and works together with the distance plate 6 to increase the strength of the entire support structure. It should be noted that in this article, relationship terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between the entities or operations.
Claims
1. A LED floodlight bracket comprising an anode stud (1), characterized in that: The bottom end of the anode connecting column (1) is provided with a feeding plate (9), the upper surface of the feeding plate (9) is provided with a cathode connecting column (8), the top end of the cathode connecting column (8) is fixedly connected with a cathode lead frame (3), the top end of the cathode lead frame (3) is provided with a heat sink (5), the inner side of the heat sink (5) is provided with a main emission bowl (4), the inner side of the main emission bowl (4) is sequentially provided with a first curved groove (11), a second curved groove (12), a third curved groove (13) and a fourth curved groove (14), and the main emission bowl (4) adopts a rectangular shape, and the top end of the anode connecting column (1) is provided with an anode lead frame (2).
2. The LED floodlight bracket of claim 1, wherein: The outer surface of the heat sink (5) is fixedly connected with a heat dissipation plate (15), and the outer surface of the heat dissipation plate (15) is fixedly connected with the outer surface of the main emission bowl (4).
3. The LED floodlight bracket of claim 2, wherein: The heat sink (5), the heat dissipation plate (15) and the main emission bowl (4) all adopt an aluminum alloy material, and the inner side of the main emission bowl (4) is coated with a diffuse reflection material.
4. The LED floodlight bracket of claim 1, wherein: The inner sides of the first curved groove (11), the second curved groove (12), the third curved groove (13) and the fourth curved groove (14) are all coated with a diffuse reflection material, and the outer sides of the first curved groove (11), the second curved groove (12), the third curved groove (13) and the fourth curved groove (14) are all attached to the inner side of the heat sink (5).
5. The LED floodlight fixture of Claim 4, wherein: The outer surface of the feeding plate (9) is provided with a plurality of groups of through holes (10).
6. The LED floodlight fixture of Claim 5, wherein: The middle segment positions of the anode connecting column (1) and the cathode connecting column (8) are provided with distance plates (6), and the outer segments of the anode connecting column (1) and the cathode connecting column (8) are provided with bridging plates (7).